CA2036758A1 - Sous-carte d'alimentation pour proteger les circuits vlsi contre les parasites electromagnetiques - Google Patents

Sous-carte d'alimentation pour proteger les circuits vlsi contre les parasites electromagnetiques

Info

Publication number
CA2036758A1
CA2036758A1 CA2036758A CA2036758A CA2036758A1 CA 2036758 A1 CA2036758 A1 CA 2036758A1 CA 2036758 A CA2036758 A CA 2036758A CA 2036758 A CA2036758 A CA 2036758A CA 2036758 A1 CA2036758 A1 CA 2036758A1
Authority
CA
Canada
Prior art keywords
power plane
power
sub
sub power
vlsi devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2036758A
Other languages
English (en)
Other versions
CA2036758C (fr
Inventor
Richard A. Vince
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Publication of CA2036758A1 publication Critical patent/CA2036758A1/fr
Application granted granted Critical
Publication of CA2036758C publication Critical patent/CA2036758C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1006—Non-printed filter
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
CA002036758A 1990-08-09 1991-02-20 Sous-carte d'alimentation pour proteger les circuits vlsi contre les parasites electromagnetiques Expired - Fee Related CA2036758C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US564,998 1983-12-13
US07/564,998 US5068631A (en) 1990-08-09 1990-08-09 Sub power plane to provide EMC filtering for VLSI devices

Publications (2)

Publication Number Publication Date
CA2036758A1 true CA2036758A1 (fr) 1992-02-10
CA2036758C CA2036758C (fr) 1995-12-05

Family

ID=24256778

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002036758A Expired - Fee Related CA2036758C (fr) 1990-08-09 1991-02-20 Sous-carte d'alimentation pour proteger les circuits vlsi contre les parasites electromagnetiques

Country Status (6)

Country Link
US (1) US5068631A (fr)
EP (1) EP0472317B1 (fr)
JP (1) JPH0746748B2 (fr)
KR (1) KR100254866B1 (fr)
CA (1) CA2036758C (fr)
DE (1) DE69115597T2 (fr)

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US5508938A (en) * 1992-08-13 1996-04-16 Fujitsu Limited Special interconnect layer employing offset trace layout for advanced multi-chip module packages
US5295869A (en) 1992-12-18 1994-03-22 The Siemon Company Electrically balanced connector assembly
JP3265669B2 (ja) * 1993-01-19 2002-03-11 株式会社デンソー プリント基板
US5423684A (en) * 1993-03-02 1995-06-13 Mitsubishi Denki Kabushiki Kaisha Apparatus and method for forming a switchboard unit circuit
JPH07176336A (ja) 1993-09-30 1995-07-14 Siemon Co:The ブレーク・テスト機能を含む電気的に拡張された配線ブロック
JPH07235775A (ja) * 1994-02-21 1995-09-05 Mitsubishi Electric Corp 多層プリント配線基板
US5761051A (en) * 1994-12-29 1998-06-02 Compaq Computer Corporation Multi-layer circuit board having a supply bus and discrete voltage supply planes
US5587887A (en) * 1995-05-01 1996-12-24 Apple Computer, Inc. Printed circuit board having a configurable voltage supply
JP3513333B2 (ja) * 1995-09-29 2004-03-31 キヤノン株式会社 多層プリント配線板およびそれを実装する電子機器
JP3581971B2 (ja) * 1996-05-22 2004-10-27 株式会社ボッシュオートモーティブシステム 車載用コントロールユニットのｅｍｉ用接地構造
US5686871A (en) * 1996-07-12 1997-11-11 Ast Research, Inc. Method for minimizing radio frequency emissions from plug-in adapter cards in computer systems
US5898576A (en) * 1996-11-12 1999-04-27 Bay Networks Inc. Printed circuit board including a terminated power plane and method of manufacturing the same
US6058022A (en) * 1998-01-07 2000-05-02 Sun Microsystems, Inc. Upgradeable PCB with adaptable RFI suppression structures
US6181571B1 (en) * 1998-03-06 2001-01-30 Canon Kabushiki Kaisha Printed-wiring board and electronic device having the same wiring board
US6532439B2 (en) * 1998-06-18 2003-03-11 Sun Microsystems, Inc. Method for determining the desired decoupling components for power distribution systems
US6385565B1 (en) * 1998-06-18 2002-05-07 Sun Microsystems, Inc. System and method for determining the desired decoupling components for power distribution systems using a computer system
US6195613B1 (en) 1998-06-18 2001-02-27 Sun Microsystems, Inc. Method and system for measuring equivalent series resistance of capacitors and method for decoupling power distribution systems
JP2970660B1 (ja) * 1998-06-30 1999-11-02 日本電気株式会社 プリント基板
US6049465A (en) * 1998-09-25 2000-04-11 Advanced Micro Devices, Inc. Signal carrying means including a carrier substrate and wire bonds for carrying signals between the cache and logic circuitry of a microprocessor
JP3456442B2 (ja) * 1999-04-21 2003-10-14 日本電気株式会社 プリント配線基板
JP3471679B2 (ja) * 1999-10-15 2003-12-02 日本電気株式会社 プリント基板
US6446016B1 (en) * 1999-12-08 2002-09-03 Intel Corporation Sizing and insertion of decoupling capacitance
JP2001204016A (ja) * 2000-01-19 2001-07-27 Sony Corp 衛星チューナの入力回路
NL1014192C2 (nl) * 2000-01-26 2001-08-08 Industree B V Printplaat.
JP3925032B2 (ja) * 2000-03-14 2007-06-06 富士ゼロックス株式会社 プリント配線基板
US6714092B1 (en) * 2000-11-02 2004-03-30 Intel Corporation Supply noise filter for clock generator
US6525622B1 (en) * 2000-11-17 2003-02-25 Sun Microsystems, Inc. Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conducts of an electrical power distribution structure
US6937480B2 (en) * 2001-05-14 2005-08-30 Fuji Xerox Co., Ltd. Printed wiring board
US20030156368A1 (en) * 2001-11-02 2003-08-21 Williams Ricki D. In-rush current controller
US6642811B2 (en) * 2002-01-30 2003-11-04 International Business Machines Corporation Built-in power supply filter for an integrated circuit
JP3646098B2 (ja) 2002-03-27 2005-05-11 コニカミノルタビジネステクノロジーズ株式会社 回路基板
US7061772B2 (en) * 2002-08-05 2006-06-13 Nec Tokin Corporation Electronic circuit with transmission line type noise filter
US6789241B2 (en) * 2002-10-31 2004-09-07 Sun Microsystems, Inc. Methodology for determining the placement of decoupling capacitors in a power distribution system
TWI244846B (en) * 2003-06-06 2005-12-01 Wistron Corp Electro-magnetic interference immunity circuit for clock buffer and method thereof
KR101022655B1 (ko) * 2004-04-29 2011-03-22 삼성에스디아이 주식회사 접지 분리형 전계 방출 디스플레이 장치
KR100712074B1 (ko) 2004-12-10 2007-05-02 한국전자통신연구원 전원 플레인이 분리된 인쇄회로기판
US8063480B2 (en) * 2006-02-28 2011-11-22 Canon Kabushiki Kaisha Printed board and semiconductor integrated circuit
JP2007234864A (ja) * 2006-03-01 2007-09-13 Daikin Ind Ltd 装置及び接続方法
US8208338B2 (en) 2006-05-12 2012-06-26 Samsung Electronics Co., Ltd. Semiconductor device
JP4736988B2 (ja) * 2006-07-24 2011-07-27 株式会社村田製作所 多層プリント基板
US7839654B2 (en) * 2007-02-28 2010-11-23 International Business Machines Corporation Method for ultimate noise isolation in high-speed digital systems on packages and printed circuit boards (PCBS)
JP4678381B2 (ja) * 2007-03-15 2011-04-27 日本電気株式会社 電源供給装置
JP5354949B2 (ja) * 2007-06-19 2013-11-27 キヤノン株式会社 プリント回路板
JP2009278412A (ja) * 2008-05-15 2009-11-26 Yokogawa Electric Corp 高速信号伝送線路とそれを用いた半導体試験装置
KR20100084379A (ko) * 2009-01-16 2010-07-26 삼성전자주식회사 인쇄회로기판
JP6153319B2 (ja) * 2011-12-08 2017-06-28 キヤノン株式会社 プリント回路板、プリント配線板及び電子機器
US9743522B2 (en) * 2012-09-26 2017-08-22 Apple Inc. Printed circuit board with compact groups of devices
TWI479953B (zh) * 2013-02-26 2015-04-01 Wistron Corp 預防靜電放電干擾的主機板
JP6226600B2 (ja) * 2013-07-18 2017-11-08 キヤノン株式会社 プリント回路板
CN103531552B (zh) * 2013-10-25 2016-01-13 深圳市华星光电技术有限公司 芯片结构及电路结构
JP6207422B2 (ja) * 2014-02-19 2017-10-04 ルネサスエレクトロニクス株式会社 電子装置
US10925164B2 (en) 2016-09-23 2021-02-16 Apple Inc. Stackable passive component
CN110943707A (zh) * 2019-12-19 2020-03-31 Tcl华星光电技术有限公司 滤波电路及电子设备

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JPH02187093A (ja) * 1989-01-13 1990-07-23 Toshiba Corp 印刷配線板
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Also Published As

Publication number Publication date
DE69115597T2 (de) 1996-05-02
CA2036758C (fr) 1995-12-05
JPH0513909A (ja) 1993-01-22
EP0472317A1 (fr) 1992-02-26
EP0472317B1 (fr) 1995-12-20
DE69115597D1 (de) 1996-02-01
US5068631A (en) 1991-11-26
JPH0746748B2 (ja) 1995-05-17
KR920005675A (ko) 1992-03-28
KR100254866B1 (ko) 2000-05-01

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