KR920005675A - Vlsi 디바이스에 대한 필터링을 제공하는 서브-파워 플레인 - Google Patents

Vlsi 디바이스에 대한 필터링을 제공하는 서브-파워 플레인 Download PDF

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Publication number
KR920005675A
KR920005675A KR1019910013554A KR910013554A KR920005675A KR 920005675 A KR920005675 A KR 920005675A KR 1019910013554 A KR1019910013554 A KR 1019910013554A KR 910013554 A KR910013554 A KR 910013554A KR 920005675 A KR920005675 A KR 920005675A
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South Korea
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sub
circuit board
power plane
power
capacitor
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KR1019910013554A
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English (en)
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KR100254866B1 (ko
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에이. 빈스 리챠드
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토마스 스태포드
아메리칸 텔리폰 앤드 텔레그라프 캄파니
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1006—Non-printed filter
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Abstract

내용 없음

Description

VLSI디바이스에 대한 필터링을 제공하는 서브-파워 플레인
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예를 예시하는 회로 기판부분의 사시도.
제4도는 다수의 서브-파워 플레인과 주 파워 플레인과의 관게 및 회로 기판의 접지 그리드를 보인 사시도.
제5도는 본 발명의 또다른 실시예를 포함하고 있는 회로기판 부분을 보인 도면.

Claims (8)

  1. 접지 시스템과 주 파워 분산 시스템을 포함하고 있는 회로 기판으로써, 상기 주 파워 분산 시스템과 공간 관계를 이루어 이것과 물리적으로 분리되어 있으며, 다중 파워 입력 리이드를 갖는 적어도 하나의 VLSI디바이스에 연결되도록된 적어도 하나의 서브-파워 플레인을 포함하는 것을 특징으로 하는 회로 기판.
  2. 제1항에 있어서, 상기 적어도 하나의 서브-파워 플레인이 적어도 하나의 해당 VLSI디바이스에 직접 연결되도록된 것을 특징으로 하는 회로 기판.
  3. 제2항에 있어서, 다수의 캐패시터를 포함하고 그리고 상기 적어도 하나의 서브-파워 플레인이 제1캐패시터를 상기 VLSI디바이스의 제1파워 입력 리이드에 연결하도록 되어 있고 그리고 적어도 하나의 제2캐패시터를 상기 VLSI디바이스의 제2파워 입력 리이드에 연결하도록된 것을 특징으로 하는 회로 기판.
  4. 제2항에 있어서, 상기 서브-파워 플레인이 상기 다수의 캐패시터를 상기 VLSI디바이스의 상기 다중 파워 입력 리이드에 1대 1식으로 연결하도록 된것을 특징으로 하는 회로 기판.
  5. 제3항에 있어서, 상기 서브-파워 플레인을 상기 주 파워 분산 시스템에 연결하여 상기 서브-파워 플레인에 파워를 공급하는 필터를 포함하는 것을 특징으로 하는 회로 기판.
  6. 제5항에 있어서, 상기 필터가 캐패시터, 페라이트 비드 및 상기 다수의 캐패시터중 하나를 구비하여, л 구성으로 배열된 것을 특징으로 하는 회로 기판.
  7. 제6항에 있어서, 상기 접지 시스템은 접지 그리드와 그리고 이 접지 그리드에 연결되도록된 단자를 갖는 상기 각각의 캐패시터로 이루어지는 것을 특징으로 하는 회로 기판.
  8. 제3항에 있어서, 상기 주 파워 분산 시스템은 내부에 배치되는 적어도 하나의 서브-파워 플레인을 가지며 물리적으로 이와 분리된 주 파워 플레인인 것을 특징으로 하는 회로 기판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910013554A 1990-08-09 1991-08-06 Vlsi 디바이스에 대한 필터링을 제공하는 서브-파워 플레인 KR100254866B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US564998 1990-08-09
US07/564,998 US5068631A (en) 1990-08-09 1990-08-09 Sub power plane to provide EMC filtering for VLSI devices

Publications (2)

Publication Number Publication Date
KR920005675A true KR920005675A (ko) 1992-03-28
KR100254866B1 KR100254866B1 (ko) 2000-05-01

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KR1019910013554A KR100254866B1 (ko) 1990-08-09 1991-08-06 Vlsi 디바이스에 대한 필터링을 제공하는 서브-파워 플레인

Country Status (6)

Country Link
US (1) US5068631A (ko)
EP (1) EP0472317B1 (ko)
JP (1) JPH0746748B2 (ko)
KR (1) KR100254866B1 (ko)
CA (1) CA2036758C (ko)
DE (1) DE69115597T2 (ko)

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Also Published As

Publication number Publication date
DE69115597T2 (de) 1996-05-02
CA2036758C (en) 1995-12-05
CA2036758A1 (en) 1992-02-10
JPH0513909A (ja) 1993-01-22
EP0472317A1 (en) 1992-02-26
EP0472317B1 (en) 1995-12-20
DE69115597D1 (de) 1996-02-01
US5068631A (en) 1991-11-26
JPH0746748B2 (ja) 1995-05-17
KR100254866B1 (ko) 2000-05-01

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