CA1341122C - Reactive hot-melt adhesive - Google Patents
Reactive hot-melt adhesiveInfo
- Publication number
- CA1341122C CA1341122C CA000607945A CA607945A CA1341122C CA 1341122 C CA1341122 C CA 1341122C CA 000607945 A CA000607945 A CA 000607945A CA 607945 A CA607945 A CA 607945A CA 1341122 C CA1341122 C CA 1341122C
- Authority
- CA
- Canada
- Prior art keywords
- epoxy
- melt adhesive
- reactive hot
- epoxy resin
- adhesive according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004831 Hot glue Substances 0.000 title claims abstract description 28
- 239000003822 epoxy resin Substances 0.000 claims abstract description 36
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 36
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 239000011347 resin Substances 0.000 claims abstract description 34
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims abstract description 18
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 15
- 239000007787 solid Substances 0.000 claims abstract description 15
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims abstract description 13
- -1 polyoxypropylene Polymers 0.000 claims abstract description 10
- 229920001451 polypropylene glycol Polymers 0.000 claims abstract description 10
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 9
- 125000003277 amino group Chemical group 0.000 claims abstract description 8
- 239000007788 liquid Substances 0.000 claims abstract description 7
- 239000000945 filler Substances 0.000 claims abstract description 5
- 239000000654 additive Substances 0.000 claims abstract description 4
- 239000004593 Epoxy Substances 0.000 claims description 14
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000470 constituent Substances 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 230000009974 thixotropic effect Effects 0.000 claims description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical group NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 20
- 230000001070 adhesive effect Effects 0.000 abstract description 20
- 239000013008 thixotropic agent Substances 0.000 abstract 1
- 206010040844 Skin exfoliation Diseases 0.000 description 11
- 239000002184 metal Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 101100128404 Caenorhabditis elegans lir-3 gene Proteins 0.000 description 1
- 241000272470 Circus Species 0.000 description 1
- 101150013573 INVE gene Proteins 0.000 description 1
- 101100005318 Mus musculus Ctsr gene Proteins 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 150000001298 alcohols Chemical group 0.000 description 1
- WMGSQTMJHBYJMQ-UHFFFAOYSA-N aluminum;magnesium;silicate Chemical compound [Mg+2].[Al+3].[O-][Si]([O-])([O-])[O-] WMGSQTMJHBYJMQ-UHFFFAOYSA-N 0.000 description 1
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 101150076562 virB gene Proteins 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/10—Polycondensates containing more than one epoxy group per molecule of polyamines with epihalohydrins or precursors thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3827626A DE3827626A1 (de) | 1988-08-10 | 1988-08-10 | Reaktiver schmelzklebstoff |
| DEP3827626.7 | 1988-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1341122C true CA1341122C (en) | 2000-10-17 |
Family
ID=6360865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000607945A Expired - Fee Related CA1341122C (en) | 1988-08-10 | 1989-08-10 | Reactive hot-melt adhesive |
Country Status (8)
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4023145A1 (de) * | 1990-07-20 | 1992-01-23 | Thera Ges Fuer Patente | Copolymerisierbare zusammensetzung, diese enthaltende haertbare harzmasse und ihre verwendung |
| JP3294268B2 (ja) * | 1991-06-26 | 2002-06-24 | ヘンケル・テロソン・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | 反応性ホットメルト接着剤 |
| DE4342722A1 (de) * | 1993-12-15 | 1995-06-22 | Hoechst Ag | Elastisches Epoxidharz-Härter-System |
| DE4342721A1 (de) * | 1993-12-15 | 1995-06-22 | Hoechst Ag | Elastisches Epoxidharz-Härter-System |
| US5708056A (en) * | 1995-12-04 | 1998-01-13 | Delco Electronics Corporation | Hot melt epoxy encapsulation material |
| US6162504A (en) * | 1997-12-04 | 2000-12-19 | Henkel Corporation | Adhesives and sealants containing adhesion promoter comprising waste powder prime |
| US20040181013A1 (en) * | 1998-10-06 | 2004-09-16 | Henkel Teroson Gmbh | Impact resistant epoxide resin compositions |
| DE19858921A1 (de) | 1998-12-19 | 2000-06-21 | Henkel Teroson Gmbh | Schlagfeste Epoxidharz-Zusammensetzungen |
| DE19909270A1 (de) | 1999-03-03 | 2000-09-07 | Henkel Teroson Gmbh | Hitzehärtbarer, thermisch expandierbarer Formkörper |
| KR20020089439A (ko) | 2000-04-10 | 2002-11-29 | 헨켈 코만디트게젤샤프트 아우프 악티엔 | 내충격성 에폭시 수지 조성물 |
| DE10062009A1 (de) * | 2000-12-13 | 2002-07-04 | Henkel Teroson Gmbh | Mehrschichtige Sandwich-Materialien mit organischen Zwischenschichten auf Epoxidbasis |
| DE10163859A1 (de) * | 2001-12-22 | 2003-07-10 | Henkel Kgaa | Mehrphasige Strukturklebstoffe |
| US20030192643A1 (en) | 2002-03-15 | 2003-10-16 | Rainer Schoenfeld | Epoxy adhesive having improved impact resistance |
| US7176044B2 (en) * | 2002-11-25 | 2007-02-13 | Henkel Corporation | B-stageable die attach adhesives |
| DE10312815A1 (de) | 2003-03-22 | 2004-10-07 | Henkel Kgaa | Verfahren zum Kontaminationstoleranten Kleben von Fügeteilen |
| CA2620028C (en) * | 2005-08-24 | 2014-01-28 | Henkel Kommanditgesellschaft Auf Aktien | Epoxy compositions having improved impact resistance |
| KR101352811B1 (ko) * | 2006-07-31 | 2014-02-17 | 헨켈 아게 운트 코. 카게아아 | 경화성 에폭시 수지-기재 접착성 조성물 |
| US7759435B2 (en) * | 2006-09-26 | 2010-07-20 | Loctite (R&D) Limited | Adducts and curable compositions using same |
| KR20090080956A (ko) | 2006-10-06 | 2009-07-27 | 헨켈 아게 운트 코. 카게아아 | 발수성의 펌핑가능한 에폭시 페이스트 접착제 |
| JP5382801B2 (ja) * | 2006-10-25 | 2014-01-08 | ヘンケル アイルランド リミテッド | 新規のイミニウム塩およびこれを用いる電子欠損オレフィンの製造方法 |
| DE102007027595A1 (de) | 2007-06-12 | 2008-12-18 | Henkel Ag & Co. Kgaa | Klebstoffzusammensetzungen |
| KR20100059818A (ko) * | 2007-07-26 | 2010-06-04 | 헨켈 코포레이션 | 경화성 에폭시 수지계 접착제 조성물 |
| US20090104448A1 (en) * | 2007-10-17 | 2009-04-23 | Henkel Ag & Co. Kgaa | Preformed adhesive bodies useful for joining substrates |
| EP2205692B1 (en) * | 2007-10-30 | 2020-02-19 | Henkel AG & Co. KGaA | Epoxy paste adhesives resistant to wash-off |
| US20090188269A1 (en) * | 2008-01-25 | 2009-07-30 | Henkel Corporation | High pressure connection systems and methods for their manufacture |
| DE102008009371A1 (de) * | 2008-02-14 | 2009-08-20 | Henkel Ag & Co. Kgaa | Verfahren zur Herstellung eines Wärmetauschers |
| DE102008023276A1 (de) | 2008-05-13 | 2009-11-19 | Henkel Ag & Co. Kgaa | Verbinden von Rohren mit thermisch härtbaren Klebstoffen |
| EP2135909B1 (en) * | 2008-06-12 | 2018-01-10 | Henkel IP & Holding GmbH | Next generation, highly toughened two part structural epoxy adhesive compositions |
| DE102008034105A1 (de) | 2008-07-21 | 2010-01-28 | Henkel Ag & Co. Kgaa | Verbinden von Rohren mittels einer Hülse und einem thermisch expandierbaren Klebstoff |
| DE102009028100A1 (de) * | 2009-07-29 | 2011-02-03 | Henkel Ag & Co. Kgaa | Schlagzähmodifizierte Zusammensetzung auf Epoxidharzbasis |
| DE102009028180A1 (de) | 2009-08-03 | 2011-02-10 | Henkel Ag & Co. Kgaa | Verfahren zum Befestigen eines Magneten auf oder in einem Rotor oder Stator |
| EP2473573B1 (en) | 2009-08-31 | 2018-06-13 | Cytec Technology Corporation | High performance adhesive compositions |
| DE102009045903A1 (de) | 2009-10-21 | 2011-04-28 | Henkel Ag & Co. Kgaa | Schlagzähe, bei Raumtemperatur härtende zweikomponentige Masse auf Epoxidbasis |
| DE102010004792A1 (de) | 2010-01-16 | 2011-07-28 | Aktiebolaget Skf | Verfahren zum Festlegen eines Lagerrings an oder in einem Bauteil |
| JP5597498B2 (ja) * | 2010-09-22 | 2014-10-01 | 電気化学工業株式会社 | エポキシ樹脂組成物、回路基板及び発光装置 |
| MX2013003295A (es) | 2010-09-23 | 2013-05-22 | Henkel Corp | Composicion epoxica resistente a vapor quimico. |
| DE102011003915A1 (de) | 2011-02-10 | 2012-08-16 | Aktiebolaget Skf | Dichtungsanordnung |
| DE102011005500A1 (de) | 2011-03-14 | 2012-09-20 | Aktiebolaget Skf | Lagerring eines Gleit- oder Wälzlagers |
| WO2015011687A1 (en) | 2013-07-26 | 2015-01-29 | Zephyros Inc | Thermosetting adhesive films including a fibrous carrier |
| DE102014226826A1 (de) | 2014-12-22 | 2016-06-23 | Henkel Ag & Co. Kgaa | Epoxidharz-Zusammensetzung |
| WO2016179010A1 (en) | 2015-05-01 | 2016-11-10 | Lord Corporation | Adhesive for rubber bonding |
| CN108603009B (zh) | 2016-02-29 | 2020-10-20 | 三菱化学株式会社 | 环氧树脂组合物、成型材料及纤维增强复合材料 |
| EP3595892B1 (en) | 2017-03-13 | 2023-07-05 | Zephyros Inc. | Composite sandwich panel comprising honeycomb core and layer of damping or attenuation material |
| EP3611210B1 (en) | 2017-04-12 | 2024-02-07 | Mitsubishi Chemical Corporation | Sheet molding compound and fiber-reinforced composite material |
| EP3724290A1 (en) | 2017-12-15 | 2020-10-21 | 3M Innovative Properties Company | High temperature structural adhesive films |
| WO2020022796A1 (ko) | 2018-07-25 | 2020-01-30 | 주식회사 엘지화학 | 접착제 조성물 |
| EP3825377B1 (en) | 2018-07-25 | 2022-11-02 | LG Chem, Ltd. | Adhesive composition |
| KR102230946B1 (ko) | 2018-07-25 | 2021-03-23 | 주식회사 엘지화학 | 접착제 조성물 |
| KR102230945B1 (ko) | 2018-07-25 | 2021-03-23 | 주식회사 엘지화학 | 접착제 조성물 |
| KR102183705B1 (ko) | 2018-07-25 | 2020-11-27 | 주식회사 엘지화학 | 접착제 조성물 |
| JP7179151B2 (ja) | 2018-07-25 | 2022-11-28 | エルジー・ケム・リミテッド | 接着剤組成物 |
| CN112469797B (zh) * | 2018-07-25 | 2022-12-27 | 株式会社Lg化学 | 粘合剂组合物 |
| CN112654666A (zh) | 2018-09-05 | 2021-04-13 | 三菱化学株式会社 | 片状模塑料及纤维增强复合材料 |
| JP7654552B2 (ja) | 2019-09-27 | 2025-04-01 | 株式会社カネカ | 接着剤、および接着剤の製造方法 |
| EP3822078A1 (de) * | 2019-11-15 | 2021-05-19 | voestalpine Stahl GmbH | Elektroband oder -blech, verfahren zur herstellung solch eines elektrobands oder -blechs sowie blechpaket daraus |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3299169A (en) * | 1961-09-18 | 1967-01-17 | Dow Chemical Co | Elastomeric epoxy resin |
| DE2123033A1 (de) * | 1971-02-11 | 1972-08-24 | Du Pont | Epoxy haltige Polymermasse |
| DE2659928C2 (de) * | 1976-01-22 | 1982-12-23 | Hoechst Ag, 6000 Frankfurt | Wäßrige Epoxidharzdispersionen, Verfahren zur Herstellung und Verwendung derselben |
| DE2659989C2 (de) * | 1976-01-22 | 1982-10-21 | Hoechst Ag, 6000 Frankfurt | Wäßrige Epoxidharzdispersionen Verfahren zur Herstellung und Verwendung derselben |
| DE3108073C2 (de) * | 1981-03-04 | 1983-10-06 | Basf Farben + Fasern Ag, 2000 Hamburg | Wasserdispergierbare Bindemittel für kationische Elektrotauchlacke |
| DE3202300C1 (de) * | 1982-01-26 | 1983-07-28 | Th. Goldschmidt Ag, 4300 Essen | Verfahren zum Flexibilisieren von Epoxidharzen |
| US4403078A (en) * | 1982-09-07 | 1983-09-06 | Texaco Inc. | Epoxy resin composition |
| US4423170A (en) * | 1982-10-15 | 1983-12-27 | Texaco Inc. | One component water reduced epoxy adhesives |
| US4578412A (en) * | 1983-07-05 | 1986-03-25 | Texaco Inc. | Extended amine curing agents [and epoxy resins cured therewith] |
| EP0130741A1 (en) * | 1983-07-05 | 1985-01-09 | Texaco Development Corporation | Extended amine curing agents and epoxy resins cured therewith |
| US4552933A (en) * | 1983-07-05 | 1985-11-12 | Texaco Inc. | Extended amine curing agents and epoxy resins cured therewith |
| US4514530A (en) * | 1983-07-05 | 1985-04-30 | Texaco Inc. | Modified amine curing agents and epoxy resins cured therewith |
| DE3409188A1 (de) * | 1984-03-14 | 1985-09-19 | Basf Farben + Fasern Ag, 2000 Hamburg | Mit alkoholen modifizierte polyepoxide, ihre herstellung und verwendung in haertbaren mischungen |
| JPS61188478A (ja) * | 1985-02-18 | 1986-08-22 | Toagosei Chem Ind Co Ltd | 接着剤組成物 |
| US4734468A (en) * | 1986-02-28 | 1988-03-29 | Shell Oil Company | Epoxy resin composition |
| US4728384A (en) * | 1986-06-23 | 1988-03-01 | Ashland Oil, Inc. | Two component epoxy structural adhesives with improved flexibility |
| JPS63308026A (ja) * | 1987-06-09 | 1988-12-15 | Mitsubishi Kasei Corp | 繊維強化プラスチック用樹脂組成物 |
| US4912179A (en) * | 1988-03-30 | 1990-03-27 | Toa Nenryo Kogyo Kabushiki Kaisha | Bisphenol A epoxy resin mixtures with aromatic di-secondary amine |
-
1988
- 1988-08-10 DE DE3827626A patent/DE3827626A1/de active Granted
-
1989
- 1989-08-04 AU AU39322/89A patent/AU627757B2/en not_active Ceased
- 1989-08-05 AT AT89114490T patent/ATE185830T1/de not_active IP Right Cessation
- 1989-08-05 EP EP89114490A patent/EP0354498B1/de not_active Expired - Lifetime
- 1989-08-05 ES ES89114490T patent/ES2138954T3/es not_active Expired - Lifetime
- 1989-08-05 DE DE58909861T patent/DE58909861D1/de not_active Expired - Lifetime
- 1989-08-07 US US07/390,140 patent/US5084532A/en not_active Expired - Lifetime
- 1989-08-09 JP JP1204934A patent/JP2689992B2/ja not_active Expired - Lifetime
- 1989-08-10 CA CA000607945A patent/CA1341122C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0288685A (ja) | 1990-03-28 |
| EP0354498B1 (de) | 1999-10-20 |
| DE3827626A1 (de) | 1990-03-08 |
| AU627757B2 (en) | 1992-09-03 |
| DE58909861D1 (de) | 1999-11-25 |
| JP2689992B2 (ja) | 1997-12-10 |
| ATE185830T1 (de) | 1999-11-15 |
| EP0354498A2 (de) | 1990-02-14 |
| US5084532A (en) | 1992-01-28 |
| AU3932289A (en) | 1990-02-15 |
| DE3827626C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-03-07 |
| ES2138954T3 (es) | 2000-02-01 |
| EP0354498A3 (de) | 1991-07-03 |
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