AU627757B2 - Reactive hot-melt adhesive containing a resin component and a thermally activatable, latent curing agent, a process for producing said adhesive and uses thereof - Google Patents

Reactive hot-melt adhesive containing a resin component and a thermally activatable, latent curing agent, a process for producing said adhesive and uses thereof

Info

Publication number
AU627757B2
AU627757B2 AU39322/89A AU3932289A AU627757B2 AU 627757 B2 AU627757 B2 AU 627757B2 AU 39322/89 A AU39322/89 A AU 39322/89A AU 3932289 A AU3932289 A AU 3932289A AU 627757 B2 AU627757 B2 AU 627757B2
Authority
AU
Australia
Prior art keywords
resin component
curing agent
adhesive
latent curing
reactive hot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU39322/89A
Other languages
English (en)
Other versions
AU3932289A (en
Inventor
Hubert Schenkel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel Teroson GmbH
Original Assignee
Henkel Teroson GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Teroson GmbH filed Critical Henkel Teroson GmbH
Publication of AU3932289A publication Critical patent/AU3932289A/en
Application granted granted Critical
Publication of AU627757B2 publication Critical patent/AU627757B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/10—Polycondensates containing more than one epoxy group per molecule of polyamines with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AU39322/89A 1988-08-10 1989-08-04 Reactive hot-melt adhesive containing a resin component and a thermally activatable, latent curing agent, a process for producing said adhesive and uses thereof Ceased AU627757B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3827626A DE3827626A1 (de) 1988-08-10 1988-08-10 Reaktiver schmelzklebstoff
DE3827626 1988-08-10

Publications (2)

Publication Number Publication Date
AU3932289A AU3932289A (en) 1990-02-15
AU627757B2 true AU627757B2 (en) 1992-09-03

Family

ID=6360865

Family Applications (1)

Application Number Title Priority Date Filing Date
AU39322/89A Ceased AU627757B2 (en) 1988-08-10 1989-08-04 Reactive hot-melt adhesive containing a resin component and a thermally activatable, latent curing agent, a process for producing said adhesive and uses thereof

Country Status (8)

Country Link
US (1) US5084532A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0354498B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP2689992B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AT (1) ATE185830T1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AU (1) AU627757B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA1341122C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (2) DE3827626A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
ES (1) ES2138954T3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

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JP3294268B2 (ja) * 1991-06-26 2002-06-24 ヘンケル・テロソン・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング 反応性ホットメルト接着剤
DE4342722A1 (de) * 1993-12-15 1995-06-22 Hoechst Ag Elastisches Epoxidharz-Härter-System
DE4342721A1 (de) * 1993-12-15 1995-06-22 Hoechst Ag Elastisches Epoxidharz-Härter-System
US5708056A (en) * 1995-12-04 1998-01-13 Delco Electronics Corporation Hot melt epoxy encapsulation material
US6162504A (en) * 1997-12-04 2000-12-19 Henkel Corporation Adhesives and sealants containing adhesion promoter comprising waste powder prime
US20040181013A1 (en) * 1998-10-06 2004-09-16 Henkel Teroson Gmbh Impact resistant epoxide resin compositions
DE19858921A1 (de) 1998-12-19 2000-06-21 Henkel Teroson Gmbh Schlagfeste Epoxidharz-Zusammensetzungen
DE19909270A1 (de) 1999-03-03 2000-09-07 Henkel Teroson Gmbh Hitzehärtbarer, thermisch expandierbarer Formkörper
KR20020089439A (ko) 2000-04-10 2002-11-29 헨켈 코만디트게젤샤프트 아우프 악티엔 내충격성 에폭시 수지 조성물
DE10062009A1 (de) * 2000-12-13 2002-07-04 Henkel Teroson Gmbh Mehrschichtige Sandwich-Materialien mit organischen Zwischenschichten auf Epoxidbasis
DE10163859A1 (de) * 2001-12-22 2003-07-10 Henkel Kgaa Mehrphasige Strukturklebstoffe
US20030192643A1 (en) 2002-03-15 2003-10-16 Rainer Schoenfeld Epoxy adhesive having improved impact resistance
US7176044B2 (en) * 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
DE10312815A1 (de) 2003-03-22 2004-10-07 Henkel Kgaa Verfahren zum Kontaminationstoleranten Kleben von Fügeteilen
CA2620028C (en) * 2005-08-24 2014-01-28 Henkel Kommanditgesellschaft Auf Aktien Epoxy compositions having improved impact resistance
KR101352811B1 (ko) * 2006-07-31 2014-02-17 헨켈 아게 운트 코. 카게아아 경화성 에폭시 수지-기재 접착성 조성물
US7759435B2 (en) * 2006-09-26 2010-07-20 Loctite (R&D) Limited Adducts and curable compositions using same
KR20090080956A (ko) 2006-10-06 2009-07-27 헨켈 아게 운트 코. 카게아아 발수성의 펌핑가능한 에폭시 페이스트 접착제
JP5382801B2 (ja) * 2006-10-25 2014-01-08 ヘンケル アイルランド リミテッド 新規のイミニウム塩およびこれを用いる電子欠損オレフィンの製造方法
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KR20100059818A (ko) * 2007-07-26 2010-06-04 헨켈 코포레이션 경화성 에폭시 수지계 접착제 조성물
US20090104448A1 (en) * 2007-10-17 2009-04-23 Henkel Ag & Co. Kgaa Preformed adhesive bodies useful for joining substrates
EP2205692B1 (en) * 2007-10-30 2020-02-19 Henkel AG & Co. KGaA Epoxy paste adhesives resistant to wash-off
US20090188269A1 (en) * 2008-01-25 2009-07-30 Henkel Corporation High pressure connection systems and methods for their manufacture
DE102008009371A1 (de) * 2008-02-14 2009-08-20 Henkel Ag & Co. Kgaa Verfahren zur Herstellung eines Wärmetauschers
DE102008023276A1 (de) 2008-05-13 2009-11-19 Henkel Ag & Co. Kgaa Verbinden von Rohren mit thermisch härtbaren Klebstoffen
EP2135909B1 (en) * 2008-06-12 2018-01-10 Henkel IP & Holding GmbH Next generation, highly toughened two part structural epoxy adhesive compositions
DE102008034105A1 (de) 2008-07-21 2010-01-28 Henkel Ag & Co. Kgaa Verbinden von Rohren mittels einer Hülse und einem thermisch expandierbaren Klebstoff
DE102009028100A1 (de) * 2009-07-29 2011-02-03 Henkel Ag & Co. Kgaa Schlagzähmodifizierte Zusammensetzung auf Epoxidharzbasis
DE102009028180A1 (de) 2009-08-03 2011-02-10 Henkel Ag & Co. Kgaa Verfahren zum Befestigen eines Magneten auf oder in einem Rotor oder Stator
EP2473573B1 (en) 2009-08-31 2018-06-13 Cytec Technology Corporation High performance adhesive compositions
DE102009045903A1 (de) 2009-10-21 2011-04-28 Henkel Ag & Co. Kgaa Schlagzähe, bei Raumtemperatur härtende zweikomponentige Masse auf Epoxidbasis
DE102010004792A1 (de) 2010-01-16 2011-07-28 Aktiebolaget Skf Verfahren zum Festlegen eines Lagerrings an oder in einem Bauteil
JP5597498B2 (ja) * 2010-09-22 2014-10-01 電気化学工業株式会社 エポキシ樹脂組成物、回路基板及び発光装置
MX2013003295A (es) 2010-09-23 2013-05-22 Henkel Corp Composicion epoxica resistente a vapor quimico.
DE102011003915A1 (de) 2011-02-10 2012-08-16 Aktiebolaget Skf Dichtungsanordnung
DE102011005500A1 (de) 2011-03-14 2012-09-20 Aktiebolaget Skf Lagerring eines Gleit- oder Wälzlagers
WO2015011687A1 (en) 2013-07-26 2015-01-29 Zephyros Inc Thermosetting adhesive films including a fibrous carrier
DE102014226826A1 (de) 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Epoxidharz-Zusammensetzung
WO2016179010A1 (en) 2015-05-01 2016-11-10 Lord Corporation Adhesive for rubber bonding
CN108603009B (zh) 2016-02-29 2020-10-20 三菱化学株式会社 环氧树脂组合物、成型材料及纤维增强复合材料
EP3595892B1 (en) 2017-03-13 2023-07-05 Zephyros Inc. Composite sandwich panel comprising honeycomb core and layer of damping or attenuation material
EP3611210B1 (en) 2017-04-12 2024-02-07 Mitsubishi Chemical Corporation Sheet molding compound and fiber-reinforced composite material
EP3724290A1 (en) 2017-12-15 2020-10-21 3M Innovative Properties Company High temperature structural adhesive films
WO2020022796A1 (ko) 2018-07-25 2020-01-30 주식회사 엘지화학 접착제 조성물
EP3825377B1 (en) 2018-07-25 2022-11-02 LG Chem, Ltd. Adhesive composition
KR102230946B1 (ko) 2018-07-25 2021-03-23 주식회사 엘지화학 접착제 조성물
KR102230945B1 (ko) 2018-07-25 2021-03-23 주식회사 엘지화학 접착제 조성물
KR102183705B1 (ko) 2018-07-25 2020-11-27 주식회사 엘지화학 접착제 조성물
JP7179151B2 (ja) 2018-07-25 2022-11-28 エルジー・ケム・リミテッド 接着剤組成物
CN112469797B (zh) * 2018-07-25 2022-12-27 株式会社Lg化学 粘合剂组合物
CN112654666A (zh) 2018-09-05 2021-04-13 三菱化学株式会社 片状模塑料及纤维增强复合材料
JP7654552B2 (ja) 2019-09-27 2025-04-01 株式会社カネカ 接着剤、および接着剤の製造方法
EP3822078A1 (de) * 2019-11-15 2021-05-19 voestalpine Stahl GmbH Elektroband oder -blech, verfahren zur herstellung solch eines elektrobands oder -blechs sowie blechpaket daraus

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Also Published As

Publication number Publication date
JPH0288685A (ja) 1990-03-28
EP0354498B1 (de) 1999-10-20
DE3827626A1 (de) 1990-03-08
DE58909861D1 (de) 1999-11-25
JP2689992B2 (ja) 1997-12-10
ATE185830T1 (de) 1999-11-15
EP0354498A2 (de) 1990-02-14
US5084532A (en) 1992-01-28
AU3932289A (en) 1990-02-15
DE3827626C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-03-07
ES2138954T3 (es) 2000-02-01
CA1341122C (en) 2000-10-17
EP0354498A3 (de) 1991-07-03

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Legal Events

Date Code Title Description
MK14 Patent ceased section 143(a) (annual fees not paid) or expired