AU2715088A - Epoxy resin compositions for use in low temperature curing applications - Google Patents

Epoxy resin compositions for use in low temperature curing applications

Info

Publication number
AU2715088A
AU2715088A AU27150/88A AU2715088A AU2715088A AU 2715088 A AU2715088 A AU 2715088A AU 27150/88 A AU27150/88 A AU 27150/88A AU 2715088 A AU2715088 A AU 2715088A AU 2715088 A AU2715088 A AU 2715088A
Authority
AU
Australia
Prior art keywords
epoxy resin
low temperature
resin compositions
temperature curing
curing applications
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
AU27150/88A
Other versions
AU610959B2 (en
Inventor
Paul M. Puckett
Paul L. Wykowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Chemical Co
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/116,593 external-priority patent/US4798761A/en
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of AU2715088A publication Critical patent/AU2715088A/en
Application granted granted Critical
Publication of AU610959B2 publication Critical patent/AU610959B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5026Amines cycloaliphatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/38Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2221Coating or impregnation is specified as water proof
    • Y10T442/2246Nitrogen containing
AU27150/88A 1987-11-03 1988-10-21 Epoxy resin compositions for use in low temperature curing applications Ceased AU610959B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/116,593 US4798761A (en) 1987-11-03 1987-11-03 Epoxy resin compositions for use in low temperature curing applications
US116593 1987-11-03
PCT/US1988/003725 WO1989004335A1 (en) 1987-11-03 1988-10-21 Epoxy resin compositions for use in low temperature curing applications

Publications (2)

Publication Number Publication Date
AU2715088A true AU2715088A (en) 1989-06-01
AU610959B2 AU610959B2 (en) 1991-05-30

Family

ID=26777956

Family Applications (1)

Application Number Title Priority Date Filing Date
AU27150/88A Ceased AU610959B2 (en) 1987-11-03 1988-10-21 Epoxy resin compositions for use in low temperature curing applications

Country Status (2)

Country Link
AU (1) AU610959B2 (en)
NO (1) NO892723D0 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58183723A (en) * 1982-04-21 1983-10-27 Toho Rayon Co Ltd Epoxy resin composition and prepreg
US4524181A (en) * 1983-08-11 1985-06-18 Minnesota Mining And Manufacturing Company Curable epoxy compositions and cured resins obtained therefrom
US4680076A (en) * 1986-08-28 1987-07-14 Hercules Incorporated Multiphase epoxy thermosets having rubber within disperse phase

Also Published As

Publication number Publication date
NO892723L (en) 1989-06-30
AU610959B2 (en) 1991-05-30
NO892723D0 (en) 1989-06-30

Similar Documents

Publication Publication Date Title
IL88200A0 (en) Epoxy resin compositions for use in low temperature curing applications
AU577586B2 (en) Epoxy resin curing agent
GB2202538B (en) Resin composition curable at low temperature
EP0282977A3 (en) Epoxy resin composition
EP0321407A3 (en) Flexibilised epoxy resin compositions
AU1096488A (en) High temperature epoxy resin tooling composition
AU7798187A (en) Thermosetting resin composition
AU569456B2 (en) Epoxy resin composition
AU576368B2 (en) Epoxy resin composition in two separate parts
GB2212165B (en) Resin composition curable at low temperature
EP0411834A3 (en) Epoxy resin composition
EP0319084A3 (en) Curable epoxy resin composition
AU1373788A (en) Molding resin composition
EP0264882A3 (en) Epoxy resin composition
AU570708B2 (en) Curable epoxy resin composition
AU7094987A (en) Epoxy resin composition
EP0293843A3 (en) Epoxy resin composition
AU566647B2 (en) Curable epoxy resin molding composition
KR0136590B1 (en) Epoxy resin composition
EP0247568A3 (en) Epoxy resin composition
GB2226029B (en) Epoxy resin compositions
EP0418888A3 (en) Epoxy resin composition
AU8931982A (en) Epoxy resin composition
AU3203789A (en) Advanced epoxy resin compositions
EP0434275A3 (en) Low-temperature curing epoxy resin composition