BRPI0809752B1 - "adesivo estrutural de um componente e método" - Google Patents

"adesivo estrutural de um componente e método" Download PDF

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Publication number
BRPI0809752B1
BRPI0809752B1 BRPI0809752A BRPI0809752A BRPI0809752B1 BR PI0809752 B1 BRPI0809752 B1 BR PI0809752B1 BR PI0809752 A BRPI0809752 A BR PI0809752A BR PI0809752 A BRPI0809752 A BR PI0809752A BR PI0809752 B1 BRPI0809752 B1 BR PI0809752B1
Authority
BR
Brazil
Prior art keywords
rubber
structural adhesive
epoxy resin
adhesive
weight percent
Prior art date
Application number
BRPI0809752A
Other languages
English (en)
Portuguese (pt)
Inventor
Lutz Andreas
G Eagle Glenn
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Publication of BRPI0809752A2 publication Critical patent/BRPI0809752A2/pt
Publication of BRPI0809752B1 publication Critical patent/BRPI0809752B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BRPI0809752A 2007-04-11 2008-04-09 "adesivo estrutural de um componente e método" BRPI0809752B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US92287707P 2007-04-11 2007-04-11
US60/922,877 2007-04-11
PCT/US2008/059696 WO2008127923A2 (en) 2007-04-11 2008-04-09 Heat-resistant structural epoxy resins

Publications (2)

Publication Number Publication Date
BRPI0809752A2 BRPI0809752A2 (pt) 2014-09-30
BRPI0809752B1 true BRPI0809752B1 (pt) 2017-05-16

Family

ID=39639648

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0809752A BRPI0809752B1 (pt) 2007-04-11 2008-04-09 "adesivo estrutural de um componente e método"

Country Status (8)

Country Link
US (2) US8097119B2 (https=)
EP (1) EP2137277B1 (https=)
JP (1) JP5390505B2 (https=)
KR (1) KR101467602B1 (https=)
CN (1) CN101679828B (https=)
AT (1) ATE510897T1 (https=)
BR (1) BRPI0809752B1 (https=)
WO (1) WO2008127923A2 (https=)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BRPI0911723A2 (pt) * 2008-07-29 2015-10-06 Dow Global Technologies Llc painel veicular reforçado, método para preparar um painel veicular reforçado, estrutura de carroceria veicular e método para preparar uma estrutura de carroceria veicular
US9528035B2 (en) 2009-09-11 2016-12-27 3M Innovative Properties Company Curable and cured adhesive compositions
WO2011031399A1 (en) 2009-09-11 2011-03-17 3M Innovative Properties Company Curable and cured adhesive compositions
US20110294963A1 (en) * 2010-05-27 2011-12-01 Far East University Method of toughening epoxy resin and toughened epoxy resin composite
US9624411B2 (en) 2010-07-01 2017-04-18 David W. Carnahan Vacuum infusion adhesive and methods related thereto
US20120299216A1 (en) * 2010-07-01 2012-11-29 Westech Aerosol Corporation Vacuum Infusion Adhesive and Methods Related Thereto
EP2638093B1 (en) 2010-11-12 2018-08-01 3M Innovative Properties Company Curable compositions
CN103189411B (zh) 2010-11-12 2015-11-25 3M创新有限公司 可固化组合物和已固化组合物
US8796361B2 (en) 2010-11-19 2014-08-05 Ppg Industries Ohio, Inc. Adhesive compositions containing graphenic carbon particles
US20120129980A1 (en) * 2010-11-19 2012-05-24 Ppg Industries Ohio, Inc. Structural adhesive compositions
US20140150970A1 (en) 2010-11-19 2014-06-05 Ppg Industries Ohio, Inc. Structural adhesive compositions
US9074040B2 (en) * 2010-12-20 2015-07-07 Mitsui Chemicals, Inc. Curable adhesive compositions
EP2748223B1 (en) * 2011-08-22 2018-10-31 Dow Global Technologies LLC Toughener and toughened epoxy adhesive
CN102391816B (zh) * 2011-10-15 2013-07-03 北京天诚宇新材料技术有限公司 一种高温修补剂
EP2828321B1 (en) 2012-03-23 2016-04-27 Dow Global Technologies LLC Flame retardant structural epoxy resin adhesives and process for bonding metal members
US9840070B2 (en) 2012-03-23 2017-12-12 Dow Global Technologies Llc Crash-durable adhesive with enhanced stress durability
US11008505B2 (en) 2013-01-04 2021-05-18 Carbo Ceramics Inc. Electrically conductive proppant
CN103317582B (zh) * 2013-04-23 2016-01-06 浙江林碳木业科技有限公司 一种带有表面凹凸立体浮雕效果的指接板的制造方法
CA2909939C (en) 2013-04-26 2022-11-22 Carbo Ceramics Inc. Compositions and methods for use of proppant surface chemistry to improve proppant consolidation and flowback control
US10047254B2 (en) 2013-09-23 2018-08-14 Bondek Corporation Curable composite manufacturing adhesive
JP6302207B2 (ja) * 2013-10-16 2018-03-28 株式会社カネカ 車両用部材の製造方法
ES2739853T3 (es) 2013-10-29 2020-02-04 Kaneka Corp Composición de resina curable que contiene partículas finas de polímero y que tiene estabilidad en almacenamiento mejorada
CN103665324B (zh) * 2013-11-14 2015-10-07 昆山珍实复合材料有限公司 一种环氧树脂潜伏性固化剂及相应的环氧树脂涂料
GB201411586D0 (en) * 2014-06-30 2014-08-13 Hexcel Composites Ltd Adhesive composition
WO2016007324A1 (en) * 2014-07-08 2016-01-14 Dow Global Technologies Llc DELAYED CURING HIGH Tg CRASH DURABLE ADHESIVE
US20170218237A1 (en) 2014-08-12 2017-08-03 3M Innovative Properties Company Film adhesive
CN104356985B (zh) * 2014-10-15 2016-08-10 安徽蓝翔电器成套设备有限公司 变压器灌封胶及其制备方法和应用
CN104293270B (zh) * 2014-10-31 2015-11-04 浙江红高梁木业有限公司 一种用于木地板的环氧树脂胶粘剂及其制备方法
BR112017020593A2 (pt) 2015-03-27 2018-07-03 Carbo Ceramics Inc métodos e composições para uso de química de superfície escorante e porosidade interna para consolidar particulados escorantes
US10017673B2 (en) * 2015-04-09 2018-07-10 Kaneka Corporation Polymer fine particle-containing curable resin composition having improved bonding strength against impact peeling
JP2018522954A (ja) 2015-05-01 2018-08-16 ロード コーポレイション ゴム接合用接着剤
CN105062393B (zh) * 2015-07-30 2017-08-04 烟台德邦科技有限公司 一种快速粘接且快速分离的胶粘剂及其制备方法
WO2017044359A1 (en) * 2015-09-10 2017-03-16 Dow Global Technologies Llc High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillers
CN106589805A (zh) * 2015-10-14 2017-04-26 中国石油化工股份有限公司 一种增韧复合环氧树脂组成物及其制备方法
EP3170860B1 (en) 2015-11-19 2020-07-29 3M Innovative Properties Company Structural adhesive with improved corrosion resistance
EP3170877B1 (en) 2015-11-19 2020-11-18 3M Innovative Properties Company Structural adhesive with improved failure mode
US10377928B2 (en) 2015-12-10 2019-08-13 Ppg Industries Ohio, Inc. Structural adhesive compositions
US10351661B2 (en) 2015-12-10 2019-07-16 Ppg Industries Ohio, Inc. Method for producing an aminimide
WO2017109620A1 (en) * 2015-12-22 2017-06-29 Aditya Birla Chemicals Thailand Epoxy Division An epoxy resin component for an adhesive composition
JP6884979B2 (ja) * 2016-03-09 2021-06-09 株式会社スリーボンド 硬化性樹脂組成物、燃料電池およびシール方法
JP6955661B2 (ja) * 2016-06-28 2021-10-27 株式会社スリーボンド エポキシ樹脂組成物
WO2018012631A1 (ja) * 2016-07-14 2018-01-18 株式会社スリーボンド 硬化性樹脂組成物、硬化物、燃料電池およびシール方法
CN106674944A (zh) * 2016-12-06 2017-05-17 云南光电辅料有限公司 一种不饱和聚酯复合材料及其分解回收方法
JP6872944B2 (ja) * 2017-03-27 2021-05-19 セメダイン株式会社 低温加熱硬化型構造用接着剤組成物
KR101967043B1 (ko) * 2017-05-12 2019-04-08 부산대학교 산학협력단 높은 연신율 및 내충격성을 갖는 구조용 접착제 조성물
US11739241B2 (en) 2017-06-23 2023-08-29 Ddp Specialty Electronic Material Us, Llc High temperature epoxy adhesive formulations
US20190002686A1 (en) 2017-06-29 2019-01-03 Dow Global Technologies Llc Epoxy-fiber reinforced composites, method to form the composites and epoxy resin composition used therefor
CN111630130B (zh) * 2017-09-12 2022-09-30 Ddp特种电子材料美国公司 单组分增韧的环氧胶粘剂
JP7299058B2 (ja) * 2018-04-27 2023-06-27 ナガセケムテックス株式会社 接着剤
CN112135869A (zh) 2018-06-05 2020-12-25 陶氏环球技术有限责任公司 将环氧-纤维复合材料回收到聚烯烃中的方法
US12146079B2 (en) 2018-07-25 2024-11-19 Lg Chem, Ltd. Adhesive composition
US12157839B2 (en) 2018-07-25 2024-12-03 Lg Chem, Ltd. Adhesive composition
JP7167301B2 (ja) * 2018-07-25 2022-11-08 エルジー・ケム・リミテッド 接着剤組成物
WO2020022798A1 (ko) 2018-07-25 2020-01-30 주식회사 엘지화학 접착제 조성물
JP7179151B2 (ja) 2018-07-25 2022-11-28 エルジー・ケム・リミテッド 接着剤組成物
CN112449650B (zh) 2018-07-25 2023-03-28 株式会社Lg化学 粘合剂组合物
KR102183704B1 (ko) 2018-07-25 2020-11-27 주식회사 엘지화학 접착제 조성물
EP3798246B1 (en) * 2019-09-27 2024-01-31 Henkel AG & Co. KGaA One component (1k) composition based on modified epoxy resin
WO2022050005A1 (ja) * 2020-09-07 2022-03-10 株式会社スリーボンド エポキシ樹脂組成物
FR3118966B1 (fr) * 2021-01-18 2024-03-01 Gaztransport Et Technigaz Composition d’adhésif époxy comprenant des nanoparticules d’élastomère, et leurs utilisations
US12110425B2 (en) 2021-08-17 2024-10-08 Uniseal, Inc. Electromagnetic curable novel toughened epoxy-hybrid structural adhesives and applications using the same
EP4148098A1 (en) 2021-09-08 2023-03-15 Sika Technology AG Expandable one-component thermosetting epoxy adhesive with improved adhesion
WO2024262261A1 (ja) * 2023-06-22 2024-12-26 株式会社スリーボンド エポキシ樹脂組成物およびその硬化物
WO2026062466A1 (en) * 2024-09-17 2026-03-26 3M Innovative Properties Company Curable adhesive compositions with a low dielectric constant

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2006207A (en) * 1930-01-25 1935-06-25 Combustion Utilities Corp Oil-soluble synthetic resin and process for its manufacture
JPS59196377A (ja) * 1983-04-22 1984-11-07 Yokohama Rubber Co Ltd:The 構造用接着剤
US4594291A (en) * 1984-07-17 1986-06-10 The Dow Chemical Company Curable, partially advanced epoxy resins
US4948449A (en) * 1986-05-07 1990-08-14 Minnesota Mining And Manufacturing Company Epoxy resin composition
US5278257A (en) * 1987-08-26 1994-01-11 Ciba-Geigy Corporation Phenol-terminated polyurethane or polyurea(urethane) with epoxy resin
DE3818692A1 (de) * 1988-06-01 1989-12-07 Bayer Ag Verwendung von 1,1,1,4,4,4-hexafluorbutan als treib- und daemmgas fuer die herstellung von kunststoff-schaumstoffen
US5202390A (en) * 1988-07-28 1993-04-13 Ciba-Geigy Corporation Butadiene/polar comonomer copolymer and aromatic reactive end group-containing prepolymer
US5290857A (en) * 1991-09-04 1994-03-01 Nippon Zeon Co., Ltd. Epoxy resin adhesive composition
JP3655646B2 (ja) * 1993-05-24 2005-06-02 日産自動車株式会社 エポキシ樹脂用接着補強剤及び該補強剤を含有する自動車用エポキシ樹脂系構造接着性組成物
JP3229467B2 (ja) * 1993-12-03 2001-11-19 三菱レイヨン株式会社 エポキシ樹脂組成物
US20040181013A1 (en) * 1998-10-06 2004-09-16 Henkel Teroson Gmbh Impact resistant epoxide resin compositions
DE19858921A1 (de) * 1998-12-19 2000-06-21 Henkel Teroson Gmbh Schlagfeste Epoxidharz-Zusammensetzungen
KR20010081833A (ko) * 2000-02-19 2001-08-29 권문구 유리전이온도 조정에 의한 반도체 패키지용 드라이 패드형탄성접착제의 탄성률 고안
CN1250665C (zh) * 2000-04-10 2006-04-12 汉高两合股份公司 抗冲击环氧树脂组合物
DE10163859A1 (de) * 2001-12-22 2003-07-10 Henkel Kgaa Mehrphasige Strukturklebstoffe
US20030192643A1 (en) * 2002-03-15 2003-10-16 Rainer Schoenfeld Epoxy adhesive having improved impact resistance
US20030215588A1 (en) * 2002-04-09 2003-11-20 Yeager Gary William Thermoset composition, method, and article
EP1457509B1 (de) * 2003-03-11 2006-06-28 hanse chemie AG Polymere Epoxidharz-Zusammensetzung
ATE331748T1 (de) * 2003-03-11 2006-07-15 Hanse Chemie Ag Polymere epoxidharz-zusammensetzung
US8222324B2 (en) 2003-06-09 2012-07-17 Kaneka Corporation Process for producing modified epoxy resin
CA2529737C (en) * 2003-07-07 2013-05-07 Dow Global Technologies Inc. Adhesive epoxy composition and process for applying it
AU2003250972A1 (en) * 2003-07-14 2005-01-28 Mattex Leisure Industries Artificial turf filament and artificial turf system
EP1498441A1 (de) * 2003-07-16 2005-01-19 Sika Technology AG Hitzehärtende Zusammensetzungen mit Tieftemperatur-Schlagzähigkeitsmodifikatoren
ATE352576T1 (de) * 2004-03-12 2007-02-15 Dow Global Technologies Inc Epoxidharz klebstoffzusammensetzung
US20050215730A1 (en) * 2004-03-24 2005-09-29 Rainer Schoenfeld Polycarboxy-functionalized prepolymers
EP1602702B2 (en) 2004-06-01 2020-09-16 Dow Global Technologies LLC Epoxy adhesive composition
EP1695990A1 (en) * 2005-02-28 2006-08-30 Dow Global Technologies Inc. Two-component epoxy adhesive composition
DE602005020260D1 (de) * 2005-06-02 2010-05-12 Dow Global Technologies Inc Schlagzähmodifizierter Strukturklebstoff auf Epoxid Basis
KR101303246B1 (ko) * 2005-08-24 2013-09-06 헨켈 아일랜드 리미티드 개선된 내충격성을 갖는 에폭시 조성물

Also Published As

Publication number Publication date
JP5390505B2 (ja) 2014-01-15
US8097119B2 (en) 2012-01-17
KR20100016407A (ko) 2010-02-12
CN101679828A (zh) 2010-03-24
EP2137277A2 (en) 2009-12-30
US20120103517A1 (en) 2012-05-03
WO2008127923A3 (en) 2009-04-23
US8585861B2 (en) 2013-11-19
JP2010523800A (ja) 2010-07-15
WO2008127923A2 (en) 2008-10-23
ATE510897T1 (de) 2011-06-15
BRPI0809752A2 (pt) 2014-09-30
CN101679828B (zh) 2012-07-25
US20080251202A1 (en) 2008-10-16
KR101467602B1 (ko) 2014-12-01
EP2137277B1 (en) 2011-05-25

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B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]
B25D Requested change of name of applicant approved
B25A Requested transfer of rights approved
B25A Requested transfer of rights approved