CN101679828B - 耐热性结构环氧树脂 - Google Patents

耐热性结构环氧树脂 Download PDF

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Publication number
CN101679828B
CN101679828B CN2008800199253A CN200880019925A CN101679828B CN 101679828 B CN101679828 B CN 101679828B CN 2008800199253 A CN2008800199253 A CN 2008800199253A CN 200880019925 A CN200880019925 A CN 200880019925A CN 101679828 B CN101679828 B CN 101679828B
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Prior art keywords
rubber
structural adhesive
weight
adhesive
epoxy resin
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Chinese (zh)
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CN101679828A (zh
Inventor
格伦·G·伊尔高
安德烈斯·卢茨
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DDP Specialty Electronic Materials US LLC
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Dow Global Technologies LLC
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN2008800199253A 2007-04-11 2008-04-09 耐热性结构环氧树脂 Active CN101679828B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US92287707P 2007-04-11 2007-04-11
US60/922,877 2007-04-11
PCT/US2008/059696 WO2008127923A2 (en) 2007-04-11 2008-04-09 Heat-resistant structural epoxy resins

Publications (2)

Publication Number Publication Date
CN101679828A CN101679828A (zh) 2010-03-24
CN101679828B true CN101679828B (zh) 2012-07-25

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CN2008800199253A Active CN101679828B (zh) 2007-04-11 2008-04-09 耐热性结构环氧树脂

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US (2) US8097119B2 (https=)
EP (1) EP2137277B1 (https=)
JP (1) JP5390505B2 (https=)
KR (1) KR101467602B1 (https=)
CN (1) CN101679828B (https=)
AT (1) ATE510897T1 (https=)
BR (1) BRPI0809752B1 (https=)
WO (1) WO2008127923A2 (https=)

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Also Published As

Publication number Publication date
JP5390505B2 (ja) 2014-01-15
US8097119B2 (en) 2012-01-17
KR20100016407A (ko) 2010-02-12
CN101679828A (zh) 2010-03-24
EP2137277A2 (en) 2009-12-30
US20120103517A1 (en) 2012-05-03
WO2008127923A3 (en) 2009-04-23
US8585861B2 (en) 2013-11-19
JP2010523800A (ja) 2010-07-15
BRPI0809752B1 (pt) 2017-05-16
WO2008127923A2 (en) 2008-10-23
ATE510897T1 (de) 2011-06-15
BRPI0809752A2 (pt) 2014-09-30
US20080251202A1 (en) 2008-10-16
KR101467602B1 (ko) 2014-12-01
EP2137277B1 (en) 2011-05-25

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