BRPI0608290A2 - composto de polivinilamÈnio, método de produção do composto, solução ácida contendo esse composto e método de eletroliticamente depositar um depósito de cobre - Google Patents
composto de polivinilamÈnio, método de produção do composto, solução ácida contendo esse composto e método de eletroliticamente depositar um depósito de cobreInfo
- Publication number
- BRPI0608290A2 BRPI0608290A2 BRPI0608290-4A BRPI0608290A BRPI0608290A2 BR PI0608290 A2 BRPI0608290 A2 BR PI0608290A2 BR PI0608290 A BRPI0608290 A BR PI0608290A BR PI0608290 A2 BRPI0608290 A2 BR PI0608290A2
- Authority
- BR
- Brazil
- Prior art keywords
- compound
- polyvinylammonium
- solution containing
- electrolytically depositing
- acid solution
- Prior art date
Links
- 150000001875 compounds Chemical class 0.000 title abstract 11
- 238000000151 deposition Methods 0.000 title abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 239000010949 copper Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 3
- 239000002253 acid Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 230000002378 acidificating effect Effects 0.000 abstract 2
- 239000007864 aqueous solution Substances 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 2
- 239000000178 monomer Substances 0.000 abstract 1
- 230000007935 neutral effect Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/02—Acids; Metal salts or ammonium salts thereof, e.g. maleic acid or itaconic acid
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
- C08F226/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a single or double bond to nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/02—Alkylation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/44—Preparation of metal salts or ammonium salts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2800/00—Copolymer characterised by the proportions of the comonomers expressed
- C08F2800/10—Copolymer characterised by the proportions of the comonomers expressed as molar percentages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
COMPOSTO DE POLIVINILAMÈNIO, MéTODO DE PRODUçãO DO COMPOSTO, SOLUçãO áCIDA CONTENDO ESSE COMPOSTO E MéTODO DE ELETROLITICAMENTE DEPOSITAR UM DEPóSITO DE COBRE. A presente invenção refere-se a um composto de polivinilamónio, a um método de produção desse composto, a uma solução aquosa ácida contendo pelo menos o composto de polivinilamónio para eletroliticamente depositar um depósito de cobre, bem como a um método de eletroliticamente depositar um depósito de cobre usando a solução aquosa ácida, esse composto de polivinilamónio correspondendo à formula química geral (1): bem como a compostos de polivinilamónio da fórmula química geral (1), em que uma das unidades monoméricas ou ambas que apresentam índices 1 e m estão presentes na forma neutra.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005011708A DE102005011708B3 (de) | 2005-03-11 | 2005-03-11 | Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages |
| PCT/EP2006/002064 WO2006094755A1 (en) | 2005-03-11 | 2006-03-01 | Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0608290A2 true BRPI0608290A2 (pt) | 2009-12-22 |
Family
ID=36569982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0608290-4A BRPI0608290A2 (pt) | 2005-03-11 | 2006-03-01 | composto de polivinilamÈnio, método de produção do composto, solução ácida contendo esse composto e método de eletroliticamente depositar um depósito de cobre |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US8114263B2 (pt) |
| EP (1) | EP1856167B1 (pt) |
| JP (1) | JP5103372B2 (pt) |
| KR (1) | KR101242879B1 (pt) |
| CN (1) | CN101137680B (pt) |
| BR (1) | BRPI0608290A2 (pt) |
| CA (1) | CA2599183C (pt) |
| DE (1) | DE102005011708B3 (pt) |
| ES (1) | ES2543805T3 (pt) |
| MY (1) | MY142821A (pt) |
| TW (1) | TWI379841B (pt) |
| WO (1) | WO2006094755A1 (pt) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005007819A2 (en) | 2003-07-09 | 2005-01-27 | Wisconsin Alumni Research Foundation | Charge-dynamic polymers and delivery of anionic compounds |
| JP4816901B2 (ja) * | 2005-11-21 | 2011-11-16 | 上村工業株式会社 | 電気銅めっき浴 |
| JP2008088524A (ja) * | 2006-10-04 | 2008-04-17 | Ebara Udylite Kk | プリント基板用硫酸銅めっき液 |
| US7557049B2 (en) * | 2006-10-30 | 2009-07-07 | Nitto Denko Corporation | Producing method of wired circuit board |
| US8679317B2 (en) | 2007-05-21 | 2014-03-25 | C. Uyemura & Co., Ltd. | Copper electroplating bath |
| US20090105375A1 (en) * | 2007-10-09 | 2009-04-23 | Lynn David M | Ultrathin Multilayered Films for Controlled Release of Anionic Reagents |
| US8062760B2 (en) * | 2008-06-19 | 2011-11-22 | Basf Coatings Gmbh | Electrocoat composition and process |
| WO2014162875A1 (ja) * | 2013-04-02 | 2014-10-09 | 株式会社Adeka | 電解銅めっき浴用添加剤、該添加剤を含む電解銅めっき浴および該電解銅めっき浴を用いた電解銅めっき方法 |
| EP3344800B1 (en) * | 2015-08-31 | 2019-03-13 | ATOTECH Deutschland GmbH | Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate |
| WO2017090161A1 (ja) * | 2015-11-26 | 2017-06-01 | 近藤 和夫 | 酸性銅めっき液、酸性銅めっき物および半導体デバイスの製造方法 |
| CN105316715B (zh) * | 2015-12-09 | 2018-02-02 | 上海新阳半导体材料股份有限公司 | 一种电镀铜用抑制剂及其用途 |
| US10100420B2 (en) * | 2015-12-29 | 2018-10-16 | Hong Kong Applied Science and Technology Research Institute Company Limtied | Plating leveler for electrodeposition of copper pillar |
| ES2761883T3 (es) | 2017-06-16 | 2020-05-21 | Atotech Deutschland Gmbh | Baño de galvanoplastia de cobre ácido acuoso y método para depositar electrolíticamente un revestimiento de cobre |
| CN113278104A (zh) * | 2021-05-10 | 2021-08-20 | 江苏理工学院 | 一种季铵盐表面活性剂及其制备方法 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE520209A (pt) | 1952-05-26 | |||
| DE933843C (de) | 1953-02-26 | 1955-10-06 | Hesse & Cie | Glanzzusatz fuer galvanische Baeder |
| DE1152863B (de) | 1957-03-16 | 1963-08-14 | Riedel & Co | Saure Baeder zur Herstellung von einebnenden Kupferueberzuegen |
| DE1165962B (de) | 1957-03-16 | 1964-03-19 | Riedel & Co | Saure Baeder zur Herstellung von einebnenden Kupferueberzuegen |
| DE1218247B (de) | 1960-06-09 | 1966-06-02 | Riedel & Co | Saures galvanisches Kupferbad |
| US3102831A (en) * | 1960-08-10 | 1963-09-03 | Molybdenum Corp | Production of columbium containing steels |
| NL291575A (pt) | 1962-04-16 | |||
| DE1246347B (de) | 1966-03-08 | 1967-08-03 | Schering Ag | Saures galvanisches Kupferbad |
| SE322956B (pt) * | 1966-08-20 | 1970-04-20 | Schering Ag | |
| DE2039831C3 (de) | 1970-06-06 | 1979-09-06 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Saures Bad zur galvanischen Abscheidung glänzender Kupferüberzüge |
| US3770598A (en) * | 1972-01-21 | 1973-11-06 | Oxy Metal Finishing Corp | Electrodeposition of copper from acid baths |
| IT1046971B (it) * | 1975-03-11 | 1980-09-10 | Oxy Metal Industries Corp | Begno per l elettrodeposizione di rame e metodo per prepararlo |
| JPS5275621A (en) * | 1975-12-19 | 1977-06-24 | Furukawa Electric Co Ltd | Tinnplated coated product |
| US4038161A (en) | 1976-03-05 | 1977-07-26 | R. O. Hull & Company, Inc. | Acid copper plating and additive composition therefor |
| DE2746938A1 (de) | 1977-10-17 | 1979-04-19 | Schering Ag | Saures galvanisches kupferbad |
| JPS57114685A (en) * | 1981-01-07 | 1982-07-16 | Kuraray Co Ltd | Brightener for plating bath |
| US4376685A (en) | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| FI70230C (fi) | 1981-07-18 | 1986-09-15 | Basf Ag | Rakkedjiga basiska polymerisat foerfarande foer deras framstaellning och deras anvaendning |
| JPS59501829A (ja) | 1982-09-30 | 1984-11-01 | リ−ロ−ナル インコ−ポレ−テツド | 電気銅メッキ液 |
| DE3534273A1 (de) * | 1985-09-26 | 1987-04-02 | Basf Ag | Verfahren zur herstellung von vinylamin-einheiten enthaltenden wasserloeslichen copolymerisaten und deren verwendung als nass- und trockenverfestigungsmittel fuer papier |
| US5232575A (en) | 1990-07-26 | 1993-08-03 | Mcgean-Rohco, Inc. | Polymeric leveling additive for acid electroplating baths |
| ES2076056T3 (es) * | 1992-01-25 | 1995-10-16 | Basf Ag | Procedimiento para la obtencion de piezas moldeadas niqueladas. |
| JPH0732823A (ja) | 1993-07-15 | 1995-02-03 | Bridgestone Corp | 空気入り安全タイヤ |
| JP3478871B2 (ja) * | 1994-06-15 | 2003-12-15 | 栗田工業株式会社 | 高分子凝集剤 |
| JP3442514B2 (ja) * | 1994-11-18 | 2003-09-02 | 栗田工業株式会社 | カチオン性重合体の製造方法 |
| DE19643091B4 (de) | 1996-10-18 | 2006-11-23 | Raschig Gmbh | Verwendung von wasserlöslichen Reaktionsprodukten aus Polyamidoaminen, Polyaminen und Epihalogenhydrin in galvanischen Bädern sowie Verfahren zu ihrer Herstellung und galvanische Bäder, die diese enthalten |
| DE19758121C2 (de) | 1997-12-17 | 2000-04-06 | Atotech Deutschland Gmbh | Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten |
| US8002962B2 (en) | 2002-03-05 | 2011-08-23 | Enthone Inc. | Copper electrodeposition in microelectronics |
| JP4534460B2 (ja) | 2002-11-11 | 2010-09-01 | 凸版印刷株式会社 | 銅めっき硬度維持剤及び銅めっき方法並びにそれを用いたグラビア版、レンズ金型 |
| DE10261852B3 (de) | 2002-12-20 | 2004-06-03 | Atotech Deutschland Gmbh | Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad |
| JP2005029818A (ja) * | 2003-07-09 | 2005-02-03 | Ebara Corp | めっき方法 |
-
2005
- 2005-03-11 DE DE102005011708A patent/DE102005011708B3/de not_active Expired - Fee Related
-
2006
- 2006-03-01 KR KR1020077020833A patent/KR101242879B1/ko active IP Right Grant
- 2006-03-01 CA CA2599183A patent/CA2599183C/en not_active Expired - Fee Related
- 2006-03-01 EP EP06723262.9A patent/EP1856167B1/en not_active Not-in-force
- 2006-03-01 BR BRPI0608290-4A patent/BRPI0608290A2/pt not_active IP Right Cessation
- 2006-03-01 CN CN2006800078743A patent/CN101137680B/zh not_active Expired - Fee Related
- 2006-03-01 ES ES06723262.9T patent/ES2543805T3/es active Active
- 2006-03-01 JP JP2008500108A patent/JP5103372B2/ja not_active Expired - Fee Related
- 2006-03-01 WO PCT/EP2006/002064 patent/WO2006094755A1/en active Application Filing
- 2006-03-01 US US11/816,717 patent/US8114263B2/en not_active Expired - Fee Related
- 2006-03-08 MY MYPI20060986A patent/MY142821A/en unknown
- 2006-03-10 TW TW095108233A patent/TWI379841B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR101242879B1 (ko) | 2013-03-13 |
| EP1856167B1 (en) | 2015-05-06 |
| DE102005011708B3 (de) | 2007-03-01 |
| CN101137680A (zh) | 2008-03-05 |
| CN101137680B (zh) | 2011-08-17 |
| US8114263B2 (en) | 2012-02-14 |
| CA2599183C (en) | 2013-05-14 |
| US20080210569A1 (en) | 2008-09-04 |
| WO2006094755A1 (en) | 2006-09-14 |
| KR20080000563A (ko) | 2008-01-02 |
| MY142821A (en) | 2011-01-14 |
| EP1856167A1 (en) | 2007-11-21 |
| CA2599183A1 (en) | 2006-09-14 |
| JP2008533224A (ja) | 2008-08-21 |
| ES2543805T3 (es) | 2015-08-24 |
| TW200640965A (en) | 2006-12-01 |
| TWI379841B (en) | 2012-12-21 |
| JP5103372B2 (ja) | 2012-12-19 |
| WO2006094755A8 (en) | 2007-04-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 10A ANUIDADE. |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2366 DE 10-05-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |