BRPI0606914A2 - materiais de moldagem termoplásticos, uso dos mesmos, e, fibras, filmes e peça moldada de qualquer tipo - Google Patents

materiais de moldagem termoplásticos, uso dos mesmos, e, fibras, filmes e peça moldada de qualquer tipo

Info

Publication number
BRPI0606914A2
BRPI0606914A2 BRPI0606914-2A BRPI0606914A BRPI0606914A2 BR PI0606914 A2 BRPI0606914 A2 BR PI0606914A2 BR PI0606914 A BRPI0606914 A BR PI0606914A BR PI0606914 A2 BRPI0606914 A2 BR PI0606914A2
Authority
BR
Brazil
Prior art keywords
weight
films
fibers
thermoplastic molding
molded parts
Prior art date
Application number
BRPI0606914-2A
Other languages
English (en)
Inventor
Peter Eibeck
Jochen Engelmann
Ralf Neuhaus
Michael Fischer
Bernd Bruchmann
Original Assignee
Basf Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Ag filed Critical Basf Ag
Publication of BRPI0606914A2 publication Critical patent/BRPI0606914A2/pt
Publication of BRPI0606914B1 publication Critical patent/BRPI0606914B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/02—Polyamines

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Artificial Filaments (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)

Abstract

MATERIAIS DE MOLDAGEM TERMOPLáSTICOS, USO DOS MESMOS, E, FIBRAS, FILMES E PEçA MOLDADA DE QUALQUER TIPO. São divulgados materiais de moldagem termoplásticos que contêm: A) desde 10 até 99% em peso de pelo menos uma poliamida termoplástica; B) desde 0,1 até 5% em peso de pelo menos um homo- ou copolímero de polietilenoimina; C) desde 0,05 até 3% em peso de um lubrificante; D) desde 0,05 até 3% em peso de um estabilizador que contém cobre ou de um fenol impedido estericamente ou misturas dos mesmos; E) desde O até 60% em peso de outros aditivos, a percentagem total em peso dos componentes A) a E) chegando a 100 por cento.
BRPI0606914A 2005-02-08 2006-02-08 materiais de moldagem termoplásticos, uso dos mesmos, e, fibras, filmes e peça moldada de qualquer tipo BRPI0606914B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005005847A DE102005005847A1 (de) 2005-02-08 2005-02-08 Wärmealterungsbeständige Polyamide
PCT/EP2006/050763 WO2006084862A1 (de) 2005-02-08 2006-02-08 Wärmealterungsbeständige polyamide

Publications (2)

Publication Number Publication Date
BRPI0606914A2 true BRPI0606914A2 (pt) 2009-12-01
BRPI0606914B1 BRPI0606914B1 (pt) 2017-04-04

Family

ID=36636651

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0606914A BRPI0606914B1 (pt) 2005-02-08 2006-02-08 materiais de moldagem termoplásticos, uso dos mesmos, e, fibras, filmes e peça moldada de qualquer tipo

Country Status (12)

Country Link
US (2) US20080262133A1 (pt)
EP (1) EP1851265B1 (pt)
JP (1) JP5118976B2 (pt)
KR (2) KR20130041392A (pt)
CN (1) CN101115786B (pt)
AT (1) ATE398645T1 (pt)
BR (1) BRPI0606914B1 (pt)
DE (2) DE102005005847A1 (pt)
ES (1) ES2306429T3 (pt)
MY (1) MY139749A (pt)
PL (1) PL1851265T3 (pt)
WO (1) WO2006084862A1 (pt)

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* Cited by examiner, † Cited by third party
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EP1683830A1 (en) 2005-01-12 2006-07-26 DSM IP Assets B.V. Heat stabilized moulding composition
EP1681313A1 (en) 2005-01-17 2006-07-19 DSM IP Assets B.V. Heat stabilized moulding composition
AU2007331458B2 (en) 2006-12-15 2013-06-13 Basf Se Polymer dispersions containing highly branched polycarbonates
BRPI0821235B1 (pt) * 2007-12-18 2018-12-18 Basf Se composição de moldagem termoplástica, usos de composto e de composição de moldagem termoplástica, e, fibra, folha, ou uma moldagem.
US7902287B2 (en) * 2008-01-21 2011-03-08 Basf Aktiengesellschaft Polyamide resin composition and method of preparing
JP2011515522A (ja) * 2008-03-18 2011-05-19 ビーエーエスエフ ソシエタス・ヨーロピア 超分岐ポリエーテルアミンとのポリアミド−ナノ複合材料
JP2011515523A (ja) * 2008-03-18 2011-05-19 ビーエーエスエフ ソシエタス・ヨーロピア 超分岐ポリエチレンイミンとのポリアミド−ナノ複合材料
MY156724A (en) * 2008-11-11 2016-03-15 Basf Se Stabilized polyamides
DE102008058246A1 (de) 2008-11-19 2010-05-20 Basf Se Hochmolekulare Polyamide
WO2010076145A1 (de) * 2008-12-16 2010-07-08 Basf Se Wärmealterungsbeständige polyamide
DE102010062538A1 (de) 2009-12-17 2011-06-22 Basf Se, 67063 Verfahren zur Herstellung geschweisster Formkörper aus Polyamid-6.10
US20120181487A1 (en) * 2011-01-18 2012-07-19 Basf Se Thermoplastic molding composition
WO2012115147A1 (ja) * 2011-02-22 2012-08-30 株式会社ブリヂストン ポリアミド樹脂組成物及びその製造方法並びに冷媒輸送用ホース
EP2570448A1 (de) * 2011-09-13 2013-03-20 Basf Se Verwendung von Polyethyleniminen in der Herstellung von Polyamiden
JP2015519465A (ja) 2012-06-13 2015-07-09 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ エポキシ−カルボン酸化合物熱安定剤を含む熱可塑性溶融混合組成物
US8871874B2 (en) 2012-06-13 2014-10-28 E I Du Pont De Nemours And Company Thermoplastic melt-mixed composition with epoxy-amino acid compound heat stabilizer and processes for their preparation
EP2861667A1 (en) 2012-06-13 2015-04-22 E.I. Du Pont De Nemours And Company Thermoplastic melt-mixed composition with polyetherol heat stabilizer
EP2861660B1 (en) 2012-06-13 2018-09-05 E. I. du Pont de Nemours and Company Thermoplastic melt-mixed composition with amino acid heat stabilizer
ES2624127T3 (es) * 2012-10-10 2017-07-13 Lanxess Deutschland Gmbh Masas de moldeo
ES2655563T3 (es) * 2013-08-21 2018-02-20 Basf Se Procedimiento para la producción de una pieza de plástico compuesto (CK)
CN105658400B (zh) * 2013-08-21 2017-08-18 巴斯夫欧洲公司 具有改进的耐热老化性的复合塑料部件
WO2015024912A1 (de) * 2013-08-21 2015-02-26 Basf Se Compositkunststoffteil mit verbesserter adhäsion zwischen den enthaltenen kunststoffkomponenten
JP2015199938A (ja) * 2014-04-03 2015-11-12 旭化成ケミカルズ株式会社 ポリアミド樹脂組成物及び成形品
CN104045922A (zh) * 2014-07-16 2014-09-17 苏州新区华士达工程塑胶有限公司 一种改良性epdm
JP6724368B2 (ja) * 2015-02-23 2020-07-15 東レ株式会社 成形品およびポリアミド樹脂組成物
CN108966653B (zh) 2016-10-18 2022-06-21 奥升德高性能材料公司 一种抗热老化的低卤素阻燃聚酰胺组合物
CN113166401A (zh) * 2018-12-10 2021-07-23 日本曹达株式会社 聚亚烷基亚胺改性的聚酰胺4
EP3670576B8 (de) 2018-12-19 2020-12-09 Ems-Chemie Ag Polyamid-formmassen für glasverbunde
BR112021015562A2 (pt) * 2019-03-06 2021-10-05 Basf Se Material de modelagem termoplástico, processo de produção de materiais de modelagem, usos e filme ou artigo moldado
MX2022010557A (es) * 2020-02-26 2022-09-23 Basf Se Composiciones de moldeo de poliamida resistentes al envejecimiento termico.
US20230129664A1 (en) 2020-03-25 2023-04-27 Basf Se Heat-aging resistant polyamide molding compositions
JPWO2023033043A1 (pt) * 2021-09-01 2023-03-09
CN115594966B (zh) * 2022-09-30 2024-01-02 上海金发科技发展有限公司 一种聚酰胺复合材料及其制备方法和应用

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JP3714788B2 (ja) * 1998-02-13 2005-11-09 旭化成ケミカルズ株式会社 成形特性に優れるポリアミド樹脂組成物のペレットの製造方法
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EP1065236B1 (de) * 1999-06-29 2003-09-24 Degussa AG Hochverzweigte Polyamid-Pfropfcopolymere
DE10030553A1 (de) * 2000-06-29 2002-01-10 Basf Ag Stabilisierte thermoplastische Formmassen
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JP4245327B2 (ja) * 2002-10-25 2009-03-25 旭化成ケミカルズ株式会社 ポリアミド樹脂組成物
EP1498445A1 (en) * 2003-07-18 2005-01-19 DSM IP Assets B.V. Heat stabilized moulding composition

Also Published As

Publication number Publication date
EP1851265A1 (de) 2007-11-07
WO2006084862A1 (de) 2006-08-17
KR20070102739A (ko) 2007-10-19
JP2008530290A (ja) 2008-08-07
ES2306429T3 (es) 2008-11-01
CN101115786A (zh) 2008-01-30
DE502006000958D1 (de) 2008-07-31
DE102005005847A1 (de) 2006-08-10
JP5118976B2 (ja) 2013-01-16
EP1851265B1 (de) 2008-06-18
ATE398645T1 (de) 2008-07-15
MY139749A (en) 2009-10-30
KR20130041392A (ko) 2013-04-24
US20080262133A1 (en) 2008-10-23
KR101278734B1 (ko) 2013-06-25
US20120149817A1 (en) 2012-06-14
PL1851265T3 (pl) 2008-11-28
BRPI0606914B1 (pt) 2017-04-04
CN101115786B (zh) 2012-06-20

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Legal Events

Date Code Title Description
B06G Technical and formal requirements: other requirements [chapter 6.7 patent gazette]

Free format text: SOLICITA-SE A REGULARIZACAO DA PROCURACAO, UMA VEZ QUE BASEADO NO ARTIGO 216 1O DA LPI, O DOCUMENTO DE PROCURACAO DEVE SER APRESENTADO EM SUA FORMA AUTENTICADA; OU SEGUNDO MEMO/INPI/PROC/NO 074/93, DEVE CONSTAR UMA DECLARACAO DE VERACIDADE, A QUAL DEVE SER ASSINADA POR UMA PESSOA DEVIDAMENTE AUTORIZADA A REPRESENTAR O INTERESSADO, DEVENDO A MESMA CONSTAR NO INSTRUMENTO DE PROCURACAO, OU NO SEU SUBSTABELECIMENTO.

B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]