BR9806136A - Substrato de carbureto de silìco e método para a produção do substrato, e dispositivo semicondutor utilizand o substrato. - Google Patents

Substrato de carbureto de silìco e método para a produção do substrato, e dispositivo semicondutor utilizand o substrato.

Info

Publication number
BR9806136A
BR9806136A BR9806136-4A BR9806136A BR9806136A BR 9806136 A BR9806136 A BR 9806136A BR 9806136 A BR9806136 A BR 9806136A BR 9806136 A BR9806136 A BR 9806136A
Authority
BR
Brazil
Prior art keywords
substrate
silicon carbide
producing
crystal
film
Prior art date
Application number
BR9806136-4A
Other languages
English (en)
Inventor
Makoto Kitabatake
Masao Uchida
Kunimasa Takahashi
Original Assignee
Matsushita Eletric Industrtial
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Eletric Industrtial filed Critical Matsushita Eletric Industrtial
Publication of BR9806136A publication Critical patent/BR9806136A/pt

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
    • H01L29/1608Silicon carbide
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/36Carbides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/04Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
    • H01L29/045Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/107Substrate region of field-effect devices
    • H01L29/1075Substrate region of field-effect devices of field-effect transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66053Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
    • H01L29/66068Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10S117/913Graphoepitaxy or surface modification to enhance epitaxy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12576Boride, carbide or nitride component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12674Ge- or Si-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Recrystallisation Techniques (AREA)

Abstract

Patente de Invenção: <B>"SUBSTRATO DE CARBURETO DE SILìCIO E MéTODO PARA A PRODUçãO DO SUBSTRATO, E DISPOSITIVO SEMI-CONDUTOR UTILIZANDO O SUBSTRATO". Uma película fina de carbureto de silício é epitaxialmetne desenvolvida por um método MBE ou semelhante com átomos de silicio 2 sendo mantidos para ficarem a mais do que os átomos de carbono em uma superfície de crescimento 1a de um cristal de carboreto de silício em um substrato 1. Um substrato de carbureto de silício com uma boa cristalidade é dessa forma obtido em uma baixa temperatura com uma boa reprodutibilidade. Essa crescimento do cristal é possível em uma baixa temperatura de 1300‹C ou menor, e as produções de uma película dopada em alta concentração, uma película seletivamente desenvolvida, e uma pelicula desenvolvida de um carbureto de silício cúbico em um cristal hexagonal são obtidas. Na cristalização de um carbureto de silício cúbico em um cristal hexagonal, o uso de uma superfície fora de corte inclinada para uma direção <1100> é eficaz para evitar a ocorrência de gêmeos.
BR9806136-4A 1997-08-27 1998-08-27 Substrato de carbureto de silìco e método para a produção do substrato, e dispositivo semicondutor utilizand o substrato. BR9806136A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP23077097 1997-08-27
PCT/JP1998/003826 WO1999010919A1 (fr) 1997-08-27 1998-08-27 Substrat en carbure de silicium, procede de fabrication de ce substrat et element semi-conducteur renfermant ce substrat

Publications (1)

Publication Number Publication Date
BR9806136A true BR9806136A (pt) 1999-10-26

Family

ID=16913000

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9806136-4A BR9806136A (pt) 1997-08-27 1998-08-27 Substrato de carbureto de silìco e método para a produção do substrato, e dispositivo semicondutor utilizand o substrato.

Country Status (8)

Country Link
US (1) US6270573B1 (pt)
EP (1) EP0962963A4 (pt)
KR (1) KR20000068834A (pt)
CN (1) CN1237272A (pt)
BR (1) BR9806136A (pt)
CA (1) CA2269912A1 (pt)
RU (1) RU99111953A (pt)
WO (1) WO1999010919A1 (pt)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USH2193H1 (en) * 2001-01-30 2007-07-03 The United States Of America As Represented By The Secretary Of The Air Force Method of growing homoepitaxial silicon carbide
US6706114B2 (en) * 2001-05-21 2004-03-16 Cree, Inc. Methods of fabricating silicon carbide crystals
EP1306890A2 (en) * 2001-10-25 2003-05-02 Matsushita Electric Industrial Co., Ltd. Semiconductor substrate and device comprising SiC and method for fabricating the same
US7396563B2 (en) * 2002-05-23 2008-07-08 Sixtron Advanced Materials, Inc. Ceramic thin film on various substrates, and process for producing same
ITMI20021724A1 (it) * 2002-08-01 2004-02-02 Siemens Mobile Comm Spa Controllore per stazioni radio base gsm e 3g in una core
JP2004219261A (ja) * 2003-01-15 2004-08-05 Fuji Photo Film Co Ltd 薄膜の解析方法
US20040144301A1 (en) * 2003-01-24 2004-07-29 Neudeck Philip G. Method for growth of bulk crystals by vapor phase epitaxy
JP4238357B2 (ja) * 2003-08-19 2009-03-18 独立行政法人産業技術総合研究所 炭化珪素エピタキシャルウエハ、同ウエハの製造方法及び同ウエハ上に作製された半導体装置
US6972236B2 (en) * 2004-01-30 2005-12-06 Chartered Semiconductor Manufacturing Ltd. Semiconductor device layout and channeling implant process
WO2005116307A1 (ja) 2004-05-27 2005-12-08 Bridgestone Corporation 炭化ケイ素単結晶ウェハの製造方法
US20060211210A1 (en) * 2004-08-27 2006-09-21 Rensselaer Polytechnic Institute Material for selective deposition and etching
JP4470690B2 (ja) 2004-10-29 2010-06-02 住友電気工業株式会社 炭化珪素単結晶、炭化珪素基板および炭化珪素単結晶の製造方法
JP4775102B2 (ja) 2005-05-09 2011-09-21 住友電気工業株式会社 半導体装置の製造方法
WO2007034761A1 (en) * 2005-09-20 2007-03-29 Showa Denko K.K. Semiconductor device and method for fabrication thereof
US20080203399A1 (en) * 2006-09-18 2008-08-28 Spencer Michael G Polarization doped transistor channels in sic heteropolytypes
KR20090089362A (ko) 2006-11-10 2009-08-21 스미토모덴키고교가부시키가이샤 탄화규소 반도체 장치 및 그 제조 방법
WO2008062729A1 (fr) 2006-11-21 2008-05-29 Sumitomo Electric Industries, Ltd. Dispositif semiconducteur en carbure de silicium et son procédé de fabrication
WO2008123213A1 (ja) * 2007-03-26 2008-10-16 Kyoto University 半導体装置及び半導体製造方法
DE102008016696A1 (de) * 2007-03-30 2008-12-11 Rev Renewable Energy Ventures, Inc. Plasmaunterstützte Organofunktionalisierung von Siliciumtetrahalogeniden oder von Organohalogensilanen
JP4532536B2 (ja) * 2007-12-19 2010-08-25 トヨタ自動車株式会社 半導体装置
JPWO2009104299A1 (ja) * 2008-02-22 2011-06-16 住友電気工業株式会社 半導体装置および半導体装置の製造方法
US8221546B2 (en) * 2008-03-26 2012-07-17 Ss Sc Ip, Llc Epitaxial growth on low degree off-axis SiC substrates and semiconductor devices made thereby
US20100072484A1 (en) * 2008-09-23 2010-03-25 Triquint Semiconductor, Inc. Heteroepitaxial gallium nitride-based device formed on an off-cut substrate
KR101333337B1 (ko) * 2009-01-30 2013-11-25 신닛테츠스미킨 카부시키카이샤 에피텍셜 탄화규소 단결정 기판 및 그 제조 방법
US8344420B1 (en) 2009-07-24 2013-01-01 Triquint Semiconductor, Inc. Enhancement-mode gallium nitride high electron mobility transistor
JP4959763B2 (ja) * 2009-08-28 2012-06-27 昭和電工株式会社 SiCエピタキシャルウェハ及びその製造方法
US8574528B2 (en) * 2009-09-04 2013-11-05 University Of South Carolina Methods of growing a silicon carbide epitaxial layer on a substrate to increase and control carrier lifetime
JP2011066355A (ja) * 2009-09-18 2011-03-31 Showa Denko Kk 再生基板の製造方法、再生基板、窒化物半導体素子及びランプ
US20120003812A1 (en) * 2009-11-24 2012-01-05 Sumitomo Electric Industries, Ltd. Method of manufacturing semiconductor substrate
JPWO2011092808A1 (ja) * 2010-01-27 2013-05-30 住友電気工業株式会社 炭化ケイ素半導体装置およびその製造方法
JP4880052B2 (ja) * 2010-05-11 2012-02-22 新日本製鐵株式会社 エピタキシャル炭化珪素単結晶基板及びその製造方法
US10208238B2 (en) 2010-10-08 2019-02-19 Advanced Ceramic Fibers, Llc Boron carbide fiber reinforced articles
US10954167B1 (en) 2010-10-08 2021-03-23 Advanced Ceramic Fibers, Llc Methods for producing metal carbide materials
US9803296B2 (en) 2014-02-18 2017-10-31 Advanced Ceramic Fibers, Llc Metal carbide fibers and methods for their manufacture
JPWO2012127748A1 (ja) * 2011-03-22 2014-07-24 住友電気工業株式会社 炭化珪素基板
DE112012004193T5 (de) * 2011-10-07 2014-07-03 Asahi Glass Co., Ltd. Siliziumcarbid-Einkristallsubstrat und Polierlösung
WO2013069067A1 (ja) * 2011-11-11 2013-05-16 学校法人関西学院 ナノメーター標準原器及びナノメーター標準原器の製造方法
JP6296394B2 (ja) * 2012-08-26 2018-03-20 国立大学法人名古屋大学 3C−SiC単結晶およびその製造方法
MD4280C1 (ro) * 2013-09-04 2014-10-31 Государственный Университет Молд0 Procedeu de creştere a structurii pInP-nCdS
US9917170B2 (en) * 2016-04-22 2018-03-13 Infineon Technologies Ag Carbon based contact structure for silicon carbide device technical field
US10793478B2 (en) 2017-09-11 2020-10-06 Advanced Ceramic Fibers, Llc. Single phase fiber reinforced ceramic matrix composites
MD4554C1 (ro) * 2017-10-18 2018-09-30 Государственный Университет Молд0 Procedeu de majorare a eficienţei celulelor fotovoltaice pe baza p+InP-p-InP-n+CdS
JP2023553477A (ja) * 2020-12-18 2023-12-21 エムアイツー‐ファクトリー ジーエムビーエイチ 電子半導体部品、および電子半導体部品用の前処理された複合基板の製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5927544A (ja) 1982-08-09 1984-02-14 Hitachi Ltd 半導体基板とその製造方法およびこれを用いた半導体装置
US5272107A (en) 1983-09-24 1993-12-21 Sharp Kabushiki Kaisha Manufacture of silicon carbide (SiC) metal oxide semiconductor (MOS) device
JPS60145992A (ja) 1983-12-29 1985-08-01 Sharp Corp 炭化珪素単結晶基板の製造方法
JPS6347984A (ja) 1986-08-18 1988-02-29 Fujitsu Ltd 半導体装置
JPS63179516A (ja) 1987-01-20 1988-07-23 Sanyo Electric Co Ltd Sic発光ダイオードの製造方法
US5011549A (en) 1987-10-26 1991-04-30 North Carolina State University Homoepitaxial growth of Alpha-SiC thin films and semiconductor devices fabricated thereon
US4912063A (en) 1987-10-26 1990-03-27 North Carolina State University Growth of beta-sic thin films and semiconductor devices fabricated thereon
JPH02172894A (ja) 1988-12-22 1990-07-04 Nec Corp 半導体の選択的結晶成長方法
JPH02177534A (ja) 1988-12-28 1990-07-10 Fujitsu Ltd 半導体装置の製造方法
US4946547A (en) 1989-10-13 1990-08-07 Cree Research, Inc. Method of preparing silicon carbide surfaces for crystal growth
US5230768A (en) * 1990-03-26 1993-07-27 Sharp Kabushiki Kaisha Method for the production of SiC single crystals by using a specific substrate crystal orientation
US5200022A (en) 1990-10-03 1993-04-06 Cree Research, Inc. Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
AU2250392A (en) * 1991-06-12 1993-01-12 Case Western Reserve University Process for the controlled growth of single-crystal films of silicon carbide polytypes on silicon carbide wafers
JPH04372122A (ja) 1991-06-20 1992-12-25 Sanyo Electric Co Ltd エピタキシャル結晶層の形成方法
CA2113336C (en) * 1993-01-25 2001-10-23 David J. Larkin Compound semi-conductors and controlled doping thereof
US6083812A (en) * 1993-02-02 2000-07-04 Texas Instruments Incorporated Heteroepitaxy by large surface steps
JPH07172997A (ja) 1993-12-16 1995-07-11 Matsushita Electric Ind Co Ltd 炭化珪素薄膜の製造方法及び製造装置
US5529949A (en) 1994-03-17 1996-06-25 Kent State University Process of making thin film 2H α-sic by laser ablation
US5766343A (en) * 1995-01-17 1998-06-16 The United States Of America As Represented By The Secretary Of The Navy Lower bandgap, lower resistivity, silicon carbide heteroepitaxial material, and method of making same

Also Published As

Publication number Publication date
CN1237272A (zh) 1999-12-01
RU99111953A (ru) 2001-03-10
EP0962963A1 (en) 1999-12-08
US6270573B1 (en) 2001-08-07
KR20000068834A (ko) 2000-11-25
CA2269912A1 (en) 1999-03-04
WO1999010919A1 (fr) 1999-03-04
EP0962963A4 (en) 2004-08-04

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B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 6A,7A E 8A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1886 DE 27/02/2007.