BR8706895A - Processo de fabricacao de um dispositivo semicondutor - Google Patents

Processo de fabricacao de um dispositivo semicondutor

Info

Publication number
BR8706895A
BR8706895A BR8706895A BR8706895A BR8706895A BR 8706895 A BR8706895 A BR 8706895A BR 8706895 A BR8706895 A BR 8706895A BR 8706895 A BR8706895 A BR 8706895A BR 8706895 A BR8706895 A BR 8706895A
Authority
BR
Brazil
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Application number
BR8706895A
Other languages
English (en)
Inventor
Myron Ralph Cagan
Douglas Frederick Ridley
Daniel James Belton
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of BR8706895A publication Critical patent/BR8706895A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/45001—Core members of the connector
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    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
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    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/485—Material
    • H01L2224/48505—Material at the bonding interface
    • H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01014—Silicon [Si]
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    • H01L2924/01032—Germanium [Ge]
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01043—Technetium [Tc]
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    • H01L2924/01079—Gold [Au]
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    • H01L2924/01082—Lead [Pb]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
BR8706895A 1986-12-19 1987-12-17 Processo de fabricacao de um dispositivo semicondutor BR8706895A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US94426886A 1986-12-19 1986-12-19

Publications (1)

Publication Number Publication Date
BR8706895A true BR8706895A (pt) 1988-07-26

Family

ID=25481096

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8706895A BR8706895A (pt) 1986-12-19 1987-12-17 Processo de fabricacao de um dispositivo semicondutor

Country Status (8)

Country Link
EP (1) EP0275588B1 (pt)
JP (1) JP2818779B2 (pt)
KR (1) KR960016238B1 (pt)
CN (1) CN1014380B (pt)
BR (1) BR8706895A (pt)
DE (1) DE3788119T2 (pt)
ES (1) ES2046984T3 (pt)
HK (1) HK163795A (pt)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0212950A (ja) * 1988-06-30 1990-01-17 Toshiba Corp 半導体装置
NL8902018A (nl) * 1989-08-07 1991-03-01 Philips Nv Halfgeleiderinrichting.
JP3563877B2 (ja) * 1996-06-21 2004-09-08 三菱電機株式会社 半導体装置
TW448524B (en) 1997-01-17 2001-08-01 Seiko Epson Corp Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment
JP3223246B2 (ja) * 1997-07-25 2001-10-29 東レ・ダウコーニング・シリコーン株式会社 半導体装置
JP2001284499A (ja) * 2000-03-09 2001-10-12 Lucent Technol Inc 半導体デバイスとその製造方法
GB0018028D0 (en) * 2000-07-24 2000-09-13 Koninkl Philips Electronics Nv Semiconductor devices and their manufacture
WO2005026761A1 (en) * 2003-09-16 2005-03-24 Koninklijke Philips Electronics N.V. A method of manufacturing an electronic device and an electronic device
CN100370580C (zh) * 2004-03-29 2008-02-20 雅马哈株式会社 半导体晶片及其制造方法
KR100863836B1 (ko) * 2005-11-02 2008-10-15 마쯔시다덴기산교 가부시키가이샤 전자 부품 패키지
CN102593190B (zh) * 2012-02-13 2015-11-25 贵州雅光电子科技股份有限公司 一种二极管
CN113517205A (zh) * 2020-04-27 2021-10-19 台湾积体电路制造股份有限公司 半导体器件及其形成方法
US11699663B2 (en) 2020-04-27 2023-07-11 Taiwan Semiconductor Manufacturing Company, Ltd. Passivation scheme design for wafer singulation

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3978578A (en) * 1974-08-29 1976-09-07 Fairchild Camera And Instrument Corporation Method for packaging semiconductor devices
JPS51147962A (en) * 1975-06-02 1976-12-18 Fairchild Camera Instr Co Method of mounting semiconductor devices
JPS5748252A (en) * 1980-09-08 1982-03-19 Nec Corp Semiconductor device and manufacture thereof
JPS5848443A (ja) * 1981-09-17 1983-03-22 Toshiba Corp 樹脂封止型半導体装置
JPS59191353A (ja) * 1983-04-15 1984-10-30 Hitachi Ltd 多層配線構造を有する電子装置
DE3327960A1 (de) * 1983-08-03 1985-02-14 Telefunken electronic GmbH, 7100 Heilbronn Halbleiteranordnung in einem isolierstoffgehaeuse

Also Published As

Publication number Publication date
DE3788119D1 (de) 1993-12-16
EP0275588B1 (en) 1993-11-10
ES2046984T3 (es) 1994-02-16
HK163795A (en) 1995-10-27
JP2818779B2 (ja) 1998-10-30
EP0275588A1 (en) 1988-07-27
CN87108334A (zh) 1988-07-13
JPS63226046A (ja) 1988-09-20
CN1014380B (zh) 1991-10-16
DE3788119T2 (de) 1994-05-11
KR960016238B1 (en) 1996-12-07

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Free format text: PATENTE EXTINTA EM 17/12/2002