BR0303025A - Método para formação de um contato de baixa resistência entre um material metálico e um material orgânico de um dispositivo semicondutor orgânico e método para criação de um transistor de efeito de campo de porta isolada de alto desempenho - Google Patents
Método para formação de um contato de baixa resistência entre um material metálico e um material orgânico de um dispositivo semicondutor orgânico e método para criação de um transistor de efeito de campo de porta isolada de alto desempenhoInfo
- Publication number
- BR0303025A BR0303025A BR0303025-3A BR0303025A BR0303025A BR 0303025 A BR0303025 A BR 0303025A BR 0303025 A BR0303025 A BR 0303025A BR 0303025 A BR0303025 A BR 0303025A
- Authority
- BR
- Brazil
- Prior art keywords
- organic
- semiconductor device
- field effect
- low resistance
- organic semiconductor
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 8
- 239000011368 organic material Substances 0.000 title abstract 5
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 230000005669 field effect Effects 0.000 title abstract 2
- 239000007769 metal material Substances 0.000 title abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 238000000137 annealing Methods 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 230000005670 electromagnetic radiation Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 230000005012 migration Effects 0.000 abstract 1
- 238000013508 migration Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/20—Organic diodes
- H10K10/23—Schottky diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/813—Anodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
- H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/114—Poly-phenylenevinylene; Derivatives thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
- H10K85/143—Polyacetylene; Derivatives thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/154—Ladder-type polymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/211—Fullerenes, e.g. C60
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/311—Phthalocyanine
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/321—Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3]
- H10K85/324—Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3] comprising aluminium, e.g. Alq3
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/611—Charge transfer complexes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/631—Amine compounds having at least two aryl rest on at least one amine-nitrogen atom, e.g. triphenylamine
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electrodes Of Semiconductors (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/218,141 US6784017B2 (en) | 2002-08-12 | 2002-08-12 | Method of creating a high performance organic semiconductor device |
| PCT/US2003/011125 WO2004015779A1 (en) | 2002-08-12 | 2003-04-10 | Method of creating a high performance organic semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR0303025A true BR0303025A (pt) | 2004-08-10 |
Family
ID=31714501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR0303025-3A BR0303025A (pt) | 2002-08-12 | 2003-04-10 | Método para formação de um contato de baixa resistência entre um material metálico e um material orgânico de um dispositivo semicondutor orgânico e método para criação de um transistor de efeito de campo de porta isolada de alto desempenho |
Country Status (12)
| Country | Link |
|---|---|
| US (2) | US6784017B2 (enExample) |
| EP (1) | EP1529312A4 (enExample) |
| JP (1) | JP2005520356A (enExample) |
| KR (1) | KR100729021B1 (enExample) |
| CN (1) | CN100459147C (enExample) |
| AU (1) | AU2003226074A1 (enExample) |
| BR (1) | BR0303025A (enExample) |
| CA (1) | CA2450611A1 (enExample) |
| IL (1) | IL158321A0 (enExample) |
| MX (1) | MXPA04010019A (enExample) |
| TW (1) | TWI244760B (enExample) |
| WO (1) | WO2004015779A1 (enExample) |
Families Citing this family (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8654018B2 (en) | 2005-04-06 | 2014-02-18 | Vanguard Identificaiton Systems, Inc. | Printed planar RFID element wristbands and like personal identification devices |
| US8585852B2 (en) | 1999-06-16 | 2013-11-19 | Vanguard Identification Systems, Inc. | Methods of making printed planar radio frequency identification elements |
| US8636220B2 (en) | 2006-12-29 | 2014-01-28 | Vanguard Identification Systems, Inc. | Printed planar RFID element wristbands and like personal identification devices |
| WO2000079617A1 (en) | 1999-06-21 | 2000-12-28 | Cambridge University Technical Services Limited | Aligned polymers for an organic tft |
| AU781584B2 (en) * | 1999-12-21 | 2005-06-02 | Flexenable Limited | Solution processed devices |
| US6982452B2 (en) * | 2000-11-28 | 2006-01-03 | Precision Dynamics Corporation | Rectifying charge storage element |
| US6946332B2 (en) * | 2002-03-15 | 2005-09-20 | Lucent Technologies Inc. | Forming nanoscale patterned thin film metal layers |
| US7229847B2 (en) * | 2002-03-15 | 2007-06-12 | Lucent Technologies Inc. | Forming electrical contacts to a molecular layer |
| US6784017B2 (en) * | 2002-08-12 | 2004-08-31 | Precision Dynamics Corporation | Method of creating a high performance organic semiconductor device |
| EP1547139A4 (en) * | 2002-09-30 | 2009-08-26 | Nanosys Inc | LARGE AREA, NANO-READY MACROELECTRONIC SUBSTRATES AND USES THEREOF |
| US7135728B2 (en) * | 2002-09-30 | 2006-11-14 | Nanosys, Inc. | Large-area nanoenabled macroelectronic substrates and uses therefor |
| US20050040757A1 (en) * | 2003-07-25 | 2005-02-24 | University Of Rochester | Light-emitting organic oligomer compositions |
| US7030666B2 (en) * | 2004-02-27 | 2006-04-18 | Motorola, Inc. | Organic semiconductor inverting circuit |
| JP2005268550A (ja) * | 2004-03-18 | 2005-09-29 | Japan Science & Technology Agency | 有機半導体及びそれを用いた半導体装置並びにそれらの製造方法 |
| KR20070015551A (ko) * | 2004-04-27 | 2007-02-05 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 용융 기술에 의한 유기 반도체 디바이스 형성 방법 |
| JP2005332991A (ja) * | 2004-05-20 | 2005-12-02 | Univ Nagoya | カーボンナノチューブ発光素子 |
| JPWO2005122233A1 (ja) * | 2004-06-10 | 2008-04-10 | 国立大学法人山梨大学 | ショットキーゲート有機電界効果トランジスタおよびその製造方法 |
| US7170779B2 (en) * | 2004-06-17 | 2007-01-30 | Canon Kabushiki Kaisha | Non-volatile memory using organic bistable device |
| US20060014044A1 (en) * | 2004-07-14 | 2006-01-19 | Au Optronics Corporation | Organic light-emitting display with multiple light-emitting modules |
| US20060060839A1 (en) * | 2004-09-22 | 2006-03-23 | Chandross Edwin A | Organic semiconductor composition |
| US7499305B2 (en) * | 2004-10-18 | 2009-03-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method of the same |
| EP1851811B1 (fr) * | 2005-02-22 | 2019-05-08 | Commissariat à l'Energie Atomique et aux Energies Alternatives | Diode organique electroluminescente a couches dopees |
| US20060261433A1 (en) * | 2005-05-23 | 2006-11-23 | Harish Manohara | Nanotube Schottky diodes for high-frequency applications |
| WO2007012031A2 (en) * | 2005-07-19 | 2007-01-25 | Precision Dynamics Corporation | Semi-active rfid tag and related processes |
| KR100691276B1 (ko) * | 2005-08-25 | 2007-03-12 | 삼성전기주식회사 | 나노와이어 발광 소자 및 제조방법 |
| US10367049B2 (en) | 2005-11-04 | 2019-07-30 | Interdigital Ce Patent Holdings | Electro-optical element integrating an organic electroluminescent diode and an organic transistor for modulating said diode |
| WO2007058436A1 (en) * | 2005-11-15 | 2007-05-24 | Iferro Co., Ltd. | Memory device |
| KR100966302B1 (ko) * | 2005-11-15 | 2010-06-28 | 서울시립대학교 산학협력단 | 메모리 장치 |
| KR100730179B1 (ko) * | 2005-12-09 | 2007-06-19 | 삼성에스디아이 주식회사 | 유기 박막 트랜지스터의 제조방법 |
| KR100695166B1 (ko) * | 2006-01-03 | 2007-03-14 | 삼성전자주식회사 | 플러렌층을 구비한 상변화 메모리 소자의 제조 방법 |
| KR100897881B1 (ko) * | 2006-06-02 | 2009-05-18 | 삼성전자주식회사 | 유기물층 및 버크민스터 플러렌층의 적층을 정보 저장요소로 채택하는 유기 메모리 소자의 제조방법 |
| KR20080026957A (ko) * | 2006-09-22 | 2008-03-26 | 삼성전자주식회사 | 박막 트랜지스터 표시판의 제조 방법 |
| EP1912268B1 (de) * | 2006-10-09 | 2020-01-01 | Novaled GmbH | Verfahren zur räumlichen Strukturierung der Leuchtdichte von lichtermittierenden organischen Halbleiterbauelementen, danach hergestelltes Halbleiterbauelement und Verwendung desselben |
| CN101165937A (zh) * | 2006-10-18 | 2008-04-23 | 清华大学 | 有机复合物p-n结及其制备方法以及应用该p-n结的有机复合物二极管 |
| JP5183913B2 (ja) * | 2006-11-24 | 2013-04-17 | 住友電工デバイス・イノベーション株式会社 | 半導体装置の製造方法 |
| KR100785037B1 (ko) * | 2006-12-13 | 2007-12-12 | 삼성전자주식회사 | GaInZnO 다이오드 |
| TW200845220A (en) * | 2007-05-04 | 2008-11-16 | Univ Nat Chiao Tung | Microwave annealing for enhancing the efficiency of polymer photovoltaic device |
| KR20100090775A (ko) * | 2007-10-18 | 2010-08-17 | 메르크 파텐트 게엠베하 | 도전성 조성물 |
| FR2925728B1 (fr) * | 2007-12-20 | 2010-01-01 | Commissariat Energie Atomique | Procede de fabrication d'un dispositif d'identification et d'authentification a base de diode organique, dispositif et procede d'utilisation. |
| US7888169B2 (en) | 2007-12-26 | 2011-02-15 | Organicid, Inc. | Organic semiconductor device and method of manufacturing the same |
| JP2011527247A (ja) * | 2008-07-08 | 2011-10-27 | ディーエスエム アイピー アセッツ ビー.ブイ. | 基材および被膜を備える積層体および複合層ならびにそれを作製するための方法および装置 |
| US9202961B2 (en) | 2009-02-02 | 2015-12-01 | Redlen Technologies | Imaging devices with solid-state radiation detector with improved sensitivity |
| US8614423B2 (en) * | 2009-02-02 | 2013-12-24 | Redlen Technologies, Inc. | Solid-state radiation detector with improved sensitivity |
| EP2251920A1 (en) | 2009-05-12 | 2010-11-17 | Università Degli Studi Di Milano - Bicocca | Method of manufacturing electrical contacts on organic semiconductors |
| KR20120061806A (ko) * | 2009-06-30 | 2012-06-13 | 플렉스트로닉스, 인크 | 1종 이상의 비티오펜 반복 단위를 포함하는 중합체, 상기 중합체의 합성 방법 및 그를 포함하는 조성물 |
| JP2011035037A (ja) * | 2009-07-30 | 2011-02-17 | Sony Corp | 回路基板の製造方法および回路基板 |
| KR101052145B1 (ko) * | 2009-08-20 | 2011-07-26 | 성균관대학교산학협력단 | 철-비소 기반 초전도성 박막용 타겟 제조방법 |
| TWI408840B (zh) * | 2009-09-16 | 2013-09-11 | Nat Univ Tsing Hua | 有機薄膜電晶體之製備方法及修復方法 |
| US8497499B2 (en) * | 2009-10-12 | 2013-07-30 | Georgia Tech Research Corporation | Method to modify the conductivity of graphene |
| JP5665839B2 (ja) * | 2010-02-22 | 2015-02-04 | 株式会社東芝 | 太陽電池およびその製造方法 |
| TWI484626B (zh) * | 2012-02-21 | 2015-05-11 | 璨圓光電股份有限公司 | 半導體發光元件及具有此半導體發光元件的發光裝置 |
| CN104769149B (zh) | 2012-11-06 | 2018-05-22 | Oti领英有限公司 | 用于在表面上沉积导电覆层的方法 |
| US9629020B2 (en) * | 2013-05-28 | 2017-04-18 | Rivada Networks, Llc | Methods and systems for data context and management via dynamic spectrum controller and dynamic spectrum policy controller |
| DE102014211602B4 (de) * | 2014-06-17 | 2018-10-25 | Siemens Healthcare Gmbh | Detektormodul für einen Röntgendetektor |
| GB2527754A (en) * | 2014-06-27 | 2016-01-06 | Cambridge Display Tech Ltd | Display systems |
| KR101653091B1 (ko) * | 2015-01-30 | 2016-09-01 | 인천대학교 산학협력단 | 열처리를 이용한 폴리사이오펜 박막과 금속 전극 계면 간의 접촉 특성 향상방법 |
| US9947895B2 (en) | 2015-06-17 | 2018-04-17 | Universal Display Corporation | Flexible AMOLED display |
| WO2017100944A1 (en) | 2015-12-16 | 2017-06-22 | Oti Lumionics Inc. | Barrier coating for opto-electronic devices |
| US11152587B2 (en) | 2016-08-15 | 2021-10-19 | Oti Lumionics Inc. | Light transmissive electrode for light emitting devices |
| KR102106774B1 (ko) * | 2017-12-11 | 2020-05-28 | 한국생산기술연구원 | 레이저를 이용하여 전류밀도를 조절한 유기 메모리 |
| CN110148581B (zh) * | 2018-02-10 | 2022-05-17 | 姜富帅 | 一种金属-半导体的金属化工艺及方法 |
| US10999919B2 (en) | 2019-07-11 | 2021-05-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Flexible electronic assembly for placement on a vehicle motor assembly |
| CN110676232B (zh) * | 2019-08-30 | 2022-05-24 | 华为技术有限公司 | 一种半导体器件封装结构及其制作方法、一种电子设备 |
| KR102306947B1 (ko) * | 2020-05-21 | 2021-09-30 | 한국과학기술원 | 쇼트키 접합 기반 광 검출소자 및 이를 이용한 광 검출방법 |
Family Cites Families (99)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6492966B1 (en) * | 1982-09-17 | 2002-12-10 | Alton O. Christensen | Integrally fabricated gated pixel elements and control circuitry for flat-panel displays |
| US4557978A (en) * | 1983-12-12 | 1985-12-10 | Primary Energy Research Corporation | Electroactive polymeric thin films |
| US5107308A (en) * | 1986-07-04 | 1992-04-21 | Mitsubishi Denki Kabushiki Kaisha | Field-effect transistor |
| US4962088A (en) | 1987-12-22 | 1990-10-09 | General Motors Corporation | Formation of film superconductors by metallo-organic deposition |
| US5250388A (en) | 1988-05-31 | 1993-10-05 | Westinghouse Electric Corp. | Production of highly conductive polymers for electronic circuits |
| GB8909011D0 (en) * | 1989-04-20 | 1989-06-07 | Friend Richard H | Electroluminescent devices |
| FI91573C (sv) | 1990-01-04 | 1994-07-11 | Neste Oy | Sätt att framställa elektroniska och elektro-optiska komponenter och kretsar |
| EP0443861B2 (en) * | 1990-02-23 | 2008-05-28 | Sumitomo Chemical Company, Limited | Organic electroluminescence device |
| US5689428A (en) | 1990-09-28 | 1997-11-18 | Texas Instruments Incorporated | Integrated circuits, transistors, data processing systems, printed wiring boards, digital computers, smart power devices, and processes of manufacture |
| US5408109A (en) * | 1991-02-27 | 1995-04-18 | The Regents Of The University Of California | Visible light emitting diodes fabricated from soluble semiconducting polymers |
| US5429884A (en) * | 1992-01-17 | 1995-07-04 | Pioneer Electronic Corporation | Organic electroluminescent element |
| US5917980A (en) * | 1992-03-06 | 1999-06-29 | Fujitsu Limited | Optical circuit device, its manufacturing process and a multilayer optical circuit using said optical circuit device |
| US6320200B1 (en) | 1992-06-01 | 2001-11-20 | Yale University | Sub-nanoscale electronic devices and processes |
| KR940009496B1 (ko) * | 1992-06-09 | 1994-10-14 | 주식회사금성사 | 다색 전계발광소자 및 제조방법 |
| US5352906A (en) * | 1993-01-29 | 1994-10-04 | Iowa State University Research Foundation, Inc. | Poly (p-phenyleneneacetylene) light-emitting diodes |
| US5334539A (en) * | 1993-01-29 | 1994-08-02 | Iowa State University Research Foundation, Inc. | Fabrication of poly(p-phenyleneacetylene) light-emitting diodes |
| JP3246189B2 (ja) * | 1994-06-28 | 2002-01-15 | 株式会社日立製作所 | 半導体表示装置 |
| US5747928A (en) * | 1994-10-07 | 1998-05-05 | Iowa State University Research Foundation, Inc. | Flexible panel display having thin film transistors driving polymer light-emitting diodes |
| US5574291A (en) | 1994-12-09 | 1996-11-12 | Lucent Technologies Inc. | Article comprising a thin film transistor with low conductivity organic layer |
| GB2296815B (en) * | 1994-12-09 | 1999-03-17 | Cambridge Display Tech Ltd | Photoresponsive materials |
| US6278127B1 (en) | 1994-12-09 | 2001-08-21 | Agere Systems Guardian Corp. | Article comprising an organic thin film transistor adapted for biasing to form a N-type or a P-type transistor |
| TW293172B (enExample) * | 1994-12-09 | 1996-12-11 | At & T Corp | |
| US5703436A (en) * | 1994-12-13 | 1997-12-30 | The Trustees Of Princeton University | Transparent contacts for organic devices |
| US6788800B1 (en) | 2000-07-25 | 2004-09-07 | Digimarc Corporation | Authenticating objects using embedded data |
| US6445006B1 (en) * | 1995-12-20 | 2002-09-03 | Advanced Technology Materials, Inc. | Microelectronic and microelectromechanical devices comprising carbon nanotube components, and methods of making same |
| US6225218B1 (en) * | 1995-12-20 | 2001-05-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and its manufacturing method |
| US6326640B1 (en) * | 1996-01-29 | 2001-12-04 | Motorola, Inc. | Organic thin film transistor with enhanced carrier mobility |
| US5656883A (en) * | 1996-08-06 | 1997-08-12 | Christensen; Alton O. | Field emission devices with improved field emission surfaces |
| US5969376A (en) | 1996-08-23 | 1999-10-19 | Lucent Technologies Inc. | Organic thin film transistor having a phthalocyanine semiconductor layer |
| US5861219A (en) * | 1997-04-15 | 1999-01-19 | The Trustees Of Princeton University | Organic light emitting devices containing a metal complex of 5-hydroxy-quinoxaline as a host material |
| US5946551A (en) * | 1997-03-25 | 1999-08-31 | Dimitrakopoulos; Christos Dimitrios | Fabrication of thin film effect transistor comprising an organic semiconductor and chemical solution deposited metal oxide gate dielectric |
| JPH113868A (ja) * | 1997-06-12 | 1999-01-06 | Nec Yamagata Ltd | ランプアニール装置およびランプアニール方法 |
| US6154263A (en) | 1997-07-25 | 2000-11-28 | Eveready Battery Company, Inc. | Liquid crystal display and battery label including a liquid crystal display |
| US5977718A (en) * | 1997-08-08 | 1999-11-02 | Christensen; Alton O. | Gated pixel elements using polymer electroluminescent materials for panel displays |
| EP0968537B1 (en) * | 1997-08-22 | 2012-05-02 | Creator Technology B.V. | A method of manufacturing a field-effect transistor substantially consisting of organic materials |
| US6177859B1 (en) | 1997-10-21 | 2001-01-23 | Micron Technology, Inc. | Radio frequency communication apparatus and methods of forming a radio frequency communication apparatus |
| US6207034B1 (en) | 1997-12-05 | 2001-03-27 | Massachusetts Institute Of Technology | Method of manufacture of polymer transistors with controllable gap |
| US5986206A (en) * | 1997-12-10 | 1999-11-16 | Nanogram Corporation | Solar cell |
| JP2002501271A (ja) | 1998-01-26 | 2002-01-15 | ウェスターマン,ウェイン | 手操作入力を統合する方法および装置 |
| GB9806066D0 (en) * | 1998-03-20 | 1998-05-20 | Cambridge Display Tech Ltd | Multilayer photovoltaic or photoconductive devices |
| JPH11274468A (ja) * | 1998-03-25 | 1999-10-08 | Sony Corp | オーミック電極およびその形成方法ならびにオーミック電極形成用積層体 |
| US6249076B1 (en) | 1998-04-14 | 2001-06-19 | Massachusetts Institute Of Technology | Conducting polymer actuator |
| US6241921B1 (en) | 1998-05-15 | 2001-06-05 | Massachusetts Institute Of Technology | Heterogeneous display elements and methods for their fabrication |
| US7854684B1 (en) | 1998-06-24 | 2010-12-21 | Samsung Electronics Co., Ltd. | Wearable device |
| US6472705B1 (en) * | 1998-11-18 | 2002-10-29 | International Business Machines Corporation | Molecular memory & logic |
| US20020008464A1 (en) * | 1998-12-22 | 2002-01-24 | Christensen Alton O. | Woven or ink jet printed arrays for extreme UV and X-ray source and detector |
| US6229259B1 (en) * | 1998-12-22 | 2001-05-08 | Alton O. Christensen, Sr. | Woven polymer fiber video displays with improved efficiency and economy of manufacture |
| US6873098B2 (en) * | 1998-12-22 | 2005-03-29 | Alton O. Christensen, Sr. | Electroluminescent devices and displays with integrally fabricated address and logic devices fabricated by printing or weaving |
| WO2000041893A1 (en) | 1999-01-15 | 2000-07-20 | 3M Innovative Properties Company | Thermal transfer element and process for forming organic electroluminescent devices |
| US6114088A (en) | 1999-01-15 | 2000-09-05 | 3M Innovative Properties Company | Thermal transfer element for forming multilayer devices |
| WO2000042668A1 (en) | 1999-01-15 | 2000-07-20 | The Dow Chemical Company | Semiconducting polymer field effect transistor |
| US6207472B1 (en) | 1999-03-09 | 2001-03-27 | International Business Machines Corporation | Low temperature thin film transistor fabrication |
| US6265243B1 (en) | 1999-03-29 | 2001-07-24 | Lucent Technologies Inc. | Process for fabricating organic circuits |
| NO314525B1 (no) * | 1999-04-22 | 2003-03-31 | Thin Film Electronics Asa | Fremgangsmåte ved fremstillingen av organiske halvledende innretninger i tynnfilm |
| GB9910964D0 (en) * | 1999-05-12 | 1999-07-14 | Secr Defence | Conducting polymers |
| WO2000079617A1 (en) * | 1999-06-21 | 2000-12-28 | Cambridge University Technical Services Limited | Aligned polymers for an organic tft |
| US6414104B1 (en) * | 1999-07-20 | 2002-07-02 | Sri International | Arylamine-substituted poly (arylene vinylenes) and associated methods of preparation and use |
| US6310360B1 (en) * | 1999-07-21 | 2001-10-30 | The Trustees Of Princeton University | Intersystem crossing agents for efficient utilization of excitons in organic light emitting devices |
| US6312971B1 (en) * | 1999-08-31 | 2001-11-06 | E Ink Corporation | Solvent annealing process for forming a thin semiconductor film with advantageous properties |
| US6335539B1 (en) | 1999-11-05 | 2002-01-01 | International Business Machines Corporation | Method for improving performance of organic semiconductors in bottom electrode structure |
| US6136702A (en) * | 1999-11-29 | 2000-10-24 | Lucent Technologies Inc. | Thin film transistors |
| US6265127B1 (en) * | 1999-12-15 | 2001-07-24 | Eastman Kodak Company | 1, 4-dihydrophyridine charge control agents for electrostatographic toners and developers |
| CN1245769C (zh) * | 1999-12-21 | 2006-03-15 | 造型逻辑有限公司 | 溶液加工 |
| WO2001047044A2 (en) * | 1999-12-21 | 2001-06-28 | Plastic Logic Limited | Forming interconnects |
| WO2001046987A2 (en) * | 1999-12-21 | 2001-06-28 | Plastic Logic Limited | Inkjet-fabricated integrated circuits |
| AU781584B2 (en) * | 1999-12-21 | 2005-06-02 | Flexenable Limited | Solution processed devices |
| WO2001059858A2 (en) * | 2000-02-09 | 2001-08-16 | Millenium Energy, Llc | Alloy compositions for use as electrode materials and for hydrogen production |
| US20020068373A1 (en) * | 2000-02-16 | 2002-06-06 | Nova Crystals, Inc. | Method for fabricating light emitting diodes |
| AT411305B (de) * | 2002-05-22 | 2003-11-25 | Qsel Quantum Solar Energy Linz | Verfahren zur nachbehandlung einer photovoltaischen zelle |
| US20020121669A1 (en) * | 2000-04-28 | 2002-09-05 | Batlogg Bertham Josef | Organic superconductive field-effect switching device |
| US6329226B1 (en) | 2000-06-01 | 2001-12-11 | Agere Systems Guardian Corp. | Method for fabricating a thin-film transistor |
| US6734623B1 (en) * | 2000-07-31 | 2004-05-11 | Xerox Corporation | Annealed organic light emitting devices and method of annealing organic light emitting devices |
| JP4094804B2 (ja) * | 2000-10-17 | 2008-06-04 | 三星エスディアイ株式会社 | 有機el装置の製造方法 |
| US6613442B2 (en) * | 2000-12-29 | 2003-09-02 | Lam Research Corporation | Boron nitride/yttria composite components of semiconductor processing equipment and method of manufacturing thereof |
| US6765348B2 (en) * | 2001-01-26 | 2004-07-20 | Xerox Corporation | Electroluminescent devices containing thermal protective layers |
| US7439096B2 (en) * | 2001-02-21 | 2008-10-21 | Lucent Technologies Inc. | Semiconductor device encapsulation |
| US7244669B2 (en) * | 2001-05-23 | 2007-07-17 | Plastic Logic Limited | Patterning of devices |
| US6580027B2 (en) * | 2001-06-11 | 2003-06-17 | Trustees Of Princeton University | Solar cells using fullerenes |
| US7002223B2 (en) * | 2001-07-27 | 2006-02-21 | Samsung Electronics Co., Ltd. | Semiconductor device having elevated source/drain |
| KR100552866B1 (ko) * | 2001-08-09 | 2006-02-20 | 아사히 가세이 가부시키가이샤 | 유기 반도체 소자 |
| CN1300824C (zh) * | 2001-08-24 | 2007-02-14 | Gracel株式会社 | 具有有机聚合物栅极绝缘层的有机半导体晶体管的制造方法 |
| US6433359B1 (en) * | 2001-09-06 | 2002-08-13 | 3M Innovative Properties Company | Surface modifying layers for organic thin film transistors |
| US6946676B2 (en) * | 2001-11-05 | 2005-09-20 | 3M Innovative Properties Company | Organic thin film transistor with polymeric interface |
| US6617609B2 (en) * | 2001-11-05 | 2003-09-09 | 3M Innovative Properties Company | Organic thin film transistor with siloxane polymer interface |
| CN1157807C (zh) * | 2001-11-09 | 2004-07-14 | 清华大学 | 一种有机薄膜场效应晶体管及其制备方法 |
| US7026178B2 (en) * | 2001-11-13 | 2006-04-11 | Applied Optoelectronics, Inc. | Method for fabricating a VCSEL with ion-implanted current-confinement structure |
| US6555411B1 (en) | 2001-12-18 | 2003-04-29 | Lucent Technologies Inc. | Thin film transistors |
| US6603141B2 (en) * | 2001-12-28 | 2003-08-05 | Motorola, Inc. | Organic semiconductor and method |
| US6620657B2 (en) * | 2002-01-15 | 2003-09-16 | International Business Machines Corporation | Method of forming a planar polymer transistor using substrate bonding techniques |
| US6795478B2 (en) * | 2002-03-28 | 2004-09-21 | Applied Optoelectronics, Inc. | VCSEL with antiguide current confinement layer |
| US20030183915A1 (en) * | 2002-04-02 | 2003-10-02 | Motorola, Inc. | Encapsulated organic semiconductor device and method |
| KR100456470B1 (ko) * | 2002-04-19 | 2004-11-10 | 주식회사 비아트론 | 반도체 막의 저온 열처리 장치 |
| US6667215B2 (en) * | 2002-05-02 | 2003-12-23 | 3M Innovative Properties | Method of making transistors |
| US20030227014A1 (en) * | 2002-06-11 | 2003-12-11 | Xerox Corporation. | Process for forming semiconductor layer of micro-and nano-electronic devices |
| US6661024B1 (en) * | 2002-07-02 | 2003-12-09 | Motorola, Inc. | Integrated circuit including field effect transistor and method of manufacture |
| US6784017B2 (en) * | 2002-08-12 | 2004-08-31 | Precision Dynamics Corporation | Method of creating a high performance organic semiconductor device |
| US7923782B2 (en) * | 2004-02-27 | 2011-04-12 | International Business Machines Corporation | Hybrid SOI/bulk semiconductor transistors |
| JP4528062B2 (ja) * | 2004-08-25 | 2010-08-18 | 富士通株式会社 | 半導体装置およびその製造方法 |
| TW200826290A (en) * | 2006-12-01 | 2008-06-16 | Univ Nat Chiao Tung | Vertical organic transistor and manufacturing method thereof |
-
2002
- 2002-08-12 US US10/218,141 patent/US6784017B2/en not_active Expired - Fee Related
-
2003
- 2003-04-10 AU AU2003226074A patent/AU2003226074A1/en not_active Abandoned
- 2003-04-10 CA CA002450611A patent/CA2450611A1/en not_active Abandoned
- 2003-04-10 BR BR0303025-3A patent/BR0303025A/pt not_active IP Right Cessation
- 2003-04-10 EP EP03784735A patent/EP1529312A4/en not_active Withdrawn
- 2003-04-10 KR KR1020037015980A patent/KR100729021B1/ko not_active Expired - Fee Related
- 2003-04-10 CN CNB038002280A patent/CN100459147C/zh not_active Expired - Fee Related
- 2003-04-10 JP JP2004527542A patent/JP2005520356A/ja active Pending
- 2003-04-10 IL IL15832103A patent/IL158321A0/xx unknown
- 2003-04-10 WO PCT/US2003/011125 patent/WO2004015779A1/en not_active Ceased
- 2003-04-10 MX MXPA04010019A patent/MXPA04010019A/es unknown
- 2003-08-12 TW TW092122137A patent/TWI244760B/zh not_active IP Right Cessation
-
2004
- 2004-07-01 US US10/884,317 patent/US20050003574A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN1524295A (zh) | 2004-08-25 |
| US20050003574A1 (en) | 2005-01-06 |
| CN100459147C (zh) | 2009-02-04 |
| KR100729021B1 (ko) | 2007-06-14 |
| JP2005520356A (ja) | 2005-07-07 |
| WO2004015779A1 (en) | 2004-02-19 |
| US20040033641A1 (en) | 2004-02-19 |
| EP1529312A1 (en) | 2005-05-11 |
| IL158321A0 (en) | 2004-06-01 |
| US6784017B2 (en) | 2004-08-31 |
| TWI244760B (en) | 2005-12-01 |
| EP1529312A4 (en) | 2005-11-23 |
| AU2003226074A1 (en) | 2004-02-25 |
| CA2450611A1 (en) | 2004-02-12 |
| MXPA04010019A (es) | 2004-12-13 |
| KR20050026844A (ko) | 2005-03-16 |
| TW200415787A (en) | 2004-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| BR0303025A (pt) | Método para formação de um contato de baixa resistência entre um material metálico e um material orgânico de um dispositivo semicondutor orgânico e método para criação de um transistor de efeito de campo de porta isolada de alto desempenho | |
| JP2005520356A5 (enExample) | ||
| CA2801900C (en) | Method for providing lateral thermal processing of thin films on low-temperature substrates | |
| Lee et al. | Switching mechanism behind the device operation mode in SnO‐TFT | |
| Pop et al. | Localized heating effects and scaling of sub-0.18 micron CMOS devices | |
| Madadi et al. | Investigation of short channel effects in SOI MOSFET with 20 nm channel length by a β-Ga2O3 layer | |
| AR028886A1 (es) | Procedimiento de tratamiento termico de una envuelta de anodo que tiene una capa de cobre formando su superficie interior | |
| Sharma et al. | Dual metal drain Ge‐source dopingless TFET with enhanced turn‐ON steep subthreshold swing and high ON‐current | |
| Raut et al. | A charge-based analytical model for gate all around junction-less field effect transistor including interface traps | |
| Im et al. | Electrical-performance and reliability improvement of flexible low-temperature polycrystalline silicon thin-film transistors via post-annealing process | |
| Yang et al. | Benefits of cryo-implantation for 28 nm NMOS advanced junction formation | |
| Mori et al. | Effect of hot implantation on ON-current enhancement utilizing isoelectronic trap in Si-based tunnel field-effect transistors | |
| US20180102477A1 (en) | Method for increasing driving current of junctionless transistor | |
| Tai et al. | Degradation of the capacitance-voltage behaviors of the low-temperature polysilicon TFTs under DC stress | |
| Kumar et al. | Performance and reliability insights of drain extended FinFET devices for high voltage SoC applications | |
| Tai et al. | Degradation of capacitance-voltage characteristics induced by self-heating effect in poly-Si TFTs | |
| KR980006499A (ko) | 이중접합구조를 갖는 반도체소자 및 그 제조방법 | |
| Weng et al. | Self-heating effect induced NBTI degradation in poly-Si TFTs under dynamic stress | |
| Cheng et al. | Fabrication of low-temperature poly-Si thin film transistors with self-aligned graded lightly doped drain structure | |
| Abrishami et al. | Off‐State Current Improvement of Double‐Gate Junctionless Field‐Effect Transistor by Modifying Central Potential | |
| Djelti et al. | NMOSFET numerical model to investigate the heat conduction effects | |
| Park et al. | Incomplete laser annealing of ion doping damage at source/drain junctions of poly-Si thin-film transistors | |
| Weng et al. | Self-heating-induced negative bias temperature instability in poly-Si TFTs under dynamic stress | |
| Ho et al. | Ambipolar conduction behavior on high performance Schottky barrier source/drain gate-all-around Si nanowire nonvolatile SONOS memory | |
| CN101826462B (zh) | 半导体器件制造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 6O ANUIDADE. |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2042 DE 23/02/2010. |