BR0013846A - Processo para formação de um padrão condutor em substratos dielétricos - Google Patents
Processo para formação de um padrão condutor em substratos dielétricosInfo
- Publication number
- BR0013846A BR0013846A BR0013846-0A BR0013846A BR0013846A BR 0013846 A BR0013846 A BR 0013846A BR 0013846 A BR0013846 A BR 0013846A BR 0013846 A BR0013846 A BR 0013846A
- Authority
- BR
- Brazil
- Prior art keywords
- conductive pattern
- metal film
- dielectric substrates
- forming
- protective layer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/135—Electrophoretic deposition of insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Liquid Crystal (AREA)
- Inorganic Insulating Materials (AREA)
- ing And Chemical Polishing (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Electric Cables (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Patente de Invenção: "PROCESSO PARA FORMAçãO DE UM PADRãO CONDUTOR EM SUBSTRATOS DIELéTRICOS". Para formar um padrão condutor em substratos dielétricos, é proposto um processo, no qual a) um substrato coberto com um filme metálico é revestido com uma camada protetora, que é formada tratando-se o filme metálico com uma solução, que contém pelo menos um composto contendo nitrogênio, b) a camada protetora é removida por radiação de UV, pelo menos parcialmente, nas regiões que não correspondem ao padrão condutor a ser formado, de tal modo que o filme metálico está exposto e c) o filme metálico exposto é depois removido por corrosão. Por meio desse processo, podem ser produzidos padrões condutores extremamente finos, de modo reprodutível, em substratos dielétricos.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19944908A DE19944908A1 (de) | 1999-09-10 | 1999-09-10 | Verfahren zum Bilden eines Leitermusters auf dielektrischen Substraten |
| PCT/DE2000/002423 WO2001020059A2 (de) | 1999-09-10 | 2000-07-18 | Verfahren zum bilden eines leitermusters auf dielektrischen substraten |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| BR0013846A true BR0013846A (pt) | 2002-05-14 |
| BR0013846B1 BR0013846B1 (pt) | 2010-06-15 |
Family
ID=7922575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0013846-0A BR0013846B1 (pt) | 1999-09-10 | 2000-07-18 | processo para formação de um padrão condutor em substratos dielétricos. |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US6806034B1 (pt) |
| EP (1) | EP1218566B1 (pt) |
| JP (1) | JP2003509590A (pt) |
| KR (1) | KR20020031178A (pt) |
| CN (1) | CN1240874C (pt) |
| AT (1) | ATE233833T1 (pt) |
| AU (1) | AU7267800A (pt) |
| BR (1) | BR0013846B1 (pt) |
| CA (1) | CA2382916A1 (pt) |
| DE (2) | DE19944908A1 (pt) |
| HK (1) | HK1044804B (pt) |
| MX (1) | MXPA02002194A (pt) |
| MY (1) | MY127027A (pt) |
| TW (1) | TW529324B (pt) |
| WO (1) | WO2001020059A2 (pt) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT412094B (de) * | 2003-05-13 | 2004-09-27 | Austria Tech & System Tech | Verfahren zur beschichtung von rohlingen zur herstellung von gedruckten leiterplatten (pcb) |
| JP2007173676A (ja) * | 2005-12-26 | 2007-07-05 | Sumitomo Metal Mining Co Ltd | 回路形成法 |
| US8475924B2 (en) | 2007-07-09 | 2013-07-02 | E.I. Du Pont De Nemours And Company | Compositions and methods for creating electronic circuitry |
| US20090017309A1 (en) * | 2007-07-09 | 2009-01-15 | E. I. Du Pont De Nemours And Company | Compositions and methods for creating electronic circuitry |
| US20100193950A1 (en) * | 2009-01-30 | 2010-08-05 | E.I.Du Pont De Nemours And Company | Wafer level, chip scale semiconductor device packaging compositions, and methods relating thereto |
| DE102009032217A1 (de) * | 2009-07-06 | 2011-01-13 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zur Behandlung von Substraten |
| CN103517566A (zh) * | 2012-06-28 | 2014-01-15 | 昆山联滔电子有限公司 | 非导电载体上的导体轨道的制造方法 |
| CN103533764A (zh) * | 2012-07-05 | 2014-01-22 | 昆山联滔电子有限公司 | 非导电基板上形成导体线路的制造方法 |
| JP6198384B2 (ja) * | 2012-11-28 | 2017-09-20 | 富士フイルム株式会社 | 半導体基板のエッチング方法及び半導体素子の製造方法 |
| CN103731994B (zh) * | 2013-12-30 | 2017-04-19 | 天津市德中技术发展有限公司 | 用覆厚导电层基板材料制作厚导电层电路结构电路板的方法 |
| EP3016110A4 (en) | 2014-04-16 | 2016-12-28 | Lg Chemical Ltd | COMPOSITION FOR FORMING A CONDUCTIVE STRUCTURE, METHOD FOR FORMING A CONDUCTIVE STRUCTURE THEREFOR AND RESIN STRUCTURE WITH CONDUCTIVE STRUCTURE |
| CN112552079B (zh) * | 2019-09-26 | 2023-09-12 | 航天特种材料及工艺技术研究所 | 一种金属化陶瓷基复合材料及曲面金属化的方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE732249C (de) | 1935-11-27 | 1943-02-25 | Lorenz C Ag | Verfahren zur Verstaerkung von in der Spannung stark unterschiedlichen Impulsen grosser Flankensteilheit |
| US3547629A (en) | 1962-09-27 | 1970-12-15 | American Screen Process Equip | Photoflash method of transferring information and fabricating printed circuits |
| JPS6190492A (ja) * | 1984-10-11 | 1986-05-08 | 四国化成工業株式会社 | 銅スル−ホ−ルプリント配線板の製造方法 |
| DE3732249A1 (de) * | 1987-09-24 | 1989-04-13 | Siemens Ag | Verfahren zur herstellung von dreidimensionalen leiterplatten |
| EP0364132A1 (en) * | 1988-09-29 | 1990-04-18 | Shikoku Chemicals Corporation | Method for forming conversion coating on surface of copper or copper alloy |
| DE3926708A1 (de) * | 1989-08-12 | 1991-02-14 | Basf Ag | Photopolymerisierbares schichtuebertragungsmaterial |
| JPH0465184A (ja) | 1990-07-05 | 1992-03-02 | Kansai Paint Co Ltd | 電着前処理方法 |
| DE4131065A1 (de) * | 1991-08-27 | 1993-03-04 | Siemens Ag | Verfahren zur herstellung von leiterplatten |
| DE4222968A1 (de) * | 1992-07-13 | 1994-01-20 | Hoechst Ag | Positiv-arbeitendes strahlungsempfindliches Gemisch und damit hergestelltes Aufzeichnungsmaterial |
| DE4311807C2 (de) * | 1993-04-03 | 1998-03-19 | Atotech Deutschland Gmbh | Verfahren zur Beschichtung von Metallen und Anwendung des Verfahrens in der Leiterplattentechnik |
| DE4339019A1 (de) * | 1993-11-10 | 1995-05-11 | Atotech Deutschland Gmbh | Verfahren zur Herstellung von Leiterplatten |
| EP0757885B1 (de) * | 1994-04-25 | 1998-08-12 | Siemens S.A. | Verfahren zur bildung metallischer leitermuster auf elektrisch isolierenden unterlagen |
| WO1997015173A1 (en) * | 1995-10-17 | 1997-04-24 | Minnesota Mining And Manufacturing Company | Method for radiation-induced thermal transfer of resist for flexible printed circuitry |
| AU6268198A (en) * | 1997-01-31 | 1998-08-25 | James M. Taylor | Composition and method for priming substrate materials |
| DE10112023A1 (de) * | 2001-03-07 | 2002-10-02 | Atotech Deutschland Gmbh | Verfahren zum Bilden eines Metallmusters auf einen dielektrischen Substrat |
-
1999
- 1999-09-10 DE DE19944908A patent/DE19944908A1/de not_active Withdrawn
-
2000
- 2000-07-18 EP EP00960317A patent/EP1218566B1/de not_active Expired - Lifetime
- 2000-07-18 AU AU72678/00A patent/AU7267800A/en not_active Abandoned
- 2000-07-18 JP JP2001523425A patent/JP2003509590A/ja active Pending
- 2000-07-18 KR KR1020027003188A patent/KR20020031178A/ko not_active Application Discontinuation
- 2000-07-18 BR BRPI0013846-0A patent/BR0013846B1/pt not_active IP Right Cessation
- 2000-07-18 CN CNB008126836A patent/CN1240874C/zh not_active Expired - Fee Related
- 2000-07-18 DE DE50001425T patent/DE50001425D1/de not_active Expired - Lifetime
- 2000-07-18 CA CA002382916A patent/CA2382916A1/en not_active Abandoned
- 2000-07-18 WO PCT/DE2000/002423 patent/WO2001020059A2/de not_active Application Discontinuation
- 2000-07-18 US US10/069,417 patent/US6806034B1/en not_active Expired - Fee Related
- 2000-07-18 AT AT00960317T patent/ATE233833T1/de not_active IP Right Cessation
- 2000-07-18 MX MXPA02002194A patent/MXPA02002194A/es active IP Right Grant
- 2000-07-28 TW TW089115135A patent/TW529324B/zh not_active IP Right Cessation
- 2000-09-07 MY MYPI20004142 patent/MY127027A/en unknown
-
2002
- 2002-09-02 HK HK02106458.0A patent/HK1044804B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003509590A (ja) | 2003-03-11 |
| WO2001020059A3 (de) | 2001-09-27 |
| CN1373817A (zh) | 2002-10-09 |
| HK1044804A1 (en) | 2002-11-01 |
| BR0013846B1 (pt) | 2010-06-15 |
| EP1218566A2 (de) | 2002-07-03 |
| DE19944908A1 (de) | 2001-04-12 |
| MXPA02002194A (es) | 2002-12-16 |
| EP1218566B1 (de) | 2003-03-05 |
| TW529324B (en) | 2003-04-21 |
| KR20020031178A (ko) | 2002-04-26 |
| HK1044804B (zh) | 2003-08-01 |
| ATE233833T1 (de) | 2003-03-15 |
| CN1240874C (zh) | 2006-02-08 |
| AU7267800A (en) | 2001-04-17 |
| US6806034B1 (en) | 2004-10-19 |
| MY127027A (en) | 2006-11-30 |
| CA2382916A1 (en) | 2001-03-22 |
| DE50001425D1 (de) | 2003-04-10 |
| WO2001020059A2 (de) | 2001-03-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
| B11B | Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements | ||
| B11N | Dismissal: publication cancelled [chapter 11.14 patent gazette] |
Free format text: REFERENTE A RPI 2014 DE 11/08/2009. |
|
| B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
| B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 18/07/2000, OBSERVADAS AS CONDICOES LEGAIS. |
|
| B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time |
Free format text: REFERENTE A 16A ANUIDADE. |
|
| B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |
Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2385 DE 20-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |