BG60349B2 - Рамки за захващане на печатни платки,подлежащи на галванизиране - Google Patents

Рамки за захващане на печатни платки,подлежащи на галванизиране Download PDF

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Publication number
BG60349B2
BG60349B2 BG78651A BG7865187A BG60349B2 BG 60349 B2 BG60349 B2 BG 60349B2 BG 78651 A BG78651 A BG 78651A BG 7865187 A BG7865187 A BG 7865187A BG 60349 B2 BG60349 B2 BG 60349B2
Authority
BG
Bulgaria
Prior art keywords
spring
frames according
holders
column
frames
Prior art date
Application number
BG78651A
Other languages
Bulgarian (bg)
English (en)
Inventor
Rudolf Kreisel
Dieter Pistor
Ludwig Mankut
Thomas Kosikowski
Rolf Gaebel
Peter Haase
Peter Kuhn
Original Assignee
Schering Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6295137&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=BG60349(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Schering Aktiengesellschaft filed Critical Schering Aktiengesellschaft
Publication of BG60349B2 publication Critical patent/BG60349B2/bg

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Devices For Use In Laboratory Experiments (AREA)
  • Electroplating Methods And Accessories (AREA)
BG78651A 1986-02-28 1987-02-26 Рамки за захващане на печатни платки,подлежащи на галванизиране BG60349B2 (bg)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3606492 1986-02-28

Publications (1)

Publication Number Publication Date
BG60349B2 true BG60349B2 (bg) 1994-06-30

Family

ID=6295137

Family Applications (1)

Application Number Title Priority Date Filing Date
BG78651A BG60349B2 (bg) 1986-02-28 1987-02-26 Рамки за захващане на печатни платки,подлежащи на галванизиране

Country Status (10)

Country Link
US (1) US4752371A (fr)
EP (1) EP0239736B2 (fr)
JP (1) JPS62253800A (fr)
CN (1) CN87100995A (fr)
AT (1) AT398581B (fr)
BG (1) BG60349B2 (fr)
CA (1) CA1263480A (fr)
DE (2) DE3771755D1 (fr)
ES (1) ES2024439B3 (fr)
SU (1) SU1554770A3 (fr)

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US7678245B2 (en) * 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US6962524B2 (en) 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20040020789A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7059948B2 (en) 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
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US7137879B2 (en) 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7344432B2 (en) 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US20050194681A1 (en) * 2002-05-07 2005-09-08 Yongqi Hu Conductive pad with high abrasion
DE10241619B4 (de) * 2002-09-04 2004-07-22 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von zumindest oberflächlich elektrisch leitfähigem Behandlungsgut
US7172184B2 (en) * 2003-08-06 2007-02-06 Sunpower Corporation Substrate carrier for electroplating solar cells
DE10340888B3 (de) 2003-09-04 2005-04-21 Atotech Deutschland Gmbh Stromversorgungseinrichtung in einer Vorrichtung zur elektrochemischen Behandlung
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US7427340B2 (en) * 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
DE102005039100A1 (de) * 2005-08-09 2007-02-15 Gebr. Schmid Gmbh & Co. Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung
WO2007117301A2 (fr) * 2005-11-01 2007-10-18 Applied Materials, Inc. Couvercle à contact par bille destiné à réduire les pertes de cuivre et la atténuer les variations brusques
DE102007026635B4 (de) * 2007-06-06 2010-07-29 Atotech Deutschland Gmbh Vorrichtung zum nasschemischen Behandeln von Ware, Verwendung eines Strömungsorgans, Verfahren zum Einbauen eines Strömungsorgans in die Vorrichtung sowie Verfahren zur Herstellung einer nasschemisch behandelten Ware
DE102007026634B4 (de) * 2007-06-06 2009-04-16 Atotech Deutschland Gmbh Vertikalanlage zur galvanotechnischen Behandlung eines Werkstückes und Verfahren zum Befördern des Werkstückes
CN101437365B (zh) * 2007-11-15 2011-05-11 富葵精密组件(深圳)有限公司 固持装置及固持方法
CN101713094B (zh) * 2009-11-27 2011-10-26 深圳市五株电路板有限公司 印刷电路板电镀夹具
DE202010001282U1 (de) * 2010-01-20 2011-06-01 Haga, Herbert, 72517 Galvanikgestell
KR101317133B1 (ko) * 2012-01-05 2013-10-08 주식회사 호진플라텍 태양전지용 전기 도금을 위한 기판 캐리어 장치
US8956514B2 (en) * 2012-11-09 2015-02-17 Kohler Co. Rack for coating components
CN103911640A (zh) * 2013-01-05 2014-07-09 刘仁志 用于竖式槽进行印制线路板水平电镀的装置
DE202015005883U1 (de) * 2015-08-20 2016-11-23 Bertold Oberle Ohg Eintauchhalterung
CN105611740A (zh) * 2016-03-30 2016-05-25 深圳市荣泰达节能机械设备有限公司 一种用于pcb双面阻焊和文字烘干的隧道炉
CN108130584A (zh) * 2018-01-19 2018-06-08 深圳崇达多层线路板有限公司 一种垂直连续式电镀铜设备中使用的电镀夹具
US11598018B2 (en) * 2018-03-30 2023-03-07 Sunpower Corporation Dual wafer plating fixture for a continuous plating line
RU191022U1 (ru) * 2019-03-12 2019-07-19 Общество с ограниченной ответственностью "Научный центр передовых технологий "СИРИУС" Подвеска для гальванической обработки тонкостенных цилиндрических трубчатых деталей
CN110284176B (zh) * 2019-07-09 2020-05-29 广德今腾电子科技有限公司 一种pcb板涂层的电镀装置及电镀工艺
CN110366320B (zh) * 2019-08-19 2022-03-25 江苏上达电子有限公司 改善柔性线路板翘曲的镀铜装置及其方法

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DD160317A3 (de) * 1981-04-22 1983-06-01 Herwig Fliegner Haltevorrichtung fuer gegenstaende die mit elektrolytischen oder chemischen oberflaechenbehandlungen oder mit metallbedampfungstechnik bearbeitet werden sollen
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DE3342712A1 (de) * 1983-11-25 1985-06-05 Strecker, Günther, 7100 Heilbronn Gestellstab mit haltevorrichtung
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Also Published As

Publication number Publication date
CN87100995A (zh) 1988-03-16
SU1554770A3 (ru) 1990-03-30
EP0239736B2 (fr) 1995-10-25
EP0239736A1 (fr) 1987-10-07
US4752371A (en) 1988-06-21
EP0239736B1 (fr) 1991-07-31
AT398581B (de) 1994-12-27
CA1263480A (fr) 1989-11-28
DE3771755D1 (de) 1991-09-05
ATA44687A (de) 1989-07-15
DE3703549A1 (de) 1987-09-03
DE3703549C2 (de) 1994-05-19
ES2024439B3 (es) 1992-03-01
JPS62253800A (ja) 1987-11-05

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