SG85700A1 - Multiple flat substrate electroplating apparatus - Google Patents

Multiple flat substrate electroplating apparatus

Info

Publication number
SG85700A1
SG85700A1 SG200001427A SG200001427A SG85700A1 SG 85700 A1 SG85700 A1 SG 85700A1 SG 200001427 A SG200001427 A SG 200001427A SG 200001427 A SG200001427 A SG 200001427A SG 85700 A1 SG85700 A1 SG 85700A1
Authority
SG
Singapore
Prior art keywords
flat substrate
electroplating apparatus
multiple flat
substrate electroplating
substrate
Prior art date
Application number
SG200001427A
Inventor
Chin-Hsiang Chen
Eugen Breitkreuz
Original Assignee
Wus Printed Circuit Co Ltd
Eugen Breitkreuz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wus Printed Circuit Co Ltd, Eugen Breitkreuz filed Critical Wus Printed Circuit Co Ltd
Priority to SG200001427A priority Critical patent/SG85700A1/en
Publication of SG85700A1 publication Critical patent/SG85700A1/en

Links

SG200001427A 2000-03-15 2000-03-15 Multiple flat substrate electroplating apparatus SG85700A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200001427A SG85700A1 (en) 2000-03-15 2000-03-15 Multiple flat substrate electroplating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200001427A SG85700A1 (en) 2000-03-15 2000-03-15 Multiple flat substrate electroplating apparatus

Publications (1)

Publication Number Publication Date
SG85700A1 true SG85700A1 (en) 2002-01-15

Family

ID=20430547

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200001427A SG85700A1 (en) 2000-03-15 2000-03-15 Multiple flat substrate electroplating apparatus

Country Status (1)

Country Link
SG (1) SG85700A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4385967A (en) * 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
US4501650A (en) * 1983-08-26 1985-02-26 Napco, Inc. Workpiece clamp assembly for electrolytic plating machine
US4752371A (en) * 1986-02-28 1988-06-21 Schering Aktiengesellschaft Elongated frame for releasably-holding printed circuit boards

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4385967A (en) * 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
US4501650A (en) * 1983-08-26 1985-02-26 Napco, Inc. Workpiece clamp assembly for electrolytic plating machine
US4752371A (en) * 1986-02-28 1988-06-21 Schering Aktiengesellschaft Elongated frame for releasably-holding printed circuit boards

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