TW467393U - Wafer plating equipment - Google Patents
Wafer plating equipmentInfo
- Publication number
- TW467393U TW467393U TW89222432U TW89222432U TW467393U TW 467393 U TW467393 U TW 467393U TW 89222432 U TW89222432 U TW 89222432U TW 89222432 U TW89222432 U TW 89222432U TW 467393 U TW467393 U TW 467393U
- Authority
- TW
- Taiwan
- Prior art keywords
- plating equipment
- wafer plating
- wafer
- equipment
- plating
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW89222432U TW467393U (en) | 2000-12-21 | 2000-12-21 | Wafer plating equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW89222432U TW467393U (en) | 2000-12-21 | 2000-12-21 | Wafer plating equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
TW467393U true TW467393U (en) | 2001-12-01 |
Family
ID=21676494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW89222432U TW467393U (en) | 2000-12-21 | 2000-12-21 | Wafer plating equipment |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW467393U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111463108A (en) * | 2020-04-09 | 2020-07-28 | 北京烁科精微电子装备有限公司 | Wafer cleaning device |
CN117810072A (en) * | 2024-03-01 | 2024-04-02 | 四川科尔威光电科技有限公司 | Control method for uniformity of wafer chip gold-tin alloy |
-
2000
- 2000-12-21 TW TW89222432U patent/TW467393U/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111463108A (en) * | 2020-04-09 | 2020-07-28 | 北京烁科精微电子装备有限公司 | Wafer cleaning device |
CN117810072A (en) * | 2024-03-01 | 2024-04-02 | 四川科尔威光电科技有限公司 | Control method for uniformity of wafer chip gold-tin alloy |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 |