TW467393U - Wafer plating equipment - Google Patents

Wafer plating equipment

Info

Publication number
TW467393U
TW467393U TW89222432U TW89222432U TW467393U TW 467393 U TW467393 U TW 467393U TW 89222432 U TW89222432 U TW 89222432U TW 89222432 U TW89222432 U TW 89222432U TW 467393 U TW467393 U TW 467393U
Authority
TW
Taiwan
Prior art keywords
plating equipment
wafer plating
wafer
equipment
plating
Prior art date
Application number
TW89222432U
Other languages
Chinese (zh)
Inventor
Cheng-Lung Kuo
Duane Sheng
Edward Huang
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW89222432U priority Critical patent/TW467393U/en
Publication of TW467393U publication Critical patent/TW467393U/en

Links

TW89222432U 2000-12-21 2000-12-21 Wafer plating equipment TW467393U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89222432U TW467393U (en) 2000-12-21 2000-12-21 Wafer plating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89222432U TW467393U (en) 2000-12-21 2000-12-21 Wafer plating equipment

Publications (1)

Publication Number Publication Date
TW467393U true TW467393U (en) 2001-12-01

Family

ID=21676494

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89222432U TW467393U (en) 2000-12-21 2000-12-21 Wafer plating equipment

Country Status (1)

Country Link
TW (1) TW467393U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111463108A (en) * 2020-04-09 2020-07-28 北京烁科精微电子装备有限公司 Wafer cleaning device
CN117810072A (en) * 2024-03-01 2024-04-02 四川科尔威光电科技有限公司 Control method for uniformity of wafer chip gold-tin alloy

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111463108A (en) * 2020-04-09 2020-07-28 北京烁科精微电子装备有限公司 Wafer cleaning device
CN117810072A (en) * 2024-03-01 2024-04-02 四川科尔威光电科技有限公司 Control method for uniformity of wafer chip gold-tin alloy

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004