GB2033927A - Device for attaching a printed circuit board to a product carrier for electroplating - Google Patents
Device for attaching a printed circuit board to a product carrier for electroplating Download PDFInfo
- Publication number
- GB2033927A GB2033927A GB7936145A GB7936145A GB2033927A GB 2033927 A GB2033927 A GB 2033927A GB 7936145 A GB7936145 A GB 7936145A GB 7936145 A GB7936145 A GB 7936145A GB 2033927 A GB2033927 A GB 2033927A
- Authority
- GB
- United Kingdom
- Prior art keywords
- arms
- printed circuit
- circuit board
- clamping
- product carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000009713 electroplating Methods 0.000 title claims description 9
- 125000006850 spacer group Chemical group 0.000 claims abstract description 11
- 241000826860 Trapezium Species 0.000 claims description 7
- 239000000463 material Substances 0.000 abstract description 10
- 239000011248 coating agent Substances 0.000 abstract description 7
- 238000000576 coating method Methods 0.000 abstract description 7
- 238000012423 maintenance Methods 0.000 abstract description 3
- 239000007921 spray Substances 0.000 abstract description 3
- 239000003792 electrolyte Substances 0.000 description 5
- 230000008021 deposition Effects 0.000 description 3
- 239000008237 rinsing water Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Clamps And Clips (AREA)
- Load-Engaging Elements For Cranes (AREA)
- Manipulator (AREA)
Abstract
In the device above a spacer 11 for two oppositely situated arms 1 and 2, one arm supports a clamping device e.g. 12, 13, enabling attachment of the upper ends of the two arms to the product carrier WTR, whilst between the other lower ends of the arms which can be moved towards and from each other a printed circuit board LP can be clamped, and below the spacer the arms are curved away from the printed circuit board, this part of the arms being adjoined by a part which extends parallel to the clamped printed circuit board, one or more abutment pins 3, 4 being arranged between the arms, the lower ends of the arms being curved towards the printed circuit board and being provided on their inner sides with a number of upwardly directed clamping pins e.g. 5, 6, 7, 8 and 9. The device enables firm mechanical attachment and reliable electrical contacting whilst the small contact area facilitates spray rinsing at the clamping area, enables a more complete covering of the printed circuit by the coating material and reduces maintenance for removal of unwanted coating material at the area of contact. <IMAGE>
Description
SPECIFICATION
Device for attaching a printed circuit board to a product carrier
The invention relates to a device for attaching a printed circuit board to a product carrier for electroplating.
For electrolytic deposition of a coating material on an electrically conductive object, the object to be coated is submerged, by means of a holder, a clamp or the product frame, in an electrolute bath and is connected to a voltage source. An anode which is connected to a voltage source of opposite polarity is also submerged in the bath and may be dissolved by ionisation. The dissolved ions are deposited on the object to be coated as soon as a current flows through the bath between the object to be coated and the anode. The metal deposited on the cathode (product) is compensated for by dissolution of the anode or (particularly in the case of insoluble anodes) by the introduction of a metal salt into the electrolyte.
The frames which are made of iron or copper are proportioned so that they permit adequate current flow without heating. For the contact of the frame with the holder or clamp, a flat or square section material is more suitable than a round profile.
For the electrolytic deposition of coating material on an electrically conductive object, current densities are required of from approximately 0.1 Ah per square dm in the case of gold plating to 50 Ah per square dm in the case of hard chromium deposition. The electrical current flow between the current source and the object to be coated is achieved via the electrically conductive clamp, holder or frame.
If the product is screwed directly to the frame in an electroplating installation incorporating spray rinsing, there is a disadvantage in that the loading of the device is time consuming.
For high current densities, comparatively large areas of contact are required to be provided between the object to be coated and the clamp or holder.
These large contact areas, however, have the disadvantage that the productto be coated is not covered by the coating material at the contact areas, so that a costly aftertreatment may be necessary. Furthermore, large contact areas necessitate a comparatively large amount of periodic maintenance for the removal of unwanted coating material at the area of contact between the holding clamp and the product.
finally, large contact areas leave little free space for the rinsing water at the clamping area in an electroplating installation incorporating spray rinsing, and after successful electroplating the bath liquid still flows over the product.
The invention has for its object to reduce the above disadvantages and to provide a device for attaching printed circuit boards to a product carrier which offers a large free space for the rinsing water at the clamping area and which allows a firm mechanical attachment and reliable electrical contacting.
According to the invention, there is provided a device for attaching a printed circuit board to a product carrier for electroplating, in which above a
spacer for two oppositely situated arm, one arm sup
ports a clamping device, clamping of the clamping
device at one hand enabling attachment of the upper ends of the two arms to the product carrier, whilst between the other lower ends of the arms which can
be moved towards and away from each other a
printed circuit board can be clamped, below the spacer the arms being curved away from the printed circuit board, this part of the arms being adjoined by a part which extends parallel to the clamped printed
circuit board, one or more abutment pins being arranged between the arms, the lower ends of the arms being curved towards the printed circuit board and being provided on their inner sides with a
number of upwardly directed clamping pins.
This device offers the advantage that when the
printed circuit board is clamped, the device is at the same time attached to the product carrier. As a result, less time is required for the loading of the device. Moreover, suitable mechanical connection and increased electrical contact pressure are ensured by the increased clamping force. The arms of the device, being bending-resistant due to the acute-angle bend on the longitudinal sides towards the printed circuit board, are preferably constructed so that a large free space remains for a jet of rinsing water at the area of clamping. In a preferred embodiment in accordance with the invention, the tips of the clamping pins on the one arm are arranged at the corner points of a trapezium, the tip of a clamping pin on the other arm being directed towards the centre of said trapezium.
The use of clamping pins offers the advantage that only little periodic maintenance if required for removing coating material, because the electrolyte does not tend to collect on the tips. The arrangement of the clamping pins and the abutment pins results in rotation-free retaining and a reproducible positioning of the object to be coated.
In a preferred embodiment of the device of the invention, said spacer is located in a recess in one of the arms around which spacer the other arm is pivotable.
Using clamping pins, the device can thus also retain objects to be coated which have a curved surface.
The use of a rotary knob with a threaded pin and a circular cutting edge in conjunction with the clamping pins, moreover, offers the advantage that, due to the friction of the cutting edge on the upper surface of the product carrier and by the contacting of the object to be coated, by the tips of the clamping pins, poorly conductive or corroded surfaces can be penetrated to give a good electrical connection.
A preferred embodiment in accordance with the invention will be described in detail hereinafter by way of example with reference to the accompanying drawing. In the drawing, the single figure is a side elevation of the device, partly in a sectional view.
In the Figure, the two arms 1 and 2 of the device are made of a non-corroding material. At its upper
end, the arm 1 can be suspended from and is fixed in a groove, extending in the longitudinal direction of a
product carrier WTR, by way of a pin 10. A number of the devices can be slid along this groove so as to be positioned atan adjustable distance from each otther in order to accommodate printed circuit boards of different widths. The two arms 1,2 are interconnected by means of a spacer 11. At their lower end, the two arms comprise curved portions which face each other. The Figure shows that the curved portions of the two arms 1,2 which have, in a side elevation the shape of a trapezium which is open in the direction of the base line, are arranged at the same level.In order to be clamped, a printed circuit board LP is introduced into the clamping zone between the clamping pins 5,6,7,8, and 9 and is slid as far as abutment pins 3, 4. When a rotary knob 13 is turned, the arm 2 is pushed away from the product carrier WTR by way of a threaded pin 12. The length of the arms 1,2 and the arrangement of the space 11 is chosen so that, the resultant lever action ensures that the pressure exerted by the clamping pins on the printed circuit board amounts to only a fraction of the force exerted on the arm 2 by the threaded pin 12, clamping force acts on the clamped printed circuit board LP. The longitudinal sides of the arms 1,2 are bent at an angle towards the printed circuit board
LP in order to provide a bending-resistant shape.In the preferred embodiment shown in the Figure, the tips of the clamping pins on the arm 1 are arranged at the corner points of a trapezium, the tip of the clamping pin 9 on the arm 2 being directed towards the centre of said trapezium. The arrangement of the clamping pins 5,6,7,8 and 9 ensures a rotation-free clamping of the printed circuit board LP. The spacer 11 and the abutment pins 3,4 serve to prevent rotation of the two arms 1,2 of the device. The device is also suitable for curved surfaces, because the arm 2, being V-shaped in a side elevation, can be pivoted via the space 11 into a siot in the arm 1 which is
V-shaped in a side elevation.
For the sensitizing of printed circuit boards, the device with a clamped printed circuit board LP is imersed in the electrolyte so that the abutment pins 3,4 are situated below the electrolyte surface
BSP. The deposit then formed on the device can be readily removed as a result of the suitable selection ofthe materials.
For electroplating (copper plating and tin piating) the device remains above the electrolyte surface
BSP.
Claims (5)
1. A device for attaching a printed circuit board to a product carrier for electroplating, in which above a spacerfortwo oppositely situated arms, one arm.
supports a clamping device, clamping of the clamping device atthe one hand enabling attachment of the upper ends of the two arms to the product carrier, whilst between the other, lower ends of the arms which can be moved towards and from each other, a printed circuit board can be clamped, below the spacer the arms being curved away from the printed circuit board, this part of the arms being adjoined by a part which extends parallel to the clamped printed circuit board, one or more abutment pins being arranged between the arms, the lower ends of the arms being curved towards the printed circuit board and being provided on their inner sides with a number of upwardly directed clamping pins.
2. A device as claimed in Claim 1, in which the tips of the clamping pins on the one arm are arranged at the corner points of a trapezium, the tip of a clamping pin on the other arm being directed towards the centre of said trapezium.
3. A device as claimed in Claim 1, in which said spacer is located in a recess in one of the arms around which spacer is other arm is pivotable.
4. A device as claimed in Claim 1, in which the clamping device arranged on one of said arms comprises a rotary knob with athreaded pin which is pressed against the product carrier by rotation of the knob, the other arm thus being fixed to the product carrier.
5. A device for attaching a printed circuit board to a product carrier for electroplating, substantially as hereinbefore described with reference to the accompanying drawing.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19782845886 DE2845886A1 (en) | 1978-10-21 | 1978-10-21 | DEVICE FOR ATTACHING PCBS TO A GOODS RACK |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB2033927A true GB2033927A (en) | 1980-05-29 |
Family
ID=6052764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB7936145A Withdrawn GB2033927A (en) | 1978-10-21 | 1979-10-18 | Device for attaching a printed circuit board to a product carrier for electroplating |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5558399A (en) |
| DE (1) | DE2845886A1 (en) |
| FR (1) | FR2439320A1 (en) |
| GB (1) | GB2033927A (en) |
| IT (1) | IT1125501B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3129909A1 (en) * | 1981-07-24 | 1983-02-10 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | SCREW AND EQUIPMENT DEVICE FOR ATTACHING AND RELEASING CIRCUITS FOR PRINTED CIRCUITS ON A GALVANIC FRAME |
| AT381509B (en) * | 1985-02-06 | 1986-10-27 | Galvano Gestellbau Ing Rudolf | DEVICE FOR HOLDING BOARD |
| DE4212567A1 (en) * | 1992-03-14 | 1993-09-16 | Schmid Gmbh & Co Geb | DEVICE FOR TREATING OBJECTS, IN PARTICULAR GALVANIZING DEVICES FOR PCBS |
| DE4317408C2 (en) * | 1993-05-18 | 1995-06-08 | Atotech Deutschland Gmbh | Device for reducing corrosion-related electrical contact resistances at contact points on anode and cathode rails in electrolytic baths |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1404674A (en) * | 1918-04-27 | 1922-01-24 | Carl C Wille | Clamp |
| US1519045A (en) * | 1924-05-01 | 1924-12-09 | Panko Albert | Plate hoist |
| DE470681C (en) * | 1927-01-08 | 1929-01-25 | Riedel & Co | Device for coating objects with a galvanic coating |
| US1773042A (en) * | 1929-06-13 | 1930-08-12 | William S Jones | Mold or plate hanger |
| US2820757A (en) * | 1955-05-26 | 1958-01-21 | Belke Mfg Co | Plating racks and methods of racking articles for electroplating |
| DE7605843U1 (en) * | 1976-02-27 | 1976-07-15 | Seemann, Heinz, 7220 Schwenningen | HANGING DEVICE FOR GALVANIC BATHROOMS |
-
1978
- 1978-10-21 DE DE19782845886 patent/DE2845886A1/en active Granted
-
1979
- 1979-10-18 IT IT26613/79A patent/IT1125501B/en active
- 1979-10-18 GB GB7936145A patent/GB2033927A/en not_active Withdrawn
- 1979-10-22 FR FR7926169A patent/FR2439320A1/en not_active Withdrawn
- 1979-10-22 JP JP13534879A patent/JPS5558399A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| IT1125501B (en) | 1986-05-14 |
| FR2439320A1 (en) | 1980-05-16 |
| JPS5558399A (en) | 1980-05-01 |
| IT7926613A0 (en) | 1979-10-18 |
| DE2845886A1 (en) | 1980-04-30 |
| DE2845886C2 (en) | 1987-11-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO1994005827A2 (en) | Dry contact electroplating apparatus | |
| US4297197A (en) | Electroplating rack | |
| US6887113B1 (en) | Contact element for use in electroplating | |
| CN215163269U (en) | Electroplating carrier and electroplating device | |
| CN205529113U (en) | Clamping device is electroplated to semiconductor wafer | |
| GB2033927A (en) | Device for attaching a printed circuit board to a product carrier for electroplating | |
| US4352727A (en) | Rotogravure cylinder plating and de-plating apparatus | |
| US6071385A (en) | Racking fixture for electrochemical processing | |
| CA2341218A1 (en) | Contact element | |
| JPH0338353B2 (en) | ||
| ATE181374T1 (en) | METHOD FOR ELECTROLYSIS OF SILVER IN MOEBIUS CELLS | |
| US3746627A (en) | Method of metal electroplating | |
| KR100584095B1 (en) | Substrate hanger rack structure of plating apparatus | |
| US20220325426A1 (en) | An electrode assembly for electrochemical processes | |
| CN110129866A (en) | A kind of BGA plate electroplanting device and electro-plating method | |
| KR20200099401A (en) | The jig for chrome plating | |
| KR20200030651A (en) | Apparatus For Individual Electroplating For PCB | |
| CN217733328U (en) | Electroplating hanger | |
| JPS5952716B2 (en) | plating device | |
| KR101286254B1 (en) | Wafer Holder Assist Apparatus for Electroplating of Semiconductor | |
| JP2001073196A (en) | Plating device and plating method using the same | |
| KR890009047Y1 (en) | Current conduct device of an electro-plating apparatus | |
| US4487681A (en) | Electroplating test cell | |
| JPS5475585A (en) | Aluminium terminal | |
| JPH0561360B2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |