JP2001073196A - Plating device and plating method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plating device which makes it possible surely and stably to obtain the contact with hangers for plating and a plating method using the same. SOLUTION: This plating device 1 includes a plating tank 2 and feed bases 10 for plating which are arranged at the top end edges thereof, supports the hangers 30 for plating and energize panels P having many wiring boards which are the materials to be plated via the hangers 30. The feed bases 10 have grooves (contact parts) 14 for coming into contact with hanging parts 32 at both ends of the hangers 30 for plating and are capable of supplying water (conductive liquid) into these grooves 14 from liquid feed holes (supply means) 16 and 16.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating apparatus for performing electrolytic copper plating or the like on a required surface of a wiring board or the like, and a plating method using the same.

[0002]

2. Description of the Related Art For example, in electrolytic copper plating, which is a typical electroplating, an object to be plated, such as a wiring board, to be plated in a plating solution of an aqueous solution of copper sulfate is used as a cathode, and an anode is opposed to this. This is a plating method in which copper ions eluted from the anode are deposited on the surface of the object to be plated by energizing. In order to perform such plating, a pair of plating power supply tables 70 as shown in FIG. 5 (A) are arranged at the opposite upper left and right edges of the plating tank filled with the plating solution. The power supply base 70 has a groove 76 having a V-shaped cross section in the center on an upper surface 74 of a metal body 72 having a substantially rectangular parallelepiped shape, and a cathode of a power supply (not shown) is connected to the body 72.

As shown in FIG. 5 (A), hook portions 79 having a substantially rhombic cross section at both ends of a plating hanger 78 indicated by alternate long and short dash lines are inserted into the grooves 76 of the power supply stand 70 to support the same. At the same time, a plating object (not shown) vertically supported in the middle of the hanger 78 is used as a cathode. And
By applying electricity from a power source between the object to be plated and the anode immersed in a plating solution, copper ions eluted from the anode are deposited on the surface of the object to be plated. Electrolytic copper plating is applied to required positions on the object surface. By the way, dust may adhere to the pair of inclined surfaces forming the groove 76, and a gap may be formed between the hanging portion 79 and the groove 76, so that surface contact between the two may be hindered. Further, in order to prevent unevenness of the plating film, the hanger 78 may be swung in the vertical direction or the front-rear direction in FIG. For this reason, as shown in FIG. 5B, for example, the hanging portion 79 of the hanger 78 rotates,
Are shifted from each other, as shown by the two-dot chain line, the hanging portion 79 comes into line contact or point contact with each inclined surface of the groove 76, and the contact area decreases.

When the contact area between the hanging portion 79 and the groove 76 decreases as described above, the resistance value of the current increases in the remaining contact portion, and heat is generated in the portion. Due to this heat,
The resin component adjacent to the groove 76 of the power supply base 70 may be thermally deformed, which may cause a trouble in the plating apparatus. Further, when the hanging portion 79 swings in the groove 76, a spark is generated at a portion where the hanging portion 79 comes in contact with or separates from the groove 76, which may cause the same problem as described above. In addition, since the conduction between the object to be plated and the power supply becomes unstable, there is a problem that the plating quality varies, and the plating time is prolonged and the plating efficiency may be reduced.

[0005]

SUMMARY OF THE INVENTION The present invention solves the problems in the prior art described above, and provides a plating apparatus including a plating power supply stand capable of reliably and stably obtaining contact with a plating hanger. Another object of the present invention is to provide a plating method using the same.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention has been made with an idea of forming a fluid film of a conductive liquid at a contact portion of a power supply stand supporting a plating hanger. It is. That is, the plating apparatus of the present invention includes a plating tank and a plating power supply stand disposed on the upper end edge of the plating tank, supporting a plating hanger, and energizing an object to be plated through the hanger. The power supply base has a contact portion that comes into contact with the hook portions at both ends of the hanger, and the conductive liquid can be supplied to the contact portion.

[0007] According to this, the contact portion between the power supply stand and the plating hanger is always covered with the thin fluid film by the flow of the conductive liquid such as water, and no gap is formed. , A stable conduction state can be maintained. Therefore, since the conventional heat generation and spark can be prevented, the trouble of the plating apparatus can be solved, and the plating quality and the plating efficiency can be stably maintained. The conductive liquid also includes tap water, natural water, machine oil, soap oil, animal and vegetable oil, and the like.

[0008] The present invention also includes a plating apparatus in which a contact portion of the plating power supply stand is an upward groove, and has a supply means for supplying the conductive liquid into the groove. According to this, the conductive liquid flows down in the groove of the power supply stand that contacts and supports the plating hanger, and the thin flow film covers the inclined surface or the curved surface that forms the groove, and the gap with the hanger is formed. Can be reliably filled. The cross-sections of the groove and the hanger do not necessarily have to be similar to each other so that they can make surface contact with each other, and may have a shape in which a slight gap is formed through which a conductive liquid can enter by capillary action. The supply means includes a liquid supply hole that penetrates the main body of the power supply stand and has one end opened in the groove, and a pipe or a pump that supplies a conductive liquid to the liquid supply hole.

Further, the lower cross section of the hanging portion at both ends of the plating hanger is substantially V-shaped, and the groove of the plating power supply stand is substantially V-shaped in cross section substantially similar to the lower cross section of the hanging portion. , Plating equipment is also included. According to this,
While the hanging part of the hanger can be easily inserted into the groove,
Even if the lower part of the hook portion does not make surface contact with the inclined surface of the groove, the thin gap between the two can be reliably filled with the conductive liquid. When the angle of the V-shape of the hanging portion and the groove is set to an acute angle of, for example, 60 °, when the hanger is swung, the hanger is displaced with respect to the power supply stand, and a situation in which the hanging portion and the groove are raised is prevented. Electrical continuity can be ensured more stably.

[0010] The present invention also includes a plating apparatus in which the lower cross section of the hanging portion at both ends of the plating hanger has a substantially arc shape, and the groove plating power supply base has a substantially U-shaped cross section. According to this, by setting the radius of the curved surface forming the lower part of the groove to be substantially the same as or slightly larger than the radius of the hanging portion of the hanger, the operation of inserting and supporting the hanger becomes easy, and both curved surfaces The gap between the two can be reliably filled with the conductive liquid. After the hanger is placed on the power supply table, the hanger can be fixed by clamping it with an air cylinder or the like via an insulating material such as a resin.

[0011] In addition, the plating method of the present invention is characterized in that the object to be plated can be energized through the plating power supply base, the flowing film of the conductive liquid, and the plating hanger in the above plating apparatus, and the plating object is used as a cathode. Electroplating is performed between the anode to be plated and the object to be plated in a plating tank filled with a plating solution. According to this, since the conduction between the cathode of the power supply and the object to be plated can be stably obtained, heat generation and trouble near the power supply stand can be prevented, so that plating with stable plating quality and plating efficiency can be performed.

[0012]

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a plating apparatus 1 according to the present invention. The plating apparatus 1 includes a rectangular cylindrical plating tank 2 filled with a plating solution M, a pair of anodes 4 and 4 immersed in parallel in the plating solution M in the plating tank 2, and FIG.
And a pair of plating power supply tables 10 disposed at upper left and right edges of the plating tank 2. The power supply tables 10 support a plating hanger 30 which vertically suspends a pair of panels P having a large number of wiring boards as plating objects. The anode 4 has both ends supported by the upper end edge of the opposite side of the plating tank 2, is electrically connected to an anode of a power source (not shown) via a conductive wire 6, and has a plurality of vertical rails 8, 8 hanging there between. The wiring board panel P in the plating solution M
And an anode plate (not shown) opposite to the anode plate is suspended.

As shown in FIGS. 1 and 2 (A) and 2 (B), plating power supplies 10, 10 are symmetrically arranged at substantially the center of the upper left and right edges of the plating tank 2 facing each other. . Each power supply stand 10 has a rectangular parallelepiped main body 12 made of a copper alloy such as brass,
A groove (contact portion) 14 having a substantially V-shaped cross section provided at the center of the upper surface.
A liquid supply hole (supply means) 16, which has a tip opened on a pair of inclined surfaces forming the groove 14 and penetrates the main body 12 horizontally.
16 and a pipe 15 for supplying water (conductive liquid) W thereto.
And The main body 12 is connected to a wiring that is electrically connected to a cathode of a power supply (not shown).

As shown in FIGS. 2A and 2B, a tray 18 made of a resin such as vinyl chloride and having a substantially L-shape in plan view is disposed below each power supply base 10. The water W flowing down from each liquid supply hole 16 is received, and the water W is drained from the hole 17a of the protruding portion 17 protruding outward through the pipe 19. In addition, as shown in FIGS.
A guide plate 20 made of a resin such as vinyl chloride is vertically erected between the plate 0 and the plating tank 2, and is described below by an upward tapered portion 22 and a U-shaped concave groove 24 provided at the center thereof. The hook 32 of the plating hanger 30 is easily inserted into the groove 14 of the power supply stand 10. The bottom 26 of the groove 24 is located below the narrow groove 13 at the bottom of the groove 14.

[0015] As shown in FIG.
Is made of titanium (Ti) or an alloy thereof, and has hanging portions 32, 32 having rhombic cross sections at both ends. In the middle of the hanger 30, a pair of vertical rails 34 made of stainless steel is hung, between which a middle rail 35 and a lower rail 36 are erected horizontally, and a plurality of clips 38 from the middle rail 35 and the lower rail 36. , Panels P, P having a large number of wiring boards as objects to be plated are suspended vertically. Each of the vertical rails 34 is detachable from the hanger 30 with a set screw or the like.

The portion of the hanger 30 that is immersed in the plating solution M is coated with a resin except for the tip of the clip 38 that comes into contact with the panel P to prevent the plating metal from adhering. Thereby, the life of the plating solution M can be extended. In addition, since the clip 38 is attached to both the middle rail 35 and the lower rail 36, the hanger 30 has a greater variation in plating thickness than when the clip 38 is provided only on the middle rail 35 or the lower rail 36. Thus, the wiring board can be plated well. Further, as shown in FIG. 2 (B), each hanging portion 32 of the hanger 30 has a lower section having an acute angle θ of 60 °, and the groove 14 of each power supply stand 10 receiving the same has an inner angle of the same angle. It is set in a substantially V shape.

The hanger 30 on which the panel P is set
3A is inserted into the groove 14 of the power supply base 10 by using a hoist or the like to raise and lower each hook 32 of the hanger 30.
As shown in FIG. 7, the lower inclined surface of the hanging portion 32 and each inclined surface of the groove 14 are in surface contact with each other. In this state, each pipe 1
When water W is supplied into the groove 14 from 5 through the liquid supply hole 16 of the power supply stand 10, the water W flows down as a thin fluid film between the hanging portion 32 and the inclined surface of the groove 14, and flows down with the power supply stand 10. Hanger 30
Can be reliably established. As a result, the wiring board of each panel P can be reliably connected to the cathode via the power supply stand 10 and the hanger 30. Therefore, electrolytic copper plating ( Plating method) and the like can be surely applied, and good plating with little variation in plating thickness can be coated. still,
With respect to the hanging portion 32 having the lower section angle θ of 60 °, the groove 14
Even if the inner angle is slightly wide as 61 ° to 62 °, it is also possible to easily fill the gap between the two with water W flowing down to make the gap conductive.

As described above, the power supply stand 10 to which the water W can be supplied.
By using the plating apparatus 1 having the above configuration, conduction can be reliably established between the plating apparatus 1 and the plating hanger 30, and a panel P having a large number of wiring boards to be plated is used as a cathode, and electrolytic plating can be performed accurately and accurately with the anode 4. It can be applied stably. Further, dust adheres to the groove 14 of the power supply stand 10 and the hanger 30
Even if there is a gap between them, it can be filled with the flowing water W to ensure conduction. Further, in FIG. 1, the power supply tables 10 supporting the hanging portions 32 of the plating hangers 30 are reciprocally slid along the upper edge of the plating tank 2, thereby plating the wiring board (P) to be plated. An operation for suppressing unevenness may be performed. Such operations include through holes (through holes) and non-through holes in the wiring board.
This is particularly effective when plating needs to be performed well in the (via hole). Then, when the pair of power supply tables 10 is slid by the above operation, the respective hanging portions 32 of the hanger 30 are slightly displaced in the respective grooves 14 due to the flow resistance of the panel P with respect to the plating solution M, and the inclined surfaces of the grooves 14 There may be a gap between them.

However, a thin flowing film of water W is formed between the hanging portion 32 and the groove 14 and fills a gap caused by the contact and separation between the hanging portion 32 and the groove 14. Conduction between the hanger 30 and the hanger 30 can be reliably and stably achieved. In addition, a pair of right and left power supply tables 10, 1
Even if a gap occurs between the two when the 0 slides, conduction can be similarly secured. Therefore, unlike the related art, it is possible to prevent damage to the resin parts such as the guide plate 20 near the power supply stand 10 due to heat generation and spark generation due to partial contact, and to stably maintain plating quality and plating efficiency. It is also possible to do. By supplying water W into the groove 14 before the hanger 30 is inserted, dust adhered to the inclined surface of the groove 14 can be removed by flowing down.

As shown in FIG. 3 (B), two liquid supply holes 16 may penetrate the main body 12 of the power supply base 10 in parallel, or alternatively, as shown in FIG. 3 (C). Alternatively, the liquid supply hole 16a may be formed in a horizontally elongated slit shape. In short, it suffices if the tips of the liquid supply holes 16 and 16a open above the respective inclined surfaces of the groove 14, and the water W can flow down on the inclined surfaces as a thin fluid film. It is to be noted that an optimal pattern for the supply pattern of the water W should be selected in accordance with the contact form between the groove 14 and the hanging portion 32, such as a continuous jet, a continuous spout, or an intermittent jet. Can be.

The present invention is not limited to the embodiment described above. For example, as shown in FIG. 4 (A), a groove 44 having a substantially U-shaped cross section having a semicircular portion 45 facing upward and having a bottom portion is formed in a rectangular parallelepiped main body 42, and It is also possible to use a plating power supply base 40 which penetrates the supply liquid supply hole 46. As shown in FIG. 4A, hooks 49 having a circular cross section (lower cross-sectional arc shape) at both ends of the plating hanger 48 are inserted into the grooves 44, and the water W from the liquid supply hole 46 is semicircular. By causing the power to flow between the hook 45 and the hanging portion 49, conduction between the power supply stand 40 and the hanger 48 can be reliably ensured. The radius of the semicircular portion 45 of the groove 44 is the same as or slightly larger than the radius of the lower cross section of the hook portion 49, so that the above-described conduction and the operation of inserting and removing the hook portion 49 can be easily performed.

As shown in FIG. 4 (B), a rectangular parallelepiped main body 52 has a substantially U-shaped section 55 with a semi-elliptical section 55 facing upward.
A groove 54 having a V-shape is formed, and water W
It is also possible to use the plating power supply base 40 that penetrates the liquid supply hole 56 for supplying the liquid. As shown in FIG.
4, a hook 59 having an elliptical cross section (a lower cross-section arc shape) at both ends of a plating hanger 58 is inserted, and a liquid supply hole 56 is formed.
By flowing the water W from the space between the semi-elliptical portion 55 and the hanging portion 59, conduction between the power supply stand 50 and the hanger 58 can be reliably obtained. That is, the hook portion 59 and the semi-elliptical portion 55 having an elliptical cross section can be surely brought into surface contact with each other by making the oblong direction of the both horizontal, and the operation of inserting and removing the hook portion 59 itself can be performed. It can be done easily.

Further, as shown in FIG. 4 (C), only a groove 64 having a substantially V-shaped cross section is formed in the rectangular parallelepiped main body 62 so as to face upward.
It is also possible to use a plating power supply base 60 in which a nozzle (supply means) 67 parallel to the inclined surface 65 is mounted near the upper end 66 of the inclined surface 65 of the groove 64. That is, as shown in FIG. 4 (C), a hanging portion 69 having a rectangular cross section of the plating hanger 68 and a lower cross section similar to the groove 64 is inserted into the groove 64, and water W is inclined from the nozzle 67 at each inclination. By flowing down between the surface 65 and the hanging portion 69, conduction between the power supply stand 60 and the hanger 68 can be reliably ensured. In this case, there is an advantage that a small-diameter drilling process is not required in the main body 62, but it is necessary to pay attention to setting each nozzle 67 to a position that does not hinder the insertion / removal operation of the hook 69.

The material of the plating power supply stand and the hanger is as follows:
Not only the Ti alloy but also a copper alloy, an aluminum alloy, an alloy steel, or a stainless steel can be used as long as it is made of metal and has the required conductivity and the hanger also has the strength as a beam. The present invention can be applied to electrolytic plating such as gold (Au) plating, nickel (Ni) plating, chromium (Cr) plating, zinc plating, and tin plating, in addition to the copper plating described above.

[0025]

According to the plating apparatus of the present invention described above, the contact portion between the plating power supply stand and the plating hanger is always covered with the conductive liquid flowing down and covered with the thin fluid film, and the gap is formed. Is not formed, a stable conduction state can be maintained between the power supply stand and the hanger. Therefore, since heat and spark at the contact portion can be prevented,
The trouble of the plating apparatus can be solved, and the plating quality and the plating efficiency can be stably maintained. Further, according to the plating apparatus of the second aspect, the conductive liquid flows down in the groove of the power supply stand that supports and contacts the plating hanger, and a thin fluid film is formed on the inclined surface or the curved surface that forms the groove. In order to cover, the gap with the above-mentioned hanger can be filled reliably and conduction can be taken reliably. On the other hand, according to the plating method of the present invention, since the conduction between the cathode of the power supply and the object to be plated can be stably obtained, heat generation and trouble near the power supply stand can be prevented, so that plating with stable plating quality and plating efficiency can be performed. Can be applied.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing a plating apparatus according to the present invention.

2A is a plan view of the vicinity of a plating power supply stand in the plating apparatus of FIG. 1, and FIG. 2B is a front view of FIG.

3A is a front view of the plating power supply unit shown in FIGS. 1 and 2, and FIGS. 3B and 3C are perspective views of the power supply unit having different water supply holes.

FIGS. 4A to 4C are front views showing different types of plating power supply units.

FIG. 5A is a perspective view showing a plating power supply stand of a conventional plating apparatus, and FIG. 5B is a front view thereof.

[Explanation of symbols]

1. Plating equipment 2. Plating tank 4. Plating tank 4. Anode 10, 40, 50, 60 Plating power supply 14, 44, 54, 64 Grooves (contact portions) 16, 16a, 46, 56 Liquid supply holes (supply means) 30, 48, 58, 68 ... Plating hangers 32, 49, 59 , 69... Hanging section 67... Nozzle (supply means) M... Plating solution W...... (Conductive liquid) P Panel with wiring board (plated object)

Claims (5)

[Claims] 1. A plating tank, comprising: a plating tank; and a plating power supply stand disposed at an upper end edge of the plating tank for supporting a plating hanger and energizing an object to be plated through the hanger. A plating apparatus, comprising: a contact portion that comes into contact with hook portions at both ends of the hanger; and a conductive liquid that can be supplied to the contact portion. 2. The plating apparatus according to claim 1, wherein a contact portion of the plating power supply base is an upward groove, and a supply unit that supplies the conductive liquid into the groove is provided. 3. A lower section of the hanging portion at both ends of the plating hanger is substantially V-shaped, and a groove of the plating power supply base is substantially V-shaped in section substantially similar to the lower section of the hanging portion. The plating apparatus according to claim 2, wherein: 4. The plating hanger according to claim 2, wherein a lower cross section of the hanging portion at both ends is substantially arc-shaped, and a groove of the plating power supply base is substantially U-shaped in cross section. The plating apparatus as described. 5. A plating solution in a plating apparatus according to claim 1, wherein an object to be plated is made electrically conductive and serves as a cathode through a plating power supply base, a conductive liquid flowing film, and the plating hanger. A plating method comprising: performing electroplating between an anode disposed opposite to an object to be plated and the object to be plated, in a plating tank filled with the object.