JPH0111728Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to an electroplating device equipped with a mechanism for sucking and circulating plating liquid.

(Problems to be solved by conventional techniques and ideas) Conventional electroplating equipment requires a special jig to support the object to be plated, and the work of fixing the object to be plated using the jig is difficult. It was a hassle.

In addition, there is a risk that the plated object may fall off the jig, and in such a case, there is a problem that the plated product will be defective.

Furthermore, in order to make the composition of the plating solution uniform, stirring of the plating solution has conventionally been carried out, but this is still insufficient to achieve uniformity.

The present invention has been developed in view of the above points, and an object of the present invention is to provide an electroplating device that can easily hold objects to be plated and can uniformize the composition of the plating solution.

(Means for solving the problem) The electroplating device of the present invention sucks the plating liquid in the plating tank through the suction pipe, and supplies the sucked plating liquid into the plating tank again to circulate the plating liquid. The plating liquid circulation mechanism and the object to be plated are configured to be able to place the object to be plated, and the bottom thereof faces the opening at the tip of the suction pipe, and the bottom is provided with a number of through holes. A mounting body, a support mechanism for supporting the mounting body, and an energizing mechanism configured by connecting the mounting body to a cathode and connecting an electrode plate facing above the mounting body to an anode. It is characterized by being configured.

(Example) In FIG. 1, 1 is a plating tank, 2 is a plating liquid circulation tank, and they communicate with each other via a connecting pipe 3. A plating liquid 4 is placed in the plating tank 1, and a suction pipe 5 for sucking the plating liquid 4 is installed. One end of the suction pipe 5 is located within the plating tank 1, and a bulging portion 6 expanding upward is formed at the rear end, and the other end of the suction pipe 5 is provided above the plating liquid circulation tank 2. It is connected to a suction pipe 7. 8 is a motor.

Further, a delivery pipe 9 is connected to the suction pipe 7, and the tip of the pipe 9 is located in and facing the plating liquid circulation tank 2.

By driving the suction pipe 7, the plating liquid in the plating tank 1 is sucked through the opening 5a at the tip of the suction pipe 5, passes through the suction pipe 5, and then passes through the delivery pipe 9.
The plating liquid is then sent into the plating liquid circulation tank 2. The plating liquid sent into the circulation tank 2 flows into the plating tank 1 again through the connecting pipe 3, and in this way, the plating liquid is suctioned and circulated to maintain a uniform liquid composition.

The suction pipe 5 and the delivery pipe 9 are made of synthetic resin such as vinyl chloride resin.

Reference numeral 10 denotes an object mounting body on which an object to be plated is placed, and is usually constructed in the shape of a basket as shown in FIG. A large number of through holes 11 are provided at the bottom of the mounting body 10.
However, the bottom of the mounting body having the through hole 11 may be a metal plate with small holes or a wire mesh. The size of the through hole 11 can be changed as appropriate depending on the size of the object to be plated.

The mounting body 10 has two hanging rods 12, each of which has a hook-shaped tip.
(FIG. 2), so that the object to be plated 10 is suspended and supported by the support frame 13 as shown in FIG.

The above-mentioned mounting body 10 is suspended and supported by the support frame 13 and is installed above the opening 5a of the suction pipe so that the bottom thereof faces the opening 5a at the tip of the suction pipe.

The above-mentioned mounting body 10 is made of a conductive material such as copper or brass, and an insulating coating can be applied to arbitrary parts as necessary.

As shown in FIG. 2, two cathode conduction rods 15 are connected to the support frame 13, and one anode conduction rod 16 is electrically insulated from the support frame 13. It extends downward through the insertion hole 17, and has an electrode plate 18 at its tip.
are connected to each other, and the electrode plate is provided so as to face above the object to be plated 10.

The support frame 13, the cathode conducting rod 15, and the anode conducting rod 16 are made of a conductive material such as copper or brass, and as the electrode plate 18, a lead plate is usually used. The portion where the anode conduction rod 16 contacts the support frame 13 (the portion inserted into the insertion hole 17 and the portion around it) is covered with an insulating material 19 (for example, a resin pipe).

The cathode conducting rod 15 is connected to a cathode, so that the object to be plated 10 is charged to the cathode via the support frame 13. On the other hand, the anode conduction rod 16 is connected to the anode, and thereby the electrode plate 18 is charged to the anode.

The anode conduction rod 16 and the cathode conduction rod 15 are the hanging rods 2
In this case, the hanging rod 20 is coated with an insulating material to prevent short circuits. It is also possible to configure the hanging rod 20 as an electrode bar, but in that case it is necessary to separate the contact points between the anode and cathode to prevent short circuits.

The hanging rod 20 is elongated in the horizontal direction, and both ends thereof are fixed to the upper end of the plating tank 1.

It is also possible to provide upper and lower cathode lockers 21 with timers at both ends of the hanging rod 20 so as to move the hanging rod 20 up and down.

As the plating liquid that can be applied to the apparatus of the present invention, conventionally known plating liquids such as chrome plating liquid can be used.

(Function) As shown in FIG. 3, when the object 22 to be plated is placed in the object mounting body 10 and the plating liquid is sucked and circulated by the suction pump 7, the mounting body 10 is contacted. The object 22 to be plated is charged as a cathode, and electroplated between it and the electrode plate 18 that is charged as an anode.

Here, the suction force by the suction pipe is applied to the inside of the suction pipe 5, but the plating liquid is applied to the mounting body 1.
It enters into the suction pipe 5 through the through hole 11 of No. 0, and is sucked and circulated. This suction force and the plating liquid are applied to the tip opening 5a of the suction pipe.
The object to be plated 22 is pressed downward by the hydraulic pressure flowing into the container 10, thereby fixing the object to be plated at a predetermined position within the mounting body 10.

In addition, when the upper and lower cathode lockers 21 with timers are provided, the hanging rod 20 can be moved up and down, thereby the suspended mounting body 10 is moved up and down, and the object to be plated is moved up and down along with the up and down movement. 22 automatically changes its position, and plating can be done uniformly by repeating this process using a timer.

(Effects of the invention) According to the invention, since the plating liquid is sucked and circulated, the object to be plated can be fixed in position by the suction force and the liquid inflow pressure. There is no need to use a tool to support and fix the object to be plated, and this has the effect of eliminating the complexity of fixing work using the jig.

In addition, there is no problem of objects to be plated falling off from the jig, and there is an effect that generation of defective plated products can be prevented and product yield can be improved.

Furthermore, since the plating solution is circulated by suction, a conventional stirring device is not required, and this suction circulation has the advantage that the composition of the plating solution can be made more uniform than in the case of stirring.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, in which Fig. 1 is a longitudinal sectional view of the device of the present invention, Fig. 2 is a perspective view showing the support mechanism of the object mounting body to be plated, and Fig. 3 is a perspective view showing the support mechanism of the object mounting body to be plated. FIG. 4 is a vertical cross-sectional view showing a state where the mounting body is installed on the tip opening of the suction pipe, and FIG. 4 is a perspective view showing the above-mentioned mounting body in a suspended and supported state. 1 is a plating tank, 4 is a plating liquid, 5 is a suction pipe, 5a is a tip opening, 10 is a plated object mounting body, 11 is a through hole, 18 is an electrode plate, and 22 is a plated object.

Claims (1)

[Scope of Claim for Utility Model Registration] (1) A plating liquid circulation mechanism that sucks plating liquid in a plating tank through a suction pipe and supplies the sucked plating liquid to the plating tank again to circulate the plating liquid, and An object-to-be-plated object mounting body configured to be able to place an object to be plated, the bottom of which faces the opening at the tip of a suction pipe, and a number of through holes provided in the bottom; The device is characterized by being composed of a support mechanism that supports the body, and an energization mechanism that connects the above-mentioned mounting body to a cathode and connects an electrode plate provided above and facing the mounting body to an anode. Electroplating equipment. (2) The object to be plated is made of conductive material,
The electroplating device according to claim 1, which is suspended and supported by a support frame.