JP2005506447A5 - - Google Patents
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- Publication number
- JP2005506447A5 JP2005506447A5 JP2003536487A JP2003536487A JP2005506447A5 JP 2005506447 A5 JP2005506447 A5 JP 2005506447A5 JP 2003536487 A JP2003536487 A JP 2003536487A JP 2003536487 A JP2003536487 A JP 2003536487A JP 2005506447 A5 JP2005506447 A5 JP 2005506447A5
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- bath
- electroplating
- bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 claims 10
- 238000007747 plating Methods 0.000 claims 6
- 239000003792 electrolyte Substances 0.000 claims 4
- 238000005192 partition Methods 0.000 claims 2
Claims (6)
電解メッキ槽と、
前記電解メッキ槽内でプリント回路基板を位置決めする手段と、
前記プリント回路基板の各側で交互に電解液の層流を生成する手段と
を備えた電解メッキシステム。 An electroplating system for plating vias and through holes in a printed circuit board,
An electroplating bath;
Means for positioning a printed circuit board in the electrolytic plating bath;
Means for alternately producing a laminar flow of electrolyte on each side of the printed circuit board.
前記槽の上方に位置する下部棒と、
前記下部棒に取り付けられた可撓性電流供給接続部と、
前記下部棒に取り付けられた少なくとも１つのプリント回路基板把持部と、
前記プリント回路基板に接触するＶ形受け部を有し、ベンチュリ形状の隔壁を更に有する浮動シールドと、
前記槽の下部で前記浮動シールドの下方に位置して、前記プリント回路基板にわたって電解液の層流を生成する少なくとも１つのエダクターと、
前記プリント回路基板の一方の側から前記プリント回路基板の他方の側へ前記層流を切り換える手段と
を備える、プリント回路基板のビアおよびスルーホールをメッキする電解メッキシステム。 An electroplating bath;
A lower bar located above the tank;
A flexible current supply connection attached to the lower bar;
At least one printed circuit board grip attached to the lower bar;
A floating shield having a V-shaped receiving portion in contact with the printed circuit board and further having a venturi-shaped partition wall;
At least one eductor positioned below the floating shield at the bottom of the bath and producing a laminar flow of electrolyte across the printed circuit board;
Means for switching the laminar flow from one side of the printed circuit board to the other side of the printed circuit board;
An electroplating system for plating vias and through holes in a printed circuit board .
前記下部棒を支持する上部棒と、
前記上部棒上の振動器と、
前記上部棒を剛性構造体に取り付けるばね系と
を備えた、プリント回路基板用の電解メッキシステム。 A plating line for supporting a printed circuit board with a lower support rod;
An upper bar supporting the lower bar;
A vibrator on the upper bar;
A spring system for attaching the upper bar to the rigid structure;
An electroplating system for printed circuit boards .
前記プリント回路基板の各側で交互に電解液の層流を生成する工程と
を含む、プリント回路基板のビアおよびスルーホールをメッキする電解メッキ方法。 Positioning the printed circuit board in the electroplating bath;
Generating a laminar flow of electrolyte alternately on each side of the printed circuit board;
An electroplating method for plating vias and through holes in a printed circuit board .
前記槽の上方に下部棒を位置決めする工程と、
可撓性接続部を用いて前記下部棒に電流を供給する工程と、
少なくとも１つのプリント回路基板を前記下部棒に把持する工程と、
前記プリント回路基板に接触するＶ形受け部を有し、前記プリント回路基板の下方のベンチュリ形状隔壁をさらに位置決めする浮動シールド中で、前記プリント回路基板を移動する工程と、
前記槽の下部で、前記浮動シールドの下方に配置された少なくとも１つのエダクターを用いて、前記プリント回路基板にわたって電解液の層流を生成する工程と、
前記プリント回路基板の一方の側から前記プリント回路基板の他方の側へ前記層流を切り換える工程と
を含む、プリント回路基板のビアおよびスルーホールをメッキする電解メッキ方法。 Preparing an electrolytic layer;
Positioning the lower bar above the bath;
Supplying current to the lower bar using a flexible connection;
Gripping at least one printed circuit board on the lower bar;
Moving the printed circuit board in a floating shield having a V-shaped receptacle in contact with the printed circuit board and further positioning a venturi-shaped partition below the printed circuit board;
Generating a laminar flow of electrolyte across the printed circuit board using at least one eductor disposed below the floating shield at the bottom of the bath;
Switching the laminar flow from one side of the printed circuit board to the other side of the printed circuit board;
An electroplating method for plating vias and through holes in a printed circuit board .
前記下部棒を上部棒で支持する工程と、
振動エネルギーを前記上部棒に供給する工程と、
ばね系を用いて前記上部棒を剛性構造体に装着する工程と
を含む、プリント回路基板の電解メッキ方法。
Supporting the printed circuit board with a lower support rod of the plating line; and
Supporting the lower bar with an upper bar;
Supplying vibration energy to the upper bar;
Attaching the upper bar to the rigid structure using a spring system; and
A method for electrolytic plating of a printed circuit board, comprising:
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US34441701P | 2001-10-19 | 2001-10-19 | |
| PCT/US2002/033530 WO2003033770A2 (en) | 2001-10-19 | 2002-10-21 | System and method for electrolytic plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005506447A JP2005506447A (en) | 2005-03-03 |
| JP2005506447A5 true JP2005506447A5 (en) | 2005-12-22 |
Family
ID=23350458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003536487A Pending JP2005506447A (en) | 2001-10-19 | 2002-10-21 | System and method for electrolytic plating |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6818115B2 (en) |
| EP (1) | EP1438446B1 (en) |
| JP (1) | JP2005506447A (en) |
| KR (1) | KR100660086B1 (en) |
| CN (3) | CN101570873B (en) |
| AU (1) | AU2002349972B2 (en) |
| ES (1) | ES2449076T3 (en) |
| HK (1) | HK1136011A1 (en) |
| WO (1) | WO2003033770A2 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4759834B2 (en) * | 2001-04-25 | 2011-08-31 | 凸版印刷株式会社 | Electroplating equipment for film carriers |
| US20050061660A1 (en) * | 2002-10-18 | 2005-03-24 | Kempen Hein Van | System and method for electrolytic plating |
| EP1903129A1 (en) * | 2003-11-20 | 2008-03-26 | Process Automation International Limited | A liquid delivery system for an electroplating apparatus, an electroplating apparatus with such a liquid delivery system, and a method of operating an electroplating apparatus |
| US7947161B2 (en) * | 2004-03-19 | 2011-05-24 | Faraday Technology, Inc. | Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes |
| US7553401B2 (en) * | 2004-03-19 | 2009-06-30 | Faraday Technology, Inc. | Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating |
| JP2011256444A (en) * | 2010-06-10 | 2011-12-22 | Sumitomo Bakelite Co Ltd | Substrate treating method and substrate treating apparatus |
| NL2005480C2 (en) * | 2010-10-07 | 2012-04-11 | Meco Equip Eng | DEVICE FOR SINGLE-SIDED ELECTROLYTIC TREATMENT OF A FLAT SUBSTRATE. |
| CN103590079A (en) * | 2012-08-14 | 2014-02-19 | 亚洲电镀器材有限公司 | Electroplating method |
| CN103320844A (en) * | 2013-05-16 | 2013-09-25 | 陈焕宗 | Surface copper control device of electroplating process |
| KR101457060B1 (en) * | 2014-04-30 | 2014-10-31 | (주)네오피엠씨 | substrate plating device |
| CN105862098B (en) * | 2016-06-22 | 2018-01-12 | 苏州翔邦达机电有限公司 | Suitable for the scaffold system of pcb board plating |
| JP2020147831A (en) * | 2019-03-15 | 2020-09-17 | 三菱マテリアル株式会社 | Electroplating apparatus and electroplating method |
| CN112822873A (en) * | 2019-11-15 | 2021-05-18 | 宇泰和股份有限公司 | High depth ratio circuit board through hole chemical treatment/electrochemical treatment device |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3015282C2 (en) * | 1980-04-21 | 1986-07-17 | Siemens AG, 1000 Berlin und 8000 München | Device for the partial electroplating of conductive or made conductive surfaces |
| US4634503A (en) * | 1984-06-27 | 1987-01-06 | Daniel Nogavich | Immersion electroplating system |
| US4696729A (en) * | 1986-02-28 | 1987-09-29 | International Business Machines | Electroplating cell |
| US5064521A (en) * | 1988-10-25 | 1991-11-12 | Belorussky Politekhnichesky Institut | Apparatus for electrochemical machining |
| US4879007B1 (en) * | 1988-12-12 | 1999-05-25 | Process Automation Int L Ltd | Shield for plating bath |
| DE4106733A1 (en) * | 1991-03-02 | 1992-09-03 | Schering Ag | DEVICE FOR DIMMING FIELD LINES IN A GALVANIC SYSTEM (III) |
| DE4337724A1 (en) * | 1993-11-05 | 1995-05-11 | Hoellmueller Maschbau H | Device for coating the wall of holes in electrical printed circuit boards or multilayer printed circuit boards |
| JP2002121699A (en) * | 2000-05-25 | 2002-04-26 | Nippon Techno Kk | Electroplating method using combination of vibrating flow and impulsive plating current of plating bath |
| US20030010625A1 (en) * | 2001-07-16 | 2003-01-16 | Gramarossa Daniel J. | Processing cells for wafers and other planar articles |
-
2002
- 2002-10-18 US US10/273,820 patent/US6818115B2/en not_active Expired - Lifetime
- 2002-10-21 ES ES02786452.9T patent/ES2449076T3/en not_active Expired - Lifetime
- 2002-10-21 CN CN2009101458143A patent/CN101570873B/en not_active Expired - Fee Related
- 2002-10-21 JP JP2003536487A patent/JP2005506447A/en active Pending
- 2002-10-21 AU AU2002349972A patent/AU2002349972B2/en not_active Ceased
- 2002-10-21 CN CNA2006101467242A patent/CN1962956A/en active Pending
- 2002-10-21 KR KR1020047005787A patent/KR100660086B1/en not_active IP Right Cessation
- 2002-10-21 EP EP02786452A patent/EP1438446B1/en not_active Expired - Lifetime
- 2002-10-21 WO PCT/US2002/033530 patent/WO2003033770A2/en active Application Filing
- 2002-10-21 CN CNB028203887A patent/CN100523305C/en not_active Expired - Fee Related
-
2010
- 2010-01-05 HK HK10100032.8A patent/HK1136011A1/en not_active IP Right Cessation
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