CN113584563A - Electroplating device for printed circuit board - Google Patents
Electroplating device for printed circuit board Download PDFInfo
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- CN113584563A CN113584563A CN202110962826.6A CN202110962826A CN113584563A CN 113584563 A CN113584563 A CN 113584563A CN 202110962826 A CN202110962826 A CN 202110962826A CN 113584563 A CN113584563 A CN 113584563A
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- electroplating
- circuit board
- tank
- box
- printed circuit
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- 238000009713 electroplating Methods 0.000 title claims abstract description 149
- 239000003792 electrolyte Substances 0.000 claims abstract description 11
- 238000007747 plating Methods 0.000 claims description 23
- 238000003825 pressing Methods 0.000 claims description 14
- 230000000087 stabilizing effect Effects 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 4
- 238000005253 cladding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011435 rock Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
- C25D17/04—External supporting frames or structures
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an electroplating device for a printed circuit board, which comprises an electroplating box, wherein a first electroplating tank, a second electroplating tank and a third electroplating tank are transversely arranged in the electroplating box, anode plates are respectively arranged in the first electroplating tank, the second electroplating tank and the third electroplating tank and are filled with electrolyte, and openings respectively communicated with the first electroplating tank, the second electroplating tank and the third electroplating tank are respectively arranged at the upper end of the electroplating box. Compared with the existing electroplating device, the electroplating device has the advantages that the driving mechanism, the bubble generation mechanism and the like are arranged, so that the space between the circuit board body serving as the cathode and the anode plate can be reduced, the widths of the upper and lower end thicker regions of the electroplated circuit board body are reduced, the surface area of the anode plate is not required to be reduced, the electroplating efficiency of the electroplating device can be greatly improved, the circuit board body can be prevented from shaking, the phenomena of uneven electroplating and easy falling of a coating are avoided, and the subsequent use effect is prevented from being influenced.
Description
Technical Field
The invention relates to the technical field of circuit board processing equipment, in particular to an electroplating device for a printed circuit board.
Background
Electroplating is an important process in the manufacture of printed circuit boards, and it utilizes electrolysis to grow a metal build-up layer in the conductive lines and vias of the printed circuit board, thereby protecting the exposed copper tracks and vias. At present, a continuous full-automatic electroplating device is mainly adopted for electroplating a printed circuit board, a plurality of electroplating baths are arranged, a circuit board body serving as a cathode continuously moves in the plurality of electroplating baths to pass through, and anode plates are respectively arranged on two sides of the circuit board body in the electroplating baths. Still be provided with a plurality of nozzles between anode plate and circuit board body, the nozzle produces the bubble to accelerate the flow of electrolyte, improve electroplating efficiency.
Due to the nozzle arranged between the anode plate and the circuit board body, the space B (usually, the space B is more than 15cm) between the circuit board body as the cathode and the anode plate in the prior electroplating device is difficult to reduce, and the width of the upper and lower end partial thickness areas of the circuit board body reaches 1-2cm after electroplating. Therefore, the distance B between the cathode and the anode cannot be reduced, so that the electroplating efficiency of the electroplating device for the prior printed circuit board is difficult to improve, and the energy consumption level cannot be reduced.
In view of the above problems, an authorized invention with application number CN201510598971.5 discloses an electroplating apparatus for a printed circuit board, which includes an electroplating bath through which the printed circuit board can pass, an anode plate disposed on any one side or both sides of the printed circuit board, and a nozzle disposed in the electroplating bath and having an opening facing the printed circuit board, wherein the anode plate is provided with a through hole penetrating along the thickness direction of the anode plate, the nozzle is fixedly disposed on the anode plate, and the opening of the nozzle is matched with the through hole.
Above-mentioned patent is through inlaying the nozzle and establishing on the anode plate wall body to reach and dwindle the interval between circuit board body and the anode plate as the negative pole, make the upper and lower tip partial thickness district width of the circuit board body after the electroplating reduce, with the electroplating efficiency who promotes electroplating device, nevertheless electroplating device in this patent still has certain weak point: first, although the above patent solves the problem of the distance between the anode plate and the cathode plate, the surface area of the anode plate is greatly reduced, so that the width of the upper and lower end parts of the circuit board body in the thicker area can be reduced, and the electroplating efficiency of the electroplating device is improved, but the improvement range is obviously insufficient; second, the stable problem of circuit board body when electroplating is not solved to above-mentioned patent, and the nozzle that sets up in the plating bath produces the air current when electroplating, but the flow tension of electrolyte and the power of spouting of nozzle can make the circuit board body produce and rock, lead to at last to electroplate inhomogeneous, and the cladding material drops easily, influences follow-up result of use.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides an electroplating device for a printed circuit board.
In order to achieve the purpose, the invention adopts the following technical scheme:
an electroplating device for a printed circuit board comprises an electroplating box, wherein a first electroplating tank, a second electroplating tank and a third electroplating tank are transversely arranged in the electroplating box, anode plates are respectively arranged in the first electroplating tank, the second electroplating tank and the third electroplating tank and are filled with electrolyte, openings respectively communicated with the first electroplating tank, the second electroplating tank and the third electroplating tank are respectively arranged at the upper end of the electroplating box, a power supply box is arranged below the electroplating box and is electrically connected with ports of the anode plates through a leading wire, a pair of fixing seats are symmetrically and fixedly connected on opposite side walls of the electroplating box, upright posts are respectively and fixedly connected at the upper ends of the fixing seats, a cross beam is jointly and fixedly connected at the upper end of each upright post, an inverted C-shaped plate is arranged at the upper end of the electroplating box, and a pushing mechanism for pushing the C-shaped plate to vertically move is arranged at the lower end of the cross beam, c template one end lateral wall fixed mounting has positive and negative motor that changes, it is connected with the threaded rod to rotate between the relative inner wall of C template, the threaded rod with the coaxial fixed connection of positive and negative motor output shaft that changes, threaded connection has the threaded sleeve on the threaded rod, the threaded sleeve lower extreme passes through fixed establishment fixedly connected with circuit board body, it is stable when being used for electroplating to install the bottom in the electroplating box the firm mechanism of circuit board body, the electroplating box lower extreme passes through link fixed connection elasticity gasbag, install the bubble generation mechanism who is used for producing the bubble in electrolyte in the elasticity gasbag.
Preferably, pushing mechanism includes electric putter, and a pair of electric putter symmetry fixed mounting be in the crossbeam lower extreme, a pair of electric putter's flexible end is all fixed connection in C template upper end.
Preferably, the fixing mechanism comprises a connecting rod, a C-shaped fixing frame, a pressing plate and a pressing spring, the connecting rod is fixedly connected between the lower end of the threaded sleeve and the upper end of the C-shaped fixing frame, the pressing plate is arranged in the C-shaped fixing frame, the pressing spring is elastically connected between the pressing plate and the inner wall of the C-shaped fixing frame, and the pressing plate is pressed tightly on the circuit board body.
Preferably, the stabilizing mechanism comprises a first magnetic block, a second magnetic block and a third magnetic block, the first magnetic block is fixedly connected to the lower end of the circuit board body, the three groups of the second magnetic block and the third magnetic block are respectively embedded at the bottom in the first electroplating tank, the second electroplating tank and the third electroplating tank, and the second magnetic block and the third magnetic block are symmetrical relative to the first magnetic block.
Preferably, the bubble generation mechanism comprises a plurality of vibrating springs, the vibrating springs are arranged between the inner top and the inner bottom of the elastic air bag, the two ends of the elastic air bag are communicated with the outside through air inlet pipes, the upper end of the elastic air bag is communicated with the lower end of the first electroplating bath, the lower end of the second electroplating bath and the lower end of the third electroplating bath through three exhaust pipes, and a driving mechanism used for driving the vibrating springs to vibrate is installed at the lower end of the elastic air bag.
Preferably, the driving mechanism includes a pair of branch wires and a pulse current converter, the pulse current converter is fixedly mounted at the lower end of the elastic airbag, the pulse current converter is electrically connected to the vibration spring, and the pair of branch wires are respectively connected between the main wire and a pair of ports of the pulse current converter.
Preferably, a check valve allowing only air to flow from the outside to the inside of the elastic airbag is installed in the air inlet pipe, and a check valve allowing only air to flow from the elastic airbag to the first plating tank, the second plating tank and the third plating tank is installed in the air outlet pipe.
Preferably, the side wall of the electroplating box is fixedly provided with a control panel, and the control panel is electrically connected with the power box, the electric push rod and the forward and reverse rotating motor.
The invention has the following beneficial effects:
1. by arranging the driving mechanism and the bubble generating mechanism, when electroplating, partial current of the power box flows to the pulse current converter through the branch lead and is converted into pulse current under the action of the pulse current converter, so that the vibration spring vibrates, the vibration spring drives the elastic air bag to continuously contract and reset, so that air is sucked in through the air inlet pipe and is exhausted through the exhaust pipe, liquid flow and air flow are generated in electrolyte, and the exhaust pipe is arranged at the bottom position in the electroplating bath, so that the distance between the anode plate and the circuit board body cannot be increased, the surface area of the anode plate cannot be reduced, compared with the existing electroplating device, the gap between the circuit board body serving as a cathode and the anode plate can be reduced, the width of the thicker area at the upper end part and the lower end part of the electroplated circuit board body is reduced, and the surface area of the anode plate does not need to be reduced, therefore, the electroplating efficiency of the electroplating device can be greatly improved;
2. through setting up fixed establishment and firm mechanism, when electroplating, utilize hold-down spring's packing force to compress tightly the circuit board body stably between two pressure strips to utilize second magnetic path and third magnetic path to the magnetic force effect of first magnetic path, make the air current that the blast pipe produced when electroplating and liquid stream impact force be not enough to make the circuit board body produce and rock, can avoid leading to electroplating inhomogeneous, the phenomenon that cladding material drops easily takes place, prevents to influence follow-up result of use.
Drawings
FIG. 1 is a schematic structural diagram of an electroplating apparatus for a printed circuit board according to the present invention;
FIG. 2 is an enlarged view of the structure at A in FIG. 1;
FIG. 3 is an enlarged view of the structure at B in FIG. 1;
FIG. 4 is a schematic diagram of an external structure of an electroplating apparatus for a printed circuit board according to the present invention;
fig. 5 is a schematic structural diagram of a fixing mechanism according to the present invention.
In the figure: 1. electroplating box; 2. a first plating bath; 3. a second plating bath; 4. a third electroplating bath; 5. an anode plate; 6. an opening; 7. a power supply box; 8. a main conductor; 9. a fixed seat; 10. A post rod; 11. a cross beam; 12. an electric push rod; 13. c-shaped plates; 14. a positive and negative rotation motor; 15. a threaded rod; 16. a threaded sleeve; 17. a circuit board body; 18. a connecting frame; 19. an elastic air bag; 20. a vibration spring; 21. an air inlet pipe; 22. a pulse current converter; 23. a branch wire; 24. a connecting rod; 25. a fixed mount; 26. a compression plate; 27. a compression spring; 28. a first magnetic block; 29. a second magnetic block; 30. a third magnetic block; 31. an exhaust pipe; 32. a control panel.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1-5, an electroplating apparatus for a printed circuit board includes an electroplating box 1, a first electroplating tank 2, a second electroplating tank 3 and a third electroplating tank 4 are transversely disposed in the electroplating box 1, anode plates 5 are respectively mounted in the first electroplating tank 2, the second electroplating tank 3 and the third electroplating tank 4 and filled with electrolyte, and openings 6 respectively communicated with the first electroplating tank 2, the second electroplating tank 3 and the third electroplating tank 4 are respectively disposed at the upper end of the electroplating box 1.
The power box 7 is arranged below the electroplating box 1, the power box 7 is electrically connected with the port of the anode plate 5 through a main guide wire 8, a pair of fixing seats 9 are symmetrically and fixedly connected to the opposite side walls of the electroplating box 1, the upper ends of the fixing seats 9 are fixedly connected with upright posts 10, the upper ends of the upright posts 10 are fixedly connected with a cross beam 11, and the upper end of the electroplating box 1 is provided with an inverted C-shaped plate 13.
The pushing mechanism used for pushing the C-shaped plate 13 to vertically move is installed at the lower end of the cross beam 11 and comprises an electric push rod 12, the pair of electric push rods 12 are symmetrically and fixedly installed at the lower end of the cross beam 11, and the telescopic ends of the pair of electric push rods 12 are fixedly connected to the upper end of the C-shaped plate 13.
C13 one end lateral wall fixed mounting of template has positive and negative motor 14, it is connected with threaded rod 15 to rotate between the relative inner wall of C template 13, threaded rod 15 and the coaxial fixed connection of the 14 output shafts of positive and negative motor, fixed establishment includes connecting rod 24, C type mount 25, pressure strip 26 and pressure spring 27, connecting rod 24 fixed connection is between 16 lower extremes of threaded sleeve and C type mount 25 upper end, a pair of pressure strip 26 sets up inside C type mount 25, and pressure spring 27 elastic connection is between pressure strip 26 and C type mount 25 inner wall, a pair of pressure strip 26 compresses tightly circuit board body 17.
Threaded connection has threaded sleeve 16 on threaded rod 15, threaded sleeve 16 lower extreme passes through fixed establishment fixedly connected with circuit board body 17, the stabilizing mean of stabilizing circuit board body 17 when being used for electroplating is installed to the bottom in electroplating box 1, stabilizing mean includes first magnetic path 28, second magnetic path 29 and third magnetic path 30, first magnetic path 28 fixed connection is at circuit board body 17 lower extreme, three groups of second magnetic path 29 and third magnetic path 30 inlay respectively and establish the bottom in first plating bath 2, second plating bath 3 and third plating bath 4, and second magnetic path 29 and third magnetic path 30 are symmetrical about first magnetic path 28.
Electroplating case 1 lower extreme is through link 18 fixed connection elasticity gasbag 19, install the bubble that is used for producing the bubble in electrolyte in the elasticity gasbag 19 and generate the mechanism, bubble generation mechanism includes many vibrating spring 20, many vibrating spring 20 all establish between top and interior bottom in the elasticity gasbag 19, the elasticity gasbag 19 both ends all communicate with the external world through intake pipe 21, the elasticity gasbag 19 upper end through three blast pipes 31 respectively with first plating bath 2, the lower tip intercommunication of second plating bath 3 and third plating bath 4, the actuating mechanism who is used for driving vibrating spring 20 to produce the vibration is installed to elasticity gasbag 19 lower extreme.
The driving mechanism comprises a pair of branch conducting wires 23 and a pulse current converter 22, the pulse current converter 22 is fixedly installed at the lower end of the elastic air bag 19, the pulse current converter 22 is electrically connected with the vibration spring 20, and the pair of branch conducting wires 23 are respectively connected between the main conducting wire 8 and a pair of ports of the pulse current converter 22.
The inlet pipe 21 is provided with a check valve for allowing air to flow from the outside to the elastic bladder 19, and the outlet pipe 31 is provided with a check valve for allowing air to flow from the elastic bladder 19 to the first plating vessel 2, the second plating vessel 3 and the third plating vessel 4.
The side wall of the electroplating box 1 is fixedly provided with a control panel 32, and the control panel 32 is electrically connected with the power box 7, the electric push rod 12 and the forward and reverse rotating motor 14.
In the invention, when electroplating is needed, the circuit board body 17 is placed between the two pressing plates 26, the circuit board body 17 is pressed by the elastic force of the pressing spring 27 to form fixation, then the electric push rod 12 is controlled to extend, the circuit board body 17 is pushed into the first electroplating bath 2, the power supply box 7 is started, and electroplating is started to be carried out on the circuit board body 17.
In the electroplating process, partial current of the power supply box 7 flows to the pulse current converter 22 through the branch lead 23, the partial current is converted into pulse current under the action of the pulse current converter 22, when current is injected into the vibration spring 20, the current between the turns of the vibration spring 20 is in the same direction, and then the turns attract each other according to the 'same direction current', so that the length of the vibration spring 20 is shortened, when no current exists, the vibration spring 20 is reset, so that the vibration spring 20 generates vibration due to the input of the pulse current, the vibration spring 20 drives the elastic air bag 19 to continuously contract and reset, air is sucked in through the air inlet pipe 21, air is exhausted through the air exhaust pipe 31, liquid flow and air flow are generated in electrolyte, and because the air exhaust pipe 31 is arranged at the bottom position in the electroplating bath, the distance between the anode plate 5 and the circuit board body 17 cannot be increased, and the surface area of the anode plate 5 cannot be reduced, compared with the existing electroplating device, the distance between the circuit board body 17 as the cathode and the anode plate 5 can be reduced, so that the widths of the thicker areas at the upper end part and the lower end part of the electroplated circuit board body 17 are reduced, the surface area of the anode plate 5 is not required to be reduced, and the electroplating efficiency of the electroplating device can be greatly improved.
And when electroplating, the magnetic force effect of second magnetic block 29 and third magnetic block 30 to first magnetic block 28 for the air current that blast pipe 31 produced during electroplating and liquid flow impact force are not enough to make circuit board body 17 produce and rock, can avoid leading to electroplating inhomogeneous, and the phenomenon that the cladding material drops easily takes place, prevents to influence follow-up result of use.
After the first electroplating tank 2 is electroplated, the electric push rod 12 is controlled to shorten, the circuit board body 17 is pulled out of the electroplating tank 1, then the forward and reverse rotation motor 14 is started, the forward and reverse rotation motor 14 drives the threaded rod 15 to rotate, so that the threaded sleeve 16 and the circuit board body 17 are driven to horizontally move, the forward and reverse rotation motor 14 is turned off when the position is above the second electroplating tank 3, the electric push rod 12 is controlled to extend, and the circuit board body 17 is pushed into the second electroplating tank 3.
After the plating operation of the second plating tank 3 is completed, the circuit board body 17 is transferred to the third plating tank 4, and the operation is the same as above.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. An electroplating device for a printed circuit board comprises an electroplating box (1) and is characterized in that a first electroplating tank (2), a second electroplating tank (3) and a third electroplating tank (4) are transversely arranged in the electroplating box (1), anode plates (5) are respectively arranged in the first electroplating tank (2), the second electroplating tank (3) and the third electroplating tank (4) and are filled with electrolyte, openings (6) respectively communicated with the first electroplating tank (2), the second electroplating tank (3) and the third electroplating tank (4) are respectively arranged at the upper end of the electroplating box (1), a power supply box (7) is arranged below the electroplating box (1), the power supply box (7) is electrically connected with ports of the anode plates (5) through a main guide wire (8), a pair of fixing seats (9) are symmetrically and fixedly connected to opposite side walls of the electroplating box (1), upright posts (10) are respectively fixedly connected to the upper ends of the fixing seats (9), the electroplating device is characterized in that a cross beam (11) is fixedly connected to the upper end of the upright post rod (10) jointly, an inverted C-shaped plate (13) is arranged at the upper end of the electroplating box (1), a pushing mechanism used for pushing the C-shaped plate (13) to move vertically is installed at the lower end of the cross beam (11), a forward and reverse motor (14) is fixedly installed on the side wall of one end of the C-shaped plate (13), a threaded rod (15) is rotatably connected between the relative inner walls of the C-shaped plate (13), the threaded rod (15) is coaxially and fixedly connected with the output shaft of the forward and reverse motor (14), a threaded sleeve (16) is connected to the threaded rod (15) in a threaded manner, a circuit board body (17) is fixedly connected to the lower end of the threaded sleeve (16) through a fixing mechanism, a stabilizing mechanism used for stabilizing the circuit board body (17) during electroplating is installed at the bottom in the electroplating box (1), and an elastic air bag (19) is fixedly connected to the lower end of the electroplating box (1) through a connecting frame (18), a bubble generation mechanism for generating bubbles in the electrolyte is installed in the elastic air bag (19).
2. The electroplating device for the printed circuit board according to claim 1, wherein the pushing mechanism comprises electric push rods (12), a pair of the electric push rods (12) are symmetrically and fixedly installed at the lower end of the cross beam (11), and the telescopic ends of the pair of the electric push rods (12) are fixedly connected to the upper end of the C-shaped plate (13).
3. The electroplating device for the printed circuit board according to claim 1, wherein the fixing mechanism comprises a connecting rod (24), a C-shaped fixing frame (25), a pressing plate (26) and a pressing spring (27), the connecting rod (24) is fixedly connected between the lower end of the threaded sleeve (16) and the upper end of the C-shaped fixing frame (25), the pair of pressing plates (26) is arranged inside the C-shaped fixing frame (25), the pressing spring (27) is elastically connected between the pressing plate (26) and the inner wall of the C-shaped fixing frame (25), and the pair of pressing plates (26) presses the circuit board body (17).
4. The electroplating device for the printed circuit board as claimed in claim 1, wherein the stabilizing mechanism comprises a first magnetic block (28), a second magnetic block (29) and a third magnetic block (30), the first magnetic block (28) is fixedly connected to the lower end of the circuit board body (17), three groups of the second magnetic block (29) and the third magnetic block (30) are respectively embedded at the inner bottoms of the first electroplating tank (2), the second electroplating tank (3) and the third electroplating tank (4), and the second magnetic block (29) and the third magnetic block (30) are symmetrical with respect to the first magnetic block (28).
5. The electroplating device for the printed circuit board according to claim 1, wherein the bubble generating mechanism comprises a plurality of vibrating springs (20), the plurality of vibrating springs (20) are arranged between the inner top and the inner bottom of the elastic air bag (19), two ends of the elastic air bag (19) are communicated with the outside through air inlet pipes (21), the upper end of the elastic air bag (19) is respectively communicated with the lower ends of the first electroplating tank (2), the second electroplating tank (3) and the third electroplating tank (4) through three air outlet pipes (31), and a driving mechanism for driving the vibrating springs (20) to vibrate is installed at the lower end of the elastic air bag (19).
6. A plating apparatus for a printed circuit board according to claim 5, wherein the driving mechanism comprises a pair of branch wires (23) and a pulse current transformer (22), the pulse current transformer (22) is fixedly installed at a lower end of the elastic air bag (19), the pulse current transformer (22) is electrically connected with the vibration spring (20), and the pair of branch wires (23) are respectively connected between the main wire (8) and a pair of ports of the pulse current transformer (22).
7. The plating apparatus for printed circuit boards as claimed in claim 5, wherein a check valve allowing only air to flow from the outside to the inside of the elastic bladder (19) is installed in the intake pipe (21), and a check valve allowing only air to flow from the elastic bladder (19) to the first plating tank (2), the second plating tank (3) and the third plating tank (4) is installed in the exhaust pipe (31).
8. The electroplating device for the printed circuit board according to claim 1, wherein a control panel (32) is fixedly mounted on the side wall of the electroplating box (1), and the control panel (32) is electrically connected with the power supply box (7), the electric push rod (12) and the forward and reverse rotation motor (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110962826.6A CN113584563A (en) | 2021-08-20 | 2021-08-20 | Electroplating device for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110962826.6A CN113584563A (en) | 2021-08-20 | 2021-08-20 | Electroplating device for printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN113584563A true CN113584563A (en) | 2021-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110962826.6A Pending CN113584563A (en) | 2021-08-20 | 2021-08-20 | Electroplating device for printed circuit board |
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| CN (1) | CN113584563A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114775005A (en) * | 2022-03-28 | 2022-07-22 | 黄石永兴隆电子有限公司 | Electroplating device for circuit board |
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