BE1021021B1 - SPUTTERTARGET UIT (Ga) Zn Sn-OXIDE - Google Patents
SPUTTERTARGET UIT (Ga) Zn Sn-OXIDE Download PDFInfo
- Publication number
- BE1021021B1 BE1021021B1 BE2014/0062A BE201400062A BE1021021B1 BE 1021021 B1 BE1021021 B1 BE 1021021B1 BE 2014/0062 A BE2014/0062 A BE 2014/0062A BE 201400062 A BE201400062 A BE 201400062A BE 1021021 B1 BE1021021 B1 BE 1021021B1
- Authority
- BE
- Belgium
- Prior art keywords
- sputtering
- sputtering target
- top layer
- oxides
- mixture
- Prior art date
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- 239000011701 zinc Substances 0.000 claims abstract description 97
- 238000005477 sputtering target Methods 0.000 claims abstract description 76
- 238000000034 method Methods 0.000 claims abstract description 61
- 239000000203 mixture Substances 0.000 claims abstract description 58
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 35
- 229910052718 tin Inorganic materials 0.000 claims abstract description 33
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 22
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 12
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000010410 layer Substances 0.000 claims description 109
- 239000002245 particle Substances 0.000 claims description 51
- 238000004544 sputter deposition Methods 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 37
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 claims description 34
- 238000000576 coating method Methods 0.000 claims description 24
- 239000011248 coating agent Substances 0.000 claims description 22
- 230000008569 process Effects 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 11
- 239000011159 matrix material Substances 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 239000010409 thin film Substances 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 5
- 239000000523 sample Substances 0.000 claims description 5
- 239000011874 heated mixture Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 2
- 238000010191 image analysis Methods 0.000 claims 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 41
- 239000000843 powder Substances 0.000 description 29
- 238000007751 thermal spraying Methods 0.000 description 25
- 239000011787 zinc oxide Substances 0.000 description 21
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 16
- 238000000151 deposition Methods 0.000 description 14
- 230000008021 deposition Effects 0.000 description 14
- 230000008901 benefit Effects 0.000 description 13
- 229910052596 spinel Inorganic materials 0.000 description 13
- 239000011029 spinel Substances 0.000 description 13
- 150000001875 compounds Chemical class 0.000 description 12
- 238000005245 sintering Methods 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 229910006404 SnO 2 Inorganic materials 0.000 description 8
- 230000015556 catabolic process Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000001228 spectrum Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 238000001000 micrograph Methods 0.000 description 7
- 238000005054 agglomeration Methods 0.000 description 6
- 230000002776 aggregation Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- 229910001887 tin oxide Inorganic materials 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000011246 composite particle Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000011872 intimate mixture Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000000411 transmission spectrum Methods 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000000572 ellipsometry Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000013507 mapping Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000001552 radio frequency sputter deposition Methods 0.000 description 2
- 238000011946 reduction process Methods 0.000 description 2
- 238000000859 sublimation Methods 0.000 description 2
- 230000008022 sublimation Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000007088 Archimedes method Methods 0.000 description 1
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 1
- 230000005355 Hall effect Effects 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010316 high energy milling Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004137 mechanical activation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 239000011268 mixed slurry Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen(.) Chemical compound [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 238000010671 solid-state reaction Methods 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/453—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/453—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
- C04B35/457—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates based on tin oxides or stannates
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C14/34—Sputtering
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
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- H01J37/3411—Constructional aspects of the reactor
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- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3284—Zinc oxides, zincates, cadmium oxides, cadmiates, mercury oxides, mercurates or oxide forming salts thereof
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3286—Gallium oxides, gallates, indium oxides, indates, thallium oxides, thallates or oxide forming salts thereof, e.g. zinc gallate
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3293—Tin oxides, stannates or oxide forming salts thereof, e.g. indium tin oxide [ITO]
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- C04B2235/77—Density
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/124—Metallic interlayers based on copper
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3322—Problems associated with coating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Structural Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Coating By Spraying Or Casting (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP131540379 | 2013-02-05 | ||
| EP13154037 | 2013-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE1021021B1 true BE1021021B1 (nl) | 2014-12-19 |
Family
ID=47720328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE2014/0062A BE1021021B1 (nl) | 2013-02-05 | 2014-02-04 | SPUTTERTARGET UIT (Ga) Zn Sn-OXIDE |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9758856B2 (enExample) |
| EP (1) | EP2953915B1 (enExample) |
| JP (1) | JP2016507004A (enExample) |
| KR (1) | KR20150115906A (enExample) |
| BE (1) | BE1021021B1 (enExample) |
| ES (1) | ES2615933T3 (enExample) |
| PL (1) | PL2953915T3 (enExample) |
| WO (1) | WO2014122120A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017179595A (ja) * | 2016-03-28 | 2017-10-05 | 日立金属株式会社 | スパッタリングターゲット材およびその製造方法 |
| WO2019079207A1 (en) * | 2017-10-16 | 2019-04-25 | Materials Science International, Inc. | PROCESS FOR PRODUCTION OF CATHODIC SPUTTER TARGET IN ZINC STANNATE |
| BE1025799B1 (nl) | 2017-12-18 | 2019-07-19 | Soleras Advanced Coatings Bvba | Gespoten lithiumcobaltoxide-targets |
| JP7726991B2 (ja) * | 2021-06-04 | 2025-08-20 | Ｊｘ金属株式会社 | スパッタリングターゲット及びその製造方法 |
| KR20240132047A (ko) | 2022-01-05 | 2024-09-02 | 제이엑스금속주식회사 | 산화물막 및 산화물 스퍼터링 타깃 |
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| US5171411A (en) * | 1991-05-21 | 1992-12-15 | The Boc Group, Inc. | Rotating cylindrical magnetron structure with self supporting zinc alloy target |
| JPH05156431A (ja) * | 1991-11-29 | 1993-06-22 | Asahi Glass Co Ltd | 回転カソードターゲットの製造方法 |
| US6193856B1 (en) * | 1995-08-23 | 2001-02-27 | Asahi Glass Company Ltd. | Target and process for its production, and method for forming a film having a highly refractive index |
| GB9600210D0 (en) | 1996-01-05 | 1996-03-06 | Vanderstraeten E Bvba | Improved sputtering targets and method for the preparation thereof |
| JPH1068072A (ja) * | 1996-08-26 | 1998-03-10 | Japan Energy Corp | Ｉｔｏシリンドリカルターゲットおよびその製造方法 |
| CN1369572A (zh) * | 2001-04-03 | 2002-09-18 | 中国科学院长春光学精密机械与物理研究所 | 氧化物透明导电薄膜材料 |
| KR20080075926A (ko) * | 2004-10-01 | 2008-08-19 | 미쓰이 긴조꾸 고교 가부시키가이샤 | 스퍼터링 타깃용 타깃재의 제조 방법 |
| JP5395994B2 (ja) * | 2005-11-18 | 2014-01-22 | 出光興産株式会社 | 半導体薄膜、及びその製造方法、並びに薄膜トランジスタ |
| JP4552950B2 (ja) * | 2006-03-15 | 2010-09-29 | 住友金属鉱山株式会社 | ターゲット用酸化物焼結体、その製造方法、それを用いた透明導電膜の製造方法、及び得られる透明導電膜 |
| KR101137906B1 (ko) * | 2006-08-03 | 2012-05-03 | 삼성코닝정밀소재 주식회사 | 회전식 타겟 어셈블리 |
| WO2009078330A1 (ja) * | 2007-12-19 | 2009-06-25 | Hitachi Metals, Ltd. | 酸化亜鉛焼結体およびその製造方法、スパッタリングターゲット、このスパッタリングターゲットを用いて形成された電極 |
| JP5024226B2 (ja) * | 2008-08-06 | 2012-09-12 | 日立金属株式会社 | 酸化物焼結体およびその製造方法、スパッタリングターゲット、半導体薄膜 |
| JP5679315B2 (ja) | 2010-03-31 | 2015-03-04 | 日立金属株式会社 | 円筒型Ｍｏ合金ターゲットの製造方法 |
| JP2012107296A (ja) * | 2010-11-18 | 2012-06-07 | Tosoh Corp | セラミック溶射円筒ターゲットの製造方法 |
| CN107419225B (zh) * | 2011-06-08 | 2020-08-04 | 株式会社半导体能源研究所 | 溅射靶材、溅射靶材的制造方法及薄膜形成方法 |
| CN102286717B (zh) | 2011-09-01 | 2013-07-03 | 基迈克材料科技（苏州）有限公司 | 以等离子喷涂制备圆柱形大面积镀膜靶材及方法 |
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- 2014-02-04 BE BE2014/0062A patent/BE1021021B1/nl not_active IP Right Cessation
- 2014-02-04 KR KR1020157024134A patent/KR20150115906A/ko not_active Withdrawn
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| US9758856B2 (en) | 2017-09-12 |
| US20150368788A1 (en) | 2015-12-24 |
| ES2615933T3 (es) | 2017-06-08 |
| KR20150115906A (ko) | 2015-10-14 |
| WO2014122120A1 (en) | 2014-08-14 |
| EP2953915A1 (en) | 2015-12-16 |
| PL2953915T3 (pl) | 2017-07-31 |
| JP2016507004A (ja) | 2016-03-07 |
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