AU2003225226A1 - Vertical elevated pore phase change memory - Google Patents

Vertical elevated pore phase change memory

Info

Publication number
AU2003225226A1
AU2003225226A1 AU2003225226A AU2003225226A AU2003225226A1 AU 2003225226 A1 AU2003225226 A1 AU 2003225226A1 AU 2003225226 A AU2003225226 A AU 2003225226A AU 2003225226 A AU2003225226 A AU 2003225226A AU 2003225226 A1 AU2003225226 A1 AU 2003225226A1
Authority
AU
Australia
Prior art keywords
phase change
change memory
pore phase
vertical elevated
elevated pore
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003225226A
Other languages
English (en)
Inventor
Tyler A. Lowrey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ovonyx Inc
Original Assignee
Ovonyx Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ovonyx Inc filed Critical Ovonyx Inc
Publication of AU2003225226A1 publication Critical patent/AU2003225226A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20—Multistable switching devices, e.g. memristors
    • H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021—Auxiliary circuits
    • G11C13/0069—Writing or programming circuits or methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011—Manufacture or treatment of multistable switching devices
    • H10N70/061—Shaping switching materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/821—Device geometry
    • H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/841—Electrodes
    • H10N70/8413—Electrodes adapted for resistive heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/881—Switching materials
    • H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828—Tellurides, e.g. GeSbTe
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021—Auxiliary circuits
    • G11C13/0069—Writing or programming circuits or methods
    • G11C2013/008—Write by generating heat in the surroundings of the memory material, e.g. thermowrite
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/50—Resistive cell structure aspects
    • G11C2213/52—Structure characterized by the electrode material, shape, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Inert Electrodes (AREA)
  • Battery Electrode And Active Subsutance (AREA)
AU2003225226A 2002-12-13 2003-04-28 Vertical elevated pore phase change memory Abandoned AU2003225226A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/319,179 2002-12-13
US10/319,179 US7049623B2 (en) 2002-12-13 2002-12-13 Vertical elevated pore phase change memory
PCT/US2003/013360 WO2004055915A2 (en) 2002-12-13 2003-04-28 Vertical elevated pore phase change memory

Publications (1)

Publication Number Publication Date
AU2003225226A1 true AU2003225226A1 (en) 2004-07-09

Family

ID=32506588

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003225226A Abandoned AU2003225226A1 (en) 2002-12-13 2003-04-28 Vertical elevated pore phase change memory

Country Status (8)

Country Link
US (2) US7049623B2 (enExample)
JP (1) JP4446891B2 (enExample)
KR (1) KR100669312B1 (enExample)
CN (1) CN1714461B (enExample)
AU (1) AU2003225226A1 (enExample)
MY (1) MY135245A (enExample)
TW (1) TWI286750B (enExample)
WO (1) WO2004055915A2 (enExample)

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US7402851B2 (en) * 2003-02-24 2008-07-22 Samsung Electronics Co., Ltd. Phase changeable memory devices including nitrogen and/or silicon and methods for fabricating the same
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KR100668824B1 (ko) * 2004-06-30 2007-01-16 주식회사 하이닉스반도체 상변환 기억 소자 및 그 제조방법
KR100623181B1 (ko) * 2004-08-23 2006-09-19 삼성전자주식회사 상변화 메모리 장치 및 이의 제조 방법
KR100568543B1 (ko) * 2004-08-31 2006-04-07 삼성전자주식회사 작은 접점을 갖는 상변화 기억 소자의 제조방법
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KR100687750B1 (ko) * 2005-09-07 2007-02-27 한국전자통신연구원 안티몬과 셀레늄 금속합금을 이용한 상변화형 메모리소자및 그 제조방법
JP4860249B2 (ja) * 2005-11-26 2012-01-25 エルピーダメモリ株式会社 相変化メモリ装置および相変化メモリ装置の製造方法
JP4860248B2 (ja) * 2005-11-26 2012-01-25 エルピーダメモリ株式会社 相変化メモリ装置および相変化メモリ装置の製造方法
CN100524876C (zh) * 2006-01-09 2009-08-05 财团法人工业技术研究院 相变化存储元件及其制造方法
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US8129706B2 (en) * 2006-05-05 2012-03-06 Macronix International Co., Ltd. Structures and methods of a bistable resistive random access memory
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KR100722769B1 (ko) * 2006-05-19 2007-05-30 삼성전자주식회사 상변화 메모리 장치 및 이의 형성 방법
US7696077B2 (en) * 2006-07-14 2010-04-13 Micron Technology, Inc. Bottom electrode contacts for semiconductor devices and methods of forming same
TWI328873B (en) * 2006-08-22 2010-08-11 Macronix Int Co Ltd Thin film fuse phase change cell with thermal isolation layer and manufacturing method
JP4437299B2 (ja) 2006-08-25 2010-03-24 エルピーダメモリ株式会社 半導体装置及びその製造方法
US7511984B2 (en) * 2006-08-30 2009-03-31 Micron Technology, Inc. Phase change memory
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US8426967B2 (en) * 2007-01-05 2013-04-23 International Business Machines Corporation Scaled-down phase change memory cell in recessed heater
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KR100881055B1 (ko) * 2007-06-20 2009-01-30 삼성전자주식회사 상변화 메모리 유닛, 이의 제조 방법, 이를 포함하는상변화 메모리 장치 및 그 제조 방법
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Also Published As

Publication number Publication date
US20040115372A1 (en) 2004-06-17
KR100669312B1 (ko) 2007-01-16
US7364937B2 (en) 2008-04-29
WO2004055915A3 (en) 2004-08-26
US7049623B2 (en) 2006-05-23
JP2006510219A (ja) 2006-03-23
TW200410245A (en) 2004-06-16
KR20050085526A (ko) 2005-08-29
MY135245A (en) 2008-03-31
CN1714461B (zh) 2010-12-08
WO2004055915A2 (en) 2004-07-01
JP4446891B2 (ja) 2010-04-07
TWI286750B (en) 2007-09-11
US20060054878A1 (en) 2006-03-16
CN1714461A (zh) 2005-12-28

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase