AU2001259312A1 - Process for improving the adhesion of polymeric materials to metal surfaces - Google Patents

Process for improving the adhesion of polymeric materials to metal surfaces

Info

Publication number
AU2001259312A1
AU2001259312A1 AU2001259312A AU5931201A AU2001259312A1 AU 2001259312 A1 AU2001259312 A1 AU 2001259312A1 AU 2001259312 A AU2001259312 A AU 2001259312A AU 5931201 A AU5931201 A AU 5931201A AU 2001259312 A1 AU2001259312 A1 AU 2001259312A1
Authority
AU
Australia
Prior art keywords
adhesion
improving
polymeric materials
metal surfaces
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001259312A
Other languages
English (en)
Inventor
Donald Ferrier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of AU2001259312A1 publication Critical patent/AU2001259312A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/40—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing molybdates, tungstates or vanadates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Laminated Bodies (AREA)
  • ing And Chemical Polishing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Paints Or Removers (AREA)
AU2001259312A 2000-06-08 2001-05-01 Process for improving the adhesion of polymeric materials to metal surfaces Abandoned AU2001259312A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/590,046 US6383272B1 (en) 2000-06-08 2000-06-08 Process for improving the adhesion of polymeric materials to metal surfaces
US09590046 2000-06-08
PCT/US2001/014012 WO2001094033A1 (en) 2000-06-08 2001-05-01 Process for improving the adhesion of polymeric materials to metal surfaces

Publications (1)

Publication Number Publication Date
AU2001259312A1 true AU2001259312A1 (en) 2001-12-17

Family

ID=24360670

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001259312A Abandoned AU2001259312A1 (en) 2000-06-08 2001-05-01 Process for improving the adhesion of polymeric materials to metal surfaces

Country Status (10)

Country Link
US (2) US6383272B1 (zh)
EP (2) EP1289678B1 (zh)
JP (1) JP3884706B2 (zh)
CN (1) CN1282505C (zh)
AU (1) AU2001259312A1 (zh)
CA (1) CA2407280A1 (zh)
DE (2) DE60142648D1 (zh)
ES (2) ES2347907T3 (zh)
TW (1) TWI250048B (zh)
WO (1) WO2001094033A1 (zh)

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US7351353B1 (en) 2000-01-07 2008-04-01 Electrochemicals, Inc. Method for roughening copper surfaces for bonding to substrates
US6419784B1 (en) * 2000-06-21 2002-07-16 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6554948B1 (en) 2000-08-22 2003-04-29 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6746547B2 (en) * 2002-03-05 2004-06-08 Rd Chemical Company Methods and compositions for oxide production on copper
US20040092102A1 (en) * 2002-11-12 2004-05-13 Sachem, Inc. Chemical mechanical polishing composition and method
US7186305B2 (en) * 2002-11-26 2007-03-06 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US7232478B2 (en) * 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
CN100334927C (zh) * 2004-04-13 2007-08-29 广东光华化学厂有限公司 用于提高电路板内层铜面与聚合材料粘结力的棕化处理液
JP4539179B2 (ja) * 2004-06-04 2010-09-08 日立金属株式会社 物品の表面に形成したニッケルめっき被膜の濡れ性を改善する方法
JP4850508B2 (ja) * 2005-12-22 2012-01-11 富士通株式会社 多層回路基板およびその製造方法
US20090123656A1 (en) * 2007-11-13 2009-05-14 Ernest Long Composition and method for controlling galvanic corrosion in printed circuit boards
CN101456015B (zh) * 2007-12-14 2012-11-21 中国第一汽车股份有限公司 一种改善铝溶胶涂敷的微翅化技术
US8518281B2 (en) * 2008-06-03 2013-08-27 Kesheng Feng Acid-resistance promoting composition
US8088246B2 (en) 2009-01-08 2012-01-03 Cordani Jr John L Process for improving the adhesion of polymeric materials to metal surfaces
US8308893B2 (en) * 2010-02-01 2012-11-13 Ming De Wang Nano-oxide process for bonding copper/copper alloy and resin
KR20180056817A (ko) * 2013-03-16 2018-05-29 피알시-데소토 인터내쇼날, 인코포레이티드 부식 억제제로서의 아졸 화합물
JP6615129B2 (ja) * 2014-06-24 2019-12-04 スリーエム イノベイティブ プロパティズ カンパニー 接着剤前駆体組成物、２剤型接着剤キット、及び接着剤組成物の製造方法
CN104928661B (zh) * 2015-06-08 2017-10-20 华南理工大学 一种用于印制电路板的复合离子液体棕化液
WO2020148308A1 (en) 2019-01-15 2020-07-23 Atotech Deutschland Gmbh Method of forming copper oxide on a copper surface
CN110856348A (zh) * 2019-10-09 2020-02-28 广东利尔化学有限公司 一种用于pcb除胶后处理中和还原剂
CN116970934B (zh) * 2023-08-03 2024-02-06 广东盈华电子科技有限公司 一种电解铜箔双面黑化表面处理工艺

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JP3392008B2 (ja) * 1996-10-30 2003-03-31 日本表面化学株式会社 金属の保護皮膜形成処理剤と処理方法
JPS5221460B1 (zh) 1971-04-26 1977-06-10
SE400575B (sv) 1974-12-13 1978-04-03 Nordnero Ab Bad for betning av koppar och dess legeringar
DE2557269A1 (de) 1975-12-19 1977-06-30 Licentia Gmbh Verfahren zum aetzen von kupfer oder kupferlegierungen
JPS52150104A (en) 1976-06-07 1977-12-13 Fuji Photo Film Co Ltd Photoosensitive lithographic press plate material
DE2905535A1 (de) * 1979-02-14 1980-09-04 Metallgesellschaft Ag Verfahren zur oberflaechenbehandlung von metallen
JPS57116775A (en) 1981-01-14 1982-07-20 Toshiba Corp Etching solution for nickel
US4844981A (en) 1982-04-05 1989-07-04 Macdermid, Incorporated Adhesion promoter for printed circuits
US4409037A (en) 1982-04-05 1983-10-11 Macdermid Incorporated Adhesion promoter for printed circuits
JPS6113688A (ja) 1984-06-28 1986-01-21 福田金属箔粉工業株式会社 印刷回路用銅箔およびその製造方法
JPS61176192A (ja) 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
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Also Published As

Publication number Publication date
US6383272B1 (en) 2002-05-07
US20020124768A1 (en) 2002-09-12
DE60122509T2 (de) 2007-05-03
ES2347907T3 (es) 2010-11-25
EP1289678A4 (en) 2004-09-15
ES2271008T3 (es) 2007-04-16
TWI250048B (en) 2006-03-01
EP1289678A1 (en) 2003-03-12
DE60122509D1 (de) 2006-10-05
JP3884706B2 (ja) 2007-02-21
DE60142648D1 (de) 2010-09-02
CN1282505C (zh) 2006-11-01
EP1681373B1 (en) 2010-07-21
CN1431939A (zh) 2003-07-23
EP1681373A1 (en) 2006-07-19
WO2001094033A1 (en) 2001-12-13
EP1289678B1 (en) 2006-08-23
JP2003535224A (ja) 2003-11-25
CA2407280A1 (en) 2001-12-13
US6503566B2 (en) 2003-01-07

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