AU2001291098A1 - Process for treating adhesion promoted metal surfaces - Google Patents

Process for treating adhesion promoted metal surfaces

Info

Publication number
AU2001291098A1
AU2001291098A1 AU2001291098A AU9109801A AU2001291098A1 AU 2001291098 A1 AU2001291098 A1 AU 2001291098A1 AU 2001291098 A AU2001291098 A AU 2001291098A AU 9109801 A AU9109801 A AU 9109801A AU 2001291098 A1 AU2001291098 A1 AU 2001291098A1
Authority
AU
Australia
Prior art keywords
metal surfaces
adhesion promoted
promoted metal
treating adhesion
treating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001291098A
Inventor
Mark J. Kapeckas
Joseph R. Montano
Wade Sonnenberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials LLC
Original Assignee
Shipley Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co LLC filed Critical Shipley Co LLC
Publication of AU2001291098A1 publication Critical patent/AU2001291098A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82—After-treatment
    • C23C22/83—Chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
AU2001291098A 2000-09-19 2001-09-19 Process for treating adhesion promoted metal surfaces Abandoned AU2001291098A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23351500P 2000-09-19 2000-09-19
US60/233,515 2000-09-19
PCT/US2001/029231 WO2002024974A2 (en) 2000-09-19 2001-09-19 Process for treating adhesion promoted metal surfaces

Publications (1)

Publication Number Publication Date
AU2001291098A1 true AU2001291098A1 (en) 2002-04-02

Family

ID=22877560

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001291098A Abandoned AU2001291098A1 (en) 2000-09-19 2001-09-19 Process for treating adhesion promoted metal surfaces

Country Status (6)

Country Link
US (1) US6752878B2 (en)
EP (1) EP1322432A2 (en)
JP (1) JP2004515645A (en)
CN (1) CN1527747A (en)
AU (1) AU2001291098A1 (en)
WO (1) WO2002024974A2 (en)

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* Cited by examiner, † Cited by third party
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KR100546169B1 (en) * 2001-09-21 2006-01-24 주식회사 하이닉스반도체 Solution composition for removing photoresist
US7232478B2 (en) * 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
US7964044B1 (en) * 2003-10-29 2011-06-21 Birchwood Laboratories, Inc. Ferrous metal magnetite coating processes and reagents
EP1678345B1 (en) * 2003-11-07 2013-11-20 Henkel AG & Co. KGaA Coloured conversion layers devoid of chrome formed on metal surfaces
US9217929B2 (en) * 2004-07-22 2015-12-22 Air Products And Chemicals, Inc. Composition for removing photoresist and/or etching residue from a substrate and use thereof
US20060065365A1 (en) 2004-09-30 2006-03-30 Ferrier Donald R Melamine-formaldehyde post-dip composition for improving adhesion of metal to polymer
EP1945748A4 (en) * 2005-10-13 2009-01-07 Advanced Tech Materials Metals compatible photoresist and/or sacrificial antireflective coating removal composition
US20100298925A1 (en) * 2007-10-31 2010-11-25 Chameleon Scientific Corporation Spinulose metal surfaces
US8158216B2 (en) 2007-10-31 2012-04-17 Metascape Llc Spinulose titanium nanoparticulate surfaces
US20090287302A1 (en) * 2008-05-16 2009-11-19 Chameleon Scientific Corporation Polymer coated spinulose metal surfaces
CN101456015B (en) * 2007-12-14 2012-11-21 中国第一汽车股份有限公司 Micro fin-formation technique capable of improving aluminum-sol coating
WO2009117734A1 (en) † 2008-03-21 2009-09-24 Enthone Inc. Adhesion promotion of metal to laminate with a multi-functional compound haftforderung von metall zu laminaten mit einer multifunktionellen
EP2328749B1 (en) 2008-08-18 2019-09-25 Productive Research LLC. Formable light weight composites
CN102650055B (en) * 2009-06-26 2015-05-06 中国石油化工股份有限公司 Composite corrosion inhibitor for butyl rubber chloromethane glycol dehydration and regeneration system
JP5676970B2 (en) * 2009-08-18 2015-02-25 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Production of polymer-containing substrates for metallization.
WO2011082128A1 (en) 2009-12-28 2011-07-07 Productive Researsh Llc. Processes for welding composite materials and articles therefrom
CA2827457C (en) 2010-02-15 2020-03-10 Productive Research Llc Formable light weight composite material systems and methods
JP2011179085A (en) * 2010-03-02 2011-09-15 C Uyemura & Co Ltd Pretreatment agent and pretreatment method for electroplating and electroplating method
EP2591645B1 (en) * 2010-07-06 2018-09-05 Namics Corporation Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards
US8524540B2 (en) * 2011-02-01 2013-09-03 Nilesh Kapadia Adhesion promoting composition for metal leadframes
US9233526B2 (en) 2012-08-03 2016-01-12 Productive Research Llc Composites having improved interlayer adhesion and methods thereof
JP6594678B2 (en) * 2015-07-01 2019-10-23 日本パーカライジング株式会社 Surface treatment agent, surface treatment method, and surface-treated metal material
JP6415424B2 (en) * 2015-12-17 2018-10-31 アトテック ドイチェランド ゲーエムベーハー Method of treating a metal surface and apparatus formed by this method
BR112018068132A2 (en) * 2016-03-08 2019-01-08 Arcanum Alloys Inc metal coating methods
WO2018045305A1 (en) * 2016-09-01 2018-03-08 Saint-Gobain Performance Plastics Corporation Conversion coating and method of making
DE102017201868B4 (en) * 2017-02-07 2021-05-06 Thyssenkrupp Ag Adhesion promoter composition and its use
CN107353810B (en) * 2017-07-07 2019-11-29 桐乡市常新农机专业合作社 A kind of composite material base metal surfaces processing method
CN109536962B (en) * 2018-11-20 2023-06-16 无锡格菲电子薄膜科技有限公司 Copper foil acidic etching solution for CVD graphene growth substrate
US11338552B2 (en) 2019-02-15 2022-05-24 Productive Research Llc Composite materials, vehicle applications and methods thereof
CN110241422B (en) * 2019-05-28 2021-03-30 电子科技大学 Multilayer high-frequency printed circuit board copper foil surface roughening liquid and use method thereof
CN113825319B (en) * 2020-06-19 2023-04-25 健鼎（湖北）电子有限公司 Method for removing dry film on copper layer of circuit board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5861076A (en) * 1991-07-19 1999-01-19 Park Electrochemical Corporation Method for making multi-layer circuit boards
US5492595A (en) * 1994-04-11 1996-02-20 Electrochemicals, Inc. Method for treating an oxidized copper film
US5869130A (en) 1997-06-12 1999-02-09 Mac Dermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
US6020029A (en) * 1997-06-12 2000-02-01 Macdermid, Incorporated Process for treating metal surfaces
US6054061A (en) 1997-12-11 2000-04-25 Shipley Company, L.L.C. Composition for circuit board manufacture
US6117250A (en) * 1999-02-25 2000-09-12 Morton International Inc. Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions
US6372055B1 (en) * 1999-10-29 2002-04-16 Shipley Company, L.L.C. Method for replenishing baths
EP1209253A3 (en) * 2000-11-28 2004-02-25 Shipley Co. L.L.C. Process for treating adhesion promoted metal surfaces with epoxy resins

Also Published As

Publication number Publication date
EP1322432A2 (en) 2003-07-02
US20020108678A1 (en) 2002-08-15
CN1527747A (en) 2004-09-08
WO2002024974A2 (en) 2002-03-28
WO2002024974A3 (en) 2003-02-06
JP2004515645A (en) 2004-05-27
US6752878B2 (en) 2004-06-22

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