ATE554640T1 - Schaltungsmodul und stromleitungs- kommunikationsvorrichtung - Google Patents

Schaltungsmodul und stromleitungs- kommunikationsvorrichtung

Info

Publication number
ATE554640T1
ATE554640T1 AT07742003T AT07742003T ATE554640T1 AT E554640 T1 ATE554640 T1 AT E554640T1 AT 07742003 T AT07742003 T AT 07742003T AT 07742003 T AT07742003 T AT 07742003T AT E554640 T1 ATE554640 T1 AT E554640T1
Authority
AT
Austria
Prior art keywords
circuit module
communication device
power line
line communication
ground terminals
Prior art date
Application number
AT07742003T
Other languages
English (en)
Inventor
Hiroshi Kawano
Munenori Fujimura
Takumi Naruse
Shuichiro Yamaguchi
Yoshinori Hashimoto
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Application granted granted Critical
Publication of ATE554640T1 publication Critical patent/ATE554640T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B3/00—Line transmission systems
    • H04B3/54—Systems for transmission via power distribution lines
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B3/00—Line transmission systems
    • H04B3/54—Systems for transmission via power distribution lines
    • H04B3/56—Circuits for coupling, blocking, or by-passing of signals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H01L2224/82009—Pre-treatment of the connector or the bonding area
    • H01L2224/8203—Reshaping, e.g. forming vias
    • H01L2224/82047—Reshaping, e.g. forming vias by mechanical means, e.g. severing, pressing, stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B2203/00—Indexing scheme relating to line transmission systems
    • H04B2203/54—Aspects of powerline communications not already covered by H04B3/54 and its subgroups
    • H04B2203/5462—Systems for power line communications
    • H04B2203/5483—Systems for power line communications using coupling circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L27/00—Modulated-carrier systems
    • H04L27/26—Systems using multi-frequency codes
    • H04L27/2601—Multicarrier modulation systems
    • H04L27/2626—Arrangements specific to the transmitter only
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L27/00—Modulated-carrier systems
    • H04L27/26—Systems using multi-frequency codes
    • H04L27/2601—Multicarrier modulation systems
    • H04L27/2647—Arrangements specific to the receiver only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
AT07742003T 2006-04-13 2007-04-13 Schaltungsmodul und stromleitungs- kommunikationsvorrichtung ATE554640T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006110769A JP5285842B2 (ja) 2006-04-13 2006-04-13 集積回路実装基板および電力線通信装置
PCT/JP2007/058567 WO2007119877A1 (en) 2006-04-13 2007-04-13 Circuit module and power line communication apparatus

Publications (1)

Publication Number Publication Date
ATE554640T1 true ATE554640T1 (de) 2012-05-15

Family

ID=38068080

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07742003T ATE554640T1 (de) 2006-04-13 2007-04-13 Schaltungsmodul und stromleitungs- kommunikationsvorrichtung

Country Status (8)

Country Link
US (1) US8310837B2 (de)
EP (1) EP2011376B1 (de)
JP (1) JP5285842B2 (de)
CN (1) CN101422089B (de)
AT (1) ATE554640T1 (de)
BR (1) BRPI0709952A2 (de)
RU (2) RU2395180C1 (de)
WO (1) WO2007119877A1 (de)

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JP5225721B2 (ja) * 2008-03-24 2013-07-03 パナソニック株式会社 電子回路装置およびこれを用いた電力線通信装置
US8582312B2 (en) 2008-03-24 2013-11-12 Panasonic Corporation Electronic circuit board and power line communication apparatus using it
JP2010011136A (ja) * 2008-06-27 2010-01-14 Sharp Corp 電力線通信装置
US8411451B2 (en) 2008-07-30 2013-04-02 Panasonic Corporation Power line communication apparatus
IT1391557B1 (it) * 2008-09-01 2012-01-11 Ferrarini Circuito stampato multistrato imbottito con componenti inglobati fra le schede sovrapposte
US8319334B2 (en) 2009-08-10 2012-11-27 Infineon Technologies Ag Embedded laminated device
CN102577148B (zh) * 2009-09-30 2014-12-24 松下电器产业株式会社 直流电力线通信系统及直流电力线通信装置
EP2526572B1 (de) * 2010-01-19 2019-08-14 LG Innotek Co., Ltd. Verpackung und herstellungsverfahren dafür
JP5746517B2 (ja) 2011-02-23 2015-07-08 住友電気工業株式会社 電力線通信システム
EP2693476A4 (de) * 2011-03-31 2014-10-15 Mitsubishi Chem Corp Laminat für einen dreidimensionalen integrierten schaltkreis und zwischenschichtfüllmaterial für das laminat für einen dreidimensionalen integrierten schaltkreis
RU2463684C1 (ru) * 2011-05-17 2012-10-10 Российская Федерация, от имени которой выступает Министерство промышленности и торговли РФ Многокристальный модуль
CN102227090B (zh) * 2011-06-27 2013-08-21 山西省电力公司临汾供电分公司 10kV载波通信智能馈线自动化系统
EP2733860B1 (de) * 2011-07-13 2016-05-18 Sumitomo Electric Industries, Ltd. Kommunikationssystem
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WO2014069126A1 (ja) * 2012-10-29 2014-05-08 京セラ株式会社 素子収納用パッケージおよび実装構造体
RU2515960C1 (ru) * 2012-11-07 2014-05-20 Открытое акционерное общество "НПО "Орион" (ОАО "НПО "Орион") СПОСОБ ИЗГОТОВЛЕНИЯ ФОТОПРИЕМНОГО МОДУЛЯ НА ОСНОВЕ PbS
CN103811444B (zh) * 2012-11-07 2016-11-23 环旭电子股份有限公司 电子装置、系统级封装模块及系统级封装模块的制造方法
DK2775806T3 (en) * 2013-03-07 2015-06-01 Tyco Electronics Svenska Holdings Ab Optical receiver and transceiver operating this
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US10374813B2 (en) * 2015-08-07 2019-08-06 The Boeing Company Coupler for power line communication and power-over-ethernet
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JP6918668B2 (ja) * 2017-09-29 2021-08-11 株式会社シマノ 回路モジュール、自転車用の電気コンポーネント、および、通信システム
WO2020090230A1 (ja) * 2018-11-01 2020-05-07 株式会社村田製作所 高周波モジュールおよび通信装置
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Also Published As

Publication number Publication date
CN101422089A (zh) 2009-04-29
RU2008144709A (ru) 2010-05-20
WO2007119877A1 (en) 2007-10-25
BRPI0709952A2 (pt) 2011-08-02
EP2011376A1 (de) 2009-01-07
RU2395180C1 (ru) 2010-07-20
RU2432721C1 (ru) 2011-10-27
JP5285842B2 (ja) 2013-09-11
JP2007287783A (ja) 2007-11-01
US20080123302A1 (en) 2008-05-29
RU2010110522A (ru) 2011-09-27
CN101422089B (zh) 2011-04-06
EP2011376B1 (de) 2012-04-18
US8310837B2 (en) 2012-11-13

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