ATE554640T1 - Schaltungsmodul und stromleitungs- kommunikationsvorrichtung - Google Patents

Schaltungsmodul und stromleitungs- kommunikationsvorrichtung

Info

Publication number
ATE554640T1
ATE554640T1 AT07742003T AT07742003T ATE554640T1 AT E554640 T1 ATE554640 T1 AT E554640T1 AT 07742003 T AT07742003 T AT 07742003T AT 07742003 T AT07742003 T AT 07742003T AT E554640 T1 ATE554640 T1 AT E554640T1
Authority
AT
Austria
Prior art keywords
circuit module
communication device
power line
line communication
ground terminals
Prior art date
Application number
AT07742003T
Other languages
English (en)
Inventor
Hiroshi Kawano
Munenori Fujimura
Takumi Naruse
Shuichiro Yamaguchi
Yoshinori Hashimoto
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Application granted granted Critical
Publication of ATE554640T1 publication Critical patent/ATE554640T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B3/00—Line transmission systems
    • H04B3/54—Systems for transmission via power distribution lines
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B3/00—Line transmission systems
    • H04B3/54—Systems for transmission via power distribution lines
    • H04B3/56—Circuits for coupling, blocking, or by-passing of signals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H05K1/186—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B2203/00—Indexing scheme relating to line transmission systems
    • H04B2203/54—Aspects of powerline communications not already covered by H04B3/54 and its subgroups
    • H04B2203/5462—Systems for power line communications
    • H04B2203/5483—Systems for power line communications using coupling circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L27/00—Modulated-carrier systems
    • H04L27/26—Systems using multi-frequency codes
    • H04L27/2601—Multicarrier modulation systems
    • H04L27/2626—Arrangements specific to the transmitter only
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L27/00—Modulated-carrier systems
    • H04L27/26—Systems using multi-frequency codes
    • H04L27/2601—Multicarrier modulation systems
    • H04L27/2647—Arrangements specific to the receiver only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
  • Combinations Of Printed Boards (AREA)
AT07742003T 2006-04-13 2007-04-13 Schaltungsmodul und stromleitungs- kommunikationsvorrichtung ATE554640T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006110769A JP5285842B2 (ja) 2006-04-13 2006-04-13 集積回路実装基板および電力線通信装置
PCT/JP2007/058567 WO2007119877A1 (en) 2006-04-13 2007-04-13 Circuit module and power line communication apparatus

Publications (1)

Publication Number Publication Date
ATE554640T1 true ATE554640T1 (de) 2012-05-15

Family

ID=38068080

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07742003T ATE554640T1 (de) 2006-04-13 2007-04-13 Schaltungsmodul und stromleitungs- kommunikationsvorrichtung

Country Status (8)

Country Link
US (1) US8310837B2 (de)
EP (1) EP2011376B1 (de)
JP (1) JP5285842B2 (de)
CN (1) CN101422089B (de)
AT (1) ATE554640T1 (de)
BR (1) BRPI0709952A2 (de)
RU (2) RU2395180C1 (de)
WO (1) WO2007119877A1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4999425B2 (ja) * 2005-11-29 2012-08-15 パナソニック株式会社 通信装置および通信方法
US8582312B2 (en) 2008-03-24 2013-11-12 Panasonic Corporation Electronic circuit board and power line communication apparatus using it
JP5225721B2 (ja) * 2008-03-24 2013-07-03 パナソニック株式会社 電子回路装置およびこれを用いた電力線通信装置
JP2010011136A (ja) * 2008-06-27 2010-01-14 Sharp Corp 電力線通信装置
US8411451B2 (en) * 2008-07-30 2013-04-02 Panasonic Corporation Power line communication apparatus
IT1391557B1 (it) * 2008-09-01 2012-01-11 Ferrarini Circuito stampato multistrato imbottito con componenti inglobati fra le schede sovrapposte
US8319334B2 (en) 2009-08-10 2012-11-27 Infineon Technologies Ag Embedded laminated device
WO2011040036A1 (ja) * 2009-09-30 2011-04-07 パナソニック株式会社 直流電力線通信システム及び直流電力線通信装置
CN102804430B (zh) * 2010-01-19 2015-11-25 Lg伊诺特有限公司 封装结构及其制造方法
JP5746517B2 (ja) 2011-02-23 2015-07-08 住友電気工業株式会社 電力線通信システム
KR20140007429A (ko) 2011-03-31 2014-01-17 미쓰비시 가가꾸 가부시키가이샤 삼차원 집적 회로 적층체, 및 삼차원 집적 회로 적층체용 층간 충전재
RU2463684C1 (ru) * 2011-05-17 2012-10-10 Российская Федерация, от имени которой выступает Министерство промышленности и торговли РФ Многокристальный модуль
CN102227090B (zh) * 2011-06-27 2013-08-21 山西省电力公司临汾供电分公司 10kV载波通信智能馈线自动化系统
WO2013008922A1 (ja) 2011-07-13 2013-01-17 住友電気工業株式会社 通信システム
US20150221414A1 (en) * 2012-06-27 2015-08-06 Google Inc. Power adapter for a computing device
US9462709B2 (en) * 2012-10-29 2016-10-04 Kyocera Corporation Element housing package and mounting structure body
CN103811444B (zh) * 2012-11-07 2016-11-23 环旭电子股份有限公司 电子装置、系统级封装模块及系统级封装模块的制造方法
RU2515960C1 (ru) * 2012-11-07 2014-05-20 Открытое акционерное общество "НПО "Орион" (ОАО "НПО "Орион") СПОСОБ ИЗГОТОВЛЕНИЯ ФОТОПРИЕМНОГО МОДУЛЯ НА ОСНОВЕ PbS
EP2775806B1 (de) * 2013-03-07 2015-03-04 Tyco Electronics Svenska Holdings AB Optischer Empfänger und Sender-Empfänger damit
CN204496889U (zh) * 2015-04-07 2015-07-22 京东方科技集团股份有限公司 一种电路、显示基板以及显示装置
US10374813B2 (en) * 2015-08-07 2019-08-06 The Boeing Company Coupler for power line communication and power-over-ethernet
EP3220474B1 (de) * 2016-03-15 2019-01-02 Finisar Corporation Trägerlayout für ein elektrooptisches modul, ein elektrooptisches modul damit und verbindungsstruktur zur ankopplung einer elektronischen einheit an eine optische vorrichtung
JP6918668B2 (ja) * 2017-09-29 2021-08-11 株式会社シマノ 回路モジュール、自転車用の電気コンポーネント、および、通信システム
WO2020090230A1 (ja) * 2018-11-01 2020-05-07 株式会社村田製作所 高周波モジュールおよび通信装置
EP3755127A1 (de) * 2019-06-18 2020-12-23 GN Hearing A/S Leiterplatten(pcb)-modul mit einem eingebetteten hochfrequenzhalbleiterchip
US11476707B2 (en) * 2020-10-06 2022-10-18 Apple Inc. Wireless power system housing
TWI830566B (zh) * 2022-12-30 2024-01-21 恆勁科技股份有限公司 整合有電感線路結構之封裝載板及其製造方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5142430A (en) * 1990-03-28 1992-08-25 Anthony Anthony A Power line filter and surge protection circuit components and circuits
JP2787640B2 (ja) * 1992-09-18 1998-08-20 富士通株式会社 印刷配線板の導体切断方法
JP3265669B2 (ja) 1993-01-19 2002-03-11 株式会社デンソー プリント基板
JP3368393B2 (ja) 1994-03-03 2003-01-20 三菱電機照明株式会社 電力線搬送通信システム
US5736965A (en) 1996-02-07 1998-04-07 Lutron Electronics Co. Inc. Compact radio frequency transmitting and receiving antenna and control device employing same
RU2161382C2 (ru) 1996-07-18 2000-12-27 НАГРА АйДи С.А. Способ изготовления печатных схем и печатная схема, изготовленная этим способом
JP3375555B2 (ja) 1997-11-25 2003-02-10 松下電器産業株式会社 回路部品内蔵モジュールおよびその製造方法
US6038133A (en) 1997-11-25 2000-03-14 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module and method for producing the same
JP3712095B2 (ja) * 1998-01-14 2005-11-02 株式会社村田製作所 入出力バランス型フィルタ
US6150724A (en) * 1998-03-02 2000-11-21 Motorola, Inc. Multi-chip semiconductor device and method for making the device by using multiple flip chip interfaces
US6246112B1 (en) 1998-06-11 2001-06-12 Intel Corporation Interleaved signal trace routing
JP3495917B2 (ja) 1998-07-15 2004-02-09 日本特殊陶業株式会社 多層配線基板
JP3665711B2 (ja) * 1999-02-25 2005-06-29 富士通株式会社 高周波増幅器および増幅素子
JP2001060802A (ja) * 1999-08-19 2001-03-06 Sony Corp 回路素子基板と半導体装置及びその製造方法
JP2001077537A (ja) * 1999-09-02 2001-03-23 Sony Corp 多層プリント配線板
DE10013936A1 (de) * 2000-03-21 2001-09-27 Bodenseewerk Geraetetech Filteranordnung
JP2001308222A (ja) 2000-04-21 2001-11-02 Hitachi Ltd 実装基板
US7247932B1 (en) * 2000-05-19 2007-07-24 Megica Corporation Chip package with capacitor
JP2001345419A (ja) * 2000-05-31 2001-12-14 Hitachi Ltd 一体型高周波無線回路モジュール
US7492565B2 (en) * 2001-09-28 2009-02-17 Epcos Ag Bandpass filter electrostatic discharge protection device
JP4081284B2 (ja) * 2002-03-14 2008-04-23 富士通株式会社 高周波集積回路モジュール
JP3575478B2 (ja) 2002-07-03 2004-10-13 ソニー株式会社 モジュール基板装置の製造方法、高周波モジュール及びその製造方法
JP3863464B2 (ja) * 2002-07-05 2006-12-27 株式会社ヨコオ フィルタ内蔵アンテナ
JP4207517B2 (ja) * 2002-09-24 2009-01-14 凸版印刷株式会社 素子内蔵基板
US20050026587A1 (en) 2003-07-29 2005-02-03 Miskho Michael S. Radio frequency communication between devices via a power plane on a circuit board
JP4049112B2 (ja) * 2004-03-09 2008-02-20 株式会社日立製作所 電子装置
JP2006050306A (ja) * 2004-08-05 2006-02-16 Matsushita Electric Ind Co Ltd 通信装置及びそれを用いた通信システム
JP2006253953A (ja) * 2005-03-09 2006-09-21 Fujitsu Ltd 通信用高周波モジュールおよびその製造方法
JP2005253115A (ja) * 2005-05-13 2005-09-15 Tdk Corp 送受信端回路装置
US7233502B1 (en) * 2006-03-15 2007-06-19 Universal Scientific Industrial Co., Ltd. Twin-substrate wireless electronic module and method for making the same
JP5034453B2 (ja) * 2006-11-16 2012-09-26 株式会社デンソー 電子部品内蔵型多層基板

Also Published As

Publication number Publication date
US20080123302A1 (en) 2008-05-29
RU2008144709A (ru) 2010-05-20
WO2007119877A1 (en) 2007-10-25
CN101422089B (zh) 2011-04-06
JP2007287783A (ja) 2007-11-01
RU2432721C1 (ru) 2011-10-27
BRPI0709952A2 (pt) 2011-08-02
RU2395180C1 (ru) 2010-07-20
RU2010110522A (ru) 2011-09-27
CN101422089A (zh) 2009-04-29
US8310837B2 (en) 2012-11-13
JP5285842B2 (ja) 2013-09-11
EP2011376B1 (de) 2012-04-18
EP2011376A1 (de) 2009-01-07

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