WO2008084723A1 - 高周波部品及び通信装置 - Google Patents

高周波部品及び通信装置 Download PDF

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Publication number
WO2008084723A1
WO2008084723A1 PCT/JP2007/075199 JP2007075199W WO2008084723A1 WO 2008084723 A1 WO2008084723 A1 WO 2008084723A1 JP 2007075199 W JP2007075199 W JP 2007075199W WO 2008084723 A1 WO2008084723 A1 WO 2008084723A1
Authority
WO
WIPO (PCT)
Prior art keywords
power line
ground electrode
power
terminal
frequency signal
Prior art date
Application number
PCT/JP2007/075199
Other languages
English (en)
French (fr)
Inventor
Shigeru Kemmochi
Keisuke Fukamachi
Kazuhiro Hagiwara
Original Assignee
Hitachi Metals, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals, Ltd. filed Critical Hitachi Metals, Ltd.
Priority to US12/520,965 priority Critical patent/US8326344B2/en
Priority to EP07860420.4A priority patent/EP2120352B1/en
Priority to JP2008553077A priority patent/JP4951005B2/ja
Publication of WO2008084723A1 publication Critical patent/WO2008084723A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H04B1/44—Transmit/receive switching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09327—Special sequence of power, ground and signal layers in multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transceivers (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

　導体パターンを有する複数の誘電体層からなる積層基板に高周波信号処理回路を設けた高周波部品であって、前記高周波信号処理回路は増幅回路及びスイッチ回路を有し、高周波信号の入力端子及び出力端子、及び増幅回路の電源端子及びスイッチ回路の電源端子を含む端子群が積層基板の一方の主面に形成されており、増幅回路の電源端子に一端が接続された電源ラインとスイッチ回路の電源端子に一端が接続された電源ラインが一つの誘電体層に形成されて電源ライン層をなし、電源ライン層に関して主面側に第一のグランド電極が配置され、第一のグランド電極は積層方向に電源ラインの少なくとも一部と重なり、電源ライン層に関して第一のグランド電極と反対側に第二のグランド電極が配置され、第二のグランド電極は積層方向に電源ラインの少なくとも一部と重なり、高周波信号処理回路は第二のグランド電極に関して電源ライン層と反対側に配置されている高周波部品。
PCT/JP2007/075199 2006-12-28 2007-12-27 高周波部品及び通信装置 WO2008084723A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/520,965 US8326344B2 (en) 2006-12-28 2007-12-27 High-frequency device and communications apparatus
EP07860420.4A EP2120352B1 (en) 2006-12-28 2007-12-27 High-frequency part and communication device
JP2008553077A JP4951005B2 (ja) 2006-12-28 2007-12-27 高周波部品及び通信装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-353757 2006-12-28
JP2006353757 2006-12-28

Publications (1)

Publication Number Publication Date
WO2008084723A1 true WO2008084723A1 (ja) 2008-07-17

Family

ID=39608617

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/075199 WO2008084723A1 (ja) 2006-12-28 2007-12-27 高周波部品及び通信装置

Country Status (4)

Country Link
US (1) US8326344B2 (ja)
EP (1) EP2120352B1 (ja)
JP (3) JP4951005B2 (ja)
WO (1) WO2008084723A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016208081A1 (ja) * 2015-06-26 2016-12-29 ルネサスエレクトロニクス株式会社 電子装置

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Publication number Priority date Publication date Assignee Title
JP5375521B2 (ja) * 2009-10-27 2013-12-25 ソニー株式会社 高周波増幅器および無線通信装置
JP2012074930A (ja) * 2010-09-29 2012-04-12 Panasonic Corp 高周波電力増幅器
CN103430457B (zh) 2011-03-24 2015-05-13 株式会社村田制作所 高频模块
CN104115411B (zh) * 2012-02-06 2016-01-20 太阳诱电株式会社 滤波器电路和模块
WO2013125362A1 (ja) * 2012-02-21 2013-08-29 株式会社村田製作所 高周波スイッチモジュール
US9847804B2 (en) * 2014-04-30 2017-12-19 Skyworks Solutions, Inc. Bypass path loss reduction
JP6278117B2 (ja) * 2014-07-10 2018-02-14 株式会社村田製作所 高周波モジュール
KR102139764B1 (ko) * 2015-09-21 2020-07-31 삼성전기주식회사 통신 모듈 및 그에 포함된 프론트 엔드 모듈
US10454434B2 (en) * 2017-07-21 2019-10-22 Murata Manufacturing Co., Ltd. Communication unit
EP3729640A4 (en) * 2017-12-19 2021-07-14 Telefonaktiebolaget LM Ericsson (publ) POWER AMPLIFIER AND RADIO FREQUENCY DEVICE WITH IT
WO2019146284A1 (ja) * 2018-01-25 2019-08-01 株式会社村田製作所 高周波モジュールおよび通信装置
WO2019181589A1 (ja) 2018-03-23 2019-09-26 株式会社村田製作所 高周波モジュールおよび通信装置
WO2019215988A1 (ja) 2018-05-10 2019-11-14 株式会社村田製作所 高周波モジュール
JP2022017605A (ja) * 2018-10-25 2022-01-26 ソニーセミコンダクタソリューションズ株式会社 回路基板、半導体装置、および、電子機器

Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH11261398A (ja) * 1997-03-28 1999-09-24 Hitachi Metals Ltd 複合スイッチ回路及び複合スイッチ回路部品
JPH11313003A (ja) * 1998-04-28 1999-11-09 Hitachi Metals Ltd 高周波スイッチモジュール
WO2006003959A1 (ja) 2004-06-30 2006-01-12 Hitachi Metals, Ltd. 高周波回路、高周波部品及びマルチバンド通信装置
WO2006112306A1 (ja) * 2005-04-15 2006-10-26 Hitachi Metals, Ltd. マルチバンド高周波回路、マルチバンド高周波回路部品及びこれを用いたマルチバンド通信装置
JP2006352532A (ja) * 2005-06-16 2006-12-28 Tdk Corp 高周波モジュール

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JP3048205B2 (ja) 1993-02-19 2000-06-05 日本電信電話株式会社 マルチチップモジュール
JPH07288488A (ja) * 1994-04-18 1995-10-31 Sanyo Electric Co Ltd 送信電力増幅器モジュール及び小型無線装置
EP0921642B1 (en) 1997-12-03 2004-12-01 Hitachi Metals, Ltd. Multiband high-frequency switching module
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JP2005354407A (ja) * 2004-06-10 2005-12-22 Hitachi Metals Ltd 高周波回路、高周波部品、及びこれを用いたマルチバンド通信装置
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JP4134129B2 (ja) * 2004-10-28 2008-08-13 Ｔｄｋ株式会社 高周波モジュール

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11261398A (ja) * 1997-03-28 1999-09-24 Hitachi Metals Ltd 複合スイッチ回路及び複合スイッチ回路部品
JPH11313003A (ja) * 1998-04-28 1999-11-09 Hitachi Metals Ltd 高周波スイッチモジュール
WO2006003959A1 (ja) 2004-06-30 2006-01-12 Hitachi Metals, Ltd. 高周波回路、高周波部品及びマルチバンド通信装置
WO2006112306A1 (ja) * 2005-04-15 2006-10-26 Hitachi Metals, Ltd. マルチバンド高周波回路、マルチバンド高周波回路部品及びこれを用いたマルチバンド通信装置
JP2006352532A (ja) * 2005-06-16 2006-12-28 Tdk Corp 高周波モジュール

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2120352A4

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016208081A1 (ja) * 2015-06-26 2016-12-29 ルネサスエレクトロニクス株式会社 電子装置
JPWO2016208081A1 (ja) * 2015-06-26 2017-10-19 ルネサスエレクトロニクス株式会社 電子装置
US10043755B2 (en) 2015-06-26 2018-08-07 Renesas Electronics Corporation Electronic device

Also Published As

Publication number Publication date
EP2120352B1 (en) 2017-12-20
JP2011035940A (ja) 2011-02-17
JPWO2008084723A1 (ja) 2010-04-30
JP4623330B2 (ja) 2011-02-02
US20100062727A1 (en) 2010-03-11
JP2010161812A (ja) 2010-07-22
EP2120352A1 (en) 2009-11-18
US8326344B2 (en) 2012-12-04
JP4951005B2 (ja) 2012-06-13
JP5024445B2 (ja) 2012-09-12
EP2120352A4 (en) 2014-05-21

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