ATE532394T1 - Leiterplatte, herstellungsverfahren dafür und hauptplatine für ein endgerätprodukt - Google Patents

Leiterplatte, herstellungsverfahren dafür und hauptplatine für ein endgerätprodukt

Info

Publication number
ATE532394T1
ATE532394T1 AT08153217T AT08153217T ATE532394T1 AT E532394 T1 ATE532394 T1 AT E532394T1 AT 08153217 T AT08153217 T AT 08153217T AT 08153217 T AT08153217 T AT 08153217T AT E532394 T1 ATE532394 T1 AT E532394T1
Authority
AT
Austria
Prior art keywords
surface layers
circuit board
layers
printed circuit
wiring
Prior art date
Application number
AT08153217T
Other languages
English (en)
Inventor
Xiaolan Shen
Qingsong Ye
Konggang Wei
Original Assignee
Huawei Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Tech Co Ltd filed Critical Huawei Tech Co Ltd
Application granted granted Critical
Publication of ATE532394T1 publication Critical patent/ATE532394T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
AT08153217T 2007-03-23 2008-03-25 Leiterplatte, herstellungsverfahren dafür und hauptplatine für ein endgerätprodukt ATE532394T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNA2007100909090A CN101031182A (zh) 2007-03-23 2007-03-23 印制线路板及其设计方法
CN200710127769XA CN101365291B (zh) 2007-03-23 2007-06-28 印制线路板及其设计方法以及一种终端产品主板

Publications (1)

Publication Number Publication Date
ATE532394T1 true ATE532394T1 (de) 2011-11-15

Family

ID=38716171

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08153217T ATE532394T1 (de) 2007-03-23 2008-03-25 Leiterplatte, herstellungsverfahren dafür und hauptplatine für ein endgerätprodukt

Country Status (7)

Country Link
EP (2) EP3013127A1 (de)
JP (1) JP5945243B2 (de)
CN (3) CN101031182A (de)
AT (1) ATE532394T1 (de)
DE (1) DE202008017736U1 (de)
ES (2) ES2374325T3 (de)
PT (1) PT1981314E (de)

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CN102111967B (zh) * 2009-12-28 2012-10-03 北大方正集团有限公司 一种电路板绝缘层厚度的控制方法及系统
CN102340559A (zh) * 2010-07-20 2012-02-01 上海闻泰电子科技有限公司 一种移动终端组合式电路板及其组装方法
CN102159039B (zh) * 2011-01-14 2014-06-25 深圳创维数字技术股份有限公司 一种印制电路板敷铜方法及敷铜印制电路板
CN102170759B (zh) * 2011-04-22 2012-10-10 博敏电子股份有限公司 一种在多层电路板上加工盲埋孔的方法
CN102427685A (zh) * 2011-11-22 2012-04-25 深圳崇达多层线路板有限公司 一种hdi板的制作流程
CN102595773B (zh) * 2012-02-21 2014-06-04 华为终端有限公司 一种检测印刷电路板设计的方法和装置及印刷电路板
KR102151200B1 (ko) * 2012-12-31 2020-09-03 이피션트 파워 컨버젼 코퍼레이션 다층 반도체 소자를 위한 기생 인덕턴스 감소 회로기판 레이아웃 디자인
CN104113984B (zh) * 2013-04-18 2017-04-19 上海斐讯数据通信技术有限公司 1阶线路板设计方法及其线路板
CN103260359B (zh) * 2013-04-26 2016-03-23 淳华科技(昆山)有限公司 柔性线路板中的正背面相对盲孔的制作方法
JP5559925B1 (ja) * 2013-09-05 2014-07-23 株式会社フジクラ プリント配線板及び該配線板を接続するコネクタ
US9457743B2 (en) 2013-09-06 2016-10-04 Johnson Controls Technology Company Battery terminal post system and method of manufacture
CN103533746A (zh) * 2013-10-08 2014-01-22 上海斐讯数据通信技术有限公司 改进叠层结构的高密度互连集成印制电路板及其制作方法
CN105101608B (zh) * 2014-05-04 2018-05-18 群联电子股份有限公司 多层印刷电路板结构、连接器模块及存储器存储装置
CN103995183B (zh) * 2014-06-06 2017-06-30 浪潮电子信息产业股份有限公司 一种基于快速脉冲响应的pcb布线阻抗连续性检测方法
TWI576023B (zh) * 2014-10-23 2017-03-21 Elite Material Co Ltd Suitable for multi-layer printed circuit board design
CN105388411A (zh) * 2015-10-13 2016-03-09 浪潮电子信息产业股份有限公司 一种电路板载流能力测试方法
CN106934083B (zh) * 2015-12-30 2020-07-21 小米科技有限责任公司 电路设计方法和装置
CN106546777A (zh) * 2016-11-04 2017-03-29 郑州云海信息技术有限公司 一种基于rj45接口的10g以太网信号测试治具
CN106507581A (zh) * 2016-12-30 2017-03-15 深圳天珑无线科技有限公司 电路板及其加工工艺
CN107396541B (zh) * 2017-08-30 2019-05-10 郑州云海信息技术有限公司 一种优化视频信号线阻抗匹配的方法
CN107995774A (zh) * 2017-11-28 2018-05-04 无锡市同步电子科技有限公司 一种表贴射频头的走线优化方法
CN108112162A (zh) * 2017-12-26 2018-06-01 威创集团股份有限公司 信号传输线及其设计方法、柔性印刷电路板
CN110798963B (zh) * 2019-09-24 2022-11-15 惠州市金百泽电路科技有限公司 5g天线pcb幅度一致性的控制方法
CN110996505B (zh) * 2019-12-31 2022-02-18 联想(北京)有限公司 一种印制电路板及电子设备
CN113946019B (zh) * 2020-07-15 2022-11-29 青岛海信宽带多媒体技术有限公司 一种光模块
CN112186496B (zh) * 2020-09-22 2022-05-13 武汉光迅科技股份有限公司 一种阻抗匹配方法以及激光器模块
CN112349668B (zh) * 2020-09-28 2022-04-26 中国电子科技集团公司第二十九研究所 一种采用射频母板的宽带射频模块结构及其设计方法
CN112257180B (zh) * 2020-10-23 2024-04-26 中国科学院微小卫星创新研究院 航天复合材料层合板可靠性分析系统及方法
CN112395653A (zh) * 2020-11-26 2021-02-23 百富计算机技术（深圳）有限公司 防泄密结构和电子设备
CN114650647A (zh) * 2020-12-18 2022-06-21 青岛海信宽带多媒体技术有限公司 一种光模块
CN114043378B (zh) * 2021-11-29 2023-04-07 湖北金禄科技有限公司 Hdi板、hdi板的内层异常检测方法及设备
CN115087200B (zh) * 2022-06-17 2024-01-23 上海泽丰半导体科技有限公司 高速连接器的pcb优化方法及系统
CN115595658B (zh) * 2022-10-27 2024-07-02 松山湖材料实验室 低传输损耗单晶铜材及其制备方法、pcb板及其制备方法和电子元器件

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Also Published As

Publication number Publication date
EP2360998A1 (de) 2011-08-24
CN102917533B (zh) 2015-08-19
CN101365291B (zh) 2012-07-25
CN101031182A (zh) 2007-09-05
CN101365291A (zh) 2009-02-11
JP2013175774A (ja) 2013-09-05
CN102917533A (zh) 2013-02-06
ES2374325T3 (es) 2012-02-15
EP2360998B1 (de) 2016-02-17
DE202008017736U1 (de) 2010-04-29
PT1981314E (pt) 2012-01-09
ES2569852T3 (es) 2016-05-12
EP3013127A1 (de) 2016-04-27
JP5945243B2 (ja) 2016-07-05

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