ATE508617T1 - Leiterplatte und herstellungsverfahren dafür - Google Patents
Leiterplatte und herstellungsverfahren dafürInfo
- Publication number
- ATE508617T1 ATE508617T1 AT09252440T AT09252440T ATE508617T1 AT E508617 T1 ATE508617 T1 AT E508617T1 AT 09252440 T AT09252440 T AT 09252440T AT 09252440 T AT09252440 T AT 09252440T AT E508617 T1 ATE508617 T1 AT E508617T1
- Authority
- AT
- Austria
- Prior art keywords
- line
- circuit board
- production process
- connecting layers
- copper
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/484—Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4853—Constructional details of the electrical connection between head and arm
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09254—Branched layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09627—Special connections between adjacent vias, not for grounding vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Paper (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008287773A JP5142951B2 (ja) | 2008-11-10 | 2008-11-10 | 配線回路基板およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE508617T1 true ATE508617T1 (de) | 2011-05-15 |
Family
ID=41404591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT09252440T ATE508617T1 (de) | 2008-11-10 | 2009-10-19 | Leiterplatte und herstellungsverfahren dafür |
Country Status (6)
Country | Link |
---|---|
US (1) | US8138427B2 (de) |
EP (1) | EP2187715B1 (de) |
JP (1) | JP5142951B2 (de) |
CN (1) | CN101742811B (de) |
AT (1) | ATE508617T1 (de) |
DE (1) | DE602009001232D1 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5484176B2 (ja) | 2010-04-26 | 2014-05-07 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
US8339748B2 (en) * | 2010-06-29 | 2012-12-25 | Western Digital Technologies, Inc. | Suspension assembly having a microactuator bonded to a flexure |
JP4962878B2 (ja) * | 2010-07-05 | 2012-06-27 | 大日本印刷株式会社 | サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ、並びに、サスペンションの製造方法 |
KR20120047596A (ko) * | 2010-11-04 | 2012-05-14 | 삼성전자주식회사 | 반도체 소자의 배선 구조 |
JP5093701B2 (ja) | 2010-12-28 | 2012-12-12 | 大日本印刷株式会社 | サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ、並びにサスペンション用基板の製造方法 |
JP5772013B2 (ja) * | 2011-01-27 | 2015-09-02 | 大日本印刷株式会社 | サスペンション用基板 |
JP5810570B2 (ja) * | 2011-03-18 | 2015-11-11 | 大日本印刷株式会社 | サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ |
JP5311237B2 (ja) * | 2011-04-11 | 2013-10-09 | 大日本印刷株式会社 | サスペンション用基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよびサスペンション用基板の製造方法 |
JP5845631B2 (ja) * | 2011-05-24 | 2016-01-20 | 大日本印刷株式会社 | サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブ、およびサスペンション用フレキシャー基板の製造方法、ならびに検査方法 |
JP5924909B2 (ja) * | 2011-11-21 | 2016-05-25 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
JP6015024B2 (ja) * | 2012-02-20 | 2016-10-26 | 大日本印刷株式会社 | サスペンション用基板の製造方法 |
JP6024803B2 (ja) * | 2015-09-07 | 2016-11-16 | 大日本印刷株式会社 | サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ |
JP6128184B2 (ja) * | 2015-10-30 | 2017-05-17 | 大日本印刷株式会社 | サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ |
JP6160756B2 (ja) * | 2016-08-26 | 2017-07-12 | 大日本印刷株式会社 | サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ |
JP6802688B2 (ja) * | 2016-11-02 | 2020-12-16 | 日東電工株式会社 | 配線回路基板 |
JP7161866B2 (ja) * | 2018-05-31 | 2022-10-27 | 日東電工株式会社 | 配線回路基板 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH065995A (ja) * | 1992-06-19 | 1994-01-14 | Japan Servo Co Ltd | バス配線用プリント基板 |
US5414393A (en) * | 1992-08-20 | 1995-05-09 | Hubbell Incorporated | Telecommunication connector with feedback |
US6341415B2 (en) * | 1992-08-31 | 2002-01-29 | Fujitsu Limited | Method for assembling a magnetic head assembly and magnetic disk drive using bonding balls connecting magnetic head terminals to wiring terminals |
CN1090200C (zh) * | 1996-02-13 | 2002-09-04 | 日东电工株式会社 | 电路基片,形成电路的支承基片及其生产方法 |
JPH1012983A (ja) | 1996-02-13 | 1998-01-16 | Nitto Denko Corp | 回路基板、回路付きサスペンション基板及びそれらの製造方法 |
SG52916A1 (en) * | 1996-02-13 | 1998-09-28 | Nitto Denko Corp | Circuit substrate circuit-formed suspension substrate and production method thereof |
US5717547A (en) * | 1996-10-03 | 1998-02-10 | Quantum Corporation | Multi-trace transmission lines for R/W head interconnect in hard disk drive |
JP3634134B2 (ja) * | 1997-09-10 | 2005-03-30 | 富士通株式会社 | サスペンション、ヘッドスライダ支持装置、及びディスク装置 |
US6392148B1 (en) * | 1999-05-10 | 2002-05-21 | Furukawa Electric Co., Ltd. | Wire harness joint |
JP3725991B2 (ja) * | 1999-03-12 | 2005-12-14 | 株式会社日立グローバルストレージテクノロジーズ | 磁気ディスク装置 |
US6424499B1 (en) * | 1999-03-31 | 2002-07-23 | Quantum Corporation | Flexible trace interconnect array for multi-channel tape head |
US6480359B1 (en) * | 2000-05-09 | 2002-11-12 | 3M Innovative Properties Company | Hard disk drive suspension with integral flexible circuit |
JP2002009406A (ja) * | 2000-06-19 | 2002-01-11 | Mitsui Chemicals Inc | 回路基板およびその製造方法 |
JP2002222578A (ja) * | 2001-01-26 | 2002-08-09 | Nitto Denko Corp | 中継フレキシブル配線回路基板 |
JP3891912B2 (ja) * | 2002-10-09 | 2007-03-14 | 日本発条株式会社 | ディスクドライブ用サスペンション |
US6930888B2 (en) * | 2002-11-04 | 2005-08-16 | Intel Corporation | Mechanism to cross high-speed differential pairs |
US7259968B2 (en) * | 2003-05-14 | 2007-08-21 | Hewlett-Packard Development Company, L.P. | Tailoring impedances of conductive traces in a circuit board |
JP2005011387A (ja) * | 2003-06-16 | 2005-01-13 | Hitachi Global Storage Technologies Inc | 磁気ディスク装置 |
JP2005109101A (ja) * | 2003-09-30 | 2005-04-21 | Nippon Mektron Ltd | 電磁シールド型可撓性回路基板 |
JP2006040414A (ja) * | 2004-07-27 | 2006-02-09 | Nitto Denko Corp | 配線回路基板 |
JP4757079B2 (ja) * | 2006-04-03 | 2011-08-24 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
-
2008
- 2008-11-10 JP JP2008287773A patent/JP5142951B2/ja active Active
-
2009
- 2009-10-19 DE DE602009001232T patent/DE602009001232D1/de active Active
- 2009-10-19 AT AT09252440T patent/ATE508617T1/de not_active IP Right Cessation
- 2009-10-19 EP EP09252440A patent/EP2187715B1/de active Active
- 2009-11-04 US US12/611,985 patent/US8138427B2/en not_active Expired - Fee Related
- 2009-11-05 CN CN2009102074776A patent/CN101742811B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US8138427B2 (en) | 2012-03-20 |
JP2010114366A (ja) | 2010-05-20 |
EP2187715B1 (de) | 2011-05-04 |
CN101742811B (zh) | 2013-09-18 |
DE602009001232D1 (de) | 2011-06-16 |
JP5142951B2 (ja) | 2013-02-13 |
US20100116537A1 (en) | 2010-05-13 |
EP2187715A1 (de) | 2010-05-19 |
CN101742811A (zh) | 2010-06-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE508617T1 (de) | Leiterplatte und herstellungsverfahren dafür | |
TW200717551A (en) | Embedded inductor and the application thereof | |
TW200731897A (en) | Method for fabricating circuit board with conductive structure | |
ATE557577T1 (de) | Flexibel-starre leiterplatte | |
WO2009057654A1 (ja) | 部品内蔵配線板、部品内蔵配線板の製造方法 | |
WO2009054098A1 (ja) | 部品内蔵配線基板および部品内蔵配線基板の製造方法 | |
WO2011112409A3 (en) | Wiring substrate with customization layers | |
WO2009048154A1 (ja) | 半導体装置及びその設計方法 | |
JP2011155251A5 (de) | ||
ATE543372T1 (de) | Flexible leiterplatte und herstellungsverfahren dafür | |
WO2009020124A1 (ja) | Ic搭載用基板およびその製造方法 | |
TW200618683A (en) | Circuit board structure with embeded adjustable passive components and method for fabricating the same | |
TW200610470A (en) | Method for fabricating electrical connecting member of circuit board | |
WO2012042667A9 (ja) | 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板 | |
WO2009054105A1 (ja) | 部品内蔵プリント配線基板およびその製造方法 | |
TW200741895A (en) | Package using array capacitor core | |
WO2012064095A3 (ko) | 발광모듈 | |
JP2018041795A5 (de) | ||
JP2010109180A5 (de) | ||
TW201513748A (zh) | 軟性電路板及其製造方法 | |
TW200610466A (en) | Method for fabricating conductive bumps of a circuit board | |
TW200740329A (en) | Circuit substrate | |
TW200731906A (en) | Circuit board structure and method for fabricating the same | |
TW200735315A (en) | Package substrate and the manufacturing method making the same | |
TW200942762A (en) | Circuit board and process for fabricating the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |