WO2009050851A1 - 回路基板および電子デバイス - Google Patents
回路基板および電子デバイス Download PDFInfo
- Publication number
- WO2009050851A1 WO2009050851A1 PCT/JP2008/002778 JP2008002778W WO2009050851A1 WO 2009050851 A1 WO2009050851 A1 WO 2009050851A1 JP 2008002778 W JP2008002778 W JP 2008002778W WO 2009050851 A1 WO2009050851 A1 WO 2009050851A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wiring
- circuit board
- interlayer signal
- grounding
- electronic device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
複数の配線層を有する回路基板であって、異なる配線層に設けられる回路パターンの間を電気的に接続する層間信号配線と、層間信号配線が貫通する配線層のうち、少なくとも一部の配線層において、層間信号配線を囲むように形成される接地プレーンとを備える回路基板が提供される。また、上記配線層における接地プレーンの内周は、層間信号配線を中心とした円状であることが好ましい。また、接地プレーンが形成される配線層のそれぞれにおいて、接地プレーンと層間信号配線との距離は略同一であることが好ましい。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009537898A JP5337042B2 (ja) | 2007-10-19 | 2008-10-02 | 回路基板および電子デバイス |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/874,933 | 2007-10-19 | ||
US11/874,933 US20090101402A1 (en) | 2007-10-19 | 2007-10-19 | Circuit board, and electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009050851A1 true WO2009050851A1 (ja) | 2009-04-23 |
Family
ID=40562322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/002778 WO2009050851A1 (ja) | 2007-10-19 | 2008-10-02 | 回路基板および電子デバイス |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090101402A1 (ja) |
JP (1) | JP5337042B2 (ja) |
WO (1) | WO2009050851A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013051387A (ja) * | 2011-08-30 | 2013-03-14 | Star Technologies Inc | 電子回路板 |
WO2013121732A1 (ja) * | 2012-02-15 | 2013-08-22 | パナソニック株式会社 | 無線モジュール |
JP2013251520A (ja) * | 2012-05-30 | 2013-12-12 | Zhuhai Advanced Chip Carriers & Electronic Substrates Solutions Technologies Co Ltd | 一体的ファラデーシールドを備えた多層電子構造体 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6259254B2 (ja) * | 2013-10-18 | 2018-01-10 | 株式会社日本マイクロニクス | 検査装置および検査方法 |
EP3755126A4 (en) | 2018-03-15 | 2021-03-03 | Huawei Technologies Co., Ltd. | CONNECTING BOARD, PCB ASSEMBLY AND ELECTRONIC DEVICE |
CN114945240A (zh) * | 2022-05-23 | 2022-08-26 | 维沃移动通信有限公司 | 转接板、电路板和电子设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0685099A (ja) * | 1992-09-01 | 1994-03-25 | Shinko Electric Ind Co Ltd | 高周波用回路基板の信号回路 |
JP2002312087A (ja) * | 2001-04-12 | 2002-10-25 | Hitachi Ltd | バスシステム、プリント配線基板および電子装置 |
JP2003204209A (ja) * | 2002-01-07 | 2003-07-18 | Kyocera Corp | 高周波用配線基板 |
JP2003218482A (ja) * | 2002-01-25 | 2003-07-31 | Mitsubishi Electric Corp | 高周波信号接続構造 |
WO2007046271A1 (ja) * | 2005-10-18 | 2007-04-26 | Nec Corporation | 垂直信号経路、それを有するプリント基板及びそのプリント基板と半導体素子とを有する半導体パッケージ |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6353540B1 (en) * | 1995-01-10 | 2002-03-05 | Hitachi, Ltd. | Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board. |
US5929729A (en) * | 1997-10-24 | 1999-07-27 | Com Dev Limited | Printed lumped element stripline circuit ground-signal-ground structure |
JP4204150B2 (ja) * | 1998-10-16 | 2009-01-07 | パナソニック株式会社 | 多層回路基板 |
JP2004304178A (ja) * | 2003-03-18 | 2004-10-28 | Tdk Corp | 積層電子部品とその製造方法 |
US7030712B2 (en) * | 2004-03-01 | 2006-04-18 | Belair Networks Inc. | Radio frequency (RF) circuit board topology |
JP2006073994A (ja) * | 2004-08-05 | 2006-03-16 | Seiko Epson Corp | 接続用基板、接続構造、接続方法並びに電子機器 |
JP4410242B2 (ja) * | 2006-12-27 | 2010-02-03 | 三菱電機株式会社 | 電子制御装置及びその製造方法 |
-
2007
- 2007-10-19 US US11/874,933 patent/US20090101402A1/en not_active Abandoned
-
2008
- 2008-10-02 WO PCT/JP2008/002778 patent/WO2009050851A1/ja active Application Filing
- 2008-10-02 JP JP2009537898A patent/JP5337042B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0685099A (ja) * | 1992-09-01 | 1994-03-25 | Shinko Electric Ind Co Ltd | 高周波用回路基板の信号回路 |
JP2002312087A (ja) * | 2001-04-12 | 2002-10-25 | Hitachi Ltd | バスシステム、プリント配線基板および電子装置 |
JP2003204209A (ja) * | 2002-01-07 | 2003-07-18 | Kyocera Corp | 高周波用配線基板 |
JP2003218482A (ja) * | 2002-01-25 | 2003-07-31 | Mitsubishi Electric Corp | 高周波信号接続構造 |
WO2007046271A1 (ja) * | 2005-10-18 | 2007-04-26 | Nec Corporation | 垂直信号経路、それを有するプリント基板及びそのプリント基板と半導体素子とを有する半導体パッケージ |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013051387A (ja) * | 2011-08-30 | 2013-03-14 | Star Technologies Inc | 電子回路板 |
WO2013121732A1 (ja) * | 2012-02-15 | 2013-08-22 | パナソニック株式会社 | 無線モジュール |
JP2013251520A (ja) * | 2012-05-30 | 2013-12-12 | Zhuhai Advanced Chip Carriers & Electronic Substrates Solutions Technologies Co Ltd | 一体的ファラデーシールドを備えた多層電子構造体 |
Also Published As
Publication number | Publication date |
---|---|
JP5337042B2 (ja) | 2013-11-06 |
US20090101402A1 (en) | 2009-04-23 |
JPWO2009050851A1 (ja) | 2011-02-24 |
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