ATE483352T1 - Leiterplatte - Google Patents
LeiterplatteInfo
- Publication number
- ATE483352T1 ATE483352T1 AT06252299T AT06252299T ATE483352T1 AT E483352 T1 ATE483352 T1 AT E483352T1 AT 06252299 T AT06252299 T AT 06252299T AT 06252299 T AT06252299 T AT 06252299T AT E483352 T1 ATE483352 T1 AT E483352T1
- Authority
- AT
- Austria
- Prior art keywords
- ground lines
- ground
- another
- equal intervals
- arranged parallel
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Chemical And Physical Treatments For Wood And The Like (AREA)
- Polysaccharides And Polysaccharide Derivatives (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005131308A JP3872084B2 (ja) | 2005-04-28 | 2005-04-28 | 配線回路基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE483352T1 true ATE483352T1 (de) | 2010-10-15 |
Family
ID=36999884
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06252299T ATE483352T1 (de) | 2005-04-28 | 2006-04-28 | Leiterplatte |
Country Status (6)
Country | Link |
---|---|
US (1) | US7473854B2 (de) |
EP (1) | EP1720384B1 (de) |
JP (1) | JP3872084B2 (de) |
CN (1) | CN1856214B (de) |
AT (1) | ATE483352T1 (de) |
DE (1) | DE602006017141D1 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008124317A (ja) * | 2006-11-14 | 2008-05-29 | Toshiba Matsushita Display Technology Co Ltd | フレキシブルプリント基板 |
US8256111B2 (en) * | 2006-12-22 | 2012-09-04 | Hon Hai Precision Industry Co., Ltd. | Circuit board layout method |
CN101207968B (zh) * | 2006-12-22 | 2011-11-09 | 鸿富锦精密工业(深圳)有限公司 | 电路板 |
EP2112871B1 (de) * | 2008-04-22 | 2016-07-13 | Hon Hai Precision Industry Co., Ltd. | Leiterplatte mit verbesserter Erdungsschicht |
CN101594732A (zh) * | 2008-05-27 | 2009-12-02 | 鸿富锦精密工业(深圳)有限公司 | 电路板 |
JP4399019B1 (ja) * | 2008-07-31 | 2010-01-13 | 株式会社東芝 | 電子機器、フレキシブルプリント配線板、およびフレキシブルプリント配線板の製造方法 |
JPWO2010082593A1 (ja) * | 2009-01-16 | 2012-07-05 | 株式会社フジクラ | コネクタ及びケーブルアセンブリ |
KR101378027B1 (ko) | 2009-07-13 | 2014-03-25 | 가부시키가이샤 무라타 세이사쿠쇼 | 신호선로 및 회로기판 |
JP2012094646A (ja) * | 2010-10-26 | 2012-05-17 | Daisho Denshi Co Ltd | 特性インピーダンスコントロール対応プリント配線基板 |
USD720310S1 (en) * | 2011-06-17 | 2014-12-30 | Soraa, Inc. | Triangular semiconductor die |
KR20130033868A (ko) * | 2011-09-27 | 2013-04-04 | 삼성전기주식회사 | 메쉬 패턴을 갖는 패키지 기판 및 그 제조방법 |
US8791371B2 (en) | 2011-11-28 | 2014-07-29 | International Business Machines Corporation | Mesh planes with alternating spaces for multi-layered ceramic packages |
US8952263B2 (en) * | 2012-08-10 | 2015-02-10 | Eastman Kodak Company | Micro-wire electrode pattern |
US20140216783A1 (en) * | 2013-02-05 | 2014-08-07 | David P. Trauernicht | Micro-wire pattern with offset intersections |
US20140216790A1 (en) * | 2013-02-05 | 2014-08-07 | David P. Trauernicht | Conductive micro-wire structure with offset intersections |
TWI457055B (zh) * | 2013-02-20 | 2014-10-11 | Novatek Microelectronics Corp | 軟性電路板及其接地線結構 |
US9536848B2 (en) * | 2014-10-16 | 2017-01-03 | Globalfoundries Inc. | Bond pad structure for low temperature flip chip bonding |
JP6745712B2 (ja) | 2016-11-30 | 2020-08-26 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
JP6987700B2 (ja) * | 2018-05-29 | 2022-01-05 | 京セラ株式会社 | 印刷配線板 |
CN114786328B (zh) * | 2022-05-23 | 2024-04-30 | 西安易朴通讯技术有限公司 | 多层印制电路板 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4855537A (en) * | 1987-09-25 | 1989-08-08 | Kabushiki Kaisha Toshiba | Wiring substrate having mesh-shaped earth line |
JPH05152768A (ja) | 1991-11-27 | 1993-06-18 | Nec Corp | 多層構造基板 |
JPH05343820A (ja) | 1992-06-04 | 1993-12-24 | Toshiba Corp | マルチチップモジュール用回路基板 |
JPH06326476A (ja) | 1993-05-13 | 1994-11-25 | Sony Corp | 多層配線基板 |
JPH07202359A (ja) | 1993-12-30 | 1995-08-04 | Sony Corp | 回路基板 |
JPH07302979A (ja) | 1994-05-10 | 1995-11-14 | Toshiba Corp | 多層配線基板 |
JP3267148B2 (ja) | 1996-04-03 | 2002-03-18 | 富士通株式会社 | 多層プリント配線板及び携帯型無線通信装置 |
JPH11298149A (ja) | 1998-04-09 | 1999-10-29 | Sumitomo Metal Ind Ltd | 多層配線基板 |
TW476229B (en) | 1998-08-24 | 2002-02-11 | Adv Flexible Circuits Co Ltd | Circuit board having shielding plate with empty-hole opening pattern to control impedance and transmission time |
JP3307597B2 (ja) | 1998-09-30 | 2002-07-24 | 株式会社 アドテック | 印刷配線装置 |
US6433286B1 (en) * | 2000-09-29 | 2002-08-13 | Intel Corporation | Method of making higher impedance traces on a low impedance circuit board |
JP2003133659A (ja) | 2001-10-19 | 2003-05-09 | Kazunori Aoki | 屈曲性能を具備した高周波用フレキシブルプリント配線板 |
-
2005
- 2005-04-28 JP JP2005131308A patent/JP3872084B2/ja active Active
-
2006
- 2006-04-25 US US11/380,008 patent/US7473854B2/en active Active
- 2006-04-26 CN CN200610076164.8A patent/CN1856214B/zh not_active Expired - Fee Related
- 2006-04-28 AT AT06252299T patent/ATE483352T1/de not_active IP Right Cessation
- 2006-04-28 DE DE602006017141T patent/DE602006017141D1/de active Active
- 2006-04-28 EP EP06252299A patent/EP1720384B1/de not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
EP1720384A2 (de) | 2006-11-08 |
EP1720384A3 (de) | 2007-11-21 |
EP1720384B1 (de) | 2010-09-29 |
JP2006310545A (ja) | 2006-11-09 |
JP3872084B2 (ja) | 2007-01-24 |
US7473854B2 (en) | 2009-01-06 |
CN1856214A (zh) | 2006-11-01 |
DE602006017141D1 (de) | 2010-11-11 |
US20060246268A1 (en) | 2006-11-02 |
CN1856214B (zh) | 2010-09-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |