ATE523881T1 - Verfahren bei der herstellung eines ferroelektrischen speicherbausteins - Google Patents
Verfahren bei der herstellung eines ferroelektrischen speicherbausteinsInfo
- Publication number
- ATE523881T1 ATE523881T1 AT06747667T AT06747667T ATE523881T1 AT E523881 T1 ATE523881 T1 AT E523881T1 AT 06747667 T AT06747667 T AT 06747667T AT 06747667 T AT06747667 T AT 06747667T AT E523881 T1 ATE523881 T1 AT E523881T1
- Authority
- AT
- Austria
- Prior art keywords
- producing
- ferroelectric memory
- memory component
- electrode sets
- memory device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
- H10B53/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the memory core region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NO20052878A NO324539B1 (no) | 2005-06-14 | 2005-06-14 | Fremgangsmate i fabrikasjonen av en ferroelektrisk minneinnretning |
PCT/NO2006/000215 WO2006135246A1 (en) | 2005-06-14 | 2006-06-08 | A method in the fabrication of a ferroelectric memory device |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE523881T1 true ATE523881T1 (de) | 2011-09-15 |
Family
ID=35295080
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06747667T ATE523881T1 (de) | 2005-06-14 | 2006-06-08 | Verfahren bei der herstellung eines ferroelektrischen speicherbausteins |
Country Status (8)
Country | Link |
---|---|
US (1) | US20090285981A1 (de) |
EP (1) | EP1894203B1 (de) |
JP (2) | JP2008544519A (de) |
KR (1) | KR20080012999A (de) |
CN (1) | CN101199021B (de) |
AT (1) | ATE523881T1 (de) |
NO (1) | NO324539B1 (de) |
WO (1) | WO2006135246A1 (de) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007184462A (ja) * | 2006-01-10 | 2007-07-19 | Agfa Gevaert Nv | 強誘電性記憶素子、その素子を含むデバイス及びその製法 |
CN101359592B (zh) * | 2007-07-30 | 2012-05-30 | 徐海生 | 铁电随机存取芯片制造方法 |
CN101359665B (zh) * | 2007-07-30 | 2011-12-28 | 徐海生 | 铁电随机存取芯片 |
CN101359633B (zh) * | 2007-07-30 | 2012-12-26 | 徐海生 | 射频识别芯片制造方法 |
FR2925765B1 (fr) * | 2007-12-21 | 2009-12-04 | E2V Semiconductors | Procede de fabrication de capteurs a couche de co-polymere p(vdf-trfe) et capteur correspondant |
SG157268A1 (en) * | 2008-05-30 | 2009-12-29 | Sony Corp | Ferroelectric polymer |
KR101245278B1 (ko) * | 2009-08-07 | 2013-03-19 | 주식회사 엘지화학 | 전도성 기판 및 이의 제조 방법 |
JP5674520B2 (ja) | 2011-03-24 | 2015-02-25 | 株式会社東芝 | 有機分子メモリの製造方法 |
EP2740122B1 (de) | 2011-06-27 | 2016-08-31 | Thin Film Electronics ASA | Kurzschlussreduktion bei einer elektronischen komponente mit einem auf einem flexiblen substrat angeordneten schichtstapel |
EP2724342B1 (de) | 2011-06-27 | 2018-10-17 | Xerox Corporation | Kurzschlussreduktion in einer ferroelektrischen speicherzelle mit einem auf einem flexiblen substrat angeordneten schichtstapel |
KR101303086B1 (ko) * | 2012-02-01 | 2013-09-04 | 한국과학기술원 | 강유전 고분자 박막을 이용한 정보 저장 매체의 제조방법 |
FR3004854B1 (fr) * | 2013-04-19 | 2015-04-17 | Arkema France | Dispositif de memoire ferroelectrique |
JP6229532B2 (ja) * | 2014-02-21 | 2017-11-15 | 国立研究開発法人産業技術総合研究所 | 有機強誘電体薄膜の製造方法 |
KR101765529B1 (ko) * | 2014-02-27 | 2017-08-07 | 서울대학교산학협력단 | 신축성 및 연성 전자 소자 및 이의 제조 방법 |
CN104409632B (zh) * | 2014-05-31 | 2017-05-10 | 福州大学 | 一种多层结构有机阻变存储器的3d打印制备方法 |
JP5739042B2 (ja) * | 2014-06-06 | 2015-06-24 | 株式会社東芝 | 有機分子メモリ |
FR3024303B1 (fr) * | 2014-07-24 | 2016-08-26 | Commissariat Energie Atomique | Procede ameliore de realisation d'un generateur tribo-electrique a polymere dielectrique rugueux |
WO2016092374A1 (en) * | 2014-12-10 | 2016-06-16 | King Abdullah University Of Science And Technology | All-printed paper-based memory |
US9853088B2 (en) | 2014-12-31 | 2017-12-26 | King Abdullah University Of Science And Technology | All-printed paper memory |
KR101823730B1 (ko) * | 2015-07-14 | 2018-01-31 | 한국과학기술원 | 수용성 기판을 이용하는 폐기 가능한 메모리 및 그 제작 방법 |
JP6926475B2 (ja) | 2015-11-25 | 2021-08-25 | 東レ株式会社 | 強誘電体記憶素子、その製造方法、ならびにそれを用いたメモリセルおよびそれを用いた無線通信装置 |
EP3185658A1 (de) * | 2015-12-23 | 2017-06-28 | Voestalpine Stahl GmbH | Metallband und coil-coating-verfahren |
US9886571B2 (en) | 2016-02-16 | 2018-02-06 | Xerox Corporation | Security enhancement of customer replaceable unit monitor (CRUM) |
US10396085B2 (en) | 2017-03-06 | 2019-08-27 | Xerox Corporation | Circular printed memory device with rotational detection |
US10978169B2 (en) | 2017-03-17 | 2021-04-13 | Xerox Corporation | Pad detection through pattern analysis |
CN107221532B (zh) * | 2017-05-12 | 2018-11-13 | 南京理工大学 | 一种透明柔性氧化物铁电存储器 |
US9928893B1 (en) * | 2017-06-05 | 2018-03-27 | Xerox Corporation | Circular printed memory system and method having robustness to orientation |
US10396124B2 (en) | 2017-07-05 | 2019-08-27 | Xerox Corporation | Memory cells and devices |
US10249625B1 (en) | 2018-07-18 | 2019-04-02 | Xerox Corporation | Coated printed electronic devices exhibiting improved yield |
US10593684B2 (en) | 2018-07-18 | 2020-03-17 | Xerox Corporation | Printed electronic devices exhibiting improved yield |
US10304836B1 (en) * | 2018-07-18 | 2019-05-28 | Xerox Corporation | Protective layers for high-yield printed electronic devices |
US11393832B2 (en) * | 2020-07-15 | 2022-07-19 | Ferroelectric Memory Gmbh | Memory cell arrangement |
CN113745261B (zh) * | 2021-07-21 | 2023-08-11 | 湖南大学 | 一种Micro-LED光信息传感与存储单元、光子集成芯片、阵列及制备方法 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4045406B2 (ja) * | 1999-06-04 | 2008-02-13 | セイコーエプソン株式会社 | 強誘電体メモリ素子及びその製造方法 |
JP3622598B2 (ja) * | 1999-10-25 | 2005-02-23 | セイコーエプソン株式会社 | 不揮発性メモリ素子の製造方法 |
JP3731641B2 (ja) * | 1999-12-09 | 2006-01-05 | セイコーエプソン株式会社 | 強誘電体、これを用いた強誘電体メモリ及び強誘電体メモリデバイス、誘電体のパターニング方法、及び、強誘電体メモリデバイスの製造方法 |
NO20001360D0 (no) * | 2000-03-15 | 2000-03-15 | Thin Film Electronics Asa | Vertikale elektriske forbindelser i stabel |
JP2002026283A (ja) * | 2000-06-30 | 2002-01-25 | Seiko Epson Corp | 多層構造のメモリ装置及びその製造方法 |
JP2002026277A (ja) * | 2000-06-30 | 2002-01-25 | Seiko Epson Corp | メモリデバイス及びその駆動方法 |
JP3901432B2 (ja) * | 2000-08-22 | 2007-04-04 | セイコーエプソン株式会社 | 強誘電体キャパシタを有するメモリセルアレイおよびその製造方法 |
NO20005980L (no) * | 2000-11-27 | 2002-05-28 | Thin Film Electronics Ab | Ferroelektrisk minnekrets og fremgangsmåte ved dens fremstilling |
DE10062254C2 (de) * | 2000-12-14 | 2002-12-19 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Charakterisieren einer Oberfläche und Verfahren und Vorrichtung zur Ermittlung einer Formanomalie einer Oberfläche |
US6756620B2 (en) * | 2001-06-29 | 2004-06-29 | Intel Corporation | Low-voltage and interface damage-free polymer memory device |
JP2005500682A (ja) * | 2001-08-13 | 2005-01-06 | アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド | メモリセル |
US20030215565A1 (en) * | 2001-10-10 | 2003-11-20 | Industrial Technology Research Institute | Method and apparatus for the formation of laminated circuit having passive components therein |
KR20030057065A (ko) * | 2001-12-28 | 2003-07-04 | 엘지.필립스 엘시디 주식회사 | 금속패턴 형성방법 |
KR100798314B1 (ko) * | 2001-12-28 | 2008-01-28 | 엘지.필립스 엘시디 주식회사 | 기판의 변동에 의한 패턴의 오정렬이 보상된 패턴형성용잉크인쇄장치 및 이를 이용한 패턴형성방법 |
US6828685B2 (en) * | 2002-06-14 | 2004-12-07 | Hewlett-Packard Development Company, L.P. | Memory device having a semiconducting polymer film |
NO322192B1 (no) * | 2002-06-18 | 2006-08-28 | Thin Film Electronics Asa | Fremgangsmate til fremstilling av elektrodelag av ferroelektriske minneceller i en ferroelektrisk minneinnretning, samt ferroelektrisk minneinnretning |
US6812509B2 (en) * | 2002-06-28 | 2004-11-02 | Palo Alto Research Center Inc. | Organic ferroelectric memory cells |
KR101247430B1 (ko) * | 2002-12-20 | 2013-03-25 | 메르크 파텐트 게엠베하 | 유기 반도체 재료의 개선 및 그와 관련된 개선 |
JP2004247716A (ja) * | 2003-01-23 | 2004-09-02 | Mitsubishi Chemicals Corp | 積層体の製造方法 |
JP3841085B2 (ja) * | 2004-01-29 | 2006-11-01 | セイコーエプソン株式会社 | キャパシタとその製造方法、及び半導体装置 |
US7135391B2 (en) * | 2004-05-21 | 2006-11-14 | International Business Machines Corporation | Polycrystalline SiGe junctions for advanced devices |
US20060098485A1 (en) * | 2004-10-29 | 2006-05-11 | Agfa-Gevaert | Printable non-volatile passive memory element and method of making thereof |
US7675123B2 (en) * | 2004-10-29 | 2010-03-09 | Agfa-Gevaert Nv | Printable non-volatile passive memory element and method of making thereof |
US20070057311A1 (en) * | 2004-10-29 | 2007-03-15 | Agfa-Gevaert | Conventionally printable non-volatile passive memory element and method of making thereof |
JP2006245185A (ja) * | 2005-03-02 | 2006-09-14 | Seiko Epson Corp | 有機強誘電体メモリ及びその製造方法 |
JP2006253475A (ja) * | 2005-03-11 | 2006-09-21 | Seiko Epson Corp | 有機強誘電体メモリおよびその製造方法 |
JP4580284B2 (ja) * | 2005-06-20 | 2010-11-10 | Okiセミコンダクタ株式会社 | 強誘電体素子の製造方法 |
TWI447765B (zh) * | 2012-01-04 | 2014-08-01 | Inotera Memories Inc | 具有多層電極結構之電容單元 |
-
2005
- 2005-06-14 NO NO20052878A patent/NO324539B1/no unknown
-
2006
- 2006-06-08 AT AT06747667T patent/ATE523881T1/de not_active IP Right Cessation
- 2006-06-08 WO PCT/NO2006/000215 patent/WO2006135246A1/en active Application Filing
- 2006-06-08 US US11/922,052 patent/US20090285981A1/en not_active Abandoned
- 2006-06-08 CN CN2006800212494A patent/CN101199021B/zh active Active
- 2006-06-08 KR KR1020077030552A patent/KR20080012999A/ko active IP Right Grant
- 2006-06-08 JP JP2008516771A patent/JP2008544519A/ja active Pending
- 2006-06-08 EP EP06747667A patent/EP1894203B1/de active Active
-
2012
- 2012-03-12 JP JP2012054625A patent/JP2012178566A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP1894203B1 (de) | 2011-09-07 |
US20090285981A1 (en) | 2009-11-19 |
CN101199021B (zh) | 2012-09-05 |
KR20080012999A (ko) | 2008-02-12 |
NO324539B1 (no) | 2007-11-19 |
NO20052878D0 (no) | 2005-06-14 |
JP2008544519A (ja) | 2008-12-04 |
WO2006135246A1 (en) | 2006-12-21 |
JP2012178566A (ja) | 2012-09-13 |
CN101199021A (zh) | 2008-06-11 |
NO20052878L (no) | 2006-12-15 |
EP1894203A1 (de) | 2008-03-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |