DE602004013338D1 - Stempel für die sanfte Lithographie, insbesondere für das Mikro-Kontaktdruckverfahren und Verfahren zu seiner Herstellung - Google Patents

Stempel für die sanfte Lithographie, insbesondere für das Mikro-Kontaktdruckverfahren und Verfahren zu seiner Herstellung

Info

Publication number
DE602004013338D1
DE602004013338D1 DE602004013338T DE602004013338T DE602004013338D1 DE 602004013338 D1 DE602004013338 D1 DE 602004013338D1 DE 602004013338 T DE602004013338 T DE 602004013338T DE 602004013338 T DE602004013338 T DE 602004013338T DE 602004013338 D1 DE602004013338 D1 DE 602004013338D1
Authority
DE
Germany
Prior art keywords
stamp
micro
production
contact printing
soft lithography
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004013338T
Other languages
English (en)
Other versions
DE602004013338T2 (de
Inventor
Gregor Kron
Jurina Wessels
Akio Yasuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Deutschland GmbH
Original Assignee
Sony Deutschland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Deutschland GmbH filed Critical Sony Deutschland GmbH
Publication of DE602004013338D1 publication Critical patent/DE602004013338D1/de
Application granted granted Critical
Publication of DE602004013338T2 publication Critical patent/DE602004013338T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K1/00—Portable hand-operated devices without means for supporting or locating the articles to be stamped, i.e. hand stamps; Inking devices or other accessories therefor
    • B41K1/36—Details
    • B41K1/38—Inking devices; Stamping surfaces
    • B41K1/50—Stamping surfaces impregnated with ink, or made of material leaving a mark after stamping contact
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41D—APPARATUS FOR THE MECHANICAL REPRODUCTION OF PRINTING SURFACES FOR STEREOTYPE PRINTING; SHAPING ELASTIC OR DEFORMABLE MATERIAL TO FORM PRINTING SURFACES
    • B41D7/00—Shaping elastic or deformable material, e.g. rubber, plastics material, to form printing surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
DE602004013338T 2004-11-10 2004-11-10 Stempel für die sanfte Lithographie, insbesondere für das Mikro-Kontaktdruckverfahren und Verfahren zu seiner Herstellung Active DE602004013338T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04026681A EP1657070B1 (de) 2004-11-10 2004-11-10 Stempel für die sanfte Lithographie, insbesondere für das Mikro-Kontaktdruckverfahren und Verfahren zu seiner Herstellung

Publications (2)

Publication Number Publication Date
DE602004013338D1 true DE602004013338D1 (de) 2008-06-05
DE602004013338T2 DE602004013338T2 (de) 2009-06-10

Family

ID=34927324

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004013338T Active DE602004013338T2 (de) 2004-11-10 2004-11-10 Stempel für die sanfte Lithographie, insbesondere für das Mikro-Kontaktdruckverfahren und Verfahren zu seiner Herstellung

Country Status (6)

Country Link
US (1) US8079305B2 (de)
EP (1) EP1657070B1 (de)
JP (1) JP5079229B2 (de)
KR (1) KR101091456B1 (de)
CN (1) CN100473537C (de)
DE (1) DE602004013338T2 (de)

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EP1840648A1 (de) 2006-03-31 2007-10-03 Sony Deutschland Gmbh Verfahren zur Aufbringung eines Musters aus Metall und/oder Halbleiter auf ein Substrat
GB2437328A (en) * 2006-04-10 2007-10-24 Cambridge Display Tech Ltd Electric devices and methods of manufacture
US20080181958A1 (en) * 2006-06-19 2008-07-31 Rothrock Ginger D Nanoparticle fabrication methods, systems, and materials
KR100768705B1 (ko) * 2006-06-21 2007-10-19 삼성전기주식회사 임프린팅용 고분자 스탬프의 제조방법 및 그에 의한 고분자스탬프
EP2082286B1 (de) * 2006-11-15 2013-12-25 3M Innovative Properties Company Prägung von flexodruckplatten mithilfe von lösungsmitteln
WO2008060864A1 (en) 2006-11-15 2008-05-22 3M Innovative Properties Company Flexographic printing with curing during transfer to substrate
US7972875B2 (en) 2007-01-17 2011-07-05 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly
US8083953B2 (en) 2007-03-06 2011-12-27 Micron Technology, Inc. Registered structure formation via the application of directed thermal energy to diblock copolymer films
US8557128B2 (en) 2007-03-22 2013-10-15 Micron Technology, Inc. Sub-10 nm line features via rapid graphoepitaxial self-assembly of amphiphilic monolayers
US7959975B2 (en) 2007-04-18 2011-06-14 Micron Technology, Inc. Methods of patterning a substrate
US8294139B2 (en) 2007-06-21 2012-10-23 Micron Technology, Inc. Multilayer antireflection coatings, structures and devices including the same and methods of making the same
US8097175B2 (en) 2008-10-28 2012-01-17 Micron Technology, Inc. Method for selectively permeating a self-assembled block copolymer, method for forming metal oxide structures, method for forming a metal oxide pattern, and method for patterning a semiconductor structure
US8372295B2 (en) 2007-04-20 2013-02-12 Micron Technology, Inc. Extensions of self-assembled structures to increased dimensions via a “bootstrap” self-templating method
JP2008282968A (ja) * 2007-05-10 2008-11-20 Brother Ind Ltd スタンプ装置
DE102007024653A1 (de) 2007-05-26 2008-12-04 Forschungszentrum Karlsruhe Gmbh Stempel für das Mikrokontaktdrucken und Verfahren zu seiner Herstellung
US8404124B2 (en) 2007-06-12 2013-03-26 Micron Technology, Inc. Alternating self-assembling morphologies of diblock copolymers controlled by variations in surfaces
US8080615B2 (en) 2007-06-19 2011-12-20 Micron Technology, Inc. Crosslinkable graft polymer non-preferentially wetted by polystyrene and polyethylene oxide
US7781555B2 (en) * 2007-09-03 2010-08-24 Shin-Etsu Chemical Co., Ltd. Microcontact printing stamp
FR2921002B1 (fr) * 2007-09-13 2010-11-12 Innopsys Procede de depot simultane d'un ensemble de motifs sur un substrat par un macro timbre
FR2922813B1 (fr) * 2007-10-31 2010-04-09 Lyon Ecole Centrale Dispositif et procedes de microtamponnage et tampon pour ce dispositif
US8999492B2 (en) 2008-02-05 2015-04-07 Micron Technology, Inc. Method to produce nanometer-sized features with directed assembly of block copolymers
US8101261B2 (en) 2008-02-13 2012-01-24 Micron Technology, Inc. One-dimensional arrays of block copolymer cylinders and applications thereof
US8425982B2 (en) 2008-03-21 2013-04-23 Micron Technology, Inc. Methods of improving long range order in self-assembly of block copolymer films with ionic liquids
US8426313B2 (en) 2008-03-21 2013-04-23 Micron Technology, Inc. Thermal anneal of block copolymer films with top interface constrained to wet both blocks with equal preference
US8114301B2 (en) 2008-05-02 2012-02-14 Micron Technology, Inc. Graphoepitaxial self-assembly of arrays of downward facing half-cylinders
US8900963B2 (en) 2011-11-02 2014-12-02 Micron Technology, Inc. Methods of forming semiconductor device structures, and related structures
US9087699B2 (en) 2012-10-05 2015-07-21 Micron Technology, Inc. Methods of forming an array of openings in a substrate, and related methods of forming a semiconductor device structure
KR102162896B1 (ko) * 2012-10-05 2020-10-08 코닝 인코포레이티드 유리/금속 적층 구조체 및 적층 구조체의 제조 방법
US10195884B2 (en) 2012-12-31 2019-02-05 3M Innovative Properties Company Microcontact printing with high relief stamps in a roll-to-roll process
CN103116251A (zh) * 2013-01-18 2013-05-22 清华大学深圳研究生院 抗变形排孔显影喷嘴及其制备方法
US9229328B2 (en) 2013-05-02 2016-01-05 Micron Technology, Inc. Methods of forming semiconductor device structures, and related semiconductor device structures
US9177795B2 (en) 2013-09-27 2015-11-03 Micron Technology, Inc. Methods of forming nanostructures including metal oxides
KR101602843B1 (ko) 2014-02-18 2016-03-11 한국화학연구원 유연소재 히터를 포함하는 그래핀 가스센서
CN109313386B (zh) * 2016-04-06 2022-06-28 皇家飞利浦有限公司 压印光刻印模的制作和使用方法
US11338477B2 (en) * 2016-07-27 2022-05-24 Koninklijke Philips N.V. Polyorganosiloxane-based stamp manufacturing method, polyorganosiloxane-based stamp, use of the same for a printing process, and an imprinting method using the same
US20220332570A1 (en) * 2019-09-10 2022-10-20 King Abdullah University Of Science And Technology Methods for producing nanoscale patterns, nano-fluidic devices, and nanogap electrochemical devices

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Also Published As

Publication number Publication date
US20060137554A1 (en) 2006-06-29
CN1772501A (zh) 2006-05-17
EP1657070A1 (de) 2006-05-17
CN100473537C (zh) 2009-04-01
EP1657070B1 (de) 2008-04-23
JP2006140493A (ja) 2006-06-01
DE602004013338T2 (de) 2009-06-10
US8079305B2 (en) 2011-12-20
KR101091456B1 (ko) 2011-12-07
KR20060052545A (ko) 2006-05-19
JP5079229B2 (ja) 2012-11-21

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Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: KRON, GREGOR, 70327 STUTTGART, DE

Inventor name: YASUDA, AKIO, 70327 STUTTGART, DE

Inventor name: WESSELS, JURINA, 70327 STUTTGART, DE

8364 No opposition during term of opposition