ATE523529T1 - Härtbare zusammensetzung und fluorhaltiges gehärtetes produkt - Google Patents

Härtbare zusammensetzung und fluorhaltiges gehärtetes produkt

Info

Publication number
ATE523529T1
ATE523529T1 AT07745047T AT07745047T ATE523529T1 AT E523529 T1 ATE523529 T1 AT E523529T1 AT 07745047 T AT07745047 T AT 07745047T AT 07745047 T AT07745047 T AT 07745047T AT E523529 T1 ATE523529 T1 AT E523529T1
Authority
AT
Austria
Prior art keywords
carbon
double bond
carbon atoms
carbon double
cured product
Prior art date
Application number
AT07745047T
Other languages
English (en)
Inventor
Norihide Sugiyama
Masahiro Ookura
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Application granted granted Critical
Publication of ATE523529T1 publication Critical patent/ATE523529T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F259/00—Macromolecular compounds obtained by polymerising monomers on to polymers of halogen containing monomers as defined in group C08F14/00
    • C08F259/08—Macromolecular compounds obtained by polymerising monomers on to polymers of halogen containing monomers as defined in group C08F14/00 on to polymers containing fluorine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F14/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F14/18—Monomers containing fluorine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18—Monomers containing fluorine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/02—Halogenated hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
    • C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
    • C08F230/085—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon the monomer being a polymerisable silane, e.g. (meth)acryloyloxy trialkoxy silanes or vinyl trialkoxysilanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544—Addition polymer is perhalogenated
AT07745047T 2006-06-12 2007-06-11 Härtbare zusammensetzung und fluorhaltiges gehärtetes produkt ATE523529T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006162172 2006-06-12
PCT/JP2007/061758 WO2007145181A1 (ja) 2006-06-12 2007-06-11 硬化性組成物および含フッ素硬化物

Publications (1)

Publication Number Publication Date
ATE523529T1 true ATE523529T1 (de) 2011-09-15

Family

ID=38831695

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07745047T ATE523529T1 (de) 2006-06-12 2007-06-11 Härtbare zusammensetzung und fluorhaltiges gehärtetes produkt

Country Status (9)

Country Link
US (1) US7847028B2 (de)
EP (1) EP2028200B1 (de)
JP (1) JP5157902B2 (de)
KR (1) KR101351212B1 (de)
CN (1) CN101466744B (de)
AT (1) ATE523529T1 (de)
CA (1) CA2655180A1 (de)
TW (1) TW200808844A (de)
WO (1) WO2007145181A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008075545A1 (ja) * 2006-12-20 2008-06-26 Asahi Glass Company, Limited 含フッ素化合物および含フッ素重合体
JP5327057B2 (ja) * 2008-01-28 2013-10-30 旭硝子株式会社 硬化性組成物、含フッ素硬化物
KR20110008040A (ko) * 2008-04-28 2011-01-25 아사히 가라스 가부시키가이샤 함불소 중합체의 제조 방법 및 함불소 이온 교환막
WO2010074038A1 (ja) * 2008-12-24 2010-07-01 旭硝子株式会社 発光素子モジュールおよびその製造方法
CN102300886B (zh) * 2009-01-16 2014-07-02 旭硝子株式会社 含氟弹性共聚物及其制造方法、交联橡胶制品
JP2010195937A (ja) * 2009-02-25 2010-09-09 Asahi Glass Co Ltd 含フッ素有機過酸化物、重合開始剤および含フッ素重合体の製造方法
CN102741343A (zh) * 2010-02-05 2012-10-17 旭硝子株式会社 含氟固化性树脂组合物
EP2889315A4 (de) * 2012-08-21 2016-04-06 Asahi Glass Co Ltd Härtbares fluorhaltige polymer, herstellungsverfahren dafür und fluorhaltiges gehärtetes polymerprodukt
WO2015037608A1 (ja) * 2013-09-12 2015-03-19 創光科学株式会社 紫外線発光装置
US10035915B2 (en) * 2013-10-16 2018-07-31 Ofs Fitel, Llc Low refractive index coating for optical fibers, methods of manufacture thereof and articles comprising the same
JP6382676B2 (ja) * 2013-10-16 2018-08-29 オーエフエス ファイテル，エルエルシー 光ファイバ用の改善された低屈折率コーティング、その製造方法、及び同コーティングを含む物品
EP3088447B1 (de) * 2013-12-26 2020-12-16 AGC Inc. Verfahren zur herstellung eines fluorhaltigen vernetzten produktes und seine verwendung
KR102342911B1 (ko) * 2014-07-15 2021-12-23 에이지씨 가부시키가이샤 자외선 발광 장치용 접착제 및 자외선 발광 장치
JP6493666B2 (ja) * 2014-11-27 2019-04-03 Jnc株式会社 ポリ（ジフルオロメチレン）鎖を有する化合物、液晶組成物および液晶表示素子
JP2016111085A (ja) * 2014-12-03 2016-06-20 株式会社トクヤマ 紫外発光素子パッケージ
WO2016125795A1 (ja) * 2015-02-05 2016-08-11 旭硝子株式会社 感光性樹脂組成物、樹脂膜の製造方法、有機半導体素子の製造方法および含フッ素重合体
JP6622032B2 (ja) * 2015-08-27 2019-12-18 日機装株式会社 発光装置
CN108144067B (zh) * 2017-12-27 2020-11-24 安徽大学 四价铂化合物-双环双键两亲性聚合物前药、其纳米胶束及制备方法和应用
EP3732235A1 (de) * 2017-12-28 2020-11-04 3M Innovative Properties Company Fluorpolymerzusammensetzungen mit nanopartikeln, die mit funktionalen fluorierten silanverbindungen funktionalisiert sind
EP3732234A1 (de) * 2017-12-28 2020-11-04 3M Innovative Properties Company Fluorpolymerzusammensetzungen mit fluorierten funktionellen silanverbindungen
WO2019133414A1 (en) * 2017-12-28 2019-07-04 3M Innovative Properties Company Functional fluorinated silane compounds
WO2020162104A1 (ja) * 2019-02-04 2020-08-13 セントラル硝子株式会社 有機発光素子封止用組成物、および該組成物を用いた有機発光素子封止膜、並びにその形成方法
KR20220115091A (ko) * 2019-12-13 2022-08-17 쓰리엠 이노베이티브 프로퍼티즈 컴파니 작용성 플루오르화 실란 화합물로 작용화된 유리 미소구체를 포함하는 플루오로중합체 조성물
WO2021193717A1 (ja) * 2020-03-26 2021-09-30 東ソ－株式会社 フッ素樹脂およびその製造方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US289087A (en) * 1883-11-27 Self and james
US295095A (en) * 1884-03-11 biled
JP2748432B2 (ja) 1988-09-20 1998-05-06 旭硝子株式会社 光学素子用接着剤
JP2752393B2 (ja) 1988-11-10 1998-05-18 旭硝子株式会社 コーティング用含フッ素重合体組成物
JP3075588B2 (ja) 1991-05-22 2000-08-14 旭硝子株式会社 含フッ素化合物及びその製造法
JPH05230151A (ja) * 1991-08-06 1993-09-07 Asahi Glass Co Ltd 含フッ素ポリマーおよび硬化物
JP3043172B2 (ja) 1992-01-31 2000-05-22 旭硝子株式会社 含フッ素化合物及びその製造方法
JP3204738B2 (ja) 1992-06-05 2001-09-04 旭硝子株式会社 含フッ素化合物及びその製造方法
JPH06248026A (ja) * 1993-02-24 1994-09-06 Asahi Glass Co Ltd 硬化性含フッ素共重合体組成物
IT1265461B1 (it) * 1993-12-29 1996-11-22 Ausimont Spa Fluoroelastomeri comprendenti unita' monomeriche derivanti da una bis-olefina
JP2000001511A (ja) * 1998-04-17 2000-01-07 Asahi Glass Co Ltd 含フッ素重合体の製造方法
JP2001302725A (ja) * 2000-04-26 2001-10-31 Asahi Glass Co Ltd 含フッ素ジエン、その製造方法およびその重合体
EP1347001B1 (de) 2000-08-29 2006-04-19 Daikin Industries, Ltd. Härtbares fluoropolymer, härtbare harzzusammensetzungen diese enthaltend und antireflexionsfilm
JP2003008073A (ja) 2001-06-26 2003-01-10 Matsushita Electric Works Ltd 発光素子
AU2003284574A1 (en) 2003-03-28 2004-10-25 Asahi Glass Company, Limited Fluoro compound and fluoropolymer
WO2005037818A1 (ja) * 2003-10-16 2005-04-28 Asahi Glass Company, Limited 新規な含フッ素ジオキソラン化合物、および新規な含フッ素重合体
RU2006118782A (ru) * 2003-10-31 2007-12-10 Асахи Гласс Компани, Лимитед (Jp) Новые фторированное соединения и фторполимер
EP1724291A4 (de) * 2004-03-08 2008-06-18 Asahi Glass Co Ltd Härtbare zusammensetzung und verfahren zur herstellung einer gehärteten fluorchemikalie
ES1058478Y (es) * 2004-09-14 2005-04-01 Hoyo Alcazar Jose Antonio Del Hoyo de golf adaptado a la pelota de golf.
JP2006104286A (ja) * 2004-10-04 2006-04-20 Asahi Glass Co Ltd 含フッ素重合体の製造方法
JP2006162172A (ja) 2004-12-08 2006-06-22 Toshiba Corp 復水回収装置

Also Published As

Publication number Publication date
US20090118429A1 (en) 2009-05-07
EP2028200B1 (de) 2011-09-07
CN101466744B (zh) 2011-01-05
TW200808844A (en) 2008-02-16
JPWO2007145181A1 (ja) 2009-10-29
EP2028200A1 (de) 2009-02-25
US7847028B2 (en) 2010-12-07
KR101351212B1 (ko) 2014-01-14
WO2007145181A1 (ja) 2007-12-21
CN101466744A (zh) 2009-06-24
KR20090018812A (ko) 2009-02-23
JP5157902B2 (ja) 2013-03-06
CA2655180A1 (en) 2007-12-21
EP2028200A4 (de) 2009-06-24

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