ATE463538T1 - Leitfähige zusammensetzung, leitfähige farbe und verfahren zur formung leitfähiger farbe - Google Patents
Leitfähige zusammensetzung, leitfähige farbe und verfahren zur formung leitfähiger farbeInfo
- Publication number
- ATE463538T1 ATE463538T1 AT08157328T AT08157328T ATE463538T1 AT E463538 T1 ATE463538 T1 AT E463538T1 AT 08157328 T AT08157328 T AT 08157328T AT 08157328 T AT08157328 T AT 08157328T AT E463538 T1 ATE463538 T1 AT E463538T1
- Authority
- AT
- Austria
- Prior art keywords
- resin
- conductive
- binder
- silver
- compound
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 3
- 239000003973 paint Substances 0.000 title abstract 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract 3
- 239000011230 binding agent Substances 0.000 abstract 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 abstract 3
- 229940100890 silver compound Drugs 0.000 abstract 3
- 150000003379 silver compounds Chemical class 0.000 abstract 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract 2
- 239000003638 chemical reducing agent Substances 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 2
- -1 phenol compound Chemical class 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 abstract 2
- ZXSQEZNORDWBGZ-UHFFFAOYSA-N 1,3-dihydropyrrolo[2,3-b]pyridin-2-one Chemical compound C1=CN=C2NC(=O)CC2=C1 ZXSQEZNORDWBGZ-UHFFFAOYSA-N 0.000 abstract 1
- JTXMVXSTHSMVQF-UHFFFAOYSA-N 2-acetyloxyethyl acetate Chemical compound CC(=O)OCCOC(C)=O JTXMVXSTHSMVQF-UHFFFAOYSA-N 0.000 abstract 1
- 229920000180 alkyd Polymers 0.000 abstract 1
- 239000005011 phenolic resin Substances 0.000 abstract 1
- 229920001225 polyester resin Polymers 0.000 abstract 1
- 239000004645 polyester resin Substances 0.000 abstract 1
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract 1
- 239000005020 polyethylene terephthalate Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- LKZMBDSASOBTPN-UHFFFAOYSA-L silver carbonate Substances [Ag].[O-]C([O-])=O LKZMBDSASOBTPN-UHFFFAOYSA-L 0.000 abstract 1
- 229910001958 silver carbonate Inorganic materials 0.000 abstract 1
- 229910001923 silver oxide Inorganic materials 0.000 abstract 1
- 229920005992 thermoplastic resin Polymers 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2286—Oxides; Hydroxides of metals of silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Physics & Mathematics (AREA)
- Wood Science & Technology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Conductive Materials (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002108178 | 2002-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE463538T1 true ATE463538T1 (de) | 2010-04-15 |
Family
ID=28786504
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT03720898T ATE416236T1 (de) | 2002-04-10 | 2003-04-09 | Leitfähige zusammensetzung; leitfähige folie und verfahren zur hestellung der folie |
| AT08157328T ATE463538T1 (de) | 2002-04-10 | 2003-04-09 | Leitfähige zusammensetzung, leitfähige farbe und verfahren zur formung leitfähiger farbe |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT03720898T ATE416236T1 (de) | 2002-04-10 | 2003-04-09 | Leitfähige zusammensetzung; leitfähige folie und verfahren zur hestellung der folie |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7771627B2 (de) |
| EP (2) | EP1493780B1 (de) |
| JP (1) | JP3949658B2 (de) |
| KR (1) | KR100664718B1 (de) |
| CN (1) | CN100396730C (de) |
| AT (2) | ATE416236T1 (de) |
| DE (2) | DE60325033D1 (de) |
| TW (1) | TWI251018B (de) |
| WO (1) | WO2003085052A1 (de) |
Families Citing this family (57)
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| JP2005015289A (ja) * | 2003-06-27 | 2005-01-20 | Mitsui Mining & Smelting Co Ltd | 微粒酸化銀粉懸濁液及びその微粒酸化銀粉懸濁液の製造方法 |
| US8383014B2 (en) | 2010-06-15 | 2013-02-26 | Cabot Corporation | Metal nanoparticle compositions |
| US8167393B2 (en) | 2005-01-14 | 2012-05-01 | Cabot Corporation | Printable electronic features on non-uniform substrate and processes for making same |
| US7533361B2 (en) | 2005-01-14 | 2009-05-12 | Cabot Corporation | System and process for manufacturing custom electronics by combining traditional electronics with printable electronics |
| US7824466B2 (en) | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
| WO2006076606A2 (en) | 2005-01-14 | 2006-07-20 | Cabot Corporation | Optimized multi-layer printing of electronics and displays |
| TW200640596A (en) | 2005-01-14 | 2006-12-01 | Cabot Corp | Production of metal nanoparticles |
| DE102006017696A1 (de) | 2006-04-15 | 2007-10-18 | Bayer Technology Services Gmbh | Verfahren zur Herstellung von Metallpartikeln, hieraus hergestellte Metallpartikel und deren Verwendung |
| WO2007131389A1 (fr) * | 2006-05-17 | 2007-11-22 | Hsiu-Yuen Chen | Matériau de base pour écrire |
| KR101394704B1 (ko) | 2006-06-30 | 2014-05-16 | 미쓰비시 마테리알 가부시키가이샤 | 태양 전지의 전극 형성용 조성물 및 그 전극의 형성 방법, 그리고 그 형성 방법에 의해 얻어진 전극을 사용한 태양 전지 |
| JP5309521B2 (ja) * | 2006-10-11 | 2013-10-09 | 三菱マテリアル株式会社 | 電極形成用組成物及びその製造方法並びに該組成物を用いた電極の形成方法 |
| DE102007037079A1 (de) | 2006-10-25 | 2008-04-30 | Bayer Materialscience Ag | Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen |
| JP4895994B2 (ja) | 2006-12-28 | 2012-03-14 | 株式会社日立製作所 | 金属粒子を用いた接合方法及び接合材料 |
| JP5169389B2 (ja) | 2007-04-19 | 2013-03-27 | 三菱マテリアル株式会社 | 導電性反射膜の製造方法 |
| US8968608B2 (en) | 2008-01-17 | 2015-03-03 | Nichia Corporation | Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device |
| DE102008014690A1 (de) * | 2008-03-18 | 2009-09-24 | Conti Temic Microelectronic Gmbh | Verfahren zur Herstellung von Schaltungsträgern |
| JP5053925B2 (ja) * | 2008-05-07 | 2012-10-24 | Dowaハイテック株式会社 | 酸化銀粉末 |
| WO2010023920A1 (ja) * | 2008-08-27 | 2010-03-04 | 三菱マテリアル株式会社 | 太陽電池用透明導電膜及びその透明導電膜用組成物、多接合型太陽電池 |
| JP5544774B2 (ja) * | 2008-08-27 | 2014-07-09 | 三菱マテリアル株式会社 | 多接合型太陽電池 |
| JP5778382B2 (ja) * | 2008-10-22 | 2015-09-16 | 東ソー株式会社 | 金属膜製造用組成物、金属膜の製造方法及び金属粉末の製造方法 |
| JP5611537B2 (ja) * | 2009-04-28 | 2014-10-22 | 日立化成株式会社 | 導電性接合材料、それを用いた接合方法、並びにそれによって接合された半導体装置 |
| EP2407980B1 (de) * | 2009-07-21 | 2019-01-23 | Nichia Corporation | Verfahren zur herstellung eines leitfähigen materials, in diesem verfahren gewonnenes leitfähiges material, elektronikgerät mit dem leitfähigen material und lichtemittierende vorrichtung damit |
| CN102484150A (zh) * | 2009-08-27 | 2012-05-30 | 独立行政法人产业技术综合研究所 | 多接合光电转换装置、集成型多接合光电转换装置及其制造方法 |
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| WO2011100532A1 (en) | 2010-02-12 | 2011-08-18 | Abs Materials, Inc. | Sol-gel derived sorbent material containing a sorbate interactive material and method for using the same |
| WO2011162836A1 (en) | 2010-02-17 | 2011-12-29 | Abs Materials, Inc | Method for extracting a metal particulate from an aqueous solution using a sol-gel derived sorbent |
| DK2369597T3 (da) | 2010-03-12 | 2014-10-06 | Clariant Internat Ag | Fremstilling af ledende overfladecoatinger med dispersion med elektrostatisk stabiliserede sølvnanopartikler |
| CN101800090B (zh) * | 2010-03-16 | 2011-08-17 | 彩虹集团公司 | 一种环保型导电浆料及其制备方法 |
| WO2011156663A1 (en) | 2010-06-10 | 2011-12-15 | Abs Materials,Inc | Method of treating a material using a sol-gel derived composition |
| EP2431438B1 (de) * | 2010-09-20 | 2012-11-28 | Henkel AG & Co. KGaA | Elektrisch leitfähiger Klebstoff |
| CN102020762B (zh) * | 2010-10-20 | 2012-07-25 | 东华大学 | 一种新型含银pet基复合材料及其原位组装制备方法和应用 |
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| KR101276671B1 (ko) * | 2011-09-06 | 2013-06-19 | 주식회사 케이씨씨 | 수분산 비히클을 포함하는 태양전지 전면전극용 페이스트 조성물 |
| DE102011118720A1 (de) * | 2011-11-16 | 2013-05-16 | Admedes Schuessler Gmbh | Ethanollöslicher, elektrisch leitender Kleber |
| CN104093796B (zh) * | 2012-04-16 | 2016-06-29 | 株式会社大阪曹达 | 导电性墨组合物 |
| TWI594268B (zh) * | 2012-04-17 | 2017-08-01 | 賀利氏貴金屬北美康舍霍肯有限責任公司 | 用於導電膏組成物之無機反應系統 |
| JP6356389B2 (ja) | 2012-04-17 | 2018-07-11 | ヘレウス プレシャス メタルズ ノース アメリカ コンショホーケン エルエルシー | 太陽電池接点用導電性厚膜ペースト |
| JP5572669B2 (ja) * | 2012-06-08 | 2014-08-13 | Dowaハイテック株式会社 | 酸化銀粉末の製造方法 |
| US20140170427A1 (en) * | 2012-12-13 | 2014-06-19 | Carestream Health, Inc. | Anticorrosion agents for transparent conductive film |
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| US20140186596A1 (en) * | 2012-12-28 | 2014-07-03 | Dip-Tech Ltd. | Ink |
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| KR102345811B1 (ko) * | 2014-10-24 | 2022-01-03 | 나믹스 가부시끼가이샤 | 도전성 조성물 및 그것을 사용한 전자 부품 |
| US20180340083A1 (en) | 2015-10-30 | 2018-11-29 | Clariant International Ltd. | Metal dispersion with increased stability |
| KR102524435B1 (ko) * | 2015-12-23 | 2023-04-24 | 헨켈 아게 운트 코. 카게아아 | 전도성 조성물을 위한 결합제로서의 중합체 에멀젼 |
| EP4029627A4 (de) * | 2019-12-19 | 2023-11-08 | Mitsubishi Materials Corporation | Silberpaste, verfahren zu ihrer herstellung und verfahren zur herstellung eines gelenkigen artikels |
| CN111511099B (zh) * | 2020-03-25 | 2021-06-08 | 上海玖银电子科技有限公司 | 一种大键盘导电薄膜线路用快干银浆及其制备方法 |
| WO2022034755A1 (ja) * | 2020-08-13 | 2022-02-17 | 花王株式会社 | 金属ペースト |
| CN117198591B (zh) * | 2023-09-14 | 2025-09-23 | 苏州市贝特利高分子材料股份有限公司 | 高抗氧化性异质结银包铜浆料 |
| CN117352207A (zh) * | 2023-10-10 | 2024-01-05 | 苏州市贝特利高分子材料股份有限公司 | 低银含异质结银包铜浆料及其制备方法 |
| CN121075726A (zh) * | 2025-11-07 | 2025-12-05 | 深圳芯源新材料有限公司 | 一种增强温度循环抗性的低温固化浆料及其制备方法 |
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| JPH11172108A (ja) * | 1997-12-12 | 1999-06-29 | Shin Etsu Chem Co Ltd | 導電性フッ素樹脂組成物 |
| FR2773423B1 (fr) * | 1998-01-06 | 2001-10-19 | Alsthom Cge Alkatel | Procede et systeme de linearisation numerique d'un amplificateur |
| US6236837B1 (en) * | 1998-07-30 | 2001-05-22 | Motorola, Inc. | Polynomial Predistortion linearizing device, method, phone and base station |
| US20030148024A1 (en) * | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
| KR100369565B1 (ko) * | 1999-12-17 | 2003-01-29 | 대주정밀화학 주식회사 | 전기발열체용 저항 페이스트 조성물 |
| JP4739495B2 (ja) | 2000-10-10 | 2011-08-03 | ナミックス株式会社 | 金属ペースト |
| US6951666B2 (en) * | 2001-10-05 | 2005-10-04 | Cabot Corporation | Precursor compositions for the deposition of electrically conductive features |
| US7211205B2 (en) * | 2003-01-29 | 2007-05-01 | Parelec, Inc. | High conductivity inks with improved adhesion |
| US7141185B2 (en) * | 2003-01-29 | 2006-11-28 | Parelec, Inc. | High conductivity inks with low minimum curing temperatures |
-
2003
- 2003-04-07 TW TW092107916A patent/TWI251018B/zh not_active IP Right Cessation
- 2003-04-09 EP EP03720898A patent/EP1493780B1/de not_active Expired - Lifetime
- 2003-04-09 DE DE60325033T patent/DE60325033D1/de not_active Expired - Lifetime
- 2003-04-09 US US10/510,512 patent/US7771627B2/en not_active Expired - Lifetime
- 2003-04-09 WO PCT/JP2003/004514 patent/WO2003085052A1/ja not_active Ceased
- 2003-04-09 DE DE60332065T patent/DE60332065D1/de not_active Expired - Lifetime
- 2003-04-09 AT AT03720898T patent/ATE416236T1/de not_active IP Right Cessation
- 2003-04-09 KR KR1020047015902A patent/KR100664718B1/ko not_active Expired - Fee Related
- 2003-04-09 JP JP2003582235A patent/JP3949658B2/ja not_active Expired - Lifetime
- 2003-04-09 CN CNB038077884A patent/CN100396730C/zh not_active Expired - Lifetime
- 2003-04-09 EP EP08157328A patent/EP1972660B1/de not_active Expired - Lifetime
- 2003-04-09 AT AT08157328T patent/ATE463538T1/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1493780A4 (de) | 2006-02-01 |
| KR20040107491A (ko) | 2004-12-20 |
| CN100396730C (zh) | 2008-06-25 |
| EP1493780A1 (de) | 2005-01-05 |
| US20050116203A1 (en) | 2005-06-02 |
| ATE416236T1 (de) | 2008-12-15 |
| CN1646633A (zh) | 2005-07-27 |
| DE60325033D1 (de) | 2009-01-15 |
| TWI251018B (en) | 2006-03-11 |
| DE60332065D1 (de) | 2010-05-20 |
| EP1493780B1 (de) | 2008-12-03 |
| US7771627B2 (en) | 2010-08-10 |
| TW200305619A (en) | 2003-11-01 |
| JP3949658B2 (ja) | 2007-07-25 |
| KR100664718B1 (ko) | 2007-01-03 |
| EP1972660B1 (de) | 2010-04-07 |
| JPWO2003085052A1 (ja) | 2005-08-11 |
| EP1972660A1 (de) | 2008-09-24 |
| WO2003085052A1 (en) | 2003-10-16 |
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| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |