ATE433134T1 - Imprint-lithographieverfahren, gerät hierfür, sowie verfahren zur herstellung eines halbleiterchips - Google Patents

Imprint-lithographieverfahren, gerät hierfür, sowie verfahren zur herstellung eines halbleiterchips

Info

Publication number
ATE433134T1
ATE433134T1 AT06122371T AT06122371T ATE433134T1 AT E433134 T1 ATE433134 T1 AT E433134T1 AT 06122371 T AT06122371 T AT 06122371T AT 06122371 T AT06122371 T AT 06122371T AT E433134 T1 ATE433134 T1 AT E433134T1
Authority
AT
Austria
Prior art keywords
producing
semiconductor chip
imprint lithography
device therefor
imprint
Prior art date
Application number
AT06122371T
Other languages
English (en)
Inventor
Junichi Seki
Nobuhito Suehira
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of ATE433134T1 publication Critical patent/ATE433134T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K3/00—Apparatus for stamping articles having integral means for supporting the articles to be stamped
    • B41K3/02—Apparatus for stamping articles having integral means for supporting the articles to be stamped with stamping surface located above article-supporting surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Micromachines (AREA)
AT06122371T 2005-10-18 2006-10-16 Imprint-lithographieverfahren, gerät hierfür, sowie verfahren zur herstellung eines halbleiterchips ATE433134T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005302747 2005-10-18
JP2006244326A JP4533358B2 (ja) 2005-10-18 2006-09-08 インプリント方法、インプリント装置およびチップの製造方法

Publications (1)

Publication Number Publication Date
ATE433134T1 true ATE433134T1 (de) 2009-06-15

Family

ID=37834137

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06122371T ATE433134T1 (de) 2005-10-18 2006-10-16 Imprint-lithographieverfahren, gerät hierfür, sowie verfahren zur herstellung eines halbleiterchips

Country Status (8)

Country Link
US (2) US7828984B2 (de)
EP (2) EP1795959B1 (de)
JP (1) JP4533358B2 (de)
KR (1) KR100771747B1 (de)
CN (1) CN1952777B (de)
AT (1) ATE433134T1 (de)
DE (1) DE602006007089D1 (de)
ES (1) ES2323979T3 (de)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008078617A (ja) * 2006-08-25 2008-04-03 Canon Inc 構造体の製造方法
EP2118706B1 (de) 2007-02-06 2019-09-18 Canon Kabushiki Kaisha Prägevorrichtung und verfahren
JP5188192B2 (ja) * 2007-02-20 2013-04-24 キヤノン株式会社 モールド、モールドの製造方法、インプリント装置及びインプリント方法、インプリント方法を用いた構造体の製造方法
JP4810496B2 (ja) * 2007-04-25 2011-11-09 株式会社東芝 パターン形成装置、パターン形成方法及びテンプレート
JP5144127B2 (ja) * 2007-05-23 2013-02-13 キヤノン株式会社 ナノインプリント用のモールドの製造方法
KR100867951B1 (ko) * 2007-07-16 2008-11-11 삼성전기주식회사 임프린팅 방법
KR100914061B1 (ko) * 2007-09-12 2009-08-28 주식회사 디씨엔 소프트 스탬핑 장치
US8945444B2 (en) * 2007-12-04 2015-02-03 Canon Nanotechnologies, Inc. High throughput imprint based on contact line motion tracking control
US8457175B2 (en) * 2008-01-29 2013-06-04 Sony Corporation Systems and methods for securing a digital communications link
JP5326468B2 (ja) * 2008-02-15 2013-10-30 凸版印刷株式会社 インプリント法
JP5150309B2 (ja) * 2008-03-03 2013-02-20 東芝機械株式会社 転写装置および転写方法
JP5666082B2 (ja) * 2008-05-30 2015-02-12 東芝機械株式会社 転写装置およびプレス装置
US20100022036A1 (en) * 2008-07-25 2010-01-28 Ikuo Yoneda Method for forming pattern, and template
JP5279397B2 (ja) * 2008-08-06 2013-09-04 キヤノン株式会社 インプリント装置、インプリント方法、およびデバイス製造方法
KR101027468B1 (ko) * 2008-08-20 2011-04-06 엘아이지에이디피 주식회사 미세패턴 형성장치 및 이를 이용한 미세패턴 형성방법
JP5517423B2 (ja) * 2008-08-26 2014-06-11 キヤノン株式会社 インプリント装置及びインプリント方法
JP2010067796A (ja) * 2008-09-11 2010-03-25 Canon Inc インプリント装置
NL2003347A (en) 2008-09-11 2010-03-16 Asml Netherlands Bv Imprint lithography.
JP2010080631A (ja) * 2008-09-25 2010-04-08 Canon Inc 押印装置および物品の製造方法
US8652393B2 (en) 2008-10-24 2014-02-18 Molecular Imprints, Inc. Strain and kinetics control during separation phase of imprint process
US8309008B2 (en) * 2008-10-30 2012-11-13 Molecular Imprints, Inc. Separation in an imprint lithography process
US20110210480A1 (en) * 2008-11-18 2011-09-01 Rolith, Inc Nanostructures with anti-counterefeiting features and methods of fabricating the same
FR2939241B1 (fr) * 2008-11-28 2011-03-25 Commissariat Energie Atomique Procede de fabrication d'un substrat nanostructure pour oled et procede de fabrication d'une oled
JP5376930B2 (ja) * 2008-12-19 2013-12-25 キヤノン株式会社 液体吐出ヘッドの製造方法
JP5402069B2 (ja) * 2009-02-20 2014-01-29 凸版印刷株式会社 針状構造物の製造方法
JP5173944B2 (ja) 2009-06-16 2013-04-03 キヤノン株式会社 インプリント装置及び物品の製造方法
JP5284212B2 (ja) * 2009-07-29 2013-09-11 株式会社東芝 半導体装置の製造方法
CN102497966B (zh) * 2009-08-31 2014-11-05 柯尼卡美能达精密光学株式会社 晶片透镜的制造方法
NL2005265A (en) * 2009-10-07 2011-04-11 Asml Netherlands Bv Imprint lithography apparatus and method.
JP5385749B2 (ja) * 2009-10-08 2014-01-08 東芝機械株式会社 転写装置および転写方法
JP5364533B2 (ja) * 2009-10-28 2013-12-11 株式会社東芝 インプリントシステムおよびインプリント方法
JP2011146447A (ja) * 2010-01-12 2011-07-28 Canon Inc インプリント装置及び物品の製造方法
US20130224322A1 (en) * 2010-11-12 2013-08-29 Hitachi High-Technologies Corporation Method For Cleaning Fine Pattern Surface Of Mold, And Imprinting Device Using Same
JP5850717B2 (ja) * 2010-12-02 2016-02-03 キヤノン株式会社 インプリント装置、及びそれを用いた物品の製造方法
JP5637931B2 (ja) * 2011-05-17 2014-12-10 キヤノン株式会社 インプリント装置、インプリント方法およびデバイス製造方法
JP5864929B2 (ja) * 2011-07-15 2016-02-17 キヤノン株式会社 インプリント装置および物品の製造方法
JP6061524B2 (ja) * 2011-08-11 2017-01-18 キヤノン株式会社 インプリント装置および物品の製造方法
JP6333039B2 (ja) * 2013-05-16 2018-05-30 キヤノン株式会社 インプリント装置、デバイス製造方法およびインプリント方法
JP6315904B2 (ja) 2013-06-28 2018-04-25 キヤノン株式会社 インプリント方法、インプリント装置及びデバイスの製造方法
CN103596372B (zh) * 2013-11-29 2016-08-31 丁保美 Pcb板超声波灌孔方法
JP6363838B2 (ja) 2014-01-08 2018-07-25 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP6465577B2 (ja) 2014-07-11 2019-02-06 キヤノン株式会社 インプリント装置及び物品の製造方法
TWI512292B (zh) * 2014-09-04 2015-12-11 Taiwan Green Point Entpr Co 薄膜式生物晶片之製作方法
JP6470153B2 (ja) * 2015-09-11 2019-02-13 東芝メモリ株式会社 インプリント方法およびインプリント装置
JP6875879B2 (ja) 2017-02-22 2021-05-26 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
US10534259B2 (en) * 2017-03-28 2020-01-14 Canon Kabushiki Kaisha Method and system for imprint force control
US10211072B2 (en) * 2017-06-23 2019-02-19 Applied Materials, Inc. Method of reconstituted substrate formation for advanced packaging applications
US11036130B2 (en) * 2017-10-19 2021-06-15 Canon Kabushiki Kaisha Drop placement evaluation
CN109119404B (zh) * 2018-07-16 2021-04-02 华天慧创科技（西安）有限公司 对准方法、压印方法和晶圆堆叠方法
US11815811B2 (en) 2021-03-23 2023-11-14 Canon Kabushiki Kaisha Magnification ramp scheme to mitigate template slippage

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH084958B2 (ja) * 1986-07-23 1996-01-24 石川島播磨重工業株式会社 等方圧圧縮成形プレス
DE3724996C2 (de) 1987-07-28 1993-11-04 Siemens Ag Verfahren zur schnellen fuellung eines engen raumes mit einem fliessfaehigen harz
JP3166203B2 (ja) * 1991-06-05 2001-05-14 日本板硝子株式会社 基板上に微細凹凸パターンを形成する方法
JP3322351B2 (ja) * 1992-04-22 2002-09-09 大日本印刷株式会社 両面レリーフパターン複製方法及び装置
US5772905A (en) 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
JPH09201874A (ja) * 1996-01-30 1997-08-05 Sony Corp 表面に凹凸模様を備えた物品、特に光ディスクの成形方法及びその成形装置
US6334960B1 (en) 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
SE515962C2 (sv) 2000-03-15 2001-11-05 Obducat Ab Anordning för överföring av mönster till objekt
US6551720B2 (en) * 2000-05-02 2003-04-22 Sarnoff Corporation Materials to fabricate a high resolution plasma display back panel
EP2306242A3 (de) 2000-10-12 2011-11-02 Board of Regents, The University of Texas System Verfahren zur Erzeugung eines Motifs auf einem Substrat
KR20050035134A (ko) * 2001-10-11 2005-04-15 브레우어 사이언스 인코포레이션 비점착성 몰드를 이용한 패턴 구조의 재현
US7442336B2 (en) * 2003-08-21 2008-10-28 Molecular Imprints, Inc. Capillary imprinting technique
US6916584B2 (en) 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
US20060266734A1 (en) * 2003-01-15 2006-11-30 Mitsuru Fujii Device, method, and system for pattern forming
JP4090374B2 (ja) * 2003-03-20 2008-05-28 株式会社日立製作所 ナノプリント装置、及び微細構造転写方法
WO2004107403A2 (en) * 2003-05-23 2004-12-09 The Regents Of The University Of Michigan Imprinting polymer film on patterned substrate
US7150622B2 (en) * 2003-07-09 2006-12-19 Molecular Imprints, Inc. Systems for magnification and distortion correction for imprint lithography processes
JP4569744B2 (ja) * 2003-07-14 2010-10-27 コニカミノルタホールディングス株式会社 光学素子の成形方法
JP2005153091A (ja) * 2003-11-27 2005-06-16 Hitachi Ltd 転写方法及び転写装置
EP1538482B1 (de) 2003-12-05 2016-02-17 Obducat AB Gerät und Methode für grossflÀ¤chige Lithographie
KR100558754B1 (ko) * 2004-02-24 2006-03-10 한국기계연구원 Ｕｖ 나노임프린트 리소그래피 공정 및 이 공정을수행하는 장치
JP4564272B2 (ja) * 2004-03-23 2010-10-20 株式会社東芝 半導体装置およびその製造方法
US7229933B2 (en) 2004-03-31 2007-06-12 Intel Corporation Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor
JP4574240B2 (ja) * 2004-06-11 2010-11-04 キヤノン株式会社 加工装置、加工方法、デバイス製造方法
US7641468B2 (en) * 2004-09-01 2010-01-05 Hewlett-Packard Development Company, L.P. Imprint lithography apparatus and method employing an effective pressure
US7695667B2 (en) * 2006-03-01 2010-04-13 Hitachi Global Storage Technologies Netherlands B.V. Method and apparatus for separating a stamper from a patterned substrate
JP2008078617A (ja) 2006-08-25 2008-04-03 Canon Inc 構造体の製造方法
JP5188192B2 (ja) 2007-02-20 2013-04-24 キヤノン株式会社 モールド、モールドの製造方法、インプリント装置及びインプリント方法、インプリント方法を用いた構造体の製造方法
JP5144127B2 (ja) 2007-05-23 2013-02-13 キヤノン株式会社 ナノインプリント用のモールドの製造方法

Also Published As

Publication number Publication date
EP2073059B1 (de) 2017-01-04
ES2323979T3 (es) 2009-07-28
KR20070042478A (ko) 2007-04-23
US9507256B2 (en) 2016-11-29
EP1795959A1 (de) 2007-06-13
US20110042348A1 (en) 2011-02-24
JP2007137051A (ja) 2007-06-07
CN1952777B (zh) 2010-11-17
EP2073059A1 (de) 2009-06-24
CN1952777A (zh) 2007-04-25
KR100771747B1 (ko) 2007-10-30
EP1795959B1 (de) 2009-06-03
US20070145639A1 (en) 2007-06-28
DE602006007089D1 (de) 2009-07-16
JP4533358B2 (ja) 2010-09-01
US7828984B2 (en) 2010-11-09

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