TWI512292B - 薄膜式生物晶片之製作方法 - Google Patents
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- 239000010409 thin film Substances 0.000 title claims description 38
- 238000000034 method Methods 0.000 title claims description 26
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- 238000004132 cross linking Methods 0.000 description 4
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- 229920002050 silicone resin Polymers 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
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- 239000010453 quartz Substances 0.000 description 3
- 229910052707 ruthenium Inorganic materials 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 102000053602 DNA Human genes 0.000 description 2
- 108020004414 DNA Proteins 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
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- 239000007789 gas Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
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- 238000005086 pumping Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 1
- 102100041003 Glutamate carboxypeptidase 2 Human genes 0.000 description 1
- 241000282412 Homo Species 0.000 description 1
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- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
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- 102000004169 proteins and genes Human genes 0.000 description 1
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
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- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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Description
本發明是有關於一種生物晶片之製作方法,特別是指一種薄膜式生物晶片之製作方法。
如圖1所示,美國第US 2005/0106607 A1早期公開號發明專利案(以下稱前案1)公開一種具有反應槽(reaction well)之生物晶片的製法。
參閱圖1,並配合參閱圖2,前案1的步驟(a)是提供一高分子膜11,且高分子膜11是由聚二甲基矽氧烷(polydimethylsiloxane,PDMS)、聚苯乙烯(polystyrene,PS)或聚丙烯(polypropylene,PPR)所構成。步驟(b)是於高分子膜11上形成出多數開口110。步驟(c)是提供一基板12,且基板12是由石英(quartz)、玻璃(glass)、塑膠(plastic)、矽(Si)或高分子(polymer)所構成。步驟(d)是對基板12施予表面處理(surface treatment)。步驟(e)是於基板12上貼附高分子膜11以形成多數反應槽13。步驟(f)是於反應槽13內固定多數探針(probe)14,從而製得如圖2所示之具有反應槽之生物晶片1。
在前案1中,步驟(b)所提到之多數開口110,
是經由壓印成型(imprinted mold)或鑄塑成型(casting)等手段來完成;步驟(d)所提到之表面處理,是在基板12表面塗佈一如苯乙烯馬來酸酐共聚物(polystyrene-co-maleic-anhydride,PSMA)、金(Au)或鎳(Ni)之生化材料(biochemical material),用以增加後續探針(probe)14於基板12的附著性;步驟(f)所提到之固定多數探針14,是於反應槽13內固定如去氧核醣核酸(deoxyribonucleic acid,DNA)、蛋白質(protein),或細胞(cell)等。
此處須說明的是,於前案1所公開的製法中,其必須先自成型用的印模內取出經成型後的高分子膜11,才可將高分子膜11貼附於基板12表面上。然而,高分子膜11不僅離模不易。此外,此離模與步驟(e)之貼附等程序,目前實際製程上主要仍須透過人為來取出及貼附。因此,可撓性的高分子膜11也極易在離模過程中,遭受破損抑或是產生變形。經破損或產生變形的高分子膜11一方面無法精準地對位並貼附於基板12上,另一方面,也難以結合至自動化製程。然而,若為使高分子膜11易於拿取,則需增加高分子膜11的厚度。如此,不僅增加高分子膜11的用料量,更需耗費許多高分子膜11於成型時的硬化(curing)時間。再者,生物晶片1亦無法輕薄短小化。
經上述說明可知,簡化薄膜式生物晶片之製作方法,同時使生物晶片得以薄型化,更使其製法整合至自動化製程以提升元件產量,是此技術領域的相關技術人員
所待突破的難題。
因此,本發明之目的,即在提供一種薄膜式生物晶片之製作方法。
於是,本發明薄膜式生物晶片之製作方法包含:(A)提供相互閉合的一公模與一母模及一底板,此公模包括一容置該底板的設置槽,此母模包括多數個面向該底板的微模穴;(B)使一待成型材於各微模穴內成型出多數個外觀互補於各微模穴且結合至該底板的微凸塊;及(C)分離此公模與此母模,以取出結合有該等微凸塊的該底板,且由該等微凸塊共同定義出一薄膜式生物晶片的多數個微流道。
本發明之功效在於,於單一道的成型步驟即可使微凸塊直接結合至底板上,並在脫模步驟時完成薄膜式生物晶片,除製作程序簡化之外,亦不會有人為因素所引致之微凸塊損壞甚或是不易對位貼附等問題;因此,本發明之製作方法也可在節省用料量與製程時間的前提下有效地製成薄膜式生物晶片。
2‧‧‧模具組
21‧‧‧公模
211‧‧‧設置槽
212‧‧‧貫孔
213‧‧‧抽氣通道
22‧‧‧母模
221‧‧‧微模穴
222‧‧‧注入口
3‧‧‧薄膜式生物晶片
31‧‧‧底板
32‧‧‧待成型材
3201‧‧‧形變材
3202‧‧‧凝膠體
321‧‧‧微凸塊
322‧‧‧微流道
33‧‧‧封裝層
4‧‧‧加熱器
5‧‧‧頂桿
F‧‧‧外力
S1‧‧‧提供步驟
S2‧‧‧配置步驟
S3‧‧‧成型步驟
S4‧‧‧脫模步驟
S5‧‧‧封裝步驟
本發明之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中:圖1是一流程圖,說明美國第US 2005/0106607 A1早期公開號發明專利案所公開的一種具有反應槽之生物晶片
的製法;圖2是一立體圖,說明圖1之製法所完成之具有反應槽之生物晶片;圖3是一流程圖,說明本發明薄膜式生物晶片之製作方法的一第一實施例與一第二實施例;圖4是一元件製作流程圖,說明本發明第一實施例的前三個步驟;圖5是一元件製作流程圖,說明本發明第一實施例的最後兩個步驟;圖6是一立體圖,說明由本發明第一實施例之製作方法所製得的一薄膜式生物晶片;及圖7是一元件製作流程圖,說明本發明該第二實施例的前三個步驟。
在本發明被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。
參閱圖3,本發明薄膜式生物晶片(如圖5與圖6所示)3之製作方法的第一實施例,其包含以下步驟:一提供步驟S1、一配置步驟S2、一成型步驟S3、一脫模步驟S4,及一封裝步驟S5。
如圖4所示,提供步驟S1是提供一具有一公模21與一母模22的模具組2,及一底板31。公模21包括一容置底板31的設置槽211、一對連通設置槽211的貫孔212,及一對連通設置槽211的抽氣通道213。母模22包括
多數個面向底板31的微模穴221。在本實施例中,提供步驟S1並自各抽氣通道213抽離各抽氣通道213內的氣體,以迫使底板31被吸附且容置於公模21的設置槽211上。此外,適用於本實施例之底板31的材料,可以是由一選自下列所構成之群組的材料所製成:金屬(metal)材料、陶瓷材料(ceramics)、玻璃(glass)、石英(quartz),及高分子(polymer)材料。
需說明的是,微模穴221的尺寸與相對於底板31的位置,是依據不同薄膜式生物晶片3的功用而變異,並不以本實施例所揭露的為限。此外,由於設置槽211與微模穴221分別設計於公模21與母模22上,藉由公模21與母模22於閉合時的精準對位,大大提高成型後的品質。又,底板31與設置槽211的輪廓匹配,因此底板31可輕易地容置於設置槽211內,藉由底板31精準的置放,可大大提高成型後的品質。
再參閱圖4,配置步驟S2是於底板31上配置一待成型材32。待成型材32於配置步驟S2置入模具組2內部時,是呈一固態(solid)或一凝膠態(gel),且是在公模21與母模22閉合前(如圖4所示)被配置於底板31上。本實施例之待成型材32是由一矽氧聚合物(polysiloxane)所製成,較佳地,矽氧聚合物是一矽氧樹脂類(silicone resins),且矽氧樹脂類是一液態矽橡膠(liquid silicone resin,LSR)或一固態矽橡膠(solid silicone resin)。在本實施例中,待成型材32是自黏性固態矽橡膠,其可直接與底板31於成型
後形成緊密黏附,不需使用額外的表面處理。又,待成型材32主要選自於彈性體材料,並依據彈性體材料的化學特性或物理特性而變異,使其同樣能達到製作薄膜式生物晶片3的功效,並不以本實施例所揭露的自黏性固態矽橡膠為限。
成型步驟S3是分別自模具組2的公模21與母模22,朝模具組2的母模22與公模21彼此相向地提供一外力F,以使模具組2閉合。此外,又利用如圖4所示的一加熱器4,在一預定溫度下加熱經閉合後的模具組2,使待成型材32加速固化成一形變材3201,且內部的底板31與形變材3201於成型步驟S3時是承受一夾持應力(clamping stress),並使形變材3201因夾持應力而填置於母模22的各微模穴221內,從而使填置於各微模穴221內之形變材3201經冷卻後所成型的各微凸塊321是結合至底板31上。在本實施例中,成型步驟S3的預定溫度是介於100℃至150℃間。
又,預定溫度為一足以使形變材3201於各微模穴221內加速固化,且不足以使底板31產生變形的溫度,以使填置於各微模穴221內之形變材3201於冷卻後,硬化且成型出多數個外觀互補於各微模穴221且結合至底板31的微凸塊321。
需說明的是,本實施例尚有一溢流槽(圖未示)圍設於設置槽211的外周緣,且不與設置槽211相連通,其可當待成型材32料量較多時,使多餘的料量由溢流槽排
出。
此外,本實施例並非僅侷限於藉由雙軸向(biaxial)外力來產生夾持應力(即,分別由公模21與母模22朝母模22與公模21彼此相向地加壓外力F以產生夾持應力)。本實施例亦可藉由單軸向(uniaxial)外力來產生夾持應力。換句話說,本實施例也可由模具組2的公模21及母模22其中一者,朝模具組2的公模21及母模22其中另一者施加外力F,並固定公模21及母模22的其中另一者,以使公模21及母模22的其中另一者因外力F(即,單軸向外力)而產生相反於外力F方向的一反作用力,從而產生夾持應力。
更具體地來說,本實施例於實施成型步驟S3時,是透過熱壓技術(hot press-molding)來完成,其是先透過加熱器4加熱模具組2至預定溫度後,使待成型材32(即,自黏性固態矽橡膠)於閉合的模具組2內受熱加速固化成形變材3201,令形變材3201於填充至各微模穴221內的過程中因預定溫度而加速產生交聯(crosslinking)反應,待模具組2完全閉合後,形變材3201填滿各微模穴221,再對模具組2予以冷卻從而使各微模穴221內之形變材3201分別對應硬化且成型出各微凸塊321。
參閱圖5,脫模步驟S4是分離公模21與母模22以取出結合有各微凸塊321的底板31,且由微凸塊321共同定義出薄膜式生物晶片3的多數個微流道322。詳細地來說,脫模步驟S4是先自公模21的抽氣通道213引入
一外部氣體(圖未示)以迫使底板31自公模21的設置槽211脫離,且分離公模21與母模22,並透過一對分別對應設置於公模21之各貫孔212內的頂桿5,以朝向底板31的方向移動,使結合有各微凸塊321的底板31遠離設置槽211,從而取出結合有各微凸塊321的底板31。
再參閱圖5,封裝步驟S5是於各微凸塊321的一頂緣覆蓋一個封裝層33,以封閉薄膜式生物晶片3的各微流道322,從而構成如圖6所示之薄膜式生物晶片3。封裝層33是選自玻璃、塑膠及矽膠其中之一。本實施例的封裝步驟S5,可以經由點置於各微凸塊321之頂緣上的黏膠(glue)來貼合封裝層33;也可以是對各微凸塊321之頂緣施予一表面電漿處理(plasma treatment),以使封裝層33貼合至經表面電漿處理之各微凸塊321的頂緣。本發明之封裝步驟S5可採用現有的任何技術來達成,並非僅侷限於前面所提到的黏膠或表面電漿處理等手段。封裝步驟S5並非本發明之技術重點,於此不再多加贅述。
在本實施例中,雖然是包含有封裝步驟S5。然而,此處須補充說明的是,例如當本實施例所完成之薄膜式生物晶片3並非直接被拿來使用,而是直接供應給下游廠商進行封裝測試時,則本實施例是無須封裝步驟S5。
再參閱圖4與圖5,經上述第一實施例之製作方法的詳細說明可知,本發明於提供步驟S1時已將不易因高溫環境(即,預定溫度)而產生軟化變形的底板31,預先容置於公模21的設置槽211上,並於配置步驟S2時將待
成型材(即,固態矽橡膠)32配置於底板31上,使得待成型材32在成型步驟S3之預定溫度與夾持應力下,產生加速固化與變形並填充至各微模穴221內且持續進行交聯反應,以在冷卻後硬化成型出結合至底板31上的各微凸塊321,從而由每兩相鄰微凸塊321定義出薄膜式生物晶片3之各微流道322。此外,本發明於脫模步驟S4時,只需透過各頂桿5將表面結合有微凸塊321的底板31頂出並脫離公模21的設置槽211,即可直接取得表面結合有微凸塊321的底板31的薄膜式生物晶片3,不需額外透過其他製程者來取出。
更具體地來說,本實施例相較於先前技術段所提到之前案1的製法(並配合參閱圖2),本實施例之底板31與微凸塊321,分別同等於前案1的基板12與高分子膜11。特別值得一提的是,本實施例僅在一道的成型步驟S3中,即可直接使微凸塊321結合至底板31上以形成薄膜式生物晶片3,無須如同前案1般,仍需透過人力自印模內取出成型後的高分子模11,並將高分子膜11貼附到基板12上等兩道程序。因此,本實施例之製作方法的程序較為簡化,不易有人為因素所造成之微凸塊321的損壞,甚或是不易對位貼附等問題產生。另,本實施例更不需如同前案1般,為了減少高分子膜11於離模時的所造成的損壞,而增加高分子膜11的使用量甚或是延長硬化時間。因此,本實施例在節省用料量與製程時間的前提下,即可有效地製成薄膜式生物晶片3。更甚者,本實施例更因無須透過
人為來實施離模甚或貼附等兩道程序,其直接透過成型步驟S3製成表面結合有微凸塊321的底板31,並透過各頂桿5來實施脫模步驟S4,使得實施例之製作方法可整合至自動化製程,以藉此大幅地提升元件產量。
再參閱圖3,並配合參閱圖7,本發明第二實施例大致上是相同於第一實施例,其不同處是在於,提供步驟S1、配置步驟S2與成型步驟S3的細部實施方式。
如圖7所示,提供步驟S1之模具組2的母模22還具有一個注入口(injection port)222,其是形成在母模22之一端緣,以與母模22之各微模穴221相連通。待成型材32於配置步驟S2置入模具組2內部前,待成型材32先經由一供料系統(圖未示)攪拌成一凝膠體3202。在公模21與母模22閉合後(如圖7所示),模具組2透過加熱器4加熱至預定溫度,自注入口222注入凝膠體3202至經加熱之模具組2的母模22,以被配置於公模21之設置槽211上的底板31上,並於成型步驟S3時被填置於模具組2的各微模穴221內,從而使填置於各微模穴221內的凝膠體3202經加熱固化後所成型的各微凸塊321是結合至底板31上。在本實施例中,待成型材32是自黏性液態矽橡膠(LSR),其可直接與底板31於成型後形成緊密黏附,不需使用額外的表面處理。
又,待成型材32主要選自於彈性體材料,並依據彈性體材料的化學特性或物理特性而變異,使其同樣能達到製作薄膜式生物晶片3的功效,並不以本實施例所揭
露的自黏性液態矽橡膠為限。
詳細地來說,本實施例於實施配置步驟S2與成型步驟S3時,是透過射出成型技術(injection molding)來達成。本發明第二實施例是先透過加熱器4加熱經閉合後的模具組2至預定溫度後,同時使位處於模具組2外的待成型材(即,液態矽橡膠)32攪拌成凝膠體3202,並自閉合後之模具組2的母模22的注入口222注入凝膠體3202到母模22,以使凝膠體3202配置於底板31上,從而完成配置步驟S2。又,凝膠體3202是於成型步驟S3時被填置於各微模穴221內,且於填置於各微模穴221的過程中持續地進行交聯反應,待凝膠體3202填滿各微模穴221後冷卻模具組2,並於冷卻後硬化成型出各微凸塊321。
同樣地,如圖7所顯示,本實施例於提供步驟S1時已將不易因高溫環境而產生軟化變形的底板31,預先容置於公模21的設置槽211上,並於配置步驟S2時使待成型材(即,LSR)32之凝膠體3202自母模22的注入口222注入到母模22以配置於底板31上。因此,待成型材32之凝膠體3202在成型步驟S3之預定溫度下得以填滿各微模穴221且持續進行交聯反應,以在加熱固化後硬化成型出結合至底板31上的各微凸塊321,從而在脫模步驟S4(圖未示)後製得薄膜式生物晶片3(圖未示)。
綜上所述,本發明薄膜式生物晶片之製作方法於單一道成型步驟S3即可使微凸塊321結合至底板31上以形成薄膜式生物晶片3,不僅製作程序簡化,亦不會有
人為因素所引致之微凸塊321損壞甚或是不易對位貼附等問題;再者,本發明之製作方法也可在節省用料量與製程時間的前提下有效地製成薄膜式生物晶片,並透過各頂桿5來實施脫模步驟S4,可直接整合至自動化製程以提升產量,故確實能達成本發明之目的。
惟以上所述者,僅為本發明之實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。
2‧‧‧模具組
21‧‧‧公模
211‧‧‧設置槽
212‧‧‧貫孔
213‧‧‧抽氣通道
22‧‧‧母模
221‧‧‧微模穴
31‧‧‧底板
32‧‧‧待成型材
3201‧‧‧形變材
321‧‧‧微凸塊
4‧‧‧加熱器
F‧‧‧外力
S1~S3‧‧‧步驟
Claims (12)
- 一種薄膜式生物晶片之製作方法,包含以下步驟:提供相互閉合的一公模與一母模及一底板,該公模包括一容置該底板的設置槽,該母模包括多數個面向該底板的微模穴;使一待成型材於各該微模穴內成型出多數個外觀互補於各該微模穴且結合至該底板的微凸塊;及分離該公模與該母模,以取出結合有該等微凸塊的該底板,且由該等微凸塊共同定義出該薄膜式生物晶片的多數個微流道。
- 如請求項1所述的薄膜式生物晶片之製作方法,還包含於該分離該公模與該母模步驟後,於該等微凸塊的一頂緣覆蓋一封裝層,以封閉該等微流道。
- 如請求項1所述的薄膜式生物晶片之製作方法,其中,該待成型材是在該公模與該母模閉合前被配置於該公模之該設置槽內的該底板上。
- 如請求項3所述的薄膜式生物晶片之製作方法,其中,使該待成型材於各該微模穴內成型的步驟包括提供一預定溫度使該待成型材加速固化,且不足以使該底板產生變形。
- 如請求項3所述的薄膜式生物晶片之製作方法,其中,使該待成型材於各該微模穴內成型的步驟更包括經由該公模及該母模其中至少一者提供該底板與該待成型材一相向的夾持應力。
- 如請求項1所述的薄膜式生物晶片之製作方法,其中,使該待成型材於各該微模穴內成型的步驟包括:將該待成型材注入該母模的該等微模穴內;及冷卻該待成型材以形成結合至該底板的該等微凸塊。
- 如請求項6所述的薄膜式生物晶片之製作方法,其中,使該待成型材於各該微模穴內成型的步驟更包括將該待成型材注入該母模的該等微模穴前,加熱該母模至一預定溫度。
- 如請求項4或7所述的薄膜式生物晶片之製作方法,其中,該預定溫度是介於100℃至150℃間。
- 如請求項1所述的薄膜式生物晶片之製作方法,其中,該待成型材是由一矽氧聚合物所製成。
- 如請求項1至7或9任一項請求項所述的薄膜式生物晶片之製作方法,其中:該公模還包括至少一個連通該設置槽的抽氣通道,且該提供該公模、母模及底板的步驟中,還包括自該抽氣通道抽離該抽氣通道內的氣體,以使該底板被吸附且容置於該公模的該設置槽上。
- 如請求項10所述的薄膜式生物晶片之製作方法,其中該公模還包括至少一連通該設置槽的貫孔,該分離該公模與母模的步驟包括:自該抽氣通道引入一外部氣體以使該底板自該公模的該設置槽脫離;及 分離該公模與該母模,並透過至少一穿過該至少一貫孔的頂桿以朝向該底板的方向移動,使結合有該等微凸塊的該底板遠離該設置槽。
- 一種薄膜式生物晶片之製作方法,其步驟包括:將一底板設置於一模具組的內部空間;於該模具組的內部空間內形成預定形狀而結合於該底板一表面的多數個微凸塊,且由該等微凸塊共同界定該生物晶片的多數個微流道;及將該底板自該模具組的內部空間取出。
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Country Status (3)
Country | Link |
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US (1) | US20160067908A1 (zh) |
CN (1) | CN105415721A (zh) |
TW (1) | TWI512292B (zh) |
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US20110133364A1 (en) * | 2008-08-20 | 2011-06-09 | Kanji Sekihara | Method for Manufacturing Micro-Channel, Die for Molding Micro-Channel Chip, and Micro-Channel Chip |
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DE3890321C2 (de) * | 1987-04-30 | 1998-01-15 | Sumitomo Chemical Co | Verfahren zum Herstellen eines mehrlagigen Preßteils |
US5147585A (en) * | 1987-10-30 | 1992-09-15 | Blum Ronald D | Method for forming plastic optical quality spectacle lenses |
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JP5274128B2 (ja) * | 2007-08-03 | 2013-08-28 | キヤノン株式会社 | インプリント方法および基板の加工方法 |
KR101066310B1 (ko) * | 2010-05-24 | 2011-09-20 | 주식회사 나노엔텍 | 미세패턴과 매크로패턴을 일체로 가지는 바이오칩 제조를 위한 스템퍼가 삽입된 금형 및 이를 이용한 바이오칩 제조방법 |
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-
2014
- 2014-09-04 TW TW103130587A patent/TWI512292B/zh active
-
2015
- 2015-07-23 CN CN201510436000.0A patent/CN105415721A/zh active Pending
- 2015-09-03 US US14/844,369 patent/US20160067908A1/en not_active Abandoned
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US20100006439A1 (en) * | 2004-04-13 | 2010-01-14 | President And Fellows Of Harvard College | Methods and apparatus for manipulation and/or detection of biological samples and other objects |
US20050230876A1 (en) * | 2004-04-14 | 2005-10-20 | Nippon Filcon Co. | Manufacturing method of a microchemical chip made of a resin and a microchemical chip made of a resin by the method |
TW200931688A (en) * | 2007-11-05 | 2009-07-16 | Towa Corp | Resin-sealed light emitting device and its manufacturing method |
US20110133364A1 (en) * | 2008-08-20 | 2011-06-09 | Kanji Sekihara | Method for Manufacturing Micro-Channel, Die for Molding Micro-Channel Chip, and Micro-Channel Chip |
Also Published As
Publication number | Publication date |
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TW201610431A (zh) | 2016-03-16 |
US20160067908A1 (en) | 2016-03-10 |
CN105415721A (zh) | 2016-03-23 |
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