ATE554050T1 - Prägeverfahren und verfahren zur verarbeitung eines substrats - Google Patents

Prägeverfahren und verfahren zur verarbeitung eines substrats

Info

Publication number
ATE554050T1
ATE554050T1 AT08792316T AT08792316T ATE554050T1 AT E554050 T1 ATE554050 T1 AT E554050T1 AT 08792316 T AT08792316 T AT 08792316T AT 08792316 T AT08792316 T AT 08792316T AT E554050 T1 ATE554050 T1 AT E554050T1
Authority
AT
Austria
Prior art keywords
substrate
resin material
pattern
photocurable resin
mold
Prior art date
Application number
AT08792316T
Other languages
English (en)
Inventor
Shingo Okushima
Junichi Seki
Haruhito Ono
Nao Nakatsuji
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of ATE554050T1 publication Critical patent/ATE554050T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AT08792316T 2007-08-03 2008-08-01 Prägeverfahren und verfahren zur verarbeitung eines substrats ATE554050T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007203044 2007-08-03
JP2008182301A JP5274128B2 (ja) 2007-08-03 2008-07-14 インプリント方法および基板の加工方法
PCT/JP2008/064259 WO2009020193A2 (en) 2007-08-03 2008-08-01 Imprint method and processing method of substrate

Publications (1)

Publication Number Publication Date
ATE554050T1 true ATE554050T1 (de) 2012-05-15

Family

ID=39863004

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08792316T ATE554050T1 (de) 2007-08-03 2008-08-01 Prägeverfahren und verfahren zur verarbeitung eines substrats

Country Status (7)

Country Link
US (1) US20100233432A1 (de)
EP (1) EP2185974B1 (de)
JP (1) JP5274128B2 (de)
KR (1) KR20100056483A (de)
CN (1) CN101809501A (de)
AT (1) ATE554050T1 (de)
WO (1) WO2009020193A2 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080105524A (ko) * 2007-05-31 2008-12-04 삼성전자주식회사 마스크 몰드 및 그 제작방법과 제작된 마스크 몰드를이용한 대면적 미세패턴 성형방법
JP2009182075A (ja) 2008-01-30 2009-08-13 Canon Inc インプリントによる構造体の製造方法
JP4799575B2 (ja) * 2008-03-06 2011-10-26 株式会社東芝 インプリント方法
GB2468635B (en) * 2009-02-05 2014-05-14 Api Group Plc Production of a surface relief on a substrate
JP5257225B2 (ja) * 2009-04-28 2013-08-07 大日本印刷株式会社 ナノインプリント用モールドおよびその製造方法
JP5483251B2 (ja) * 2009-07-10 2014-05-07 株式会社ニコン パターン形成装置、パターン形成方法、デバイス製造装置、及びデバイス製造方法
US20110031650A1 (en) * 2009-08-04 2011-02-10 Molecular Imprints, Inc. Adjacent Field Alignment
EP2474403A1 (de) * 2009-08-31 2012-07-11 Konica Minolta Opto, Inc. Vorrichtung zur herstellung einer wafer-linse, form dafür und verfahren zur herstellung einer wafer-linse
JP5568960B2 (ja) * 2009-11-17 2014-08-13 大日本印刷株式会社 ナノインプリントによるパターン形成方法
JP5532939B2 (ja) * 2010-01-14 2014-06-25 大日本印刷株式会社 光インプリント用のモールドおよびこれを用いた光インプリント方法
JP5355614B2 (ja) * 2011-04-19 2013-11-27 パナソニック株式会社 シート状デバイスの製造装置、シート状デバイスの製造方法
JP2013038117A (ja) * 2011-08-04 2013-02-21 Jx Nippon Oil & Energy Corp 微細パターンを転写するための転写ヘッド及びそれを用いた微細パターンの形成方法
JP6115300B2 (ja) * 2012-08-23 2017-04-19 凸版印刷株式会社 インプリント用モールド、インプリント方法、パターン形成体
KR20150112945A (ko) * 2013-01-24 2015-10-07 소켄 케미칼 앤드 엔지니어링 캄파니, 리미티드 광투과형 임프린트용 몰드, 대면적 몰드의 제조방법
WO2014144133A1 (en) * 2013-03-15 2014-09-18 The Trustees Of The Princeton University Analyte detection enhancement by targeted immobilization, surface amplification, and pixelated reading and analysis
TWI662591B (zh) * 2014-07-08 2019-06-11 Soken Chemical & Engineering Co., Ltd. 使用分步重複用壓印用模具的分步重複壓印方法、及分步重複用壓印用模具之製造方法
TWI512292B (zh) * 2014-09-04 2015-12-11 Taiwan Green Point Entpr Co 薄膜式生物晶片之製作方法
EP3256907B1 (de) * 2015-02-13 2020-04-15 Morphotonics Holding B.V. Verfahren zum texturieren von diskreten substraten
JP2016157785A (ja) * 2015-02-24 2016-09-01 株式会社東芝 テンプレート形成方法、テンプレートおよびテンプレート基材
KR101704587B1 (ko) * 2016-03-08 2017-02-08 주식회사 에이디피 복합패턴의 구현방법 및 그 복합패턴이 구현된 시트
US10883006B2 (en) * 2016-03-31 2021-01-05 Canon Kabushiki Kaisha Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
KR101882612B1 (ko) * 2016-05-10 2018-07-26 성균관대학교산학협력단 고분자 수지를 이용하여 강도구배를 갖는 마이크로-나노 패턴 형성방법 및 상기 방법으로 제조된 기판
KR102591120B1 (ko) 2016-08-29 2023-10-19 에스케이하이닉스 주식회사 나노임프린트 리소그래피를 이용한 패턴 형성 방법
US11366400B2 (en) * 2017-05-15 2022-06-21 Canon Kabushiki Kaisha Method of determining drop recipe, imprint apparatus, and article manufacturing method
CN108445711A (zh) * 2018-03-13 2018-08-24 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示装置
CN108873605A (zh) * 2018-07-06 2018-11-23 京东方科技集团股份有限公司 一种纳米压印模板及其制作方法
KR102666843B1 (ko) * 2018-08-31 2024-05-21 삼성디스플레이 주식회사 나노 임프린트용 스탬프 및 이의 제조 방법
CN109240041B (zh) * 2018-11-19 2020-06-26 京东方科技集团股份有限公司 拼接式压印模板及其制备方法和母模板
CN110764364B (zh) 2019-11-01 2021-05-25 京东方科技集团股份有限公司 一种纳米图案的制作方法、纳米压印基板、显示基板
JP7465146B2 (ja) * 2020-05-12 2024-04-10 キヤノン株式会社 インプリント方法、インプリント装置、判定方法及び物品の製造方法
JP7547081B2 (ja) * 2020-05-21 2024-09-09 キヤノン株式会社 インプリント方法及び物品の製造方法
KR102379451B1 (ko) * 2021-04-27 2022-03-28 창원대학교 산학협력단 대면적 패턴 제작용 몰드, 이의 제조 방법 및 이를 이용한 패턴 성형 방법

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6939474B2 (en) * 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US6780001B2 (en) * 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
JP2004523906A (ja) * 2000-10-12 2004-08-05 ボード・オブ・リージエンツ，ザ・ユニバーシテイ・オブ・テキサス・システム 室温かつ低圧マイクロおよびナノ転写リソグラフィのためのテンプレート
US6653030B2 (en) * 2002-01-23 2003-11-25 Hewlett-Packard Development Company, L.P. Optical-mechanical feature fabrication during manufacture of semiconductors and other micro-devices and nano-devices that include micron and sub-micron features
US6900881B2 (en) * 2002-07-11 2005-05-31 Molecular Imprints, Inc. Step and repeat imprint lithography systems
US20070023912A1 (en) * 2003-03-14 2007-02-01 Acm Research, Inc. Integrating metal with ultra low-k-dielectrics
WO2004086471A1 (en) * 2003-03-27 2004-10-07 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
US7136150B2 (en) * 2003-09-25 2006-11-14 Molecular Imprints, Inc. Imprint lithography template having opaque alignment marks
EP1542074A1 (de) * 2003-12-11 2005-06-15 Heptagon OY Herstellung eines Werkzeugs zur Vervielfältigung
JP4393244B2 (ja) * 2004-03-29 2010-01-06 キヤノン株式会社 インプリント装置
US7490547B2 (en) * 2004-12-30 2009-02-17 Asml Netherlands B.V. Imprint lithography
KR100632556B1 (ko) * 2005-01-28 2006-10-11 삼성전기주식회사 인쇄회로기판의 제조방법
US7855046B2 (en) * 2005-04-07 2010-12-21 The University Of North Carolina At Charlotte Method and apparatus for fabricating shaped structures and shaped structures including one- , two- or three-dimensional patterns incorporated therein
US20060266916A1 (en) * 2005-05-25 2006-11-30 Molecular Imprints, Inc. Imprint lithography template having a coating to reflect and/or absorb actinic energy
US8999218B2 (en) * 2005-06-06 2015-04-07 Canon Kabushiki Kaisha Process for producing member having pattern, pattern transfer apparatus, and mold
US7289868B2 (en) * 2005-08-22 2007-10-30 Hewlett-Packard Development Company, L.P. System and method for calculating a shift value between pattern instances
US20070046940A1 (en) * 2005-08-22 2007-03-01 Jun Gao Positioning system and method using displacements
US8011916B2 (en) * 2005-09-06 2011-09-06 Canon Kabushiki Kaisha Mold, imprint apparatus, and process for producing structure
US20070138699A1 (en) * 2005-12-21 2007-06-21 Asml Netherlands B.V. Imprint lithography
US20070200276A1 (en) * 2006-02-24 2007-08-30 Micron Technology, Inc. Method for rapid printing of near-field and imprint lithographic features
KR20080088238A (ko) * 2007-03-29 2008-10-02 삼성전자주식회사 패턴 형성용 몰드, 패턴 형성 장치 및 패턴 형성 방법

Also Published As

Publication number Publication date
WO2009020193A2 (en) 2009-02-12
CN101809501A (zh) 2010-08-18
JP5274128B2 (ja) 2013-08-28
KR20100056483A (ko) 2010-05-27
JP2009060085A (ja) 2009-03-19
US20100233432A1 (en) 2010-09-16
WO2009020193A3 (en) 2009-04-16
EP2185974B1 (de) 2012-04-18
EP2185974A2 (de) 2010-05-19

Similar Documents

Publication Publication Date Title
ATE554050T1 (de) Prägeverfahren und verfahren zur verarbeitung eines substrats
ATE551631T1 (de) Prägeverfahren zur strukturherstellung
JP6173354B2 (ja) 光透過型インプリント用モールド、大面積モールドの製造方法
EP2584408A3 (de) Druckverfahren und Druckvorrichtung
DE602006007089D1 (de) Imprint-Lithographieverfahren, Gerät hierfür, sowie Verfahren zur Herstellung eines Halbleiterchips
US20170157836A1 (en) Mold for step-and-repeat imprinting, and method for producing same
JP2008260273A5 (de)
JP2007103924A5 (de)
EA201790196A1 (ru) Способ изготовления пластмассовой автомобильной детали
EP1992479A4 (de) Folienvorlage aus einer geprägten trennfolie, geprägte trennfolie, verfahren zur herstellung einer folienvorlage aus einer geprägten trennfolie, verfahren zur herstellung einer geprägten trennfolie, vorrichtung zur herstellung einer geprägten trennfolie, kunstleder und verfahren zur herstellung von kunstleder
CN105936124B (zh) 压印装置
ATE448927T1 (de) Vorrichtung und verfahren zur herstellung einer zweiseitig gemusterten bahn in deckung
TW200802529A (en) Soft mold and method of fabricating the same
WO2011052895A3 (ko) 롤 임프린트 장치
WO2012106121A3 (en) Forming a template with discrete domains
JP2019021911A5 (de)
WO2009053586A3 (fr) Procede de realisation d'un agencement a image en relief utilisable notamment dans le domaine de la flexographie et agencement realise selon ce procede
WO2010105091A3 (en) Large area dissolvable template lithography
JP2016213423A5 (de)
WO2009108323A3 (en) Real time imprint process diagnostics for defects
SG10201709477TA (en) Imprint apparatus, imprinting method, and method for manufacturing article
TW200633791A (en) Method for fabricating nano-adhesive
JP2014120604A5 (de)
ATE258492T1 (de) Verfahren zur herstellung einer prägewalze aus silikonkautschuk zum kontinuierlichen prägen der oberfläche einer thermoplastischen folie
KR101816838B1 (ko) 나노 임프린트용 레플리카 몰드, 그 제조방법 및 나노 임프린트용 레플리카 몰드 제조장치