ATE302221T1 - Polyoxazolidon-klebstoffzusammensetzung hergestellt aus polyepoxiden und polyisocyanaten - Google Patents
Polyoxazolidon-klebstoffzusammensetzung hergestellt aus polyepoxiden und polyisocyanatenInfo
- Publication number
- ATE302221T1 ATE302221T1 AT99964227T AT99964227T ATE302221T1 AT E302221 T1 ATE302221 T1 AT E302221T1 AT 99964227 T AT99964227 T AT 99964227T AT 99964227 T AT99964227 T AT 99964227T AT E302221 T1 ATE302221 T1 AT E302221T1
- Authority
- AT
- Austria
- Prior art keywords
- polyoxazolidone
- polyepoxides
- polyisocyanates
- polyepoxide
- adhesive composition
- Prior art date
Links
- 229920000647 polyepoxide Polymers 0.000 abstract 3
- 229920001228 polyisocyanate Polymers 0.000 abstract 3
- 239000005056 polyisocyanate Substances 0.000 abstract 3
- 239000000376 reactant Substances 0.000 abstract 2
- 239000011342 resin composition Substances 0.000 abstract 2
- WDGCBNTXZHJTHJ-UHFFFAOYSA-N 2h-1,3-oxazol-2-id-4-one Chemical group O=C1CO[C-]=N1 WDGCBNTXZHJTHJ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004970 Chain extender Substances 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000007795 chemical reaction product Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 229920001169 thermoplastic Polymers 0.000 abstract 1
- 239000004416 thermosoftening plastic Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/003—Polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/302—Polyurethanes or polythiourethanes; Polyurea or polythiourea
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Polyurethanes Or Polyureas (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB9827367.5A GB9827367D0 (en) | 1998-12-11 | 1998-12-11 | Adhesive resin composition |
| PCT/US1999/029431 WO2000034351A1 (en) | 1998-12-11 | 1999-12-10 | Polyoxazolidone adhesive resin composition prepared from polyepoxides and polyisocyanates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE302221T1 true ATE302221T1 (de) | 2005-09-15 |
Family
ID=10844100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT99964227T ATE302221T1 (de) | 1998-12-11 | 1999-12-10 | Polyoxazolidon-klebstoffzusammensetzung hergestellt aus polyepoxiden und polyisocyanaten |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US6432541B1 (https=) |
| EP (1) | EP1137683B1 (https=) |
| JP (2) | JP5209155B2 (https=) |
| CN (1) | CN100379781C (https=) |
| AT (1) | ATE302221T1 (https=) |
| AU (1) | AU2051200A (https=) |
| DE (1) | DE69926790T2 (https=) |
| GB (1) | GB9827367D0 (https=) |
| HK (1) | HK1043138B (https=) |
| TW (1) | TWI240745B (https=) |
| WO (1) | WO2000034351A1 (https=) |
Families Citing this family (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000294922A (ja) * | 1999-04-01 | 2000-10-20 | Victor Co Of Japan Ltd | 多層プリント配線板用の絶縁樹脂組成物 |
| JP3711842B2 (ja) * | 2000-06-01 | 2005-11-02 | ソニーケミカル株式会社 | 異方性導電接続材料及び接続構造体 |
| TW593404B (en) * | 2001-03-14 | 2004-06-21 | Akzo Nobel Nv | Powder coated rotor, stator or field coil and powder coating composition |
| US7431981B2 (en) * | 2002-11-04 | 2008-10-07 | The Boeing Company | Polymer composite structure reinforced with shape memory alloy and method of manufacturing same |
| US6989197B2 (en) * | 2002-11-04 | 2006-01-24 | The Boeing Company | Polymer composite structure reinforced with shape memory alloy and method of manufacturing same |
| EP1867672B1 (en) * | 2005-04-07 | 2011-01-26 | Asahi Kasei Chemicals Corporation | Epoxy resin composition |
| EP1818044A1 (en) | 2005-11-25 | 2007-08-15 | DSMIP Assets B.V. | Cosmetic or personal care composition comprising a polymer comprising oxazolidon groups |
| CN101511900B (zh) * | 2006-09-14 | 2011-11-23 | 松下电工株式会社 | 印刷电路板用环氧树脂组合物、树脂组合物清漆、预成型料、覆金属层压体、印刷电路板以及多层印刷电路板 |
| EP2148894B1 (en) * | 2007-05-16 | 2012-02-29 | Dow Global Technologies LLC | Flame retardant composition |
| US20100237292A1 (en) * | 2007-10-05 | 2010-09-23 | Joseph Gan | Isocyanate modified epoxy resin and epoxy powder coating composition thereof |
| US20100240816A1 (en) * | 2007-10-26 | 2010-09-23 | Dow Global Technologies Inc. | Epoxy resin composition containing isocyanurates for use in electrical laminates |
| KR101150311B1 (ko) * | 2007-11-29 | 2012-06-11 | 다우 글로벌 테크놀로지스 엘엘씨 | 열경화성 에폭시 수지의 경화제로서 디시안디아미드를 사용한 디메틸포름아미드가 없는 제형 |
| EP2229416B1 (en) * | 2008-01-08 | 2018-04-04 | Dow Global Technologies LLC | High tg epoxy systems for composite application |
| EP2268697B1 (en) | 2008-04-14 | 2014-01-29 | Dow Global Technologies LLC | Epoxy-imidazole catalysts useful for powder coating applications |
| CN105713182A (zh) * | 2009-01-06 | 2016-06-29 | 陶氏环球技术有限责任公司 | 环氧树脂的金属稳定剂和增长方法 |
| US8871892B2 (en) * | 2009-11-12 | 2014-10-28 | Dow Global Technologies Llc | Polyoxazolidone resins |
| US20120129414A1 (en) * | 2010-11-24 | 2012-05-24 | Chung-Hao Chang | Thermosetting resin composition and prepreg or laminate using the same |
| US9408296B2 (en) | 2010-12-28 | 2016-08-02 | Mitsui Chemicals Tohcello, Inc. | Resin composition, and protective film, dry film, circuit board, and multilayer circuit board containing same |
| CN103649154A (zh) * | 2011-07-04 | 2014-03-19 | 陶氏环球技术有限责任公司 | 在可热固化的环氧树脂体系中作为增韧剂的加合物 |
| TWI444132B (zh) * | 2011-12-08 | 2014-07-01 | Ind Tech Res Inst | 電磁波屏蔽複合膜及具有該複合膜之軟性印刷電路板 |
| BR112015010248A2 (pt) | 2012-11-07 | 2017-07-11 | Dow Global Technologies Llc | composição de resina epóxi curável, processo para preparar a composição de resina epóxi curável e compósito |
| EP2803684A1 (de) * | 2013-05-13 | 2014-11-19 | Basf Se | Isocyanat-Epoxid-Hybridharze |
| CN103436155B (zh) * | 2013-09-09 | 2015-12-23 | 段宝荣 | 一种耐光性水性聚氨酯涂料的制备方法 |
| DE102014226838A1 (de) | 2014-12-22 | 2016-06-23 | Henkel Ag & Co. Kgaa | Oxazolidinon- und Isocyanurat-vernetzte Matrix für faserverstärktes Material |
| DE102014226842A1 (de) | 2014-12-22 | 2016-06-23 | Henkel Ag & Co. Kgaa | Katalysator-Zusammensetzung zur Härtung von Epoxidgruppen-haltigen Harzen |
| JP2016094610A (ja) * | 2015-11-24 | 2016-05-26 | ブルー キューブ アイピー エルエルシー | 熱硬化性エポキシ系の強化剤用付加体 |
| CN105295041B (zh) * | 2015-12-03 | 2017-07-25 | 苏州太湖电工新材料股份有限公司 | 一种聚噁唑烷酮树脂、其制备方法及在浸渍漆中的应用 |
| CN106916282B (zh) | 2015-12-28 | 2019-07-26 | 广东生益科技股份有限公司 | 一种环氧树脂组合物以及使用其的预浸料和层压板 |
| CN107227001B (zh) * | 2016-03-25 | 2019-06-14 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物以及含有它的预浸料、层压板和印制电路板 |
| EP3260481B1 (de) * | 2016-06-20 | 2022-02-23 | Henkel AG & Co. KGaA | Gehärtete zusammensetzung mit hoher schlagfestigkeit und temperaturbeständigkeit, basierend auf einem epoxidharz und einem polyisocyanat |
| JP6294927B1 (ja) | 2016-09-15 | 2018-03-14 | 日清紡ホールディングス株式会社 | 樹脂組成物及びこれを用いた熱伝導性軟質シート、並びに放熱構造 |
| CN106497024A (zh) * | 2016-10-27 | 2017-03-15 | 国家康复辅具研究中心 | 一种抗菌聚氨酯复合材料及其制备方法和应用 |
| WO2018149844A1 (de) * | 2017-02-16 | 2018-08-23 | Basf Se | Polyoxazolidone und deren herstellung |
| JP7323265B2 (ja) * | 2017-03-31 | 2023-08-08 | 富士紡ホールディングス株式会社 | 研磨パッド |
| EP3428045A1 (de) * | 2017-07-13 | 2019-01-16 | Sika Technology Ag | Einkomponentiger hitzehärtender epoxidklebstoff hoher auswaschbeständigkeit |
| EP3456754A1 (en) * | 2017-09-15 | 2019-03-20 | Covestro Deutschland AG | Method for the production of thermoplastic polyoxazolidinone polymers |
| ES2906200T3 (es) * | 2017-09-29 | 2022-04-13 | Basf Se | Polioxazolidonas termoplásticas de diisocianatos y éteres diglicidílicos de derivados del 2-fenil-1,3-propanodiol |
| CN107652937B (zh) * | 2017-11-06 | 2021-03-30 | 烟台德邦科技股份有限公司 | 一种可与低表面能材料粘接的聚氨酯热熔胶的制备方法 |
| CN108371948A (zh) * | 2018-02-09 | 2018-08-07 | 安徽师范大学 | 新型亲和嗜硫硅球色谱材料及其制备方法和应用 |
| WO2019211127A1 (en) * | 2018-04-30 | 2019-11-07 | Evonik Degussa Gmbh | Polyurea compositions from polyaspartic esters and secondary heterocyclic amines derived aspartic esters |
| TW202006002A (zh) * | 2018-07-18 | 2020-02-01 | 德商巴斯夫歐洲公司 | 聚唑烷酮的本體聚合 |
| EP3647335A1 (en) * | 2018-10-30 | 2020-05-06 | Covestro Deutschland AG | Method for the production of thermoplastic polyoxazolidinone polymers |
| US20220154055A1 (en) * | 2019-05-15 | 2022-05-19 | Dow Global Technologies Llc | Two-component adhesive compositions, articles prepared with same and preparation methods thereof |
| CN112175168B (zh) * | 2020-10-14 | 2021-12-14 | 上海交通大学 | 一种三元共聚物、嵌段聚合物以及三元共聚物的合成方法 |
| CN119019639A (zh) * | 2024-09-14 | 2024-11-26 | 万华化学集团股份有限公司 | 一种低内生热的热塑性聚氨酯弹性体及其制备方法和应用 |
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|---|---|---|---|---|
| US3354114A (en) | 1964-03-03 | 1967-11-21 | Grace W R & Co | Polystyrene fiber-finely divided silica thickening agent, and organic liquid materials thickened therewith |
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| US3334110A (en) | 1965-08-16 | 1967-08-01 | Baker Chem Co J T | Method for preparing epoxyoxazolidinones |
| GB1370782A (en) | 1970-11-11 | 1974-10-16 | Ciba Geigy Ag | Adhesive compositions |
| US4070416A (en) * | 1972-11-29 | 1978-01-24 | Hitachi, Ltd. | Novel thermosetting resin and a process for producing same |
| US4066628A (en) | 1976-08-02 | 1978-01-03 | Mitsubishi Chemical Industries Ltd. | Oxazolidone catalyst |
| JPS5515870A (en) | 1978-07-23 | 1980-02-04 | Toho Beslon Co | Strand preepreg composition |
| US4401499A (en) * | 1980-06-09 | 1983-08-30 | Sumitomo Bakelite Company Limited | Crosslinked resin of epoxy compound and isocyanate and process for producing same |
| ZA839459B (en) | 1982-12-30 | 1985-08-28 | Mobil Oil Corp | Polyoxazolidone powder coating compositions |
| DE3323122A1 (de) | 1983-06-27 | 1985-05-23 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung von reaktionsharzformstoffen |
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| EP0318325B1 (en) | 1987-11-26 | 1994-03-16 | Nippon Shokubai Co., Ltd. | Resin composition for artificial marble |
| JPH01236226A (ja) | 1988-03-17 | 1989-09-21 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| GB8912952D0 (en) * | 1989-06-06 | 1989-07-26 | Dow Rheinmuenster | Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones |
| US5387495A (en) | 1989-06-28 | 1995-02-07 | Digital Equipment Corporation | Sequential multilayer process for using fluorinated hydrocarbons as a dielectric |
| US5071520A (en) | 1989-10-30 | 1991-12-10 | Olin Corporation | Method of treating metal foil to improve peel strength |
| ZA913801B (en) | 1990-05-21 | 1993-01-27 | Dow Chemical Co | Latent catalysts,cure-inhibited epoxy resin compositions and laminates prepared therefrom |
| JP3322909B2 (ja) | 1991-08-15 | 2002-09-09 | 旭化成エポキシ株式会社 | エポキシ樹脂組成物 |
| JP3290449B2 (ja) * | 1991-08-19 | 2002-06-10 | 旭化成エポキシ株式会社 | エポキシ樹脂組成物 |
| JP3355658B2 (ja) | 1992-08-13 | 2002-12-09 | 旭化成エポキシ株式会社 | エポキシ樹脂組成物 |
| CA2147361A1 (en) | 1992-11-12 | 1994-05-26 | Michael L. Gould | Curable composition containing anhydride resins |
| JPH07197000A (ja) | 1993-12-28 | 1995-08-01 | Shin Etsu Chem Co Ltd | 耐熱性接着剤 |
| CA2115533C (en) | 1994-02-11 | 2002-06-18 | Hiroshi Uchida | Urethane modified epoxy resin compositions |
| US5545697A (en) | 1994-02-14 | 1996-08-13 | Ciba-Geigy Corporation | Urethane modified epoxy resin compositions |
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| NL1003499C2 (nl) | 1996-07-04 | 1998-01-07 | Holland Sweetener Co | Aspartaampoeders voor poedermengsels. |
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-
1998
- 1998-12-11 GB GBGB9827367.5A patent/GB9827367D0/en not_active Ceased
-
1999
- 1999-12-10 TW TW088121687A patent/TWI240745B/zh not_active IP Right Cessation
- 1999-12-10 DE DE69926790T patent/DE69926790T2/de not_active Expired - Lifetime
- 1999-12-10 JP JP2000586792A patent/JP5209155B2/ja not_active Expired - Fee Related
- 1999-12-10 AU AU20512/00A patent/AU2051200A/en not_active Abandoned
- 1999-12-10 AT AT99964227T patent/ATE302221T1/de active
- 1999-12-10 CN CNB998157384A patent/CN100379781C/zh not_active Expired - Fee Related
- 1999-12-10 US US09/458,379 patent/US6432541B1/en not_active Expired - Lifetime
- 1999-12-10 WO PCT/US1999/029431 patent/WO2000034351A1/en not_active Ceased
- 1999-12-10 EP EP99964227A patent/EP1137683B1/en not_active Expired - Lifetime
- 1999-12-10 HK HK02102373.1A patent/HK1043138B/en not_active IP Right Cessation
-
2012
- 2012-08-24 JP JP2012185696A patent/JP5735467B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1137683A1 (en) | 2001-10-04 |
| JP2012251161A (ja) | 2012-12-20 |
| JP5209155B2 (ja) | 2013-06-12 |
| TWI240745B (en) | 2005-10-01 |
| DE69926790D1 (de) | 2005-09-22 |
| CN1333791A (zh) | 2002-01-30 |
| US6432541B1 (en) | 2002-08-13 |
| JP2003522217A (ja) | 2003-07-22 |
| WO2000034351A1 (en) | 2000-06-15 |
| GB9827367D0 (en) | 1999-02-03 |
| AU2051200A (en) | 2000-06-26 |
| HK1043138B (en) | 2006-04-07 |
| EP1137683B1 (en) | 2005-08-17 |
| JP5735467B2 (ja) | 2015-06-17 |
| DE69926790T2 (de) | 2006-06-08 |
| HK1043138A1 (en) | 2002-09-06 |
| CN100379781C (zh) | 2008-04-09 |
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