ATE178441T1 - Doppelseitige oszillatoranordnung - Google Patents

Doppelseitige oszillatoranordnung

Info

Publication number
ATE178441T1
ATE178441T1 AT95112907T AT95112907T ATE178441T1 AT E178441 T1 ATE178441 T1 AT E178441T1 AT 95112907 T AT95112907 T AT 95112907T AT 95112907 T AT95112907 T AT 95112907T AT E178441 T1 ATE178441 T1 AT E178441T1
Authority
AT
Austria
Prior art keywords
double
package
oscillator arrangement
sided oscillator
receive
Prior art date
Application number
AT95112907T
Other languages
English (en)
Inventor
Thomas Knecht
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23491873&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE178441(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of ATE178441T1 publication Critical patent/ATE178441T1/de

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/08—Holders with means for regulating temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Amplifiers (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
AT95112907T 1995-01-24 1995-08-17 Doppelseitige oszillatoranordnung ATE178441T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/378,135 US5500628A (en) 1995-01-24 1995-01-24 Double-sided oscillator package and method of coupling components thereto

Publications (1)

Publication Number Publication Date
ATE178441T1 true ATE178441T1 (de) 1999-04-15

Family

ID=23491873

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95112907T ATE178441T1 (de) 1995-01-24 1995-08-17 Doppelseitige oszillatoranordnung

Country Status (5)

Country Link
US (1) US5500628A (de)
EP (1) EP0724334B2 (de)
JP (2) JP3372716B2 (de)
AT (1) ATE178441T1 (de)
DE (1) DE69508731T3 (de)

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US6133674A (en) * 1998-10-27 2000-10-17 Cts Low profile integrated oscillator having a stepped cavity
WO2000033455A1 (fr) * 1998-12-02 2000-06-08 Seiko Epson Corporation Dispositif piezo-electrique et son procédé de fabrication
EP1263127A4 (de) * 2000-01-31 2008-12-10 Kyocera Kinseki Corp Behälter für oszillationsschaltungen mit piezoelektrischem vibrator, verfahren zu seiner herstellung und oszillator
JP4138211B2 (ja) * 2000-07-06 2008-08-27 株式会社村田製作所 電子部品およびその製造方法、集合電子部品、電子部品の実装構造、ならびに電子装置
US6703768B2 (en) * 2000-09-27 2004-03-09 Citizen Watch Co., Ltd. Piezoelectric generator and mounting structure therefor
US6608531B2 (en) 2000-10-31 2003-08-19 Cts Corporation Temperature compensated crystal oscillator package
US6580332B2 (en) 2000-11-30 2003-06-17 Cts Corporation Dual-function connection pads for TCXO integrated circuit
US6456168B1 (en) 2000-12-29 2002-09-24 Cts Corporation Temperature compensated crystal oscillator assembled on crystal base
US6946919B2 (en) 2002-01-14 2005-09-20 Cts Corporation Controllable crystal oscillator component
US6627987B1 (en) * 2001-06-13 2003-09-30 Amkor Technology, Inc. Ceramic semiconductor package and method for fabricating the package
US6759913B2 (en) 2001-06-29 2004-07-06 Cts Corporation Crystal resonator based oscillator formed by attaching two separate housings
US6847115B2 (en) * 2001-09-06 2005-01-25 Silicon Bandwidth Inc. Packaged semiconductor device for radio frequency shielding
JP2003110396A (ja) * 2001-09-27 2003-04-11 Hokuriku Electric Ind Co Ltd 振動素子ユニット
US6664864B2 (en) 2001-10-31 2003-12-16 Cts Corporation Cavity design printed circuit board for a temperature compensated crystal oscillator and a temperature compensated crystal oscillator employing the same
KR20030042314A (ko) * 2001-11-22 2003-05-28 삼성전기주식회사 온도 보상 수정 발진기 및 그 제조방법
US6653906B1 (en) 2002-06-24 2003-11-25 Cts Corporation Controllable SAW oscillator component
US6700448B1 (en) * 2002-08-30 2004-03-02 Cts Corporation High performance dual range oscillator module
US20040070462A1 (en) * 2002-10-10 2004-04-15 Iyad Alhayek Oscillator package
JP4046641B2 (ja) * 2003-03-10 2008-02-13 富士通メディアデバイス株式会社 電子デバイスのパッケージ、ベース基板、電子部品及びそれの製造方法
JP4271527B2 (ja) * 2003-07-24 2009-06-03 日本電波工業株式会社 表面実装型の水晶発振器
WO2005020288A2 (en) * 2003-08-19 2005-03-03 Vectron International Multiple cavity/compartment package
JP2005124122A (ja) * 2003-09-25 2005-05-12 Kyocera Corp 圧電振動子収納用パッケージおよび圧電装置
US6998587B2 (en) * 2003-12-18 2006-02-14 Intel Corporation Apparatus and method for heating micro-components mounted on a substrate
TWI232566B (en) * 2004-02-06 2005-05-11 Txc Corp Packaging structure of oscillator and its device mounting method
JP2006165759A (ja) * 2004-12-03 2006-06-22 Nippon Dempa Kogyo Co Ltd 温度補償水晶発振器及びその製造方法
JP2006245098A (ja) * 2005-03-01 2006-09-14 Seiko Epson Corp 電子部品及びその製造方法、並びに電子機器
US7518880B1 (en) * 2006-02-08 2009-04-14 Bi-Link Shielding arrangement for electronic device
JP5075504B2 (ja) * 2007-06-29 2012-11-21 京セラクリスタルデバイス株式会社 圧電発振器
US20100257732A1 (en) * 2009-04-14 2010-10-14 Ziberna Frank J Shielding Arrangement for Electronic Device
TWI466437B (zh) * 2010-03-29 2014-12-21 Kyocera Kinseki Corp Piezoelectric vibrator
JP5747574B2 (ja) * 2011-03-11 2015-07-15 セイコーエプソン株式会社 圧電デバイス及び電子機器
TWI418067B (zh) * 2011-07-15 2013-12-01 台灣晶技股份有限公司 A crystal oscillator with a layout structure for miniaturized dimensions
JP6017901B2 (ja) * 2012-09-14 2016-11-02 ラピスセミコンダクタ株式会社 半導体装置および計測装置
US9825597B2 (en) 2015-12-30 2017-11-21 Skyworks Solutions, Inc. Impedance transformation circuit for amplifier
US9918386B2 (en) 2016-04-18 2018-03-13 Skyworks Solutions, Inc. Surface mount device stacking for reduced form factor
US10062670B2 (en) 2016-04-18 2018-08-28 Skyworks Solutions, Inc. Radio frequency system-in-package with stacked clocking crystal
US10297576B2 (en) 2016-04-18 2019-05-21 Skyworks Solutions, Inc. Reduced form factor radio frequency system-in-package
CN106449527A (zh) * 2016-08-23 2017-02-22 太仓市威士达电子有限公司 一种用于集成电路封装的金属外壳
TWI800014B (zh) 2016-12-29 2023-04-21 美商天工方案公司 前端系統及相關裝置、積體電路、模組及方法
US10515924B2 (en) 2017-03-10 2019-12-24 Skyworks Solutions, Inc. Radio frequency modules
DE102018100946A1 (de) * 2018-01-17 2019-07-18 Osram Opto Semiconductors Gmbh Bauteil und verfahren zur herstellung eines bauteils
JP7371344B2 (ja) * 2019-04-01 2023-10-31 セイコーエプソン株式会社 集積回路装置、発振器、電子機器及び移動体
JP2023100135A (ja) * 2022-01-05 2023-07-18 日本電波工業株式会社 ベース及び水晶振動子

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JPS5643814A (en) † 1979-09-17 1981-04-22 Nec Corp Container for piezoelectric oscillator
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JPS5991719A (ja) † 1982-11-17 1984-05-26 Nippon Dempa Kogyo Co Ltd 圧電振動子
DE3382208D1 (de) * 1982-12-15 1991-04-18 Nec Corp Monolithisches vielschichtkeramiksubstrat mit mindestens einer dielektrischen schicht aus einem material mit perovskit-struktur.
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JPS6150414A (ja) * 1984-08-20 1986-03-12 Nippon Dempa Kogyo Co Ltd 複合圧電ユニツト
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DE3539504A1 (de) * 1985-11-07 1987-05-21 Schott Glaswerke Flachgehaeuse zur hermetischen kapselung von piezoelektrischen bauelementen
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FR2633465B1 (fr) * 1988-06-24 1993-09-10 Cepe Oscillateur ultrastable fonctionnant a pression atmospherique et sous vide
JPH0358606A (ja) * 1989-07-27 1991-03-13 Murata Mfg Co Ltd 圧電発振子
JPH0372707A (ja) * 1989-08-11 1991-03-27 Toyo Commun Equip Co Ltd 圧電複合部品
JP2969526B2 (ja) * 1990-03-22 1999-11-02 日本電波工業株式会社 表面実装用小型水晶発振器
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JPH06275739A (ja) * 1993-03-23 1994-09-30 Sony Corp セラミック製アダプター及びセラミックパッケージ
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Also Published As

Publication number Publication date
JPH08204452A (ja) 1996-08-09
DE69508731T3 (de) 2004-08-19
JP2002164740A (ja) 2002-06-07
EP0724334A1 (de) 1996-07-31
US5500628A (en) 1996-03-19
EP0724334B1 (de) 1999-03-31
DE69508731D1 (de) 1999-05-06
EP0724334B2 (de) 2004-01-02
DE69508731T2 (de) 1999-10-07
JP3372716B2 (ja) 2003-02-04
JP3923762B2 (ja) 2007-06-06

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties