DE3382208D1 - Monolithisches vielschichtkeramiksubstrat mit mindestens einer dielektrischen schicht aus einem material mit perovskit-struktur. - Google Patents

Monolithisches vielschichtkeramiksubstrat mit mindestens einer dielektrischen schicht aus einem material mit perovskit-struktur.

Info

Publication number
DE3382208D1
DE3382208D1 DE8383112593T DE3382208T DE3382208D1 DE 3382208 D1 DE3382208 D1 DE 3382208D1 DE 8383112593 T DE8383112593 T DE 8383112593T DE 3382208 T DE3382208 T DE 3382208T DE 3382208 D1 DE3382208 D1 DE 3382208D1
Authority
DE
Germany
Prior art keywords
perovskit
dielectric layer
layer made
ceramic substrate
multilayer ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8383112593T
Other languages
English (en)
Inventor
Shuzo Fujii
Yuzo Shimada
Kazuaki Utsumi
Yutaka Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP21975382A external-priority patent/JPS59110208A/ja
Priority claimed from JP1920183A external-priority patent/JPS59144206A/ja
Priority claimed from JP3030883A external-priority patent/JPS59156002A/ja
Priority claimed from JP3030983A external-priority patent/JPS59156003A/ja
Priority claimed from JP58042576A external-priority patent/JPS59168705A/ja
Priority claimed from JP4346183A external-priority patent/JPS59170736A/ja
Priority claimed from JP58043482A external-priority patent/JPS59169210A/ja
Priority claimed from JP4346283A external-priority patent/JPS59169209A/ja
Priority claimed from JP4744983A external-priority patent/JPS59172807A/ja
Priority claimed from JP5785683A external-priority patent/JPS59183508A/ja
Application filed by NEC Corp filed Critical NEC Corp
Publication of DE3382208D1 publication Critical patent/DE3382208D1/de
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/495—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
    • C04B35/497—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates based on solid solutions with lead oxides
    • C04B35/499—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates based on solid solutions with lead oxides containing also titanates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/495—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
    • C04B35/497—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates based on solid solutions with lead oxides
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/32—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using change of resonant frequency of a crystal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • H03B5/36—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator active element in amplifier being semiconductor device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S331/00—Oscillators
    • Y10S331/03—Logic gate active element oscillator

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE8383112593T 1982-12-15 1983-12-14 Monolithisches vielschichtkeramiksubstrat mit mindestens einer dielektrischen schicht aus einem material mit perovskit-struktur. Expired - Fee Related DE3382208D1 (de)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP21975382A JPS59110208A (ja) 1982-12-15 1982-12-15 複合積層化多周波水晶発振器
JP1920183A JPS59144206A (ja) 1983-02-08 1983-02-08 積層セラミツク化水晶発振器
JP3030983A JPS59156003A (ja) 1983-02-25 1983-02-25 温度補償圧電発振器
JP3030883A JPS59156002A (ja) 1983-02-25 1983-02-25 温度補償圧電発振器
JP58042576A JPS59168705A (ja) 1983-03-15 1983-03-15 積層型電圧制御圧電発振器
JP4346183A JPS59170736A (ja) 1983-03-16 1983-03-16 水晶温度計
JP58043482A JPS59169210A (ja) 1983-03-16 1983-03-16 積層型広帯域圧電発振器
JP4346283A JPS59169209A (ja) 1983-03-16 1983-03-16 恒温槽付水晶発振器
JP4744983A JPS59172807A (ja) 1983-03-22 1983-03-22 積層型位相同期圧電発振器
JP5785683A JPS59183508A (ja) 1983-04-04 1983-04-04 圧電発振器

Publications (1)

Publication Number Publication Date
DE3382208D1 true DE3382208D1 (de) 1991-04-18

Family

ID=27579704

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383112593T Expired - Fee Related DE3382208D1 (de) 1982-12-15 1983-12-14 Monolithisches vielschichtkeramiksubstrat mit mindestens einer dielektrischen schicht aus einem material mit perovskit-struktur.

Country Status (4)

Country Link
US (1) US4574255A (de)
EP (1) EP0111890B1 (de)
AU (1) AU563467B2 (de)
DE (1) DE3382208D1 (de)

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Publication number Priority date Publication date Assignee Title
JPS6355157A (ja) * 1986-08-26 1988-03-09 日本電気株式会社 磁器組成物
GB2197540B (en) * 1986-11-12 1991-04-17 Murata Manufacturing Co A circuit structure.
JPS6488128A (en) * 1987-09-29 1989-04-03 Murata Manufacturing Co Temperature sensor
US4870746A (en) * 1988-11-07 1989-10-03 Litton Systems, Inc. Method of making a multilayer printed circuit board having screened-on resistors
JPH02148862A (ja) * 1988-11-30 1990-06-07 Hitachi Ltd 回路素子パッケージ、キャリヤ基板および製造方法
US4899118A (en) * 1988-12-27 1990-02-06 Hughes Aircraft Company Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits
JP2790640B2 (ja) * 1989-01-14 1998-08-27 ティーディーケイ株式会社 混成集積回路部品の構造
JP2869998B2 (ja) * 1989-03-03 1999-03-10 セイコーエプソン株式会社 圧電発振器
JPH03201805A (ja) * 1989-12-28 1991-09-03 Nec Corp 電圧制御発振器
ATE124599T1 (de) * 1990-04-05 1995-07-15 Dyconex Ag Herstellung von mehrschichtigen leiterplatten mit erhöhter leiterbahnendichte.
JP3088021B2 (ja) * 1990-12-20 2000-09-18 株式会社村田製作所 電圧制御発振器
US5144526A (en) * 1991-08-05 1992-09-01 Hughes Aircraft Company Low temperature co-fired ceramic structure containing buried capacitors
JPH05206730A (ja) * 1992-01-27 1993-08-13 Murata Mfg Co Ltd 電圧制御発振器およびその発振周波数の調整方法
JPH06314622A (ja) * 1993-04-30 1994-11-08 Murata Mfg Co Ltd チップ型回路部品及びその製造方法
JPH06334236A (ja) * 1993-05-20 1994-12-02 Fujitsu Ltd 積層型圧電・電歪アクチュエータの製造方法
JP3461204B2 (ja) * 1993-09-14 2003-10-27 株式会社東芝 マルチチップモジュール
WO1996022008A1 (fr) * 1995-01-10 1996-07-18 Hitachi, Ltd. Appareil electronique a faible interference electromagnetique, carte de circuit a faible interference electromagnetique et procede de fabrication de la carte de circuit a faible interference
US5500628A (en) * 1995-01-24 1996-03-19 Motorola, Inc. Double-sided oscillator package and method of coupling components thereto
US5646580A (en) * 1996-03-04 1997-07-08 Motorola, Inc. Method and apparatus for switching crystals in a crystal controlled oscillator
US5796587A (en) * 1996-06-12 1998-08-18 International Business Machines Corporation Printed circut board with embedded decoupling capacitance and method for producing same
JPH10275747A (ja) * 1997-03-28 1998-10-13 Nec Corp 電気二重層コンデンサ
JP3756041B2 (ja) * 1999-05-27 2006-03-15 Ｈｏｙａ株式会社 多層プリント配線板の製造方法
US6212078B1 (en) 1999-10-27 2001-04-03 Microcoating Technologies Nanolaminated thin film circuitry materials
US6535398B1 (en) * 2000-03-07 2003-03-18 Fujitsu Limited Multichip module substrates with buried discrete capacitors and components and methods for making
JP3796099B2 (ja) * 2000-05-12 2006-07-12 新光電気工業株式会社 半導体装置用インターポーザー、その製造方法および半導体装置
US6407929B1 (en) * 2000-06-29 2002-06-18 Intel Corporation Electronic package having embedded capacitors and method of fabrication therefor
US6388207B1 (en) 2000-12-29 2002-05-14 Intel Corporation Electronic assembly with trench structures and methods of manufacture
JP2003023250A (ja) * 2001-07-06 2003-01-24 Denso Corp 多層基板のおよびその製造方法
US6946923B2 (en) * 2003-11-21 2005-09-20 International Business Machines Corporation Wide range crystal oscillator
KR100651358B1 (ko) * 2005-06-22 2006-11-29 삼성전기주식회사 Ｒｆ모듈의 전력단 회로를 내장한 인쇄회로기판
KR100998499B1 (ko) * 2005-11-16 2010-12-06 쿄세라 코포레이션 전자 부품 밀봉용 기판, 복수개 분할 형태의 전자 부품밀봉용 기판, 전자 부품 밀봉용 기판을 사용한 전자 장치,및 전자 장치의 제조 방법
US8169014B2 (en) * 2006-01-09 2012-05-01 Taiwan Semiconductor Manufacturing Co., Ltd. Interdigitated capacitive structure for an integrated circuit
GB0706638D0 (en) * 2007-04-04 2007-05-16 Mbda Uk Ltd A high-dielectric material
CN103178024B (zh) * 2011-12-26 2015-11-11 深圳光启高等理工研究院 具有复合介电常数的基板及其制备方法
JP6245424B2 (ja) * 2013-08-08 2017-12-13 セイコーエプソン株式会社 発振回路の制御方法、発振用回路、発振器、電子機器及び移動体
CN104519678B (zh) * 2013-09-27 2017-09-26 北大方正集团有限公司 一种pcb板的压合方法
CN107110716B (zh) * 2014-12-18 2020-07-28 霓达株式会社 传感器片
JP2017073647A (ja) * 2015-10-06 2017-04-13 富士通株式会社 水晶振動子、及び水晶振動子の調整方法
JP6610143B2 (ja) * 2015-10-06 2019-11-27 富士通株式会社 水晶振動子、及び水晶振動子の調整方法

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US4485180A (en) * 1982-09-06 1984-11-27 Murata Manufacturing Co., Ltd. High frequency dielectric ceramic compositions

Also Published As

Publication number Publication date
AU563467B2 (en) 1987-07-09
EP0111890B1 (de) 1991-03-13
EP0111890A3 (en) 1986-12-30
US4574255A (en) 1986-03-04
AU2242783A (en) 1984-06-21
EP0111890A2 (de) 1984-06-27

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