ATE131546T1 - Saures bad zur galvanischen abscheidung von kupfer und dessen verwendung - Google Patents
Saures bad zur galvanischen abscheidung von kupfer und dessen verwendungInfo
- Publication number
- ATE131546T1 ATE131546T1 AT92916259T AT92916259T ATE131546T1 AT E131546 T1 ATE131546 T1 AT E131546T1 AT 92916259 T AT92916259 T AT 92916259T AT 92916259 T AT92916259 T AT 92916259T AT E131546 T1 ATE131546 T1 AT E131546T1
- Authority
- AT
- Austria
- Prior art keywords
- pct
- sec
- bath
- copper
- date
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4126502A DE4126502C1 (OSRAM) | 1991-08-07 | 1991-08-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE131546T1 true ATE131546T1 (de) | 1995-12-15 |
Family
ID=6438067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT92916259T ATE131546T1 (de) | 1991-08-07 | 1992-07-22 | Saures bad zur galvanischen abscheidung von kupfer und dessen verwendung |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5433840A (OSRAM) |
| EP (1) | EP0598763B1 (OSRAM) |
| JP (1) | JP3121346B2 (OSRAM) |
| AT (1) | ATE131546T1 (OSRAM) |
| CA (1) | CA2115062C (OSRAM) |
| DE (2) | DE4126502C1 (OSRAM) |
| ES (1) | ES2082486T3 (OSRAM) |
| WO (1) | WO1993003204A1 (OSRAM) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5849171A (en) * | 1990-10-13 | 1998-12-15 | Atotech Deutschland Gmbh | Acid bath for copper plating and process with the use of this combination |
| DE4126502C1 (OSRAM) | 1991-08-07 | 1993-02-11 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De | |
| RU2166567C2 (ru) * | 1995-09-22 | 2001-05-10 | Сиркюи Фуаль Люксембург Трейдинг С.А.Р.Л. | Способ изготовления электроосажденной медной фольги и медная фольга, полученная этим способом |
| JP3313277B2 (ja) * | 1995-09-22 | 2002-08-12 | 古河サーキットフォイル株式会社 | ファインパターン用電解銅箔とその製造方法 |
| WO1998036042A1 (en) * | 1997-02-14 | 1998-08-20 | The Procter & Gamble Company | Liquid hard-surface cleaning compositions based on specific dicapped polyalkylene glycols |
| US6460548B1 (en) * | 1997-02-14 | 2002-10-08 | The Procter & Gamble Company | Liquid hard-surface cleaning compositions based on specific dicapped polyalkylene glycols |
| US5863410A (en) * | 1997-06-23 | 1999-01-26 | Circuit Foil Usa, Inc. | Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby |
| US7033463B1 (en) * | 1998-08-11 | 2006-04-25 | Ebara Corporation | Substrate plating method and apparatus |
| WO2000014306A1 (fr) * | 1998-09-03 | 2000-03-16 | Ebara Corporation | Procede et dispositif de revetement de substrat |
| US6444110B2 (en) * | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
| JP2001073182A (ja) * | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | 改良された酸性銅電気メッキ用溶液 |
| EP1207730B1 (en) * | 1999-08-06 | 2009-09-16 | Ibiden Co., Ltd. | Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board |
| LU90532B1 (en) | 2000-02-24 | 2001-08-27 | Circuit Foil Luxembourg Trading Sarl | Comosite copper foil and manufacturing method thereof |
| US6491806B1 (en) * | 2000-04-27 | 2002-12-10 | Intel Corporation | Electroplating bath composition |
| US6361673B1 (en) | 2000-06-27 | 2002-03-26 | Ga-Tek Inc. | Electroforming cell |
| US6679983B2 (en) * | 2000-10-13 | 2004-01-20 | Shipley Company, L.L.C. | Method of electrodepositing copper |
| US7074315B2 (en) | 2000-10-19 | 2006-07-11 | Atotech Deutschland Gmbh | Copper bath and methods of depositing a matt copper coating |
| DE10058896C1 (de) * | 2000-10-19 | 2002-06-13 | Atotech Deutschland Gmbh | Elektrolytisches Kupferbad, dessen Verwendung und Verfahren zur Abscheidung einer matten Kupferschicht |
| US6797146B2 (en) * | 2000-11-02 | 2004-09-28 | Shipley Company, L.L.C. | Seed layer repair |
| US20020195351A1 (en) * | 2001-04-12 | 2002-12-26 | Chang Chun Plastics Co., Ltd. | Copper electroplating composition for integrated circuit interconnection |
| JP2003105584A (ja) * | 2001-07-26 | 2003-04-09 | Electroplating Eng Of Japan Co | 微細配線埋め込み用銅メッキ液及びそれを用いた銅メッキ方法 |
| US6911068B2 (en) * | 2001-10-02 | 2005-06-28 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| US6736954B2 (en) * | 2001-10-02 | 2004-05-18 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| US6652731B2 (en) | 2001-10-02 | 2003-11-25 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| EP1310582A1 (en) * | 2001-11-07 | 2003-05-14 | Shipley Company LLC | Process for electrolytic copper plating |
| US6676823B1 (en) * | 2002-03-18 | 2004-01-13 | Taskem, Inc. | High speed acid copper plating |
| EP1475463B2 (en) † | 2002-12-20 | 2017-03-01 | Shipley Company, L.L.C. | Reverse pulse plating method |
| DE10261852B3 (de) * | 2002-12-20 | 2004-06-03 | Atotech Deutschland Gmbh | Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad |
| US6851200B2 (en) * | 2003-03-14 | 2005-02-08 | Hopkins Manufacturing Corporation | Reflecting lighted level |
| DE102004045451B4 (de) | 2004-09-20 | 2007-05-03 | Atotech Deutschland Gmbh | Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer |
| TWI400365B (zh) | 2004-11-12 | 2013-07-01 | Enthone | 微電子裝置上的銅電沈積 |
| US20070158199A1 (en) * | 2005-12-30 | 2007-07-12 | Haight Scott M | Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps |
| US20070178697A1 (en) * | 2006-02-02 | 2007-08-02 | Enthone Inc. | Copper electrodeposition in microelectronics |
| US8784634B2 (en) | 2006-03-30 | 2014-07-22 | Atotech Deutschland Gmbh | Electrolytic method for filling holes and cavities with metals |
| JP2007327127A (ja) * | 2006-06-09 | 2007-12-20 | Daiwa Fine Chemicals Co Ltd (Laboratory) | 銀めっき方法 |
| US7905994B2 (en) | 2007-10-03 | 2011-03-15 | Moses Lake Industries, Inc. | Substrate holder and electroplating system |
| US8262894B2 (en) | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
| MY156690A (en) * | 2010-03-18 | 2016-03-15 | Basf Se | Composition for metal electroplating comprising leveling agent |
| US8691987B2 (en) | 2010-09-24 | 2014-04-08 | Andrew M. Krol | Method of producing polymeric phenazonium compounds |
| US8735580B2 (en) | 2010-09-24 | 2014-05-27 | Andrew M. Krol | Method of producing polymeric phenazonium compounds |
| CN103422079B (zh) * | 2012-05-22 | 2016-04-13 | 比亚迪股份有限公司 | 一种化学镀铜液及其制备方法 |
| EP2735627A1 (en) * | 2012-11-26 | 2014-05-28 | ATOTECH Deutschland GmbH | Copper plating bath composition |
| WO2015077772A1 (en) * | 2013-11-25 | 2015-05-28 | Enthone Inc. | Electrodeposition of copper |
| DE102014208733A1 (de) | 2014-05-09 | 2015-11-12 | Dr. Hesse Gmbh & Cie Kg | Verfahren zum elektrolytischen Abscheiden von Kupfer aus Wasser basierenden Elektrolyten |
| JP6733314B2 (ja) * | 2015-09-29 | 2020-07-29 | 三菱マテリアル株式会社 | 高純度銅電解精錬用添加剤と高純度銅製造方法 |
| CA3119028A1 (en) * | 2018-11-07 | 2020-05-14 | Coventya, Inc. | Satin copper bath and method of depositing a satin copper layer |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA633957A (en) * | 1962-01-02 | Unipak Cartons Ltd. | Container carton and cellular structure therefor | |
| NL291575A (OSRAM) * | 1962-04-16 | |||
| DE1293749B (de) * | 1965-04-24 | 1969-04-30 | Hoechst Ag | Verfahren zur Aufarbeitung der bei der Herstellung von Sorbinsaeure durch thermische Polyesterspaltung entstandenen waessrigen Polyglykoldialkylaetherloesung |
| DE2028803C3 (de) * | 1970-06-06 | 1980-08-14 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Polymere Phenazoniumverbindungen |
| US3804729A (en) * | 1972-06-19 | 1974-04-16 | M & T Chemicals Inc | Electrolyte and process for electro-depositing copper |
| DE2746938C2 (de) * | 1977-10-17 | 1987-04-09 | Schering AG, 1000 Berlin und 4709 Bergkamen | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades |
| FR2510145B1 (fr) * | 1981-07-24 | 1986-02-07 | Rhone Poulenc Spec Chim | Additif pour bain de cuivrage electrolytique acide, son procede de preparation et son application au cuivrage des circuits imprimes |
| AU554236B2 (en) * | 1983-06-10 | 1986-08-14 | Omi International Corp. | Electrolyte composition and process for electrodepositing copper |
| DE3722778A1 (de) * | 1987-07-09 | 1989-03-09 | Raschig Ag | Polyalkylenglykol-naphthyl-3-sulfopropyl- diether und deren salze, verfahren zur herstellung dieser verbindungen und ihre verwendung als netzmittel in der galvanotechnik |
| DE3836521C2 (de) | 1988-10-24 | 1995-04-13 | Atotech Deutschland Gmbh | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades |
| DE4126502C1 (OSRAM) | 1991-08-07 | 1993-02-11 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De | |
| US5328589A (en) * | 1992-12-23 | 1994-07-12 | Enthone-Omi, Inc. | Functional fluid additives for acid copper electroplating baths |
| JP5727189B2 (ja) | 2010-10-01 | 2015-06-03 | Necエンジニアリング株式会社 | 同期整流型電源回路 |
| JP5752960B2 (ja) | 2011-03-10 | 2015-07-22 | ダイヤモンド電機株式会社 | 電磁式可変バルブタイミング装置用の制御装置 |
| JP5838516B2 (ja) | 2011-05-19 | 2016-01-06 | 株式会社ブイ・テクノロジー | フォトマスク及び露光装置 |
| JP6220278B2 (ja) | 2014-01-31 | 2017-10-25 | 京葉瓦斯株式会社 | テープ貼付け方法及びテープ貼付け冶具並びにテープ |
-
1991
- 1991-08-07 DE DE4126502A patent/DE4126502C1/de not_active Expired - Fee Related
-
1992
- 1992-07-22 EP EP92916259A patent/EP0598763B1/de not_active Expired - Lifetime
- 1992-07-22 US US08/193,016 patent/US5433840A/en not_active Expired - Lifetime
- 1992-07-22 DE DE59204703T patent/DE59204703D1/de not_active Expired - Lifetime
- 1992-07-22 WO PCT/DE1992/000605 patent/WO1993003204A1/de not_active Ceased
- 1992-07-22 ES ES92916259T patent/ES2082486T3/es not_active Expired - Lifetime
- 1992-07-22 AT AT92916259T patent/ATE131546T1/de active
- 1992-07-22 CA CA002115062A patent/CA2115062C/en not_active Expired - Fee Related
- 1992-07-22 JP JP05503171A patent/JP3121346B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| ES2082486T3 (es) | 1996-03-16 |
| DE4126502C1 (OSRAM) | 1993-02-11 |
| WO1993003204A1 (de) | 1993-02-18 |
| EP0598763B1 (de) | 1995-12-13 |
| CA2115062C (en) | 2005-11-22 |
| JPH07505187A (ja) | 1995-06-08 |
| CA2115062A1 (en) | 1993-02-18 |
| US5433840A (en) | 1995-07-18 |
| JP3121346B2 (ja) | 2000-12-25 |
| EP0598763A1 (de) | 1994-06-01 |
| DE59204703D1 (de) | 1996-01-25 |
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