AT501653A5 - Substrat-reinigungsverfahren, substrat-reinigungsvorrichtung und computer-lesbares aufzeichnungsmedium - Google Patents
Substrat-reinigungsverfahren, substrat-reinigungsvorrichtung und computer-lesbares aufzeichnungsmedium Download PDFInfo
- Publication number
- AT501653A5 AT501653A5 AT0939904A AT93992004A AT501653A5 AT 501653 A5 AT501653 A5 AT 501653A5 AT 0939904 A AT0939904 A AT 0939904A AT 93992004 A AT93992004 A AT 93992004A AT 501653 A5 AT501653 A5 AT 501653A5
- Authority
- AT
- Austria
- Prior art keywords
- substrate cleaning
- computer
- recording medium
- readable recording
- cleaning device
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title 2
- 239000000758 substrate Substances 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
- G11B23/50—Reconditioning of record carriers; Cleaning of record carriers ; Carrying-off electrostatic charges
- G11B23/505—Reconditioning of record carriers; Cleaning of record carriers ; Carrying-off electrostatic charges of disk carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003387728 | 2003-11-18 | ||
PCT/JP2004/016842 WO2005050724A1 (ja) | 2003-11-18 | 2004-11-12 | 基板洗浄方法、基板洗浄装置およびコンピュータ読み取り可能な記録媒体 |
Publications (3)
Publication Number | Publication Date |
---|---|
AT501653A2 AT501653A2 (de) | 2006-10-15 |
AT501653A5 true AT501653A5 (de) | 2010-02-15 |
AT501653B1 AT501653B1 (de) | 2010-04-15 |
Family
ID=34616168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT0939904A AT501653B1 (de) | 2003-11-18 | 2004-11-12 | Substrat-reinigungsverfahren, substrat-reinigungsvorrichtung und computer-lesbares aufzeichnungsmedium |
Country Status (7)
Country | Link |
---|---|
US (2) | US7927429B2 (de) |
JP (1) | JP4040063B2 (de) |
KR (1) | KR100772469B1 (de) |
CN (1) | CN100423205C (de) |
AT (1) | AT501653B1 (de) |
TW (1) | TWI242808B (de) |
WO (1) | WO2005050724A1 (de) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI286353B (en) | 2004-10-12 | 2007-09-01 | Tokyo Electron Ltd | Substrate processing method and substrate processing apparatus |
JP4527660B2 (ja) * | 2005-06-23 | 2010-08-18 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
US7914626B2 (en) | 2005-11-24 | 2011-03-29 | Tokyo Electron Limited | Liquid processing method and liquid processing apparatus |
JP4680044B2 (ja) * | 2005-11-24 | 2011-05-11 | 東京エレクトロン株式会社 | 液処理方法、液処理装置、制御プログラム、およびコンピュータ読取可能な記憶媒体 |
JP4607755B2 (ja) * | 2005-12-19 | 2011-01-05 | 東京エレクトロン株式会社 | 基板洗浄方法、基板洗浄装置、制御プログラム、およびコンピュータ読取可能な記憶媒体 |
CN101405835A (zh) * | 2006-03-17 | 2009-04-08 | Nxp股份有限公司 | 清洁半导体晶片的方法 |
CN100459057C (zh) * | 2006-05-22 | 2009-02-04 | 中芯国际集成电路制造(上海)有限公司 | 晶圆表面的清洗方法 |
JP5143498B2 (ja) * | 2006-10-06 | 2013-02-13 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置、プログラムならびに記録媒体 |
JP5166802B2 (ja) | 2007-09-13 | 2013-03-21 | 株式会社Sokudo | 基板処理装置および基板処理方法 |
JP5192206B2 (ja) | 2007-09-13 | 2013-05-08 | 株式会社Sokudo | 基板処理装置および基板処理方法 |
CN101391254B (zh) * | 2007-09-17 | 2010-04-21 | 中芯国际集成电路制造(上海)有限公司 | 晶片清洗方法 |
JP4940123B2 (ja) * | 2007-12-21 | 2012-05-30 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
JP5151629B2 (ja) | 2008-04-03 | 2013-02-27 | 東京エレクトロン株式会社 | 基板洗浄方法、基板洗浄装置、現像方法、現像装置及び記憶媒体 |
US20100154826A1 (en) * | 2008-12-19 | 2010-06-24 | Tokyo Electron Limited | System and Method For Rinse Optimization |
US8707974B2 (en) | 2009-12-11 | 2014-04-29 | United Microelectronics Corp. | Wafer cleaning device |
CN104624545A (zh) * | 2009-12-24 | 2015-05-20 | 联华电子股份有限公司 | 晶片清洗装置及晶片清洗方式 |
US20110180113A1 (en) * | 2010-01-28 | 2011-07-28 | Chin-Cheng Chien | Method of wafer cleaning and apparatus of wafer cleaning |
JP2011176035A (ja) * | 2010-02-23 | 2011-09-08 | Disco Corp | ウエーハの洗浄方法 |
KR101806191B1 (ko) | 2010-06-17 | 2017-12-07 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 방법, 이 기판 처리 방법을 실행하기 위한 컴퓨터 프로그램이 기록된 기록 매체 및 기판 처리 장치 |
JP5538102B2 (ja) * | 2010-07-07 | 2014-07-02 | 株式会社Sokudo | 基板洗浄方法および基板洗浄装置 |
JP5889537B2 (ja) * | 2011-03-23 | 2016-03-22 | ファスフォードテクノロジ株式会社 | ダイボンダ |
JP5789400B2 (ja) * | 2011-04-12 | 2015-10-07 | 東京エレクトロン株式会社 | 液処理方法及び液処理装置 |
TWI566311B (zh) * | 2011-06-27 | 2017-01-11 | 聯華電子股份有限公司 | 半導體機台與其操作方法 |
JP2013201418A (ja) * | 2012-02-24 | 2013-10-03 | Ebara Corp | 基板処理方法 |
CN102580941A (zh) * | 2012-02-27 | 2012-07-18 | 上海集成电路研发中心有限公司 | 提高晶圆清洁度的清洗方法及清洗甩干设备 |
JP5926086B2 (ja) | 2012-03-28 | 2016-05-25 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP6250924B2 (ja) * | 2012-10-02 | 2017-12-20 | 株式会社荏原製作所 | 基板洗浄装置および研磨装置 |
US9079304B2 (en) * | 2012-10-31 | 2015-07-14 | Semes Co., Ltd. | Transfer unit, method for controlling the transfer unit, and apparatus and method for treating substrate using the transfer unit |
JP6007925B2 (ja) * | 2013-05-28 | 2016-10-19 | 東京エレクトロン株式会社 | 基板洗浄装置、基板洗浄方法及び記憶媒体 |
TWI597770B (zh) * | 2013-09-27 | 2017-09-01 | 斯克林集團公司 | 基板處理裝置及基板處理方法 |
JP6308910B2 (ja) * | 2013-11-13 | 2018-04-11 | 東京エレクトロン株式会社 | 基板洗浄方法、基板洗浄システムおよび記憶媒体 |
JP6064875B2 (ja) * | 2013-11-25 | 2017-01-25 | 東京エレクトロン株式会社 | 液処理装置、液処理方法及び記憶媒体 |
US9793143B2 (en) * | 2014-01-06 | 2017-10-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor processing apparatus and method of operating the same |
JP6386769B2 (ja) * | 2014-04-16 | 2018-09-05 | 株式会社荏原製作所 | 基板乾燥装置、制御プログラム、及び基板乾燥方法 |
JP2015211137A (ja) * | 2014-04-25 | 2015-11-24 | キヤノン株式会社 | 半導体素子の製造方法及び洗浄処理システム |
JP6251825B2 (ja) | 2014-06-16 | 2017-12-20 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置、及び基板を搬送する方法 |
KR102231022B1 (ko) * | 2014-07-14 | 2021-03-25 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
JP6454245B2 (ja) * | 2014-10-21 | 2019-01-16 | 東京エレクトロン株式会社 | 基板液処理方法及び基板液処理装置並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体 |
KR20160057966A (ko) | 2014-11-14 | 2016-05-24 | 가부시끼가이샤 도시바 | 처리 장치, 노즐 및 다이싱 장치 |
JP6545511B2 (ja) * | 2015-04-10 | 2019-07-17 | 株式会社東芝 | 処理装置 |
TWI638034B (zh) | 2015-11-14 | 2018-10-11 | 東京威力科創股份有限公司 | 使用稀釋的氫氧化四甲基銨處理微電子基板的方法 |
JP6690717B2 (ja) * | 2016-08-22 | 2020-04-28 | 東京エレクトロン株式会社 | 塗布方法、塗布装置及び記憶媒体 |
JP6975953B2 (ja) * | 2016-12-28 | 2021-12-01 | ヒューグル開発株式会社 | 異物除去装置及び異物除去方法 |
US11325822B2 (en) * | 2018-11-21 | 2022-05-10 | Organo Corporation | Water dispenser and pure water producing apparatus |
CN112859548B (zh) * | 2019-11-27 | 2024-03-26 | 长鑫存储技术有限公司 | 显影装置及其显影方法 |
US11728185B2 (en) | 2021-01-05 | 2023-08-15 | Applied Materials, Inc. | Steam-assisted single substrate cleaning process and apparatus |
KR102615758B1 (ko) * | 2021-05-10 | 2023-12-19 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
Family Cites Families (16)
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JP2640999B2 (ja) | 1991-01-22 | 1997-08-13 | 大日本スクリーン製造株式会社 | 回転式表面処理方法及びその方法を実施するための回転式表面処理装置 |
US6058945A (en) * | 1996-05-28 | 2000-05-09 | Canon Kabushiki Kaisha | Cleaning methods of porous surface and semiconductor surface |
JP3691227B2 (ja) * | 1996-10-07 | 2005-09-07 | 東京エレクトロン株式会社 | 液処理方法及びその装置 |
US5997653A (en) | 1996-10-07 | 1999-12-07 | Tokyo Electron Limited | Method for washing and drying substrates |
JPH10303169A (ja) | 1997-04-30 | 1998-11-13 | Shibaura Eng Works Co Ltd | スピン処理装置 |
US6491764B2 (en) | 1997-09-24 | 2002-12-10 | Interuniversitair Microelektronics Centrum (Imec) | Method and apparatus for removing a liquid from a surface of a rotating substrate |
JPH11233480A (ja) | 1998-02-10 | 1999-08-27 | Dainippon Screen Mfg Co Ltd | 基板乾燥装置及びその方法 |
JP3322853B2 (ja) | 1999-08-10 | 2002-09-09 | 株式会社プレテック | 基板の乾燥装置および洗浄装置並びに乾燥方法および洗浄方法 |
US6488040B1 (en) * | 2000-06-30 | 2002-12-03 | Lam Research Corporation | Capillary proximity heads for single wafer cleaning and drying |
JP3694641B2 (ja) * | 2000-08-09 | 2005-09-14 | 東京エレクトロン株式会社 | 基板処理装置、現像処理装置及び現像処理方法 |
JP2002075949A (ja) | 2000-08-31 | 2002-03-15 | Seiko Epson Corp | ウェハ洗浄乾燥方法 |
JP2003017461A (ja) | 2001-07-03 | 2003-01-17 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP3803913B2 (ja) * | 2001-07-12 | 2006-08-02 | 大日本スクリーン製造株式会社 | 基板乾燥装置、基板乾燥方法および基板のシリコン酸化膜除去方法 |
JP3892792B2 (ja) | 2001-11-02 | 2007-03-14 | 大日本スクリーン製造株式会社 | 基板処理装置および基板洗浄装置 |
JP2003197590A (ja) | 2001-12-21 | 2003-07-11 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP4940066B2 (ja) * | 2006-10-23 | 2012-05-30 | 東京エレクトロン株式会社 | 洗浄装置、洗浄方法、およびコンピュータ読取可能な記憶媒体 |
-
2004
- 2004-11-12 AT AT0939904A patent/AT501653B1/de not_active IP Right Cessation
- 2004-11-12 KR KR1020057021359A patent/KR100772469B1/ko active IP Right Grant
- 2004-11-12 US US10/577,314 patent/US7927429B2/en not_active Expired - Fee Related
- 2004-11-12 WO PCT/JP2004/016842 patent/WO2005050724A1/ja active Application Filing
- 2004-11-12 JP JP2005515595A patent/JP4040063B2/ja active Active
- 2004-11-12 CN CNB2004800339443A patent/CN100423205C/zh active Active
- 2004-11-15 TW TW093134967A patent/TWI242808B/zh not_active IP Right Cessation
-
2011
- 2011-03-08 US US13/042,844 patent/US8113221B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPWO2005050724A1 (ja) | 2007-06-14 |
TW200524029A (en) | 2005-07-16 |
US8113221B2 (en) | 2012-02-14 |
AT501653B1 (de) | 2010-04-15 |
US20110155193A1 (en) | 2011-06-30 |
KR20060034640A (ko) | 2006-04-24 |
JP4040063B2 (ja) | 2008-01-30 |
CN100423205C (zh) | 2008-10-01 |
TWI242808B (en) | 2005-11-01 |
AT501653A2 (de) | 2006-10-15 |
US7927429B2 (en) | 2011-04-19 |
CN1883035A (zh) | 2006-12-20 |
WO2005050724A1 (ja) | 2005-06-02 |
US20070131256A1 (en) | 2007-06-14 |
KR100772469B1 (ko) | 2007-11-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ELJ | Ceased due to non-payment of the annual fee |