WO2023185923A1 - 覆晶封装结构的形成方法、覆晶封装结构及显示装置 - Google Patents

覆晶封装结构的形成方法、覆晶封装结构及显示装置 Download PDF

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Publication number
WO2023185923A1
WO2023185923A1 PCT/CN2023/084686 CN2023084686W WO2023185923A1 WO 2023185923 A1 WO2023185923 A1 WO 2023185923A1 CN 2023084686 W CN2023084686 W CN 2023084686W WO 2023185923 A1 WO2023185923 A1 WO 2023185923A1
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WO
WIPO (PCT)
Prior art keywords
chip
heat sink
colloid
flexible substrate
flip
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PCT/CN2023/084686
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English (en)
French (fr)
Inventor
杨宗铭
石浩
Original Assignee
颀中科技（苏州）有限公司
合肥颀中科技股份有限公司
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Publication of WO2023185923A1 publication Critical patent/WO2023185923A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays

Definitions

  • the present invention relates to the field of chip packaging technology, in particular to a method for forming a flip-chip packaging structure, a flip-chip packaging structure and a display device.
  • Flip Chip technology also known as "flip chip packaging” or “flip chip packaging method” is a type of chip packaging technology. This packaging technology is different from the past method of placing the chip on the substrate and then using wire bonding technology to connect the chip to the connection points on the substrate. Instead, solder joints are grown on the chip connection points, and then the chip is turned over so that the solder joints are directly connected to the substrate.
  • flip-chip technology has been widely used in microprocessor packaging, and has also become a mainstream packaging technology for graphics, special applications, and computer chipsets.
  • representative examples of flip-chip technology are chip-on-glass (COG) and chip-on-film (COF).
  • thin film flip-chip packaging is a soft film construction technology that fixes integrated circuits (ICs) on flexible circuit boards.
  • a soft additional circuit board is used as a packaging chip carrier to connect the chip and the flexible substrate.
  • the circuits are combined, and encapsulating colloid is set on the upper side of the flexible substrate next to the chip for packaging.
  • the chip will generate a lot of heat during use. If this heat cannot be released effectively, it will affect the performance and usage of the chip. Therefore, after the packaging is completed using encapsulating colloid between the chip and the flexible substrate, there will generally be a seal on the back of the chip. Attach a thermal pad to dissipate heat from the chip.
  • the heat dissipation patch is attached to the surface of the packaging structure, especially the surface with the chip.
  • the requirements for the clarity of the display panel are getting higher and higher.
  • the higher the clarity, the heat generated during the operation of the chip will also increase accordingly.
  • the heat generation of the circuit layer on the flexible substrate will also increase accordingly.
  • the heat dissipation sticker is attached to the package structure by rolling. Since the chip has a certain height and the bottom-filled packaging gel covering the chip has an irregular slope shape, the prior art attachment method is used. It is easy to generate arches or bubbles at the transition position between the chip and the flexible substrate, which not only affects the heat dissipation effect but also affects the smoothness of the surface.
  • the purpose of the present invention is to provide a flip-chip packaging structure to solve the deficiencies in the prior art. It can more conveniently implement the attachment of heat dissipation patches, is simple to operate, and is not prone to wrinkles or bubbles after attachment. .
  • the flexible circuit board includes a flexible substrate and a circuit layer and inner pins provided on the flexible substrate;
  • the chip is provided with bumps;
  • An encapsulating colloid is formed on the side of the chip, and the encapsulating colloid is located on the upper side of the flexible substrate;
  • a first heat sink is attached to the upper surface of the flexible substrate, wherein an escape hole matching the packaging colloid is formed on the first heat sink;
  • a second heat sink is attached to the upper surface of the chip, wherein the second heat sink includes a central bonding portion that matches the upper surface of the chip and edge stickers extending from the center bonding portion to both sides. joint part;
  • a rolling mechanism is used to bend the edge fitting portion of the second heat sink and attach it to the encapsulant, and after the attachment is completed, the edge of the second heat sink covers the first heat sink. superior.
  • attachment the first heat sink to the upper surface of the flexible substrate includes the following steps:
  • the first header is used to absorb the first heat sink, wherein the first header is provided with an escape groove for avoiding the chip. After the first heat sink is adsorbed by the first header, the escape groove is connected to the first heat sink.
  • the above-mentioned avoidance holes are in relative positions;
  • the first header is controlled to move toward the flexible substrate and the first heat sink is pressed tightly against the flexible substrate.
  • a heat dissipation substrate is provided, and an escape hole is cut in the center of the heat dissipation substrate to form the first heat dissipation fin.
  • the shape of the escape hole is adapted to the shape of the outer contour of the encapsulant, and the cut escape hole is a rectangular hole.
  • the packaging colloid has a colloid bottom surface disposed on the upper side of the flexible substrate and a colloid side surface disposed on the side of the chip.
  • the side of the colloid bottom surface away from the chip is the outer edge of the colloid.
  • the outer edge of the colloid is The distance from the plane where the side of the chip is located is L, where L satisfies the following conditions: L1 ⁇ L ⁇ L2; L1 is the shortest distance, and L2 is the longest distance;
  • the width A1 of the avoidance hole is not greater than D1+2*L1, where D1 is the size of the chip in the width direction, in mm;
  • the length A2 of the escape hole is no greater than D2+2*L1, where D2 is the size of the chip in the length direction, in mm.
  • the width of the edge bonding portions extending from the center bonding portion to both sides is not less than 0.2+ ⁇ ((H1 ⁇ 2+L2 ⁇ 2)) , where H1 is the height of the chip, in mm.
  • attaching a second heat sink to the upper surface of the chip includes the following steps:
  • the second header is controlled to move toward the chip and the second heat sink is pressed tightly against the chip.
  • the activity trajectory of the rolling mechanism is as follows: first, from the edge of the chip The top surface moves to the side of the chip, and finally moves to the flexible circuit board along the outer surface of the encapsulant.
  • Another embodiment of the present invention also discloses a flip-chip packaging structure, which is manufactured using the above-described method for forming a flip-chip packaging structure.
  • Another embodiment of the present invention also discloses a display device, including: a display screen and the flip-chip packaging structure, the flexible circuit board also has external pins provided on the flexible substrate, the The external pin is electrically connected to the display screen.
  • the method for forming a flip-chip packaging structure disclosed in the embodiment of the present invention separates the entire heat sink originally attached to the flexible circuit board and the core 2 into a first heat sink when attaching the heat sink.
  • the first heat sink is mainly used to be attached to the flexible substrate to dissipate heat from the flexible substrate.
  • the second heat sink is attached to the chip and the packaging gel next to the chip. on the chip to dissipate heat for the chip; during the attachment process, you need to attach the first heat sink first, and then attach the second heat sink, which makes it easier to attach the heat sink.
  • the operation is simple, and after attachment Not prone to wrinkles or bubbles.
  • Figure 1 is a schematic structural diagram of a flip-chip packaging structure disclosed in an embodiment of the present invention
  • Figure 2 is a cross-sectional view along the AA direction in Figure 1;
  • Figure 3 is a schematic structural diagram of the flip-chip packaging structure disclosed in the embodiment of the present invention after the second heat dissipation patch is attached and before the rolling mechanism is rolled;
  • Figure 4 is a schematic structural diagram of the flip-chip packaging structure disclosed in the embodiment of the present invention after being rolled by the rolling mechanism after the second heat dissipation patch is attached;
  • Figure 5 is a schematic structural diagram of the first heat dissipation patch in the flip-chip packaging structure disclosed in the embodiment of the present invention.
  • Embodiments of the present invention A method for forming a flip-chip packaging structure is disclosed.
  • the flip-chip packaging structure formed by the formation method can be applied to liquid crystal displays (LCDs) and organic light-emitting secondary displays (organic displays). light-emitting diode, OLED) and other display devices.
  • LCDs liquid crystal displays
  • organic displays organic light-emitting secondary displays
  • OLED light-emitting diode
  • the upper surface of the flexible substrate is generally covered during the process of attaching a heat dissipation patch to a chip, so that the heat dissipation patch can simultaneously dissipate heat to the circuit layer and chip on the flexible substrate.
  • the flexible substrate and the chip are joined through the pins and the bumps, there is a height difference between the flexible circuit board and the chip. Due to the existence of the height difference, the heat dissipation patch cannot Fits perfectly against the chip.
  • the existing attachment method is to first use a pick-up head to absorb the heat dissipation patch, and then attach the heat dissipation patch to the upper surface of the chip.
  • the heat dissipation patch only attaches to the chip in the middle part of the middle bonding area, but the edges of the heat dissipation patch are affixed.
  • the attached area is not completely attached to the flexible substrate.
  • the rolling mechanism 100 is used to move the heat dissipation patch along the chip to both ends, and finally press the heat dissipation patch onto the flexible substrate.
  • inventions of the present invention disclose a method for forming a flip-chip packaging structure.
  • the method for forming a flip-chip packaging structure specifically includes the following steps:
  • the flexible circuit board 1 includes a flexible substrate 11 and a circuit layer 12 and inner pins 13 provided on the flexible substrate 11;
  • S200 Provide a chip 2, the chip 2 is provided with bumps 21; the chip 2 can be a driver chip for a display device;
  • S300 Electrically connect the inner pins 13 of the flexible circuit board 1 to the bumps 21 of the chip 2;
  • S400 Form an encapsulating colloid 3 on the side of the chip 2, and the encapsulating colloid 3 is located on the upper side of the flexible substrate 11;
  • the entire heat sink originally attached to the flexible circuit board 1 and the chip 2 is divided into a first heat sink 4 and a second heat sink.
  • Heat sink 5 The first heat sink 4 is mainly used to be attached to the flexible substrate 11 to dissipate heat from the flexible substrate 11.
  • the second heat sink 5 is attached to the chip 2 and the package next to the chip 2. on the colloid 3 to dissipate heat for the chip 2 .
  • the first heat sink 4 needs to be attached first, and then the second heat sink 5 is attached during the attachment process.
  • the first heat sink 4 is attached to a relatively flat flexible surface. On the substrate 11, it is relatively easy to operate, and it is not easy to produce wrinkles or bubbles after being attached. If the second heat sink 5 is attached first and then the first heat sink 4 is attached, the position of the second heat sink 5 after being attached is difficult to control, that is, after the second heat sink 5 is attached to the chip 2
  • the position of its edge is uncertain, which means that the avoidance hole formed on the first heat sink 4 may not be able to avoid the second heat sink 5, thereby causing interference when the first heat sink 4 is attached, affecting the second heat sink 4.
  • the flexible substrate 11 is an entire plane, the operation can be better realized when attaching the first heat sink 4; and in order to avoid the influence of the chip 2, an avoidance is provided on the first heat sink 4 holes 41, so that bubbles or wrinkles are less likely to occur when the first heat sink 4 is attached, and the attached first heat sink 4 can be made smoother.
  • the attached heat sink 5 When attaching the second heat sink 5 , the attached heat sink only needs to cover the encapsulant 3 . Therefore, the size of the second heat sink 5 can be controlled to be relatively narrow, so that after the second heat sink 5 is attached to the upper surface of the chip 1 and before being rolled by the rolling mechanism 100, it extends out of the chip 1.
  • the edge bonding portion 52 on the upper surface can be set very short. If the edge bonding portion 52 is set short, the heat dissipation patch will not easily sag. In this way, the heat dissipation patch pre-attached to the upper surface of the chip 2 can only be pressed by the rolling mechanism.
  • the bending occurs only when the 100-degree roller is pressed, and under the action of the roller-pressing mechanism 100, the transition from the chip 2 to the encapsulating colloid 3 can be smoothed, thereby making the attached heat dissipation patch smoother.
  • the heat dissipation patch needs to be bonded to the packaging colloid 3 and the flexible substrate 11 simultaneously, so the size needs to be wide enough, so that the central bonding part of the heat dissipation patch is attached to the upper surface of the chip 2 to complete the pre-heating process.
  • After bonding due to the large size extending outside the chip 2, it is easy to sag.
  • part of the heat dissipation patch will be adhered to the flexible substrate, and after pasting, it is easy to form between the pasting position and the chip. Bubbles and wrinkles will affect the heat dissipation effect and may also cause the attached heat dissipation patch to have more wrinkles and fail to meet customer requirements.
  • the embodiments of the present invention can effectively avoid the above problems.
  • S502 Use the first header to absorb the first heat sink 4, wherein the first header is provided with an escape groove for avoiding the chip 2. After the first heat sink 4 is adsorbed by the first header, the first heat sink 4 is absorbed by the first header.
  • the escape groove is positioned opposite to the escape hole 41;
  • S506 Control the first retrieval head to move toward the flexible substrate 11 and press the first heat sink 4 tightly onto the flexible substrate 11.
  • S501 Provide a heat dissipation substrate, and cut an escape hole 41 in the center of the heat dissipation substrate to form the first heat dissipation fin 4 .
  • S602 Use the second header to absorb the second heat sink 5, wherein the bottom surface of the second header to absorb the second heat sink 5 is flat;
  • S604 Control the second header to move toward the chip 2 and press the second heat sink 5 tightly onto the chip 1 .
  • the first header is provided with a chip that is suitable for the chip 2. Equipped with an escape groove, this can prevent the protruding chip 2 from affecting the heat dissipation patch when it is pressed.
  • the area where the first pick-up head absorbs the first heat sink 4 is a flat pressing part.
  • the flat pressing part is located at the edge of the escape groove and surrounds the escape groove.
  • the flat pressing part has a planar structure to facilitate alignment.
  • a heat sink 4 is pressed tightly together.
  • the second size of the header is determined to be flat as a whole, and after adsorbing the second heat sink 5, the second heat sink 5 is pasted on the chip 2.
  • the activity trajectory of the rolling mechanism 100 is as follows : First move from the top surface of the chip 2 to the side of the chip 2, and finally move to the flexible circuit board 1 along the outer surface of the packaging colloid 3.
  • the above-mentioned rolling method of the rolling mechanism 100 can better make the heat dissipation paste adhere to the side of the encapsulating compound 3 and the chip 2, and can reduce the occurrence of bubbles.
  • the edge bonding portions of the second heat sink 5 are only provided on two opposite sides of the central bonding portion 51 , and are not provided on the other two sides of the central bonding portion 51 .
  • the chip 2 is rectangular and has a length direction and a width direction.
  • the central bonding portion 51 is also rectangular, and the two edge bonding portions 52 extend outward from the long sides of the central bonding portion 51 . This can avoid the chip 2 being attached during the attachment of the second heat sink 5 . Wrinkles appear where the length and width directions meet. Extending the edge bonding portion 52 along the longitudinal direction of the center bonding portion 51 can also enable more bonding with the chip 2 , thereby enabling better heat dissipation of the chip 2 .
  • FIG. 1-5 another embodiment of the present invention also discloses a flip-chip packaging structure, including: a flexible circuit board 1, a chip 2, a packaging colloid 3, a first heat sink 4 and a second heat sink 5;
  • the flexible circuit board 1 includes a flexible substrate 11 and a circuit layer 12 and inner pins 13 provided on the flexible substrate 11 .
  • the flexible substrate 11 has a first surface and a second surface that are oppositely arranged.
  • the first surface includes a chip bonding area.
  • the circuit layer 12 and the inner pins 13 are both disposed on the flexible substrate. on the first surface of 11, and the inner pins 13 are exposed from the chip bonding area and used to be combined with the chip 2.
  • the material of the flexible substrate 11 is, for example, polyethylene terephthalate (PET), polyimide (PI), polyethersulfone (PES), carbonate (polycarbonate, PC) or Other suitable flexible materials.
  • the chip 2 is disposed on the flexible substrate 11 and is electrically connected to the circuit layer 12. Specifically, the chip 2 is provided with bumps 21, and the circuit layer 12 is located between the flexible substrate 11 and the circuit layer 12. between the chips 2; after the chip 2 is electrically connected to the flexible substrate 11, it is opposite to the chip bonding area, and the bumps 21 are used to connect with the inner pins 13 on the circuit layer 12.
  • the packaging colloid 3 is disposed beside the chip 2 and on the upper side of the flexible substrate; the packaging colloid 3 at least fills the space between the chip 2 and the flexible substrate 11 to protect the chip 2 and the wires.
  • the electrical contacts of layer 12 and prevent the intrusion of moisture and contaminants.
  • the packaging colloid 3 has a colloid bottom surface 31 disposed on the upper side of the flexible substrate 11 and a colloid side surface 32 disposed on the side of the chip 2.
  • the side of the colloid bottom surface 31 away from the chip 2 is the colloid outer edge 33.
  • the material of the encapsulating colloid 3 is, for example, epoxy molding resin (Epoxy Molding Compound, EMC).
  • the first heat sink 4 is attached to the flexible substrate 11 and has a position corresponding to the chip 2
  • the first heat sink 4 has an inner edge 42 arranged along the edge of the escape hole 41;
  • the second heat sink 5 is attached to the side of the chip 2 away from the flexible substrate 11 and attached to the sealant 3 .
  • the shape of the escape hole 41 is adapted to the shape of the outer contour of the encapsulant 3 .
  • the upper surface of the chip 2 has a rectangular structure.
  • the shape of the outer contour of the encapsulant 3 is also rectangular, and the escape hole 41 is a corresponding rectangular hole.
  • the packaging colloid 3 has a colloid bottom surface 31 provided on the upper side of the flexible substrate 11 and a colloid side surface 32 provided on the side of the chip 2.
  • the side of the colloid bottom surface 32 away from the chip 2 is the colloid outer edge 33.
  • the shape of the escape hole 41 is adapted to the shape of the outer edge 33 of the colloid.
  • the size of the escape hole 41 can be set to be slightly larger than the outer contour of the packaging colloid 3. At this time, after the first heat sink 4 is attached, the inner edge 42 of the first heat sink 4 is in contact with the outer contour of the packaging colloid 3, that is, outside the colloid.
  • the edges 33 are arranged side by side.
  • the size of the escape hole 41 can also be set to be larger than the outer contour of the packaging glue 3 , so that after the first heat sink 4 is attached, there is a gap between the inner edge 42 of the first heat sink 4 and the outer edge 33 of the glue. A gap is formed.
  • edge of the second heat sink 5 covers the first heat sink 4 or the edge of the second heat sink 5 is juxtaposed with the inner edge 42 of the first heat sink 4 .
  • the edge of the second heat sink 5 covers the first heat sink 4.
  • This structural arrangement enables the encapsulant 3 to be completely covered by the heat sink, allowing the chip 2 to obtain more sufficient heat dissipation.
  • cover the edge of the second heat sink 5 on the first heat sink 4 The above can also make it easier to set the size of the second heat sink 5, and is also more convenient for production and manufacturing.
  • the second heat sink 5 and the first heat sink 4 are arranged side by side, that is, the second heat sink 5 is attached to the flexible substrate 11 regardless of whether the second heat sink 5 is attached to the flexible substrate 11.
  • the avoidance hole 41 on the first heat sink 4 The size is slightly larger than the size of the encapsulation glue 3. After the first heat sink 4 is attached, a gap is formed between the outer edge 33 and the inner edge 42 of the glue, and the gap is covered when the second heat sink 5 is attached.
  • the second heat sink 5 and the first heat sink 4 are arranged side by side, although it can achieve a better heat dissipation effect, it puts forward greater requirements on the difficulty of attachment, especially when the second heat sink 5 is attached.
  • the second heat sink 5 and the encapsulant 3 need to be completely attached.
  • the distance between the outer edge of the colloid 33 and the plane on the side of the chip 2 is L, where L satisfies the following conditions L1 ⁇ L ⁇ L2, L1 is the shortest distance, and L2 is the longest distance; the unit is mm; it should be noted that the side of the chip 2 here is the side of the chip 2 closest to the outer edge 33 of the colloid.
  • the width A1 of the escape hole 41 is no greater than D1+2*L1, where D1 is the size of the chip 2 in the width direction; the unit is mm.
  • the length A2 of the escape hole 41 is no greater than D2+2*L1, where D2 is the length direction dimension of the chip 2 in mm.
  • the arrangement of the above structure can make the size of the escape hole 41 larger than the size of the outer edge 33 of the colloid, so that during the process of attaching the first heat sink 4, the first heat sink 4 can be more evenly attached to the flexible surface. on the base plate 11.
  • the packaging colloid 3 is arranged along the periphery of the chip, and has a left colloid 34 and a right colloid 35 disposed on opposite sides of the chip;
  • the second heat sink 5 has a middle fitting portion 51 and two edge fitting portions 52 formed on opposite sides of the middle fitting portion 51 .
  • the middle fitting portion 51 and the chip 2 are away from the removable One side of the flexible substrate 11 is bonded to each other, and the two edge bonding portions 52 are bonded to the outer surfaces of the left colloid 34 and the right colloid 35 respectively.
  • the left colloid 34 and the right colloid 35 both extend along the length direction of the chip 2 and are attached to the sides of the chip 2 in the length direction.
  • the left colloid 34 and the right colloid 35 are relatively located on the chip 2 in the width direction of the chip 2 . both sides.
  • the second heat dissipation patch 52 only two edge bonding portions are provided on the second heat dissipation patch 52 , which can avoid wrinkles when the heat dissipation patch is attached to the intersection of the length direction and the width direction of the chip 2 , thereby making the second heat dissipation patch It will be smoother after being attached.
  • the width of the edge bonding portions 52 extending from the center bonding portion 51 to both sides is not less than 0.2+ ⁇ ((H1 ⁇ 2+L2 ⁇ 2) ), where H1 is the height of the chip in mm.
  • the width C1 of the second heat sink in this embodiment is not less than D1+2*0.2+2* ⁇ ((H1 ⁇ 2+L2 ⁇ 2)), where H1 is the height of the chip , the unit is mm; the length C2 of the second heat sink is not greater than the length D2 of the chip.
  • the units of the above lengths and dimensions are mm, and the attachment accuracy is +/-0.2mm. Therefore, when calculating the length of the second heat sink C1, it is also necessary to consider the length of the first heat sink 4 after attachment. Attachment accuracy.
  • Another embodiment of the present invention also discloses a display device, including: a display screen and the flip-chip packaging structure, the flexible circuit board also has external pins provided on the flexible substrate, so The external pin is electrically connected to the display screen.

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  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Crystallography & Structural Chemistry (AREA)
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

提供了覆晶封装结构的形成方法、覆晶封装结构及显示装置。形成方法包括：将柔性电路板（1）与芯片（2）电性接合；在可挠性性基板（11）的上表面贴附第一散热片（4），第一散热片（4）上形成有与封装胶体（3）相适配的避让孔（41）；在芯片（2）的上表面贴附第二散热片（5）；采用辊压机构（100）使第二散热片（5）的边缘贴合部（52）弯折并贴附在封装胶体（3）之上。本发明能够更方便实现散热贴的贴附，且不容易产生褶皱。

Description

覆晶封装结构的形成方法、覆晶封装结构及显示装置 技术领域
本发明涉及芯片封装技术领域，特别是覆晶封装结构的形成方法、覆晶封装结构及显示装置。
背景技术
覆晶技术(Flip Chip)，也称“倒晶封装”或“倒晶封装法”，是芯片封装技术的一种。此封装技术有别于过去芯片置放于基板上，再用打线技术将芯片与基板上的连结点连接的方式。而是在芯片连接点上长焊点，然后将芯片翻转过来使焊点与基板直接连结。目前覆晶技术已经被普遍应用在微处理器封装，而且也成为绘图、特种应用、和电脑芯片组等的主流封装技术。特别地，覆晶技术的代表性实施例为玻璃覆晶封装(Chip On Glass，COG)和薄膜覆晶封装(Chip On Film，COF)。
在上述封装工艺中，薄膜覆晶封装是一种将集成电路(IC)固定在柔性线路板上的晶粒软膜构装技术，运用软质附加电路板作为封装芯片载体将芯片与软性基板电路结合，并在芯片旁侧可挠性基板的上侧设置封装胶体进行封装。芯片在使用过程中会产生大量的热，如果这些热量不能有效的释放将影响芯片的性能和使用状况，因此，在芯片与可挠性基板之间采用封装胶体封装完成后一般会在芯片的背面贴附散热贴以对芯片进行散热。
现行的薄膜覆晶封装(Chip on Film,COF)为增进散热效果，会将散热贴贴附于封装结构的表面上，特别是具有芯片的表面上。但现今液晶显示面板(liquid crystal display,LCD)领域中，对显示面板的清晰度要求越来越高，越高的清晰度要求芯片运行过程中产生的热量也相应升高，同时设置在可挠性基板上的线路层的发热量也会相应的升高，为了 避免封装结构温度较高影响性能的稳定性，一般要求在对芯片背面贴附散热贴的时候，需要散热贴同时包覆整个可挠性基板。
现有技术中散热贴是以滚压的方式贴附于封装结构上，由于芯片具有一定的高度，且覆盖芯片四周的底部填充的封装胶体呈不规则坡形，采用现有技术的贴附方式容易在芯片与可挠性基板的过渡位置生成拱起或出现气泡，不仅影响散热效果而且对表面的平整也产生影响。
发明内容
本发明的目的是提供一种覆晶封装结构，以解决现有技术中的不足，它能够更方便实现散热贴的贴附，操作简单，且贴附后不容易产生褶皱或气泡。。
本发明实施例公开的覆晶封装结构，包括以下步骤：
提供一柔性电路板，所述柔性电路板包括可挠性基板和设置在可挠性基板上的线路层、内引脚；
提供一芯片，所述芯片设置有凸块；
将所述柔性电路板的内引脚与所述芯片的凸块电性接合；
在所述芯片的旁侧形成封装胶体，且封装胶体位于所述可挠性基板的上侧；
在所述可挠性性基板的上表面贴附第一散热片，其中，所述第一散热片上形成有与所述封装胶体相适配的避让孔；
在所述芯片的上表面贴附第二散热片，其中，第二散热片包括与所述芯片的上表面相适配的中心贴合部和自中心贴合部向两侧延伸设置的边缘贴合部；
采用辊压机构使第二散热片的边缘贴合部弯折并贴附在所述封装胶体之上，且在贴附完成后所述第二散热片的边缘覆盖在所述第一散热片之上。
进一步的，“在所述可挠性性基板的上表面贴附第一散热片；”包括如下步骤：
采用第一取标头吸取第一散热片，其中，所述第一取标头上设置有用于避让芯片的避让槽，在第一散热片被第一取标头吸附后所述避让槽与所述避让孔位置相对；
将吸附第一散热片的第一取标头运转到可挠性基板的上侧，并使所述避让槽与所述芯片位置相对；
控制所述第一取标头向可挠性基板方向移动并将第一散热片压紧贴合在所述可挠性基板上。
进一步的，在“采用第一取标头吸取第一散热片”之前还包括：
提供一散热基片，并在散热基片的中心裁切出避让孔以形成所述第一散热片。
进一步的，所述避让孔的形状与所述封装胶体外轮廓的形状相适配，且裁切后的所述避让孔为矩形孔。
进一步的，所述封装胶体具有设置在所述柔性基板上侧的胶体底面和设置在所述芯片侧面的胶体侧面，所述胶体底面远离所述芯片的一边为胶体外边缘，所述胶体外边缘距离所述芯片侧面所在平面的距离为L，其中，L满足如下条件L1<L<L2；L1为最短距离，L2为最长距离；
则所述避让孔的宽度A1不大于D1+2*L1，其中，所述D1为所述芯片在宽度方向上的尺寸，单位为mm；
所述避让孔的长度A2不大于D2+2*L1，其中，所述D2为所述芯片在长度方向上的尺寸，单位为mm。
进一步的，在中心贴合部贴合在芯片的上表面之后，自中心贴合部向两侧延伸设置的边缘贴合部的宽度不小于0.2+√((H1^2+L2^2))，其中，H1为芯片的高度，单位为mm。
进一步的，“在所述芯片的上表面贴附第二散热片；”包括如下步骤：
提供一第二散热片；
采用第二取标头吸取第二散热片，其中，所述第二取标头上吸附第二散热片的底面为平面；
将第二散热片运转到芯片的上方并使中间贴合部与所述芯片位置相对；
控制所述第二取标头向芯片方向移动并将第二散热片压紧贴合在所述芯片之上。
进一步的，“采用辊压机构使第二散热片的边缘贴合部弯折并贴附在所述封装胶体之上”的过程中所述辊压机构的活动轨迹如下：先自所述芯片的顶面移动到所述芯片的侧面，最后顺着所述封装胶体的外表面移动到所述柔性电路板上。
本发明另一实施例还公开了一种覆晶封装结构，包括采用所述的覆晶封装结构的形成方法制造而成。
本发明另一实施例还公开了一种显示装置，包括：显示屏幕和所述的覆晶封装结构，所述柔性电路板还具有设置在所述可挠性基板上的外引脚，所述外引脚与所述显示屏幕电性连接。
与现有技术相比，本发明实施例公开的覆晶封装结构的形成方法对散热片进行贴附的时候将原本贴附在柔性电路板和芯2之上的整块散热贴拆分为第一散热片和第二散热片，其中，第一散热片主要用于贴附在可挠性基板上，对可挠性基板进行散热，第二散热片贴附在芯片及芯片旁侧的封装胶体上，以用于为芯片进行散热；在贴附的过程中需要先贴附第一散热片，再贴附第二散热片，能够更方便实现散热贴的贴附，操作简单，且贴附后不容易产生褶皱或气泡。
附图说明
图1是本发明实施例公开的覆晶封装结构的结构示意图；
图2是图1中AA方向的剖视图；
图3是本发明实施例公开的覆晶封装结构在第二散热贴贴附后辊压机构未辊压前的结构示意图；
图4是本发明实施例公开的覆晶封装结构在第二散热贴贴附后辊压机构辊压后的结构示意图；
图5是本发明实施例公开的覆晶封装结构中第一散热贴的结构示意图；
附图标记说明：
1-柔性电路板，11-可挠性基板，12-线路层，13-内引脚，
2-芯片，21-凸块，
3-封装胶体，31-胶体底面，32-胶体侧面，33-胶体外边缘，34-左
胶体，35-右胶体，
4-第一散热片，41-避让孔，42-内边缘，
5-第二散热片，51-中心贴合部，52-边缘贴合部,
100-辊压机构。
具体实施方式
下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能解释为对本发明的限制。
本发明的实施例：公开了一种覆晶封装结构的形成方法，采用该形成方法形成的覆晶封装结构可以被应用在液晶显示器(liquid crystal display,LCD)和有机发光二级体显示器(organic light-emitting diode,OLED)等显示装置中。随着显示要求的不断增多，在所述显示装置运行的过程中，覆晶封装结构内芯片的温度会不断的升高，而若是所述芯片温度过高，将会影响所述显示装置的效能，进而影响到使用体验。
为了降低芯片的温度，一般在所述芯片之上贴覆散热贴，但研究表 面现有的覆晶封装结构中可挠性基板上的线路层在使用过程中也存在温度较高的问题，因此，也需要对可挠性基板上进行散热。
现有技术中一般在对芯片贴附散热贴的过程中也会附带将可挠性基板的上表面包覆住，使散热贴能够对可挠性基板上的线路层和芯片同时散热。然而，由于所述柔性基板和所述芯片是通过所述引脚和所述凸块进行接合，因此，所述柔性电路板和所述芯片存在高低差，由于高低差的存在，使散热贴无法完全紧贴所述芯片。
现有的贴附方式为先用取标头吸取散热贴，将散热贴贴附在芯片的上表面，散热贴只是中间部分的中间贴合区与芯片形成粘贴，但散热贴的边缘的边缘贴附区不与可挠性基板完成粘贴，在散热贴贴附在芯片之后然后再采用辊压机构100将散热贴顺着芯片向两端将散热贴最终压紧贴合在可挠性基板上。
采用现有的贴附方式容易在在可挠性基板、芯片和散热贴之间的空隙容易形成气泡及褶皱，从而会降低散热贴的散热效果。
为此，本发明实施例公开了一种覆晶封装结构的形成方法，该覆晶封装结构的形成方法具体包括以下步骤：
S100：提供一柔性电路板·1，所述柔性电路板1包括可挠性基板11和设置在可挠性基板11上的线路层12、内引脚13；
S200：提供一芯片2，所述芯片2设置有凸块21；所述芯片2可以为用于显示设备的驱动芯片；
S300：将所述柔性电路板1的内引脚13与所述芯片2的凸块21电性接合；
S400：在所述芯片2的旁侧形成封装胶体3，且封装胶体3位于所述可挠性基板11的上侧；
S500：在所述可挠性基板11的上表面贴附第一散热片4，其中，所述第一散热片4上形成有与所述封装胶体3相适配的避让孔41；
S600：在所述芯片2的上表面贴附第二散热片5，其中，第二散热片5包括与所述芯片2的上表面相适配的中心贴合部51和自中心贴合部51向两侧延伸设置的边缘贴合部52；
S700：采用辊压机构100使第二散热片5的边缘贴合部52弯折并贴附在所述封装胶体3之上，在贴附完成后所述第二散热片5的边缘覆盖在所述第一散热片4之上。
如图1-4所示，本实施例在对散热片进行贴附的时候将原本贴附在柔性电路板1和芯片2之上的整块散热贴拆分为第一散热片4和第二散热片5，其中，第一散热片4主要用于贴附在可挠性基板11上，对可挠性基板11进行散热，第二散热片5贴附在芯片2及芯片2旁侧的封装胶体3上，以用于为芯片2进行散热。
本实施例中如图3所示，在贴附的过程中需要先贴附第一散热片4，再贴附第二散热片5，第一散热片4由于贴附在相对平整的可挠性基板11上，相对容易操作，且贴附后不容易产生褶皱或气泡。如果先贴附第二散热贴5再贴附第一散热片4则贴附后的第二散热贴5的区间位置是不易把控的，也就是第二散热贴5在贴附在芯片2后其边缘的位置是不确定的，这也就使第一散热片4上形成的避让孔可能无法对第二散热贴5形成避让，从而在第一散热片4贴附的时候产生干扰，影响第一散热 片4的贴附。
本实施例中由于可挠性基板11是整个平面，在对第一散热片4进行贴附的时候能够更好的实现操作；并且为了避免芯片2的影响在第一散热片4上设置了避让孔41，这样在第一散热片4进行贴附的时候不太容易产生气泡或褶皱，能够使贴附后的第一散热片4更加的平整。
在对第二散热片5进行贴附的时候，由于贴附后的散热贴只需要对封装胶体3形成覆盖即可。因此，第二散热片5的尺寸可以控制的相对较窄，这样在第二散热片5在贴附在芯片1的上表面之后在未采用辊压机构100进行辊压之前，延伸出芯片1的上表面的边缘贴合部52可以设置的很短，边缘贴合部52设置的短就不会容易出现散热贴的下垂，这样使预贴合在芯片2上表面的散热贴仅在辊压机构100辊压的时候才会产生弯折，并且在辊压机构100辊压的作用下能够自芯片2向封装胶体3更平滑的过度，从而使贴附后的散热贴更加的平整。
现有技术中散热贴因为需要同时考量在封装胶体3和可挠性基板11上的贴合，因此尺寸需要足够宽，这样在散热贴的中心贴合部贴合在芯片2的上表面完成预贴合后，由于延伸在芯片2外的尺寸较大容易产生下垂，下垂后的散热贴的部分位置会与可挠性基板黏贴，并在黏贴后容易在黏贴位置与芯片之间形成气泡和褶皱，从而影响散热的效果且也能够使贴附后的散热贴褶皱较多不能满足客户要求。本实用新型实施例能够有效的规避上述问题的出现。
具体的，“S500：在所述可挠性性基板11的上表面贴附第一散热片4；”包括如下步骤：
S502：采用第一取标头吸取第一散热片4，其中，所述第一取标头上设置有用于避让芯片2的避让槽，在第一散热片4被第一取标头吸附后所述避让槽与所述避让孔41位置相对；
S504：将吸附第一散热片4的第一取标头运转到可挠性基板11的上侧，并使所述避让槽与所述芯片2位置相对；
S506：控制所述第一取标头向可挠性基板11方向移动并将第一散热片4压紧贴合在所述可挠性基板11上。
可以理解的是，在“S502：采用第一取标头吸取第一散热片”之前还包括：
S501：提供一散热基片，并在散热基片的中心裁切出避让孔41以形成所述第一散热片4。
具体的，“S600：在所述芯片的上表面贴附第二散热片；”包括如下步骤：
S601：提供一第二散热片5；
S602：采用第二取标头吸取第二散热片5，其中，所述第二取标头上吸附第二散热片5的底面为平面；
S603：将第二散热片5运转到芯片2的上方并使中间贴合部51与所述芯片2位置相对；
S604：控制所述第二取标头向芯片2方向移动并将第二散热片5压紧贴合在所述芯片1之上。
在本实施例中采用两种取标头分别获取第一散热片4和第二散热片5，为了方便第一散热片4的贴附，在第一取标头上设置有与芯片2相适 配的避让槽，这样在对散热贴进行压合的时候能够避免突起的芯片2对其产生影响。
第一取标头吸附第一散热片4的区域为平整的压合部，平整的压合部位于避让槽的边缘并对避让槽形成包围，平整压合部具有平面状结构以方便实现对第一散热片4的压紧贴合。第二取标头的尺寸则整体为平面并在吸附第二散热片5后将第二散热片5黏贴在芯片2之上。
进一步的，“S700：采用辊压机构100使第二散热片5的边缘贴合部52弯折并贴附在所述封装胶体3之上”的过程中所述辊压机构100的活动轨迹如下：先自所述芯片2的顶面移动到所述芯片2的侧面，最后顺着所述封装胶体3的外表面移动到所述柔性电路板1上。
上述的辊压机构100的辊压方式能够更好的使散热贴贴合在封装胶体3和芯片2的侧面上，能够更少的减少气泡的出现。
需要说明的是在本实施例中所述第二散热片5的边缘贴合部只设置在所述中心贴合部51的相对的两侧设置，在中心贴合部51的另外两侧不设置。在本实施例中所述芯片2为矩形并具有长度方向和宽度方向。
相应的，中心贴合部51也为矩形，两个边缘贴合部52自中心贴合部51的长边向外延伸形成，这样能够避免在第二散热片5贴附的过程中在芯片2的长度方向和宽度方向交接的位置出现褶皱。将边缘贴合部52沿中心贴合部51的长边方向延伸设置也能够更多的与芯片2实现贴合，从而能够更好的实现对芯片2的散热。
如图1-5所示，本发明的另一实施例还公开了一种覆晶封装结构，包括：柔性电路板1、芯片2、封装胶体3、第一散热片4和第二散热片 5；
所述柔性电路板1包括可挠性基板11和设置在所述可挠性基板11上的线路层12及内引脚13。
所述可挠性基板11具有相对设置的第一表面以及第二表面，所述第一表面包含一芯片接合区，所述线路层12和所述内引脚13均设置于该可挠性基板11的第一表面上，且所述内引脚13自芯片结合区暴露并用于与芯片2相结合。可挠性基板11的材质例如是聚乙烯对苯二甲酸酯(polyethylene terephthalate,PET)、聚酰亚胺(Polyimide,PI)、聚醚(polyethersulfone,PES)、碳酸脂(polycarbonate,PC)或其他适合的可挠性材料。
芯片2设置所述可挠性基板11上，且与所述线路层12电性连接，具体的，芯片2上设置有凸块21，所述线路层12位于所述可挠性基板11与所述芯片2之间；芯片2在电性连接在可挠性基板11上之后与芯片结合区位置相对，凸块21用于与线路层12上的内引脚13连接。
封装胶体3设置在所述芯片2的旁侧并位于所述述可挠性基板的上侧；封装胶体3至少填充于芯片2与可挠性基板11之间的空间，以保护芯片2与导线层12的电性接点，并防止湿气及污染物侵入。
所述封装胶体3具有设置在所述柔性基板11上侧的胶体底面31和设置在所述芯片2侧面的胶体侧面32，所述胶体底面31远离所述芯片2的一边为胶体外边缘33。封装胶体3的材料例如是环氧模压树脂(Epoxy MoldingCompound,EMC)。
第一散热片4贴附在所述柔性基板11上并具有与所述芯片2位置相 对的避让孔41，所述第一散热片4具有沿避让孔41边缘设置的内边缘42；
第二散热片5贴附在所述芯片2上背离所述可挠性基板11的一侧，并贴合在所述封胶胶体3之上。
可以理解的是，所述避让孔41的形状与所述封装胶体3外轮廓的形状相适配。在本实施例中由于芯片2的上表面具有矩形结构。相应的，封装胶体3的外轮廓的形状也为矩形，所述避让孔41则为相应的矩形孔。
所述封装胶体3具有设置在所述柔性基板11上侧的胶体底面31和设置在所述芯片2侧面的胶体侧面32，所述胶体底面32远离所述芯片2的一边为胶体外边缘33，所述避让孔41的形状与胶体外边缘33的形状相适配。
避让孔41的尺寸可以设置成略大于封装胶体3的外轮廓，此时，在第一散热片4贴附后，第一散热片4的内边缘42与封装胶体3的外轮廓也即胶体外边缘33并列设置。
在另一实施例中避让孔41的尺寸还可以设置成大于封装胶体3的外轮廓，这样在第一散热片4贴附后，第一散热片4的内边缘42与胶体外边缘33之间形成间隙部。
进一步的，所述第二散热片5的边缘覆盖在所述第一散热片4之上或所述第二散热片5的边缘与所述第一散热片4的内边缘42并列设置。
作为优选的方案第二散热片5的边缘覆盖在第一散热片4之上，这样结构的设置能够使封装胶体3能够被散热贴完全的包覆，能够使芯片2得到更充足的散热。此外，将第二散热片5的边缘覆盖在第一散热片4 之上也能够更方便第二散热片5尺寸的设置，也更方便生产制造。
将第二散热片5的边缘覆盖在第一散热片4之上会在两者交接的位置形成空隙，从而可能会影响可挠性基板11的散热，所以更好的方案是在第二散热片5贴附后第二散热片5与第一散热片4并列设置，也就是不分第二散热片5贴合在可挠性基板11上，此时，第一散热片4上的避让孔41的尺寸略大于封装胶体3的尺寸，在第一散热片4贴附完成后，胶体外边缘33与内边缘42之间形成有间隙，在第二散热片5贴附的时候覆盖住该间隙。
在第二散热片5与第一散热片4并列设置的方案中虽然能够起到更好的散热效果，但是却对贴附的难度提出了较大的要求，尤其是在第二散热片5贴附的时候需要第二散热片5与封装胶体3的完全贴合。
在本实施例中，所述胶体外边缘33距离所述芯片2侧面所在平面的距离为L，其中，L满足如下条件L1<L<L2，L1为最短距离，L2为最长距离；单位为mm；需要说明的是这里的芯片2的侧面是胶体外边缘33距离最近的芯片2的侧面。
则所述避让孔41的宽度A1不大于D1+2*L1，其中，所述D1为所述芯片2在宽度方向上的尺寸；单位为mm。
所述避让孔41的长度A2不大于D2+2*L1，其中，所述D2为所述芯片2在长度方向上的尺寸，单位为mm。
上述结构的设置能够使避让孔41的尺寸相比于胶体外边缘33的尺寸更大，这样在贴附第一散热片4的过程中能够使第一散热片4更平整的贴合在可挠性基板11上。
在本实施例中，所述封装胶体3沿所述芯片的四周设置，并具有相对设置在所述芯片相对两侧的左胶体34和右胶体35；
所述第二散热片5具有中间贴合部51和形成在在中间贴合部51相对两侧的两个边缘贴合部52，所述中间贴合部51与所述芯片2背离所述可挠性基板11的一侧相贴合，两个所述边缘贴合部52分别贴合在所述左胶体34的外表面和所述右胶体35的外表面。
所述左胶体34和右胶体35均沿芯片2的长度方向延伸设置并贴合在芯片2的长度方向的侧面上，左胶体34和右胶体35在芯片2的宽度方向上相对位于芯片2的两侧。
在本实施例中第二散热贴52上仅设置两个边缘贴合部，能够避免散热贴在贴附到芯片2的长度方向和宽度方向交接的位置的时候产生褶皱，从而使第二散热贴贴附后更加的平整。
在中心贴合部51贴合在芯片2的上表面之后，自中心贴合部51向两侧延伸设置的边缘贴合部52的宽度不小于0.2+√((H1^2+L2^2))，其中，H1为芯片的高度，单位为mm。这样结构的设置能够使第二散热贴5更好的贴附在芯片上。
根据上述公式则能得到在本实施例中所述第二散热片的宽度C1不小于D1+2*0.2+2*√((H1^2+L2^2))，其中，H1为芯片的高度，单位为mm；所述第二散热片的长度C2不大于所述芯片的长度D2。需要说明的是以上长度及尺寸的单位都是mm，贴附精度为+/-0.2mm，因此在计算第二散热片C1的长度的时候还需要考虑到第一散热贴4在贴附后的贴附精度。
本发明的另一实施例还公开了一种显示装置，包括：显示屏幕和所述的覆晶封装结构，所述柔性电路板还具有设置在所述可挠性基板上的外引脚，所述外引脚与所述显示屏幕电性连接。
以上依据图式所示的实施例详细说明了本发明的构造、特征及作用效果，以上所述仅为本发明的较佳实施例，但本发明不以图面所示限定实施范围，凡是依照本发明的构想所作的改变，或修改为等同变化的等效实施例，仍未超出说明书与图示所涵盖的精神时，均应在本发明的保护范围内。

Claims (10)

  1. 一种覆晶封装结构的形成方法，其特征在于，包括以下步骤：
    提供一柔性电路板，所述柔性电路板包括可挠性基板和设置在可挠性基板上的线路层、内引脚；
    提供一芯片，所述芯片设置有凸块；
    将所述柔性电路板的内引脚与所述芯片的凸块电性接合；
    在所述芯片的旁侧形成封装胶体，且封装胶体位于所述可挠性基板的上侧；
    在所述可挠性性基板的上表面贴附第一散热片，其中，所述第一散热片上形成有与所述封装胶体相适配的避让孔；
    在所述芯片的上表面贴附第二散热片，其中，第二散热片包括与所述芯片的上表面相适配的中心贴合部和自中心贴合部向两侧延伸设置的边缘贴合部；
    采用辊压机构使第二散热片的边缘贴合部弯折并贴附在所述封装胶体之上，且在贴附完成后所述第二散热片的边缘覆盖在所述第一散热片之上。
  2. 根据权利要求1所述的覆晶封装结构的形成方法，其特征在于，“在所述可挠性性基板的上表面贴附第一散热片；”包括如下步骤：
    采用第一取标头吸取第一散热片，其中，所述第一取标头上设置有用于避让芯片的避让槽，在第一散热片被第一取标头吸附后所述避让槽与所述避让孔位置相对；
    将吸附第一散热片的第一取标头运转到可挠性基板的上侧，并使所述避让槽与所述芯片位置相对；
    控制所述第一取标头向可挠性基板方向移动并将第一散热片压紧贴合在所述可挠性基板上。
  3. 根据权利要求2所述的覆晶封装结构的形成方法，其特征在于，在“采用第一取标头吸取第一散热片”之前还包括：
    提供一散热基片，并在散热基片的中心裁切出避让孔以形成所述第一散热片。
  4. 根据权利要求3所述的覆晶封装结构的形成方法，其特征在于， 所述避让孔的形状与所述封装胶体外轮廓的形状相适配，且裁切后的所述避让孔为矩形孔。
  5. 根据权利要求4所述的覆晶封装结构的形成方法，其特征在于，所述封装胶体具有设置在所述柔性基板上侧的胶体底面和设置在所述芯片侧面的胶体侧面，所述胶体底面远离所述芯片的一边为胶体外边缘，所述胶体外边缘距离所述芯片侧面所在平面的距离为L，其中，L满足如下条件L1<L<L2；L1为最短距离，L2为最长距离；
    则所述避让孔的宽度A1不大于D1+2*L1，其中，所述D1为所述芯片在宽度方向上的尺寸，单位为mm；
    所述避让孔的长度A2不大于D2+2*L1，其中，所述D2为所述芯片在长度方向上的尺寸，单位为mm。
  6. 根据权利要求5所述的覆晶封装结构的形成方法，其特征在于，在中心贴合部贴合在芯片的上表面之后，自中心贴合部向两侧延伸设置的边缘贴合部的宽度不小于0.2+√((H1^2+L2^2))，其中，H1为芯片的高度，单位为mm。
  7. 根据权利要求1所述的覆晶封装结构的形成方法，其特征在于，“在所述芯片的上表面贴附第二散热片；”包括如下步骤：
    提供一第二散热片；
    采用第二取标头吸取第二散热片，其中，所述第二取标头上吸附第二散热片的底面为平面；
    将第二散热片运转到芯片的上方并使中间贴合部与所述芯片位置相对；
    控制所述第二取标头向芯片方向移动并将第二散热片压紧贴合在所述芯片之上。
  8. 根据权利要求1所述的覆晶封装结构的形成方法，其特征在于，“采用辊压机构使第二散热片的边缘贴合部弯折并贴附在所述封装胶体之上”的过程中所述辊压机构的活动轨迹如下：先自所述芯片的顶面移动到所述芯片的侧面，最后顺着所述封装胶体的外表面移动到所述柔性电路板上。
  9. 一种覆晶封装结构，其特征在于，采用如权利要求1所述的覆晶 封装结构的形成方法制造而成。
  10. 一种显示装置，其特征在于，包括：显示屏幕和如权利要求9所述的覆晶封装结构，所述柔性电路板还具有设置在所述可挠性基板上的外引脚，所述外引脚与所述显示屏幕电性连接。
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