CN212303651U - 覆晶薄膜封装结构 - Google Patents
覆晶薄膜封装结构 Download PDFInfo
- Publication number
- CN212303651U CN212303651U CN202021303756.0U CN202021303756U CN212303651U CN 212303651 U CN212303651 U CN 212303651U CN 202021303756 U CN202021303756 U CN 202021303756U CN 212303651 U CN212303651 U CN 212303651U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- layer
- chip
- package structure
- protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021303756.0U CN212303651U (zh) | 2020-07-06 | 2020-07-06 | 覆晶薄膜封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021303756.0U CN212303651U (zh) | 2020-07-06 | 2020-07-06 | 覆晶薄膜封装结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN212303651U true CN212303651U (zh) | 2021-01-05 |
Family
ID=73935283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202021303756.0U Active CN212303651U (zh) | 2020-07-06 | 2020-07-06 | 覆晶薄膜封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN212303651U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114721188A (zh) * | 2022-03-29 | 2022-07-08 | 颀中科技(苏州)有限公司 | 覆晶封装结构的形成方法、覆晶封装结构及显示装置 |
-
2020
- 2020-07-06 CN CN202021303756.0U patent/CN212303651U/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114721188A (zh) * | 2022-03-29 | 2022-07-08 | 颀中科技(苏州)有限公司 | 覆晶封装结构的形成方法、覆晶封装结构及显示装置 |
CN114721188B (zh) * | 2022-03-29 | 2024-05-17 | 颀中科技(苏州)有限公司 | 覆晶封装结构的形成方法、覆晶封装结构及显示装置 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6713856B2 (en) | Stacked chip package with enhanced thermal conductivity | |
US20080278917A1 (en) | Heat dissipation module and method for fabricating the same | |
US9275977B2 (en) | Electronic system comprising stacked electronic devices provided with integrated-circuit chips | |
JPH0955459A (ja) | 半導体装置 | |
KR100973722B1 (ko) | 방열기를 가지는 전자 모듈 어셈블리 | |
JP2009016626A (ja) | 半導体モジュール装置および半導体モジュール装置の製造方法ならびにフラットパネル型表示装置,プラズマディスプレイパネル | |
TWI508238B (zh) | 晶片散熱系統 | |
KR20080011392A (ko) | 써멀 라미네이션 모듈 | |
US20080291639A1 (en) | Communication module package assembly | |
JP4056598B2 (ja) | 赤外線データ通信モジュール | |
EP1178594B1 (en) | Electronic apparatus provided with an electronic circuit substrate | |
CN212303651U (zh) | 覆晶薄膜封装结构 | |
US20060091528A1 (en) | High heat dissipation flip chip package structure | |
JP2008235576A (ja) | 電子部品の放熱構造及び半導体装置 | |
JP2004079949A (ja) | メモリモジュール内発熱半導体素子の放熱装置 | |
JP2016071269A (ja) | 電子機器、及びシステム | |
TWI702887B (zh) | 軟性線路板結構 | |
US11502020B2 (en) | Electronic device having a chip package module | |
CN212115767U (zh) | 电路板组件和电子设备 | |
US7235889B2 (en) | Integrated heatspreader for use in wire bonded ball grid array semiconductor packages | |
CN101236938A (zh) | 芯片封装模块的散热方法及构造 | |
US20080291637A1 (en) | Small-sized communication module package | |
US20170231109A1 (en) | Communication system and communication device therefor | |
CN220934057U (zh) | 封装结构 | |
JPH06252299A (ja) | 半導体装置及びこの半導体装置を実装した基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Patentee after: CHIPMORE TECHNOLOGY Corp.,Ltd. Patentee after: Xi'an yisiwei Material Technology Co.,Ltd. Patentee after: Hefei Qizhong Sealing Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Patentee before: CHIPMORE TECHNOLOGY Corp.,Ltd. Patentee before: Beijing yisiwei Material Technology Co.,Ltd. Patentee before: Hefei Qizhong Sealing Technology Co.,Ltd. Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Patentee after: CHIPMORE TECHNOLOGY Corp.,Ltd. Patentee after: Beijing yisiwei Material Technology Co.,Ltd. Patentee after: Hefei Qizhong Sealing Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Patentee before: CHIPMORE TECHNOLOGY Corp.,Ltd. Patentee before: Beijing yisiwei Technology Co.,Ltd. Patentee before: Hefei yisiwei sealing and Testing Technology Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210622 Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Patentee after: CHIPMORE TECHNOLOGY Corp.,Ltd. Patentee after: Hefei Qizhong Sealing Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Patentee before: CHIPMORE TECHNOLOGY Corp.,Ltd. Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: Hefei Qizhong Sealing Technology Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Patentee after: CHIPMORE TECHNOLOGY Corp.,Ltd. Patentee after: Hefei Qizhong Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Patentee before: CHIPMORE TECHNOLOGY Corp.,Ltd. Patentee before: Hefei Qizhong Sealing Technology Co.,Ltd. |