WO2022074780A1 - 半導体受光素子 - Google Patents

半導体受光素子 Download PDF

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Publication number
WO2022074780A1
WO2022074780A1 PCT/JP2020/038106 JP2020038106W WO2022074780A1 WO 2022074780 A1 WO2022074780 A1 WO 2022074780A1 JP 2020038106 W JP2020038106 W JP 2020038106W WO 2022074780 A1 WO2022074780 A1 WO 2022074780A1
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Prior art keywords
light
receiving element
incident
light receiving
operating region
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Ceased
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PCT/JP2020/038106
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English (en)
French (fr)
Japanese (ja)
Inventor
允洋 名田
泰彦 中西
詔子 辰己
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NTT Inc
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Nippon Telegraph and Telephone Corp
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Priority to US18/246,595 priority Critical patent/US20230361226A1/en
Priority to PCT/JP2020/038106 priority patent/WO2022074780A1/ja
Priority to JP2022555045A priority patent/JPWO2022074780A1/ja
Publication of WO2022074780A1 publication Critical patent/WO2022074780A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/30—Coatings
    • H10F77/306—Coatings for devices having potential barriers
    • H10F77/331—Coatings for devices having potential barriers for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H10F77/334—Coatings for devices having potential barriers for filtering or shielding light, e.g. multicolour filters for photodetectors for shielding light, e.g. light blocking layers or cold shields for infrared detectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
    • H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
    • H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
    • H10F30/223—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PIN barrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/30—Coatings
    • H10F77/306—Coatings for devices having potential barriers

Definitions

  • the present invention relates to high speed and high sensitivity of a semiconductor light receiving element.
  • the semiconductor light receiving element has a role of converting an incident optical signal into an electric signal, and is widely applied to an optical receiver in optical communication, a photomixer for millimeter wave oscillators, and the like.
  • the basic structure of a semiconductor light receiving element is roughly divided into two.
  • the incident light propagates in the light absorption layer formed by crystal growth perpendicular to the film thickness direction, and the generated photocarriers move in the film thickness direction. Therefore, the carrier transport time can be shortened while improving the light absorption efficiency, and the structure is aimed at high speed and high sensitivity.
  • the vertically incident type structure has an advantage that the element formation is easy and the optical coupling of the manufactured element is also easy.
  • dark current, light receiving sensitivity, and operating band are important as performance indexes required for semiconductor light receiving elements.
  • the trade-off between the light receiving sensitivity and the operating band is more remarkable in the vertically incident type. This is related to the optical path length of the light propagating in the light absorption layer and the mileage of the carrier.
  • the vertically incident type it is easy to adopt a structure that selectively generates an electric field only on the side surface of the element, and there is a reduction in the side surface dark current that is the main component of the dark current.
  • the waveguide type it is difficult to adopt such a structure.
  • FIG. 1 shows an example of a conventional vertically incident type light receiving element.
  • a typical example of the vertically incident type is the inverted structure disclosed in Non-Patent Document 1.
  • a mesa 3 including a light absorption layer is formed on the surface of the substrate 1 via the contact layer 2.
  • the actual operating region 5 of the light absorption layer is defined by the mesa corresponding to the contact layer 4 at the uppermost portion.
  • the terrace portion which is the portion other than the uppermost mesa, the electric field strength does not increase even if the voltage of the light receiving element is increased. Therefore, even if the applied voltage is high, the electric field on the side surface of the device is kept small, and the side dark current can be reduced.
  • this inverted structure is excellent in scalability because the operating area of the element can be defined by etching the uppermost mesa. Therefore, even if it is a vertically incident structure, it is possible to easily realize a certain degree of high-speed operation in the inverted structure.
  • the light receiving element is a back surface incident type in which light is incident on the light absorption layer from the back surface of the substrate.
  • a certain degree of light receiving sensitivity can be observed even if the incident light L1 does not hit the central portion of the element or the portion where an electric field is generated in the element. This is because when light is incident on the light absorption layer corresponding to the terrace portion of the device, the carrier is taken out of the device by the diffusion movement of electrons / holes.
  • the carrier that moves by diffusion has a lower moving speed than the drift movement in which the carrier is accelerated and moved by an electric field.
  • the carrier drifts in the vertical direction with the component A having a slow diffusion speed in the horizontal direction. It will have two components, component B, which has a high speed of drifting. Therefore, the response speed is significantly deteriorated as compared with the case where the incident light L1 hits the central portion of the element.
  • the operating area of the light receiving element is reduced in order to increase the speed.
  • a photocarrier generated by incident signal light in the operating region and a photocarrier generated by incident signal light in the peripheral portion thereof are in a mixed state.
  • the expected light receiving sensitivity can be obtained, but high-speed operation may be impaired due to the slow response of the photocarrier generated in the peripheral portion. Therefore, there is a problem that optimum optical coupling becomes difficult.
  • An object of the present invention is to apply a structure that blocks light incident to the peripheral portion of the element on the back surface portion, and to ensure high-speed operation by incident light on the central portion of the element when optically coupled to the light receiving element.
  • the present invention is to provide a semiconductor light receiving element that can be realized.
  • one embodiment of the present invention is a semiconductor light receiving element that includes a semiconductor light absorbing layer on the surface of a semiconductor substrate and incidents signal light from the back surface of the semiconductor substrate.
  • the transmittance of the inner region of the back surface of the semiconductor substrate which has a similar shape and has the same center as the operating region determined by the semiconductor light absorption layer, is higher than the transmittance of the outer region of the shape.
  • FIG. 1 is a cross-sectional view showing an example of a conventional vertically incident type light receiving element.
  • FIG. 2 is a cross-sectional view for explaining the operation of a conventional vertically incident type light receiving element.
  • FIG. 3 is a diagram showing the structure of the light receiving element according to the first embodiment of the present invention.
  • FIG. 4 is a diagram showing the structure of the light receiving element according to the second embodiment of the present invention.
  • FIG. 5 is a diagram showing the structure of the light receiving element according to the third embodiment of the present invention.
  • FIG. 6 is a diagram showing a structure of a light receiving element according to a fourth embodiment of the present invention.
  • FIG. 3 shows the structure of the light receiving element according to the first embodiment of the present invention.
  • FIG. 3A is a cross-sectional view of the vertically incident type semiconductor light receiving element 10.
  • the semiconductor light receiving element 10 has a layer structure in which a p-type InP contact layer 12, an undoped InGaAs light absorption layer 13, and an n-type InP contact layer 14 are laminated in this order on the surface of the InP substrate 11.
  • the uppermost contact layer 14 has a multi-stage mesa structure in which the outer shape thereof is gradually increased in the order of the light absorption layer 13 and the contact layer 12 after being processed into the smallest mesa.
  • the mesa of the uppermost contact layer 14 is formed in a circular shape.
  • 3B is a bottom view of the semiconductor light receiving element 10.
  • a light shielding film 16 made of Ti is provided on the outside of a concentric circle centered on the operating region 15 defined by the contact layer 14.
  • the InP substrate 11 is exposed inside the concentric circles.
  • the incident light on the light receiving element 10 is incident on the back surface of the substrate 11.
  • the incident light is absorbed by the light absorption layer 13, a photocarrier is generated, and a current flows between the contact layers 12 and 14, so that the incident light functions as a light receiving element.
  • the incident light L 2 from the back surface is incident on the central portion of the operating region 15, the incident light L 2 is incident without being interrupted by the light shielding film 16. Therefore, the photocurrent at the time of centering shows the maximum value. Since the incident light L 2 is incident on the central portion of the operating region 15, all the generated photocarriers are affected by the electric field generated in the operating region 15 and drift and move. Therefore, a desired high-speed operation can be realized.
  • the incident light L 3 deviates from the central portion of the operating region 15, a part of the incident light L 3 is blocked by the light-shielding film 16, so that the observed photocurrent is extremely reduced.
  • the transmittance of the light inside the concentric circle having the same center as the operating region 15 is higher than the transmittance of the region outside the concentric circle. Therefore, the photocurrent is maximized only when the signal light is incident on the central portion of the operating region 15.
  • the accuracy of alignment can be improved even with optical alignment using unmodulated light (CW light). Therefore, in the subsequent actual operation, even when receiving modulated light of several tens of GHz, the accuracy of alignment is high, so that the influence of slow components can be suppressed and high-speed operation can be realized.
  • the method of manufacturing the semiconductor light receiving element 10 of the first embodiment will be described.
  • the p-type InP contact layer 12, the undoped InGaAs light absorption layer 13, and the n-type InP light absorption layer 14 are epitaxially grown on the surface of the semi-insulating InP substrate 11 in this order by using the MOCVD method.
  • photolithography and etching are sequentially performed so that the contact layer 14 becomes the smallest mesa, and then the area of the light absorption layer 13 and the contact layer 12 increases in this order.
  • the back surface of the light receiving element 10 that is, the back surface of the substrate 11 is polished.
  • a resist that is concentric with the center of the operating region 15 is formed on the polished surface.
  • the light-shielding film 16 is formed by peeling off the resist.
  • the diameter of the concentric circles formed on the back surface of the substrate 11 does not necessarily have to match the diameter of the operating region 15, that is, the contact layer 14 of the semiconductor light receiving element 10.
  • the incident light is parallel light, there is no problem even if the diameter of the concentric circles matches the diameter of the contact layer 14.
  • the diameter of the concentric circles may be appropriately determined depending on the thickness of the substrate and the focal position of the incident light.
  • the light-shielding film does not need to completely block light, and it is sufficient that the transmittance of the inner region of the concentric circles centered on the operating region 15 is higher than the transmittance of the outer region of the concentric circles.
  • FIG. 4 shows the structure of the light receiving element according to the second embodiment of the present invention.
  • FIG. 4A is a cross-sectional view of the vertically incident type semiconductor light receiving element 20.
  • the semiconductor light receiving element 20 has a layer structure in which a p-type InP contact layer 22, an undoped InGaAs light absorption layer 23, and an n-type InP contact layer 24 are laminated in this order on the surface of the InP substrate 21.
  • the uppermost contact layer 24 has a multi-stage mesa structure in which the outer shape of the contact layer 24 is gradually increased in the order of the light absorption layer 23 and the contact layer 22 after being processed into the smallest mesa.
  • FIG. 4B is a bottom view of the semiconductor light receiving element 20.
  • an antireflection film 26 made of a dielectric multilayer film made of SiO 2 / TiO 2 is provided in a shape concentric circle having the same center as the operating region 25 defined by the contact layer 24.
  • the incident light on the light receiving element 20 is incident on the back surface of the substrate 21.
  • the incident light is absorbed by the light absorption layer 23, a photocarrier is generated, and a current flows between the contact layers 22 and 24 to function as a light receiving element.
  • the incident light from the back surface is incident on the central portion of the operating region 25
  • the incident light is transmitted through the region where the antireflection film 26 is formed, so that the reflection on the back surface of the substrate 21 is suppressed and the incident light is substantially. It reaches the light absorption layer 23 with a transmittance close to 100%. Therefore, the photocurrent at the time of centering shows the maximum value. Since the incident light is incident on the central portion of the operating region 25, all the generated photocarriers are affected by the electric field generated in the operating region 25 and drift and move. Therefore, a desired high-speed operation can be realized.
  • the incident light deviates from the center of the operating region 25, a part of the incident light does not pass through the antireflection film 26, so that it is reflected on the back surface of the substrate 21 and the observed photocurrent is extremely reduced. ..
  • the transmittance of the light inside the concentric circle having the same center as the operating region 25 is higher than the transmittance of the region outside the concentric circle. Therefore, the photocurrent is maximized only when the signal light is incident on the central portion of the operating region 25.
  • the optical alignment is performed by unmodulated light (CW light)
  • CW light unmodulated light
  • the p-type InP contact layer 22, the undoped InGaAs light absorption layer 23, and the n-type InP light absorption layer 24 are epitaxially grown on the surface of the semi-insulating InP substrate 21 in this order by using the MOCVD method. After crystal growth, photolithography and etching are sequentially performed so that the contact layer 24 becomes the smallest mesa, and then the area of the light absorption layer 23 and the contact layer 22 increases in this order. After forming the necessary electrodes and the like on the contact layers 22 and 24, the back surface of the light receiving element 20, that is, the back surface of the substrate 21 is polished.
  • an antireflection film of SIO 2 / TiO 2 is formed on the polished surface by sputtering.
  • a resist that is concentric with the center of the operating region 25 is formed, the antireflection film 26 is processed into a circular shape by dry etching, and the resist is peeled off.
  • the diameter of the concentric circles formed on the back surface of the substrate 21 does not necessarily have to match the diameter of the operating region 25 of the semiconductor light receiving element 20, that is, the contact layer 24.
  • the incident light is parallel light, there is no problem even if the diameter of the concentric circles matches the diameter of the contact layer 24.
  • the incident light is diffused light or convergent light, the beam diameter incident on the contact layer 24 and the beam diameter on the back surface of the substrate 21 are different.
  • the diameter of the concentric circles may be appropriately determined depending on the thickness of the substrate and the focal position of the incident light.
  • the antireflection film does not need to completely reflect light, and it is sufficient that the transmittance of the region inside the concentric circle centered with the operating region 25 is higher than the transmittance of the region outside the concentric circle.
  • FIG. 5 shows the structure of the light receiving element according to the third embodiment of the present invention.
  • FIG. 5A is a cross-sectional view of the vertically incident type semiconductor light receiving element 30.
  • the semiconductor light receiving element 30 has a layer structure in which a p-type InP contact layer 32, an undoped InGaAs light absorption layer 33, and an n-type InP contact layer 34 are laminated in this order on the surface of the InP substrate 31.
  • the uppermost contact layer 34 has a multi-stage mesa structure in which the outer shape thereof is gradually increased in the order of the light absorption layer 33 and the contact layer 32, which is processed into the smallest mesa.
  • FIG. 5B is a bottom view of the semiconductor light receiving element 30.
  • An antireflection film 36 made of SiO 2 / TiO 2 is formed on the back surface of the light receiving element 30, and a light shielding film 37 made of Ti is provided on the outside of an ellipse having the same center as the operating region 35 defined by the contact layer 34. Has been done.
  • the antireflection film 36 is exposed inside the ellipse.
  • the incident light on the light receiving element 30 is incident on the back surface of the substrate 31.
  • the incident light is absorbed by the light absorption layer 33, a photocarrier is generated, and a current flows between the contact layers 32 and 34, so that the incident light functions as a light receiving element.
  • the incident light from the back surface is incident on the central portion of the operating region 35
  • the incident light is transmitted through the region where the antireflection film 36 is formed, so that the reflection on the back surface of the substrate 31 is suppressed and the incident light is substantially. It reaches the light absorption layer 33 with a transmittance close to 100%. Therefore, the photocurrent at the time of centering shows the maximum value. Since the incident light is incident on the central portion of the operating region 35, all the generated photocarriers are affected by the electric field generated in the operating region 35 and drift and move. Therefore, a desired high-speed operation can be realized.
  • the p-type InP contact layer 32, the undoped InGaAs light absorption layer 33, and the n-type InP light absorption layer 34 are epitaxially grown on the surface of the semi-insulating InP substrate 31 in this order by using the MOCVD method. After crystal growth, photolithography and etching are sequentially performed so that the contact layer 34 becomes the smallest mesa, and then the area of the light absorption layer 33 and the contact layer 32 increases in this order. After forming the necessary electrodes and the like on the contact layers 32 and 34, the back surface of the light receiving element 30, that is, the back surface of the substrate 31 is polished.
  • the antireflection film 36 of SIO 2 / TiO 2 is formed on the polished surface by sputtering. After the antireflection film 36 is formed, a resist having an ellipse centered on the operating region 35 is formed. After forming Ti by sputtering, the light-shielding film 37 is formed by peeling off the resist.
  • the major axis and the minor axis of the ellipse formed on the back surface of the substrate 31 do not necessarily have to match the major axis and the minor axis of the operating region 35 of the semiconductor light receiving element 30, that is, the contact layer 34.
  • the incident light is parallel light, there is no problem even if the major axis and the minor axis of the ellipse match the major axis and the minor axis of the contact layer 34.
  • the incident light is diffused light or convergent light, the beam diameter incident on the contact layer 34 and the beam diameter on the back surface of the substrate 31 are different.
  • the major axis and the minor axis of the ellipse may be appropriately determined depending on the thickness of the substrate and the focal position of the incident light.
  • FIG. 6 shows the structure of the light receiving element according to the fourth embodiment of the present invention.
  • FIG. 6A is a cross-sectional view of the vertically incident type semiconductor light receiving element 40.
  • the semiconductor light receiving element 40 has a layer structure in which a p-type InP contact layer 42, an undoped InGaAs light absorption layer 43, and an n-type InP contact layer 44 are laminated in this order on the surface of the InP substrate 41.
  • the uppermost contact layer 44 has a multi-stage mesa structure in which the outer shape thereof is gradually increased in the order of the light absorption layer 43 and the contact layer 42, which are processed into the smallest mesa.
  • the mesa of the uppermost contact layer 44 is formed in a circular shape.
  • FIG. 6B is a bottom view of the semiconductor light receiving element 40.
  • An antireflection film 46 made of SiO 2 / TiO 2 is formed on the back surface of the light receiving element 40, and a ring-shaped light-shielding film 47 made of Ti is formed on a concentric circle centered on the operating region 35 defined by the contact layer 44. It is provided.
  • the antireflection film 36 is exposed on the back surface excluding the light-shielding film 47.
  • the incident light on the light receiving element 40 is incident on the back surface of the substrate 41.
  • the incident light is absorbed by the light absorption layer 43, a photocarrier is generated, and a current flows between the contact layers 42 and 44, so that the incident light functions as a light receiving element.
  • the incident light from the back surface is incident on the central portion of the operating region 45
  • the incident light is transmitted through the region where the antireflection film 46 is formed, so that the reflection on the back surface of the substrate 41 is suppressed, and the incident light is substantially. It reaches the light absorption layer 43 with a transmittance close to 100%. Therefore, the photocurrent at the time of centering shows the maximum value. Since the incident light is incident on the central portion of the operating region 45, all the generated photocarriers are affected by the electric field generated in the operating region 45 and drift and move. Therefore, a desired high-speed operation can be realized.
  • the incident light deviates from the center of the operating region 45, a part of the incident light is blocked by the ring-shaped light-shielding film 47, so that the observed photocurrent is extremely reduced.
  • the transmittance of the light inside the ring having the same center as the operating region 45 is higher than the transmittance of the region outside the ring. Therefore, the photocurrent is maximized only when the signal light is incident on the central portion of the operating region 45.
  • the optical alignment is performed by unmodulated light (CW light)
  • CW light unmodulated light
  • a method for manufacturing the semiconductor light receiving element 40 according to the fourth embodiment will be described.
  • a p-type InP contact layer 42, an undoped InGaAs light absorption layer 43, and an n-type InP light absorption layer 44 are epitaxially grown on the surface of the semi-insulating InP substrate 41 using the MOCVD method.
  • photolithography and etching are sequentially performed so that the contact layer 44 becomes the smallest mesa, and then the area of the light absorption layer 43 and the contact layer 42 increases in this order.
  • the back surface of the light receiving element 40 that is, the back surface of the substrate 41 is polished.
  • an antireflection film 46 of SIO 2 / TiO 2 is formed on the polished surface by sputtering. After the antireflection film 46 is formed, a resist having a ring shape concentric with the center of the operating region 45 is formed. After forming Ti by sputtering, the light-shielding film 47 is formed by peeling off the resist.
  • the ring diameter of the concentric circles formed on the back surface of the substrate 41 does not necessarily have to match the diameter of the operating region 45 of the semiconductor light receiving element 40, that is, the contact layer 44.
  • the incident light is parallel light, there is no problem even if the diameter of the concentric circles matches the diameter of the contact layer 44.
  • the incident light is diffused light or convergent light, the beam diameter incident on the contact layer 44 and the beam diameter on the back surface of the substrate 41 are different.
  • the diameter of the concentric circles may be appropriately determined depending on the thickness of the substrate and the focal position of the incident light.
  • the InGaAs-based light-receiving element has been described as an example, but it is clear that the light-receiving element can be applied to other material-based devices such as Si and SiGe. Further, a so-called “two-pass structure" may be adopted in which a mirror is formed on the light absorption layer side of the light receiving element, that is, on the mesa side of the contact layer, and the incident light is reflected on the surface side.
  • the shape of the operating region defined by the contact layer is not limited to a circular shape or an elliptical shape, and may be any shape.
  • the shape having the same center as the operating region formed on the back surface may be a shape similar to the shape of the operating region, and should be appropriately designed in an optical system for incident signal light on the light receiving element.
  • all light receiving elements having a mesa structure have been exemplified, but it goes without saying that the light receiving elements such as a so-called ion implantation structure and a "planar structure" using selective diffusion can also be applied.
  • This embodiment is a vertically incident type, and is a widely effective technique as long as it has some kind of electric field constriction structure.
  • alignment marks are also possible to form alignment marks at the same time in the back surface process in the method of manufacturing the light receiving element. For example, coarse alignment can be performed by passive alignment using an alignment mark, and highly accurate alignment can be performed by active alignment.

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PCT/JP2020/038106 2020-10-08 2020-10-08 半導体受光素子 Ceased WO2022074780A1 (ja)

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US18/246,595 US20230361226A1 (en) 2020-10-08 2020-10-08 Semiconductor Light Receiving Element
PCT/JP2020/038106 WO2022074780A1 (ja) 2020-10-08 2020-10-08 半導体受光素子
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JP2002151730A (ja) * 2000-11-14 2002-05-24 Sumitomo Electric Ind Ltd 半導体受光素子
JP2002252366A (ja) * 2000-12-19 2002-09-06 Fujitsu Quantum Devices Ltd 半導体受光装置
JP2004158763A (ja) * 2002-11-08 2004-06-03 Toshiba Corp 半導体受光素子
JP2018098399A (ja) * 2016-12-14 2018-06-21 日本電信電話株式会社 半導体受光素子
KR102093168B1 (ko) * 2019-02-22 2020-03-25 이상환 이중 광경로를 가진 광 검출기

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