WO2022042060A1 - 用于显示模组的散热膜及显示装置的制备方法 - Google Patents
用于显示模组的散热膜及显示装置的制备方法 Download PDFInfo
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- WO2022042060A1 WO2022042060A1 PCT/CN2021/104912 CN2021104912W WO2022042060A1 WO 2022042060 A1 WO2022042060 A1 WO 2022042060A1 CN 2021104912 W CN2021104912 W CN 2021104912W WO 2022042060 A1 WO2022042060 A1 WO 2022042060A1
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- WIPO (PCT)
- Prior art keywords
- protective film
- display module
- heat dissipation
- composite structure
- film
- Prior art date
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 70
- 238000002360 preparation method Methods 0.000 title claims abstract description 5
- 230000001681 protective effect Effects 0.000 claims abstract description 68
- 239000002131 composite material Substances 0.000 claims abstract description 48
- 239000010410 layer Substances 0.000 claims description 72
- 238000005520 cutting process Methods 0.000 claims description 21
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000006260 foam Substances 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000005192 partition Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 15
- 238000003475 lamination Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 3
- 229920002545 silicone oil Polymers 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Definitions
- the embodiments of the present disclosure relate to, but are not limited to, the technical field of display devices, and in particular, relate to a heat dissipation film for a display module and a method for manufacturing the display device.
- OLED organic electroluminescent diode
- Embodiments of the present disclosure provide a heat dissipation film for a display module, comprising a composite structure layer and a removable protective film disposed on the composite structure layer, the composite structure layer having opposite first sides and a second Two sides, the composite structure layer is provided with reserved holes penetrating the first side and the second side, and the first side of the composite structure layer is set to be bonded to the side of the display module away from the display one side, the protective film is attached to the second side of the composite structure layer; the protective film is provided with a shielding area covering the reserved hole, the shielding area and the protective film are The rest can be torn off from the composite structure layer independently, and the shielding area is provided with a cut-off line, and the cut-off line connects the inside of the reserved hole with a part of the protective film that is away from the composite structure layer. side connection.
- Embodiments of the present disclosure also provide a method for manufacturing a display device, including:
- the heat dissipation film is pasted on the side of the display module away from the display side, and the reserved holes are corresponding to the set area of the display module, wherein the heat dissipation film is pasted on the display module.
- the cutting line makes the internal air pressure of the reserved hole the same as the external air pressure.
- FIG. 1 is a schematic cross-sectional structure diagram of some display modules after attaching a heat dissipation film
- FIG. 2 is a schematic structural diagram of the display module of FIG. 1 after the heat dissipation film is attached to produce a mold;
- 3a is a schematic diagram of an exploded structure of a heat dissipation film of some exemplary embodiments
- Fig. 3b is the exploded structure schematic diagram of the part where the shielding region of the heat dissipation film is located in Fig. 3a;
- FIG. 4 is a schematic top-view structural diagram of a heat dissipation film of some exemplary embodiments
- FIG. 5 is a schematic cross-sectional structural diagram of the heat dissipation film of some exemplary embodiments after being attached to the display module.
- some display modules 100 are attached to a heat dissipation film 200 (the heat dissipation film 200 includes a composite structural layer 1 and a protective film 2 disposed on the composite structural layer 1 , and the composite structural layer 1 is provided with reserved holes 10 ) Afterwards, the reserved hole 10 forms a closed space together with the display module 100 and the protective film 2 .
- the heat dissipation film 200 rolling can be used for lamination
- part of the gas in the reserved hole 10 will be discharged, and each film layer of the heat dissipation film 200 is squeezed and deformed during the lamination process.
- each film layer of the heat-dissipating film 200 recovers, and the airtight space increases, causing the air pressure in the airtight space to decrease.
- the three parallel lines with arrows in FIG. 2 represent the external atmospheric pressure), which exerts a certain pressure on the protective film 2, and the protective film 2 covering the reserved hole 10 has obvious dents.
- the composite structure layer 1 is bonded together, so each film layer of the heat dissipation film around the enclosed space is forced to deform and squeeze the display module 100, resulting in a molding problem of the display module 100, causing the display panel of the display module 100 to have a problem.
- the position of the (Panel) corresponding to the reserved hole 10 produces a bulge.
- an embodiment of the present disclosure provides a heat dissipation film for a display module.
- the heat dissipation film 200 includes a composite structure layer 1 and is disposed on the composite structure layer 1 and is removable
- the protective film 2 the composite structure layer 1 has opposite first side and second side, the composite structure layer 1 is provided with a reserved hole 10 running through the first side and the second side, the The first side of the composite structure layer 1 is set to be bonded to the side of the display module 100 away from the display side, and the protective film 2 is attached to the second side of the composite structure layer 1; the protection The film 2 is provided with a shielding area 21 covering the reserved hole 10.
- the shielding area 21 and the rest of the protective film 2 can be torn off from the composite structure layer 1 independently.
- the area 21 is provided with a cutting line 23 , and the cutting line 23 connects the inside of the reserved hole 10 with the side of the protective film 2 facing away from the composite structure layer 1 .
- a cutting line 23 is set on the protective film 2 . Connected on one side. In this way, after the heat dissipation film 200 is attached to the display module 100, the outside air can enter the reserved hole 10 from the cut-off line 23, so that the air pressure inside the reserved hole 10 can be the same as the outside air pressure, avoiding the need for pre-production
- the molding problem caused by the difference between the air pressure inside the hole 10 and the outside air pressure can improve the product yield.
- the heat dissipation film 200 of the embodiment of the present disclosure can be used in a rigid or flexible OLED display module, and the OLED display module can include an OLED display panel (Panel), a touch structure layer, a polarizer, a cover plate, a flexible circuit board, and the like.
- the heat dissipation film 200 is attached to the side of the OLED display panel away from the display side, which can dissipate heat, help the heat generated by the OLED display panel to quickly dissipate during operation, and can also play a role of shading.
- the reserved holes 10 on the heat dissipation film 200 can be set to install some sensor modules, such as a fingerprint unlocking module, a face-to-face screen-off module, etc. When installing these sensor modules, the heat dissipation film 200 can be installed by hand or tools. Remove the protective film 2.
- the protective film 2 is further provided with a partition line 22 separating the shielding area 21 from the rest of the protective film 2 .
- the blocking line 22 can completely cut off the shielding area 21 from the rest of the protective film 2 , so that the shielding area 21 is not connected with the rest of the protective film 2 .
- the breaking line 22 may include a plurality of apertures arranged discontinuously, so that the shielding area 21 can be easily and completely separated from the rest of the protective film 2 along the breaking line 22 under the action of an external force. In this way, the shielding area 21 and the rest of the protective film 2 can be torn off from the composite structure layer 1 independently through the separation line 22 . After the rest of the protective film 2 is torn off from the composite structural layer 1, the shielding area 21 is still covered on the reserved hole 10, and the shielding area 21 can play a role in the part of the display module 100 exposed by the reserved hole 10. Protective effects.
- the break line 22 may extend to the edge of the protective film 2 .
- the shielding area 21 may include a first area 211 that completely covers the reserved hole 10, and a second area 212 connected to one side of the first area 211, and the second area 212 is far from the first area.
- One end of the region 211 extends to the edge of the protective film 2 and is provided with a protruding portion 213 protruding from the edge of the protective film 2 .
- the shape of the first region 211 may be adapted to the cross-sectional shape of the reserved hole 10.
- the cross-sectional shape of the reserved hole 10 may be a rectangle, a circle, a polygon, etc.
- the shape of an area 211 is a rectangle, a circle, a polygon, or the like.
- the area of the first region 211 is larger than the cross-sectional area of the reserved hole 10 .
- the shape of the second area 212 may be a bar shape, one end of the second area 212 is connected to the first area 211 , and the other end of the second area 212 is provided with the protruding portion 213 .
- the shielding region 21 can be torn off from the composite structural layer 1 by gripping the protruding portion 213 .
- the first region 211 is provided with the cutting line 23 , one end of the cutting line 23 may extend to the breaking line 22 , and the other end of the cutting line 23 may It is located in the middle area of the shielding area 21 .
- the number of cutting lines 23 may be one or more.
- the heat dissipation film 200 may further include a support sheet 3 , and the support sheet 3 is disposed in the reserved hole 10 of the protective film 2 .
- the thickness of the support sheet 3 is smaller than the depth of the reserved hole 10 .
- the support sheet 3 in the process of attaching the heat dissipation film 200 to the display module 100 , the support sheet 3 can be supported on the display module 100 , which can prevent the heat dissipation film 200 from existing at the reserved hole 10 . Damage to the display module 100 caused by a higher level difference.
- the provision of the support sheet 3 can prevent the protective film 2 from being adhered to the display module 100 during the process of attaching the heat dissipation film 200 to the display module 100.
- the cut-off line 23 may not cut the support sheet 3 , and the support sheet 3 does not block the cut-off line 23 , so as to ensure that the outside air can enter the reserved hole 10 through the cut-off line 23 .
- the composite structural layer 1 may include an adhesive layer 11 , a buffer layer 12 and a metal layer 13 stacked in sequence, and the protective film 2 is attached to the metal layer 13 .
- the adhesive layer 11 is arranged to be adhered to the side of the display module 100 away from the display side.
- the heat dissipation film 200 may be a super clean foam (Super clean foam; SCF for short).
- the adhesive layer 11 can be an EMBO layer, which can be pressed by a grid to make vertical and horizontal meshes on the adhesive surface, which can prevent the curling phenomenon caused by the shrinkage of the adhesive layer, and strengthen the heat dissipation film 200 and the heat dissipation film 200.
- the tightness of the attachment of the module 100 is displayed.
- the adhesive material of the adhesive layer 11 can be acrylic adhesive or silica gel.
- the material of the buffer layer 12 can be foam, and the buffer layer 12 can buffer external force to prevent damage to the display panel caused by the bonding pressure during the bonding process of the heat dissipation film 200 and the display module 100 .
- the material of the metal layer 13 can be copper or aluminum, so that the heat dissipation film 200 has a good heat dissipation effect.
- the adhesive layer 11 , the buffer layer 12 and the metal layer 13 are respectively provided with a first opening 111 and a second opening 121 and the third opening 131, the first opening 111, the second opening 121 and the third opening 131 form the reserved hole 10, and the third opening 131 is in the protective film 2 may include the orthographic projection of the second opening 121 on the protective film 2, and the orthographic projection of the second opening 121 on the protective film 2 may include or be equal to the first The orthographic projection of the opening 111 on the protective film 2 .
- each layer of the composite structure layer 1 is provided with openings of different sizes.
- the height difference of the reserved holes 10 formed on the composite structure layer 1 will not be too large, and it is possible to avoid the difference between the heat dissipation film 200 and the heat dissipation film 200 .
- the large height difference at the reserved hole 10 causes damage to the display panel.
- the shapes of the first opening 111 , the second opening 121 and the third opening 131 are adapted to each other, for example, they are all rectangular, circular or polygonal.
- the shielding area 21 of the protective film 2 can completely cover the third opening 131 , so that the shielding area 21 can completely cover the reserved hole 10 .
- the shape and size of the first opening 111 , the second opening 121 and the third opening 131 may be the same.
- the thickness of the support sheet 3 is less than or equal to the thickness of the metal layer 13 , and the orthographic projection of the support sheet 3 on the protective film 2 Including the orthographic projection of the second opening 121 on the protective film 2 .
- there is a gap between the edge of the support sheet 3 and the hole wall of the third opening 131 and the gap can be, for example, 0.2 mm to 0.4 mm.
- the cut-off line 23 is at least partially arranged in the area of the shielding area 21 corresponding to the gap, one end of the cut-off line 23 can extend to the cut-off line 22, and the other end of the cut-off line 23 can extend to the shielding area 21 and the support. At the position corresponding to the edge of the sheet 3 , the cutting line 23 may not cut the supporting sheet 3 .
- the edge portion of the support sheet 3 can be supported on the buffer layer 12 , and the lamination pressure can be distributed to the buffer layer 12 and the adhesive layer 11 . , to prevent damage to the display module 100 .
- one side of the support sheet 3 is pasted on the portion of the protective film 2 facing into the reserved hole 10 , and the other side of the support sheet 3 may be coated with silicone oil.
- the silicone oil can play the role of hydrophobic and oleophobic. Since the side of the buffer layer 12 facing the protective film 2 is viscous, and the side of the support sheet 3 is coated with silicone oil, it can prevent the heat dissipation film 200 from being attached to the display module 100 during the bonding process.
- the middle support sheet 3 is adhered to the buffer layer 12 .
- the support sheet 3 can be made of flexible material and opaque to light.
- the support sheet 3 made of flexible material can prevent damage to the display module 100 .
- the support sheet 3 can be black to play the role of shading.
- the material of the support sheet 3 may be polyethylene terephthalate (PET), polyethylene (PE), polyimide (PI), or the like.
- the heat dissipation film 200 may further include a light shielding sheet 4 , and the light shielding sheet 4 is attached to the shielding area 21 away from the composite structure layer 1 .
- the position corresponding to the cutting line 23 is cut by the cutting line 23 .
- the light shielding sheet 4 can be made of black light shielding tape and attached to the protective film 2 , and the light shielding sheet 4 can completely cover the reserved hole 10 .
- the protective film 2 can be made of translucent material, and the light shielding sheet 4 can prevent external light from passing through the protective film 2 and irradiating the display module 100 exposed by the reserved hole 10 .
- the light shielding sheet 4 when forming the cutting line 23 on the protective film 2 , the light shielding sheet 4 can be cut at the same time, so that the cutting line 23 can be formed at the corresponding position of the light shielding sheet 4 at the same time, so as to prevent the light shielding sheet 4 from cutting the cutting line on the protective film 2 .
- 23 is blocked to affect the balance between the air pressure inside the reserved hole 10 and the outside air pressure after the heat dissipation film 200 is attached to the display module 100 .
- An embodiment of the present disclosure also provides a method for manufacturing a display device, as shown in FIG. 5 , which includes: attaching the heat dissipation film 200 described in any of the foregoing embodiments on the side surface of the display module 100 away from the display side, and The reserved hole 10 corresponds to the set area of the display module 100, wherein after the heat dissipation film 200 is attached to the display module 100, the cutting line 23 makes the The air pressure inside the hole 10 is the same as the air pressure outside.
- the preparation method of the display device further includes: after the heat dissipation film 200 is attached to the display module 100,
- the shielding area 21 is torn off, and the sensor module is installed in the reserved hole 10 .
- plasma cleaning equipment can be used to clean the second side of the composite structure layer 1. During the cleaning process, since the shielding area 21 still covers the reserved hole 10, the shielding area 21 can The plasma is prevented from causing damage to the portion of the display module 100 exposed by the reserved hole 10 .
- the display module 100 of the embodiment of the present disclosure may be a rigid or flexible OLED display module, and the OLED display module may include an OLED display panel (Panel), a touch structure layer, a polarizer, a cover plate, a flexible circuit board, and the like.
- the heat dissipation film 200 is attached to the side of the OLED display panel away from the display side, and can play a role of heat dissipation.
- the sensor module may be a fingerprint unlocking module, a veneer screen-extinguishing module, and the like.
- connection means a fixed connection, or a Detachable connection, or integral connection;
- installed may be direct connection, or indirect connection through an intermediate medium, or internal communication between two elements.
Abstract
一种用于显示模组的散热膜及显示装置的制备方法，所述散热膜包括复合结构层和设于复合结构层上且可移除的保护膜，所述复合结构层具有相对的第一侧面和第二侧面，复合结构层设有贯穿所述第一侧面和所述第二侧面的预留孔，所述复合结构层的第一侧面设置为粘接在显示模组的背离显示侧的一侧，所述保护膜贴合在复合结构层的第二侧面上；所述保护膜设有覆盖在所述预留孔上的遮挡区，所述遮挡区和所述保护膜的其余部分均能够独立地从所述复合结构层上撕除，所述遮挡区设有切断线，所述切断线将所述预留孔内部与所述保护膜的背离所述复合结构层的一侧连通。
Description
本申请要求于2020年8月27日提交中国专利局、申请号为202010876839.7、发明名称为“一种用于显示模组的散热膜及显示装置的制备方法”的中国专利申请的优先权，其内容应理解为通过引用的方式并入本公开中。
本公开实施例涉及但不限于显示装置技术领域，具体涉及一种用于显示模组的散热膜及显示装置的制备方法。
有机电致发光二极管(OLED)显示装置的应用越来越广泛，显示模组中一些传感器模组(比如指纹解锁模组、贴面熄屏模组等)设置在显示面板的背侧，显示面板的背侧通常还贴合有散热膜。这些传感器模组一般在散热膜贴合后进行安装，因此需要在散热膜上预留相应的孔来安装这些传感器模组。一些显示模组在贴合散热膜后，显示面板的对应于散热膜上的预留孔的位置会产生模印问题，影响显示效果。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本公开实施例提供一种用于显示模组的散热膜，包括复合结构层和设于所述复合结构层上且可移除的保护膜，所述复合结构层具有相对的第一侧面和第二侧面，所述复合结构层设有贯穿所述第一侧面和所述第二侧面的预留孔，所述复合结构层的第一侧面设置为粘接在所述显示模组的背离显示侧的一侧，所述保护膜贴合在所述复合结构层的第二侧面上；所述保护膜设有覆盖在所述预留孔上的遮挡区，所述遮挡区和所述保护膜的其余部分均能够独立地从所述复合结构层上撕除，所述遮挡区设有切断线，所述切断线将所述预留孔内部与所述保护膜的背离所述复合结构层的一侧连通。
本公开实施例还提供一种显示装置的制备方法，包括：
将所述的散热膜贴合在显示模组的背离显示侧的侧面上，并使所述预留孔与所述显示模组的设定区域相对应，其中，将所述散热膜贴合在所述显示模组上后，所述切断线使所述预留孔的内部气压与外界气压相同。
在阅读并理解了附图和详细描述后，可以明白其他方面。
附图用来提供对本公开实施例的理解，并且构成说明书的一部分，与本公开实施例一起用于解释本公开实施例的技术方案，并不构成对本公开实施例技术方案的限制。
图1为一些显示模组的贴附散热膜后的剖面结构示意图；
图2为图1的显示模组在贴附散热膜后产生模印的结构示意图；
图3a为一些示例性实施例的散热膜的爆炸结构示意图；
图3b为图3a中散热膜的遮挡区所在部分的爆炸结构示意图；
图4为一些示例性实施例的散热膜的俯视结构示意图；
图5为一些示例性实施例的散热膜在贴附于显示模组后的剖面结构示意图。
本领域的普通技术人员应当理解，可以对本公开实施例的技术方案进行修改或者等同替换，而不脱离本公开技术方案的精神和范围，均应涵盖在本公开的权利要求范围当中。
如图1所示，一些显示模组100在贴合散热膜200(散热膜200包括复合结构层1和设置在复合结构层1上的保护膜2，复合结构层1设有预留孔10)后，预留孔10与显示模组100以及保护膜2共同形成密闭空间。散热膜200贴合(可以采用滚轮辊压进行贴合)过程中，会排出预留孔10内的部分气体，且在贴合过程中散热膜200的每个膜层受挤压而变形，贴合完成一定时间后，散热膜200的每个膜层形变恢复，密闭空间增大，造成密闭空间内 气压降低，此时，如图2所示，密闭空间内气压低于外界大气压，外界大气压(图2中三个平行的带箭头直线代表外界大气压力)对保护膜2有一定的压力，覆盖在预留孔10处的保护膜2有明显的凹痕，由于保护膜2与散热膜200的复合结构层1粘结在一起，因此会迫使密闭空间四周散热膜的每个膜层发生形变并挤压显示模组100，导致显示模组100产生模印问题，使显示模组100的显示面板(Panel)的对应于预留孔10的位置产生凸起。
如图3a、图4、图5所示，本公开实施例提供一种用于显示模组的散热膜，散热膜200包括复合结构层1和设于所述复合结构层1上且可移除的保护膜2，所述复合结构层1具有相对的第一侧面和第二侧面，所述复合结构层1设有贯穿所述第一侧面和所述第二侧面的预留孔10，所述复合结构层1的第一侧面设置为粘接在所述显示模组100的背离显示侧的一侧，所述保护膜2贴合在所述复合结构层1的第二侧面上；所述保护膜2设有覆盖在所述预留孔10上的遮挡区21，所述遮挡区21和所述保护膜2的其余部分均能够独立地从所述复合结构层1上撕除，所述遮挡区21设有切断线23，所述切断线23将所述预留孔10内部与所述保护膜2的背离所述复合结构层1的一侧连通。
本公开实施例的用于显示模组的散热膜，在保护膜2上设置了切断线23，切断线23将复合结构层1的预留孔10内部与保护膜2的背离复合结构层1的一侧连通。如此，在散热膜200贴合在显示模组100上后，外界的空气可以从切断线23进入预留孔10内部，由此可使预留孔10内部的气压与外界气压相同，避免了预留孔10内部气压与外界气压不相同而导致的模印问题，可以提升产品良率。
本公开实施例的散热膜200可用于刚性或柔性OLED显示模组，OLED显示模组可以包括OLED显示面板(Panel)、触控结构层、偏光片、盖板，以及柔性电路板等。散热膜200贴附在OLED显示面板的背离显示侧的一侧，可以起到散热的作用，有助于OLED显示面板工作时产生的热量快速散发，此外可起到遮光的作用。散热膜200上的预留孔10可以设置为安装一些传感器模组，比如指纹解锁模组、贴面熄屏模组等，在安装这些传感器模组时，可以用手或工具将散热膜200的保护膜2撕除。
如图4所示，在一些示例性实施例中，所述保护膜2上还设有将所述遮挡区21与所述保护膜2的其余部分分隔开的隔断线22。示例性地，隔断线22可以将遮挡区21与所述保护膜2的其余部分完全割断，使遮挡区21与所述保护膜2的其余部分不连接。或者，隔断线22可以包括不连续排布的多个孔隙，使得在外力作用下容易沿隔断线22将遮挡区21与保护膜2的其余部分完全分离开。如此，通过隔断线22，可以使所述遮挡区21和所述保护膜2的其余部分均能够独立地从所述复合结构层1上撕除。在将保护膜2的其余部分从复合结构层1上撕除后，遮挡区21仍覆盖在预留孔10上，遮挡区21可以对显示模组100的被预留孔10暴露的部分起到保护作用。
如图4所示，在一些示例性实施例中，隔断线22可以延伸至保护膜2的边缘。所述遮挡区21可以包括完全覆盖所述预留孔10的第一区域211，以及连接于所述第一区域211一侧的第二区域212，所述第二区域212的远离所述第一区域211的一端延伸至所述保护膜2的边缘，并设有凸出于所述保护膜2的边缘的凸出部213。本实施例的一个示例中，第一区域211的形状可以与预留孔10的截面形状相适配，比如，预留孔10的截面形状可以为矩形、圆形、多边形等，相应地，第一区域211的形状为矩形、圆形、多边形等。第一区域211的面积大于预留孔10的截面面积。第二区域212的形状可以为条形，第二区域212的一端与第一区域211相接，第二区域212的另一端设有所述凸出部213。在撕除遮挡区21时可以夹持住凸出部213将遮挡区21从复合结构层1上撕除。
如图4所示，在一些示例性实施例中，第一区域211设有所述切断线23，所述切断线23的一端可以延伸至所述隔断线22处，切断线23的另一端可以位于遮挡区21的中间区域。切断线23的数量可以是一条或者多条。
如图3a和图5所示，在一些示例性实施例中，所述散热膜200还可以包括支撑片3，所述支撑片3设置在所述保护膜2的朝向所述预留孔10内的部分上，所述支撑片3的厚度小于所述预留孔10的深度。本实施例的一个示例中，在将散热膜200贴合在显示模组100上的过程中，支撑片3可以支撑在显示模组100上，可以防止因散热膜200在预留孔10处存在较高的段差而对显示模组100造成的损害。此外，由于保护膜2的朝向复合结构层1的侧面 具有粘性，设置支撑片3可以防止在将散热膜200贴合在显示模组100上过程中保护膜2粘接在显示模组100上。所述切断线23可以不切到支撑片3，支撑片3不遮挡所述切断线23，以保证外界气体可经切断线23进入预留孔10内部。
如图5所示，在一些示例性实施例中，所述复合结构层1可以包括依次叠设的粘胶层11、缓冲层12和金属层13，所述保护膜2贴合在所述金属层13上，所述粘胶层11设置为粘接在所述显示模组100的背离显示侧的一侧。本实施例的一个示例中，所述散热膜200可以是超净泡棉(Super clean foam；简称SCF)。粘胶层11可以为网纹胶(EMBO)层，可以通过网格施压而使胶面印压上纵横的网纹，可以防止因胶层收缩所导致的卷曲现象，并加强散热膜200与显示模组100贴附的紧密性。粘胶层11的胶材可以采用亚克力胶或者硅胶。所述缓冲层12的材料可以为泡棉(Foam)，缓冲层12可以缓冲外力，可防止散热膜200与显示模组100贴合过程中贴合压力对显示面板造成损害。所述金属层13的材料可以为铜或铝等，使散热膜200具有良好的散热作用。
如图4、图5所示，在一些示例性实施例中，所述粘胶层11、所述缓冲层12和所述金属层13上分别设有第一开孔111、第二开孔121和第三开孔131，所述第一开孔111、所述第二开孔121和所述第三开孔131形成所述预留孔10，所述第三开孔131在所述保护膜2上的正投影可以包含所述第二开孔121在所述保护膜2上的正投影，所述第二开孔121在所述保护膜2上的正投影可以包含或者等于所述第一开孔111在所述保护膜2上的正投影。本示例中，复合结构层1的每个层上分别设置不同大小的开孔，由此，复合结构层1上形成的预留孔10的高度段差不会太大，可避免在散热膜200与显示模组100贴合过程中，预留孔10处较大的高度段差对显示面板造成损害。本示例中，第一开孔111、第二开孔121和第三开孔131三者的形状相适配，比如均为矩形、圆形或多边形。保护膜2的遮挡区21可以完全覆盖所述第三开孔131，这样，遮挡区21可以完全覆盖预留孔10。在另一些示例中，所述第一开孔111、所述第二开孔121和所述第三开孔131的形状、大小可以均相同。
如图4、图5所示，在一些示例性实施例中，所述支撑片3的厚度小于或等于所述金属层13的厚度，所述支撑片3在所述保护膜2上的正投影包含所述第二开孔121在所述保护膜2上的正投影。本实施例的一个示例中，支撑片3的边缘与所述第三开孔131的孔壁之间具有间隙，此间隙比如可以为0.2mm至0.4mm。切断线23至少部分地设置在遮挡区21的与此间隙对应的区域内，切断线23的一端可以延伸至所述隔断线22处，切断线23的另一端可以延伸至遮挡区21的与支撑片3的边缘对应的位置，切断线23可以不切到支撑片3。本示例中，在将散热膜200贴合在显示模组100上过程中，支撑片3的边缘部分可以支撑在缓冲层12上，可以将贴合压力分散至缓冲层12和粘胶层11上，防止对显示模组100造成损害。
在一些示例性实施例中，支撑片3的一个侧面粘贴在保护膜2的朝向预留孔10内的部分上，支撑片3的另一个侧面可以涂覆有硅油。硅油可以起到疏水疏油的作用，由于缓冲层12的朝向保护膜2的侧面具有粘性，支撑片3的侧面涂覆有硅油，如此，可以防止在散热膜200与显示模组100贴合过程中支撑片3粘附在缓冲层12上。
所述支撑片3可以为柔性材质且不透光。柔性材质的支撑片3可防止对显示模组100造成损害。支撑片3可以为黑色，起到遮光作用。示例性地，支撑片3的材料可以为聚对苯二甲酸乙二醇酯(PET)、聚乙烯(PE)、聚酰亚胺(PI)等。
如图3b、图5所示，在一些示例性实施例中，所述散热膜200还可以包括遮光片4，所述遮光片4贴合在所述遮挡区21的背离所述复合结构层1的侧面上，所述遮光片4的与所述切断线23对应的位置被所述切断线23切断。示例性地，遮光片4可采用黑色遮光胶带并贴附在保护膜2上，遮光片4可以将预留孔10完全覆盖。保护膜2可以为半透明材质，遮光片4可以防止外部光线透过保护膜2照射到预留孔10露出的显示模组100上。本示例中，在形成保护膜2上的切断线23时可以同时切到遮光片4，以将切断线23同时形成在遮光片4的相应位置，避免遮光片4将保护膜2上的切断线23遮挡而影响散热膜200与显示模组100贴合后预留孔10内部气压与外界气压的平衡。
本公开实施例还提供一种显示装置的制备方法，如图5所示，包括：将 前文任一实施例所述的散热膜200贴合在显示模组100的背离显示侧的侧面上，并使所述预留孔10与所述显示模组100的设定区域相对应，其中，将所述散热膜200贴合在所述显示模组100上后，所述切断线23使所述预留孔10的内部气压与外界气压相同。
本公开实施例的显示装置的制备方法中，在贴合(可采用滚轮辊压贴合)散热膜200过程中，贴附滚轮经过预留孔10时，排出预留孔10内部的部分气体，同时散热膜200的每个膜层受压形变，贴合完成一定时间后，散热膜200的每个膜层形变恢复，预留孔10的内部空间增大，此时根据压差原理，外界气体从切断线23进入预留孔10内部，最终使预留孔10内外气压相同，从而避免了显示模组100产生模印。
在一些示例性实施例中，如图4所示，所述显示装置的制备方法还包括：将所述散热膜200贴合在所述显示模组100上后，
将所述保护膜2的除所述遮挡区21以外的其余部分撕除，对所述复合结构层1的第二侧面进行清洗；
将所述遮挡区21撕除，将传感器模组安装在所述预留孔10内。
本实施例的一个示例中，可以采用等离子清洗设备对所述复合结构层1的第二侧面进行清洗，清洗过程中，由于遮挡区21仍覆盖在预留孔10上，因此，遮挡区21可以防止等离子体对显示模组100的被预留孔10暴露的部分造成伤害。
本公开实施例的显示模组100可以为刚性或柔性OLED显示模组，OLED显示模组可以包括OLED显示面板(Panel)、触控结构层、偏光片、盖板，以及柔性电路板等。散热膜200贴合在OLED显示面板的背离显示侧的一侧，可以起到散热作用。所述传感器模组可以是指纹解锁模组、贴面熄屏模组等。
在本公开实施例的描述中，除非另有明确的规定和限定，术语“连接”、“固定连接”、“安装”、“装配”应做广义理解，例如，可以是固定连接，或是可拆卸连接，或一体地连接；术语“安装”、“连接”、“固定连接”可以是直接相连，或通过中间媒介间接相连，或是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据情况理解上述术语在本公开实施例中的含义。
Claims (13)
- 一种用于显示模组的散热膜，包括复合结构层和设于所述复合结构层上且可移除的保护膜，所述复合结构层具有相对的第一侧面和第二侧面，所述复合结构层设有贯穿所述第一侧面和所述第二侧面的预留孔，所述复合结构层的第一侧面设置为粘接在所述显示模组的背离显示侧的一侧，所述保护膜贴合在所述复合结构层的第二侧面上；所述保护膜设有覆盖在所述预留孔上的遮挡区，所述遮挡区和所述保护膜的其余部分均能够独立地从所述复合结构层上撕除，所述遮挡区设有切断线，所述切断线将所述预留孔内部与所述保护膜的背离所述复合结构层的一侧连通。
- 如权利要求1所述的用于显示模组的散热膜，其中：所述保护膜上还设有将所述遮挡区与所述保护膜的其余部分分隔开的隔断线。
- 如权利要求2所述的用于显示模组的散热膜，其中：所述切断线的一端延伸至所述隔断线处。
- 如权利要求1所述的用于显示模组的散热膜，其中：所述遮挡区包括完全覆盖所述预留孔的第一区域，以及连接于所述第一区域一侧的第二区域，所述第二区域的远离所述第一区域的一端延伸至所述保护膜的边缘，并设有凸出于所述保护膜的边缘的凸出部。
- 如权利要求1所述的用于显示模组的散热膜，还包括支撑片，所述支撑片设置在所述保护膜的朝向所述预留孔内的部分上，所述支撑片的厚度小于所述预留孔的深度。
- 如权利要求5所述的用于显示模组的散热膜，其中：所述支撑片为柔性材质且不透光。
- 如权利要求5所述的用于显示模组的散热膜，其中：所述复合结构层包括依次叠设的粘胶层、缓冲层和金属层，所述保护膜贴合在所述金属层上，所述粘胶层设置为粘接在所述显示模组的背离显示侧的一侧。
- 如权利要求7所述的用于显示模组的散热膜，其中：所述粘胶层、所述缓冲层和所述金属层上分别设有第一开孔、第二开孔和第三开孔，所述第 一开孔、所述第二开孔和所述第三开孔形成所述预留孔，所述第三开孔在所述保护膜上的正投影包含所述第二开孔在所述保护膜上的正投影，所述第二开孔在所述保护膜上的正投影包含或者等于所述第一开孔在所述保护膜上的正投影。
- 如权利要求8所述的用于显示模组的散热膜，其中：所述遮挡区完全覆盖所述第三开孔，所述支撑片的厚度小于或等于所述金属层的厚度，所述支撑片在所述保护膜上的正投影包含所述第二开孔在所述保护膜上的正投影。
- 如权利要求7所述的用于显示模组的散热膜，其中：所述缓冲层的材料包括泡棉，所述金属层的材料包括铜。
- 如权利要求1至10任一项所述的用于显示模组的散热膜，还包括遮光片，所述遮光片贴合在所述遮挡区的背离所述复合结构层的侧面上，所述遮光片的与所述切断线对应的位置被所述切断线切断。
- 一种显示装置的制备方法，包括：将权利要求1至11任一项所述的散热膜贴合在显示模组的背离显示侧的侧面上，并使所述预留孔与所述显示模组的设定区域相对应，其中，将所述散热膜贴合在所述显示模组上后，所述切断线使所述预留孔的内部气压与外界气压相同。
- 如权利要求12所述的显示装置的制备方法，还包括：将所述散热膜贴合在所述显示模组上后，将所述保护膜的除所述遮挡区以外的其余部分撕除，对所述复合结构层的第二侧面进行清洗；将所述遮挡区撕除，将传感器模组安装在所述预留孔内。
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| CN111867342A (zh) * | 2020-08-27 | 2020-10-30 | 京东方科技集团股份有限公司 | 一种用于显示模组的散热膜及显示装置的制备方法 |
| CN112736120B (zh) * | 2020-12-30 | 2023-04-18 | 武汉华星光电半导体显示技术有限公司 | 背板结构及显示面板 |
| CN112863338B (zh) * | 2021-01-12 | 2022-05-31 | 武汉华星光电半导体显示技术有限公司 | 显示模组及其制备方法 |
| CN112909062B (zh) * | 2021-02-03 | 2024-03-15 | 京东方科技集团股份有限公司 | 一种显示模组的制备方法 |
| CN112861761A (zh) * | 2021-02-24 | 2021-05-28 | 京东方科技集团股份有限公司 | 一种显示模组及显示装置 |
| CN113022046B (zh) * | 2021-02-26 | 2023-05-09 | 武汉华星光电半导体显示技术有限公司 | 复合材及其制备方法、显示装置 |
| CN113257122B (zh) * | 2021-04-07 | 2022-03-25 | 合肥维信诺科技有限公司 | 显示模组用支撑层组、显示模组及其制备方法 |
| CN115802694A (zh) * | 2021-09-10 | 2023-03-14 | 荣耀终端有限公司 | 一种电子设备 |
| CN114783309B (zh) * | 2022-04-12 | 2023-11-28 | 武汉华星光电半导体显示技术有限公司 | 复合功能膜及其制备方法、显示装置 |
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