WO2022006982A1 - Procédé de fabrication de fpc et fpc à exposer - Google Patents

Procédé de fabrication de fpc et fpc à exposer Download PDF

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Publication number
WO2022006982A1
WO2022006982A1 PCT/CN2020/102723 CN2020102723W WO2022006982A1 WO 2022006982 A1 WO2022006982 A1 WO 2022006982A1 CN 2020102723 W CN2020102723 W CN 2020102723W WO 2022006982 A1 WO2022006982 A1 WO 2022006982A1
Authority
WO
WIPO (PCT)
Prior art keywords
fpc
exposed
film
pair
positioning
Prior art date
Application number
PCT/CN2020/102723
Other languages
English (en)
Chinese (zh)
Inventor
陈康
陈勇利
韩佳明
Original Assignee
瑞声声学科技(深圳)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声声学科技(深圳)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Publication of WO2022006982A1 publication Critical patent/WO2022006982A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means

Definitions

  • the invention relates to the field of flexible circuit board manufacturing, in particular to a manufacturing process of an FPC.
  • the sample exposure is mainly LDI (for wiring) or DI exposure (for solder mask), which has high exposure accuracy, but the equipment cost is high; while the film is exposed manually after lamination, although its equipment cost It is greatly reduced, but the accuracy mainly depends on the accuracy of manual fitting, and can only be used in scenarios with relatively low accuracy requirements.
  • the film and the FPC to be exposed are fitted by aligning the alignment point 10' on the FPC100' to be exposed and the alignment point on the film.
  • the alignment points on the to-be-exposed FPC100' are set at the four corners of the to-be-exposed FPC100', and the entire plate is aligned to complete the entire plate exposure at one time.
  • the production parameters have not been systematically optimized, and their fluctuations in expansion and contraction are large, and a batch of boards will have different expansion and contraction. If the same film is used to manually expose these boards with different expansion and contraction, it may Exposure offset occurs, resulting in poor wiring or solder mask.
  • the film is usually produced after obtaining the expansion and contraction of the FPC to be exposed, that is, measuring the expansion and contraction of the FPC to be exposed before manual exposure of the film, and producing the exposure film according to the expansion and contraction of the FPC to be exposed.
  • the film production can be started only after the expansion and contraction before the exposure, which causes the product to wait for the film and delays the proofing cycle.
  • the purpose of the present invention is to provide a manufacturing process of FPC which reduces the proofing cycle, reduces the alignment deviation, and avoids the poor exposure caused by the irregular expansion and contraction of the product.
  • a manufacturing process of an FPC, which is exposed after being manually attached by a film, and the manufacturing process of the FPC includes:
  • a first pair of points for positioning the film is processed on the FPC to be exposed, and all the first pairs of points divide the FPC to be exposed into at least two positioning areas, and each positioning area can locate one of the film;
  • a corresponding number of the film is produced, and a second pair of points is processed on the film at a position corresponding to the first pair of points;
  • a first pair of sites is etched on the FPC to be exposed or a first pair of sites is drilled on the FPC to be exposed.
  • the first pair of sites is a copper disk or a substrate disk exposed after etching the copper layer.
  • first pair of points are drilled through holes.
  • the radius of the first pair of points is 0.5-3 mm.
  • the radius of the second pair of points is 0.1-0.3 mm larger than the radius of the first pair of points.
  • the film is produced according to the pre-expansion and contraction of the FPC to be exposed.
  • all the first pair of sites divide the to-be-exposed FPC into an even number of the positioning regions.
  • An FPC to be exposed the FPC to be exposed is provided with a first pair of points, and all the first pairs of points divide the FPC to be exposed into at least two positioning areas, so that each positioning area can locate a film.
  • the beneficial effects of the present invention are: the application is exposed by manual lamination of film, and according to the product size, the FPC to be exposed is divided into two or more positioning areas, and the first pair of points is placed in blocks.
  • the alignment and lamination are carried out in each positioning area, and the black film covers the remaining positioning areas, and the exposure of each positioning area is completed in turn, so as to achieve more accurate manual exposure.
  • This alignment method has great advantages. Under the condition of certain film expansion and contraction, the impact of product expansion and contraction on the alignment accuracy is greatly reduced, and the alignment accuracy and yield of manual film exposure are significantly improved.
  • the production of film can be completed in advance and the proofing cycle is reduced; the use of sub-positioning area alignment reduces the sensitivity to product expansion and contraction compared with the traditional alignment method, thereby reducing the need for The alignment deviation reduces the defects caused by the difference of expansion and contraction of the same batch of products; manual partition exposure also avoids the poor exposure caused by irregular expansion and contraction of products.
  • FIG. 1 is a schematic diagram of an FPC to be exposed in the prior art
  • FIG. 2 is a flowchart of a manufacturing process of an FPC provided by an embodiment of the present invention
  • FIG. 3 is a schematic diagram of an FPC to be exposed in a manufacturing process of an FPC provided by an embodiment of the present invention
  • FIG. 4 is a schematic diagram of a film in a manufacturing process of an FPC provided by an embodiment of the present invention.
  • FIG. 5 , FIG. 6 , FIG. 7 and FIG. 8 are schematic diagrams of laminating films one by one on the FPC to be exposed in the manufacturing process of the FPC provided by the embodiment of the present invention.
  • the FPC to be exposed 100', the FPC to be exposed; 10', the alignment point on the FPC to be exposed; 100, the FPC to be exposed; 10, the first alignment point; 20, the positioning area; 21, the first positioning area; 22, the second positioning area ; 23, the third positioning area; 24, the fourth positioning area; 30, the film; 301, the second pair of sites.
  • a manufacturing process of FPC which is exposed after 30 sheets of film are manually attached, and the manufacturing process of the FPC includes:
  • the film 30 is manually attached and then exposed.
  • the FPC 100 to be exposed is divided into two or more positioning areas 20, and the first pair of points 10 are placed in blocks.
  • alignment and lamination are performed in each positioning area 20 respectively, the black film covers the remaining positioning areas 20, and the exposure of each positioning area 20 is completed in sequence, thereby realizing more accurate manual exposure.
  • This alignment method has great advantages. Under the condition of certain expansion and contraction of FPC100, the influence of product expansion and contraction on the alignment accuracy is greatly reduced, and the alignment accuracy and yield of manual film 30 exposure are significantly improved.
  • the production of film 30 can be completed ahead of time and the proofing cycle is reduced; the use of 20 positioning areas for alignment reduces the sensitivity to product expansion and contraction compared with the traditional alignment method, thereby reducing the proofing cycle.
  • the alignment deviation is reduced, and the defects caused by the difference of expansion and contraction of the same batch of products are reduced; manual partition exposure also avoids the poor exposure caused by irregular expansion and contraction of products.
  • adjacent positioning regions 20 may share the first pair of sites 10 .
  • the first pair of sites 10 are etched on the FPC 100 to be exposed or the first pair of sites 10 are drilled on the FPC 100 to be exposed, so as to prevent fools.
  • a first pair of sites 10 is etched on the FPC 100 to be exposed, and the first pair of sites 10 is a copper disk or a substrate disk exposed after removing the copper foil.
  • a first pair of spots 10 is drilled on the FPC 100 to be exposed, and the first pair of spots 10 are drilled through holes.
  • the radius of the through hole is 0.5-3 mm.
  • the radius of the second alignment point 301 is 0.1-0.3 mm larger than the radius of the first alignment point.
  • the film 30 is produced according to the pre-expansion and contraction of the FPC 100 to be exposed, that is, the film 30 is produced by calculating the expansion and contraction of the FPC 100 to be exposed according to empirical data. Saves the time of waiting to calculate the expansion and contraction of FPC100.
  • all the first pair of sites 10 divide the to-be-exposed FPC 100 into an even number of the positioning regions 20 .
  • all of the positioning regions 20 are of the same shape and size.
  • the first pair of sites 10 may be shared between adjacent positioning regions 20 .
  • FIG. 5 , FIG. 6 , FIG. 7 and FIG. 8 illustrate the processing of nine first pairs of sites 10 on the FPC 100 to be exposed in an embodiment, and all the first pairs of sites 10 divide the FPC 100 to be exposed into Four positioning areas 20 .
  • FIGS. 5 , 6 , 7 and 8 illustrate the process of laminating the films 30 on the FPC 100 to be exposed one by one, and completing the exposure process of each positioning area 20 in sequence, wherein the first positioning area 21 shown in FIG. Manually attach the film 30 and then expose (the process of attaching the film 30 and exposure is not shown), and then manually attaching the film 30 in the second positioning area 22 shown in FIG. The positioning area 23 is manually attached to the film 30 and then exposed, and finally the fourth positioning area 24 shown in FIG.
  • the alignment accuracy of the traditional alignment method in which the first alignment point 10 is placed around is ⁇ 0.2mm. Calculated with a board length of 250mm, when the difference between the expansion and contraction of the FPC100 to be exposed reaches 0.08%, the alignment deviation will exceed 0.2mm; After exposure in blocks, the board length of the small positioning area 20 is about 125mm, calculated based on the board length of 250mm, and calculated based on the alignment deviation of 0.2mm, the expansion and shrinkage difference of the FPC100 to be exposed can be accommodated to 0.16%.
  • the present invention also provides an FPC 100 to be exposed, and the FPC 100 to be exposed is provided with a first pair of points 10, and all the first pair of points 10 divide the FPC 100 to be exposed into at least two positioning areas 20, so that Each positioning area 20 can locate a film 30 .
  • the FPC100 to be exposed is divided into four or more positioning areas 20, which reduces the sensitivity of the alignment deviation in each positioning area to the product expansion and shrinkage, and significantly improves the alignment accuracy of manual film 30 exposure. Yield.
  • the production of film 30 can be completed ahead of time and the proofing cycle is reduced; the use of 20 positioning areas for alignment reduces the sensitivity to product expansion and contraction compared with the traditional alignment method, thereby reducing the proofing cycle.
  • the alignment deviation is reduced, and the defects caused by the difference in expansion and contraction of the same batch of products are reduced.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'un FPC et un FPC à exposer. Le FPC est exposé après qu'un film a été fixé manuellement. Le procédé de fabrication du FPC comprend : le traitement, sur un FPC à exposer, des premiers points d'alignement utilisés pour positionner un film, et au moins diviser ledit FPC en deux régions de positionnement par tous les premiers points d'alignement, chaque région de positionnement pouvant positionner un film ; la fabrication d'un nombre correspondant de films selon le nombre de régions de positionnement sur ledit FPC, et le traitement de seconds points d'alignement sur les films selon une correspondance biunivoque avec les premiers points d'alignement ; et la fixation des films aux régions de positionnement dudit FPC un par un, le réglage des positions des films, le revêtement, avec un film noir, des régions de positionnement auxquelles les films ne sont pas fixés sur ledit FPC chaque fois que les films sont attachés, et l'achèvement de l'exposition des régions de positionnement auxquelles les films sont fixés jusqu'à ce que l'ensemble du FPC à exposer soit complètement fabriqué, de façon à obtenir le FPC. Le procédé de fabrication du FPC selon la présente invention peut réduire le degré de sensibilité au retrait et à l'expansion d'un produit, raccourcit une période d'apprêt, et réduit un écart d'alignement.
PCT/CN2020/102723 2020-07-08 2020-07-17 Procédé de fabrication de fpc et fpc à exposer WO2022006982A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010653700.6A CN111867261A (zh) 2020-07-08 2020-07-08 Fpc的制作工艺和待曝光fpc
CN202010653700.6 2020-07-08

Publications (1)

Publication Number Publication Date
WO2022006982A1 true WO2022006982A1 (fr) 2022-01-13

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WO (1) WO2022006982A1 (fr)

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Publication number Priority date Publication date Assignee Title
CN113687576A (zh) * 2021-08-24 2021-11-23 广东华恒智能科技有限公司 曝光工艺及曝光机

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CN102378494A (zh) * 2011-10-31 2012-03-14 深南电路有限公司 一种电路板阻焊加工方法
CN103152983A (zh) * 2012-12-21 2013-06-12 景旺电子科技(龙川)有限公司 一种铝基板菲林拼接制作方法
JP2013143462A (ja) * 2012-01-11 2013-07-22 Sumitomo Heavy Ind Ltd 薄膜形成装置及び薄膜形成方法
CN104869764A (zh) * 2015-05-15 2015-08-26 江门崇达电路技术有限公司 一种大尺寸精密线路板的制作方法
CN111031685A (zh) * 2019-12-25 2020-04-17 深圳市景旺电子股份有限公司 一种高频天线pcb板的制造方法

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CN105307388B (zh) * 2015-10-14 2018-06-26 苏州福莱盈电子有限公司 Fpc柔性线路板线路pin对位的操作方法
CN105376950A (zh) * 2015-12-14 2016-03-02 谢兴龙 一种线路板防焊曝光手动对位的改良方法
CN106604554A (zh) * 2016-12-29 2017-04-26 深圳市鑫达辉软性电路科技有限公司 柔性线路板覆盖膜偏差检测方法
CN108520403A (zh) * 2018-04-12 2018-09-11 江苏博敏电子有限公司 一种印刷线路板防焊前涨缩管理方法
CN108513461A (zh) * 2018-04-28 2018-09-07 珠海智锐科技有限公司 一种fpc板制作工艺

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101448366A (zh) * 2007-11-26 2009-06-03 比亚迪股份有限公司 一种印刷线路板的防焊处理方法
CN102378494A (zh) * 2011-10-31 2012-03-14 深南电路有限公司 一种电路板阻焊加工方法
JP2013143462A (ja) * 2012-01-11 2013-07-22 Sumitomo Heavy Ind Ltd 薄膜形成装置及び薄膜形成方法
CN103152983A (zh) * 2012-12-21 2013-06-12 景旺电子科技(龙川)有限公司 一种铝基板菲林拼接制作方法
CN104869764A (zh) * 2015-05-15 2015-08-26 江门崇达电路技术有限公司 一种大尺寸精密线路板的制作方法
CN111031685A (zh) * 2019-12-25 2020-04-17 深圳市景旺电子股份有限公司 一种高频天线pcb板的制造方法

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