WO2021243737A1 - 柔性电路板的丝网印刷方法、制备方法及柔性电路板 - Google Patents

柔性电路板的丝网印刷方法、制备方法及柔性电路板 Download PDF

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Publication number
WO2021243737A1
WO2021243737A1 PCT/CN2020/095052 CN2020095052W WO2021243737A1 WO 2021243737 A1 WO2021243737 A1 WO 2021243737A1 CN 2020095052 W CN2020095052 W CN 2020095052W WO 2021243737 A1 WO2021243737 A1 WO 2021243737A1
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WIPO (PCT)
Prior art keywords
circuit board
screen
flexible circuit
positioning mark
screen printing
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PCT/CN2020/095052
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English (en)
French (fr)
Inventor
陈康
韩佳明
陈勇利
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瑞声声学科技(深圳)有限公司
瑞声精密制造科技(常州)有限公司
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Publication of WO2021243737A1 publication Critical patent/WO2021243737A1/zh

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225Screens or stencils; Holders therefor

Definitions

  • the invention relates to the technical field of flexible circuit boards, in particular to a screen printing method, a preparation method and a flexible circuit board of a flexible circuit board.
  • Flexible Printed Circuit Board also known as "soft board” is a printed circuit made of a flexible insulating substrate and has many advantages that a rigid printed circuit board does not have. Due to the characteristics of light weight, thin thickness, and good bendability of the flexible circuit board, in the prior art, the flexible circuit board is gradually applied to the miniature sound generating device to play the role of connection and support.
  • the screen printing of flexible circuit boards is to print the printing paste on the surface of the flexible circuit board according to a certain graphic pattern using a silk screen. Print back and forth, through the squeeze of the squeegee, the printing paste is printed on the flexible circuit board placed under the screen through the screen on the screen. In the above process, the flexible circuit board and the screen Both the screens will expand and contract.
  • the entire flexible circuit board and the four vertices of the screen are generally aligned before printing. This is sensitive to the difference in expansion and contraction of the flexible circuit board.
  • the flexible circuit board has an intra-batch expansion and contraction value
  • the parameters are not optimized.
  • the flexible circuit board samples generally have larger expansion and contraction, which is more prone to printing offset. If the expansion and contraction value of each flexible circuit board sample is tested, then screen printing is performed. Will greatly delay the proofing cycle.
  • the purpose of the present invention is to provide a screen printing method, a preparation method and a flexible circuit board for a flexible circuit board, and solve the technical problems of printing deviation and low printing efficiency due to the sensitivity of the expansion and contraction difference of the flexible circuit board in the prior art.
  • the technical scheme of the present invention is as follows: a method for screen printing of a flexible circuit board is provided, which includes the following steps:
  • the screen plate for printing the flexible circuit board, the screen plate is provided with a second positioning mark corresponding to the first positioning mark, and the second positioning mark marks the
  • the screen screen is divided into a plurality of screen blocks, and the screen blocks have a one-to-one correspondence with the circuit board area;
  • step S4 Repeat step S3 to complete the screen printing of each circuit board area in turn.
  • the first positioning mark is a through hole, a metal pad or an etching line.
  • the screen screen is made according to the empirical value of expansion and contraction of the flexible circuit board and the expansion and contraction value of the material used to make the screen screen.
  • the expansion and contraction value of the flexible circuit board is measured, and the screen mesh is made according to the expansion and contraction value of the flexible circuit board and the expansion and contraction value of the material used to make the screen plate. Version.
  • the center position of the second positioning mark coincides with the center position of the first positioning mark, and the size of the second positioning mark is larger than the size of the first positioning mark.
  • the circuit board area is rectangular, and the four vertices of the circuit board area are respectively provided with first positioning marks.
  • the flexible circuit board includes two oppositely arranged first side edges, two oppositely arranged second side edges, and are respectively formed at the junction of the adjacent first side edge and the second side edge Of the four corners;
  • the first positioning mark includes:
  • the vertex positioning mark is arranged on the corner part
  • the middle positioning mark is arranged at the middle position of the first side or the middle position of the second side;
  • the center positioning mark is arranged at the center of the flexible circuit board.
  • the area of the circuit board after the screen printing is dried.
  • Another technical solution of the present invention is as follows: a method for preparing a flexible circuit board is provided, including a screen printing step, and the screen printing step adopts the above-mentioned screen printing method for a flexible circuit board.
  • a flexible circuit board is provided, which is prepared by using the above-mentioned method for preparing a flexible circuit board.
  • the beneficial effects of the present invention are: in the screen printing method of the flexible circuit board of the present invention, a first positioning mark is arranged on the flexible circuit board to be printed, and the flexible circuit board is divided into a plurality of circuit board areas; A second positioning mark corresponding to the first positioning mark is provided on the screen plate, and the screen screen is divided into a plurality of screen blocks corresponding to the circuit board area one-to-one; and the circuit board area and The screen is divided into blocks for alignment, and the circuit board area is printed, which realizes the sub-area printing of the flexible circuit board, reduces the sensitivity of the printing process to the expansion and contraction of the flexible circuit board, reduces the alignment deviation, and improves the printing accuracy; When there is a large difference in expansion and contraction value, there is no need to re-make the screen screen, which improves the printing efficiency; reduces the poor printing of the same batch of flexible circuit boards due to the difference in expansion and contraction, and avoids the irregularities of the flexible circuit boards due to the divided printing. Bad printing caused by expansion and contraction.
  • FIG. 1 is a schematic diagram of the structure of a flexible circuit board in an embodiment of the present invention
  • FIG. 2 is a schematic diagram of the structure of a flexible circuit board in a preferred embodiment of the embodiment of the present invention
  • FIG. 3 is a schematic diagram of the structure of a screen plate in an embodiment of the present invention.
  • Fig. 4 is a schematic flow chart of a screen printing method according to an embodiment of the present invention.
  • first”, “second”, and “third” in the present invention are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with “first”, “second”, and “third” may explicitly or implicitly include at least one of the features.
  • “plurality” means at least two, such as two, three, etc., unless specifically defined otherwise. All directional indicators (such as up, down, left, right, front, back%) in the embodiments of the present invention are only used to explain the relative positional relationship between the components in a specific posture (as shown in the figure) , Movement status, etc., if the specific posture changes, the directional indication will also change accordingly.
  • the terms “including” and “having” and any variations thereof are intended to cover non-exclusive inclusions.
  • the embodiment of the present invention provides a screen printing method for a flexible circuit board. Please refer to FIG. 1 to FIG. 4, which includes the following steps:
  • a first positioning mark 101 is provided on the flexible circuit board 100 to be printed, and the first positioning mark 101 divides the flexible circuit board 100 into a plurality of circuit board regions 100a.
  • the first positioning marks 101 are arranged on the boundary of the circuit board area 100a.
  • the circuit board area 100a is rectangular, and the first positioning marks 101 are located on the four sides of the rectangle.
  • the vertex is also located on the four sides of the rectangle.
  • the first positioning mark 101 can be a through hole, a metal pad or an etching line, for example, a copper sheet or an etched gasket or a drilled hole.
  • the size, for example, the diameter can be 0.5mm ⁇ 3mm.
  • the flexible circuit board 100 has a width of 250mm and a length of 250mm-500mm, the circuit board area 100a is rectangular, and the four vertices of each circuit board area 100a are respectively arranged There is a first positioning mark 101.
  • the first positioning mark 101 is only located on the four vertices of the rectangle.
  • the flexible circuit board 100 includes two first positioning marks arranged opposite to each other.
  • first positioning mark 101 The number of is 9, which are respectively the four vertex positioning marks 101a provided on the corner portion 104, and the four middle positioning marks set on the middle position of the first side 102 or the middle position of the second side 103 Mark 101b; a central positioning mark 101c arranged at the center of the flexible circuit board 100 divides the flexible circuit board 100 into four circuit board areas 100a.
  • the screen 200 is provided with a second positioning mark 201 corresponding to the first positioning mark 101, and the second positioning mark 201 is
  • the screen screen 200 is divided into a plurality of screen sub-blocks 200 a, and the screen sub-blocks 200 a correspond to the circuit board area 100 a one-to-one.
  • the screen screen is made according to the empirical value of expansion and contraction of the flexible circuit board and the expansion and contraction value of the material used to make the screen, without the need for expansion and contraction of the flexible circuit board.
  • the value is measured, and the past experience value is directly used as a reference to prepare the screen version of the preventive value.
  • the above method is especially suitable for flexible circuit board proofing, and the silk screen can be used directly.
  • the expansion and contraction value of the flexible circuit board is measured, and the screen is made according to the expansion and contraction value of the flexible circuit board and the expansion and contraction value of the material used to make the screen plate. Screen version.
  • the screen printing operation is performed on the circuit board area 100a located in the upper left corner of FIG.
  • the position of the screen plate 200 relative to the flexible circuit board 100 is aligned and screen printed, and the circuit board area after the screen printing is dried.
  • step S4 Repeat step S3 to sequentially complete the screen printing of each circuit board area 100a.
  • the screen printing operation is performed on the circuit board area 100a located in the lower left corner of FIG.
  • the position of the flexible circuit board 100 is aligned and screen printed, and the circuit board area 100a after the screen printing is dried.
  • the screen printing operation is performed on the circuit board area 100a located in the lower right corner of FIG.
  • the position of the flexible circuit board 100 is aligned and screen printed, and the circuit board area 100a after the screen printing is dried.
  • the screen printing method of this embodiment divides the flexible circuit board into multiple areas according to the size of the flexible circuit board, and uses the method of placing the first marking points in blocks. During the screen printing, the alignment is performed in each area. The film Cover the remaining area, complete each printing in turn and dry, so as to achieve more precise screen printing. In the screen printing method of this embodiment, the screen printing alignment scheme has great advantages.
  • the production of the screen screen can be completed in advance, reducing the proofing cycle;
  • the sensitivity to the expansion and contraction of the flexible circuit board is reduced to half or more of that of the traditional alignment method, thereby reducing the alignment deviation and reducing the defects caused by the difference in expansion and contraction of the same batch of flexible circuit boards; Avoid poor printing caused by irregular expansion and contraction of flexible circuit boards.
  • the embodiment of the present invention also provides a method for preparing a flexible circuit board, including a screen printing step, and the screen printing step adopts the above-mentioned screen printing method for a flexible circuit board.
  • the embodiment of the present invention also provides a flexible circuit board, which is prepared by using the above-mentioned preparation method of the flexible circuit board.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Printing Methods (AREA)

Abstract

一种柔性电路板(100)的丝网印刷方法、制备方法及柔性电路板(100)。柔性电路板(100)的丝网印刷方法,在待印刷的柔性电路板(100)上设置第一定位标记(101),将所述柔性电路板(100)划分为多个电路板区域(100a);在丝网网版(200)上设置有与所述第一定位标记(101)相对应的第二定位标记(201),将所述丝网网版(200)划分为多个与所述电路板区域(100a)一一对应网版分块(200a);将电路板区域(100a)和网版分块(200a)进行对位,对电路板区域(100a)进行印刷,实现了柔性电路板(100)的分区域印刷,降低了印刷过程对柔性电路板(100)的涨缩敏感度,降低了对位偏差,提高了印刷精度;减少了同一批柔性电路板(100)因涨缩差异而造成的不良,分次印刷也避免因柔性电路板(100)不规则涨缩造成的印刷不良。

Description

柔性电路板的丝网印刷方法、制备方法及柔性电路板 技术领域
本发明涉及柔性电路板技术领域,具体涉及一种柔性电路板的丝网印刷方法、制备方法及柔性电路板。
背景技术
柔性电路板(Flexible Printed Circuit Board,简称FPC)又称“软板”是用柔性的绝缘基板制成的印刷电路,具有许多硬性印刷电路板不具备的优点。由于柔性电路板重量轻、厚度薄、弯折性好的特点,现有技术中,逐渐将柔性电路板应用到微型发声器件中起到连接和支撑的作用。
柔性电路板的丝网印刷是将印刷浆料按照一定的图形样式使用丝网网版印刷至柔性电路板表面,在丝网印刷的过程中,一般采用安装有刮胶的刮刀在丝网网版上来回印刷,通过刮胶的挤压将印刷浆料透过丝网网版上的丝网印刷至置于丝网网版下的柔性电路板上,在上述过程中,柔性电路板和丝网网版均会出现涨缩。
现有技术中进行丝网印刷时一般将整张柔性电路板和丝网网版四个顶点对齐后再进行印刷,对柔性电路板的涨缩差异敏感,当柔性电路板出现批内涨缩值差异时,容易导致印刷偏移;为了保证印刷质量,有时需要针对柔性电路板的涨缩值重新制作丝网网版,降低了印刷效率。尤其是在进行打样时,参数没有经过优化,柔性电路板样本涨缩一般较大,更容易出现印刷偏移,如果针对每一柔性电路板样本测试涨缩值后再进行丝网网版制作,会大大延缓打样周期。
因此,有必要提供一种柔性电路板的丝网印刷方法以解决现有技术中的上述技术问题。
技术问题
本发明的目的在于提供一种柔性电路板的丝网印刷方法、制备方法及柔性电路板,解决现有技术中由于柔性电路板的涨缩差异敏感导致印刷偏差以及印刷效率低的技术问题。
技术解决方案
本发明的技术方案如下:提供一种柔性电路板的丝网印刷方法,包括如下步骤:
S1、在待印刷的柔性电路板上设置第一定位标记,所述第一定位标记将所述柔性电路板划分为多个电路板区域;
S2、提供用于印刷所述柔性电路板的丝网网版,所述丝网网版上设置有与所述第一定位标记相对应的第二定位标记,所述第二定位标记将所述丝网网版划分为多个网版分块,所述网版分块与所述电路板区域一一对应;
S3、覆盖所述柔性电路板上除当前待印刷的所述电路板区域之外的所有区域,根据待印刷的所述电路板区域中第一定位标记的位置以及对应网版分块中第二定位标记的位置,调整所述丝网网版相对于所述柔性电路板的位置,以将待印刷的所述电路板区域与对应的所述网版分块进行对位并对所述电路板区域进行丝网印刷;
S4、重复步骤S3,依次完成每个电路板区域的丝网印刷。
优选地,所述第一定位标记为通孔、金属垫或蚀刻线。
优选地,所述步骤S2中,根据所述柔性电路板的涨缩经验值以及用于制作丝网网版的材料的涨缩值制作所述丝网网版。
优选地,所述步骤S2中,测量所述柔性电路板的涨缩值,根据所述柔性电路板的涨缩值以及用于制作丝网网版的材料的涨缩值制作所述丝网网版。
优选地,在所述步骤S2中,所述第二定位标记的中心位置与所述第一定位标记的中心位置重合,所述第二定位标记的尺寸大于所述第一定位标记的尺寸。
优选地,所述电路板区域呈矩形,所述电路板区域的四个顶点处分别设置有第一定位标记。
优选地,所述柔性电路板包括相对设置的两个第一侧边、相对设置的两个第二侧边以及分别形成于相邻的所述第一侧边和所述第二侧边连接处的四个转角部;
所述第一定位标记包括:
顶点定位标,设置于所述转角部;
中间定位标,设置于所述第一侧边的中间位置或所述第二侧边的中间位置;以及
中心定位标,设置于所述柔性电路板的中心位置。
优选地,在所述步骤S3中,对丝网印刷后的电路板区域进行烘干。
本发明的另一技术方案如下:提供一种柔性电路板的制备方法,包括丝网印刷步骤,所述丝网印刷步骤采用上述的柔性电路板的丝网印刷方法。
本发明的另一技术方案如下:提供一种柔性电路板,所述柔性电路板采用上述的柔性电路板的制备方法制备而成。
有益效果
本发明的有益效果在于:本发明的柔性电路板的丝网印刷方法,在待印刷的柔性电路板上设置第一定位标记,将所述柔性电路板划分为多个电路板区域;在丝网网版上设置有与所述第一定位标记相对应的第二定位标记,将所述丝网网版划分为多个与所述电路板区域一一对应网版分块;将电路板区域和网版分块进行对位,对电路板区域进行印刷,实现了柔性电路板的分区域印刷,降低了印刷过程对柔性电路板的涨缩敏感度,降低了对位偏差,提高了印刷精度;当出现涨缩值差异较大时无需重新制作丝网网版,提高了印刷效率;减少了同一批柔性电路板因涨缩差异而造成的印刷不良,分次印刷也避免因柔性电路板不规则涨缩造成的印刷不良。
附图说明
图1为本发明实施例中柔性电路板的结构示意图;
图2为本发明实施例中优选实施方式的柔性电路板的结构示意图;
图3为本发明实施例中丝网网版的结构示意图;
图4为本发明实施例的丝网印刷方法的流程原理图。
本发明的实施方式
下面将结合本发明实施例中的附图,对发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
本发明中的术语“第一”、“第二”、“第三”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”、“第三”的特征可以明示或者隐含地包括至少一个该特征。本发明的描述中,“多个”的含义是至少两个,例如两个,三个等,除非另有明确具体的限定。本发明实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等,如果该特定姿态发生改变时,则该方向性指示也相应地随之改变。此外,术语“包括”和“具有”以及它们任何变形,意图在于覆盖不排他的包含。
在本文中提及“实施例”意味着,结合实施例描述的特定特征、结构或特性可以包含在本发明的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例,也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是,本文所描述的实施例可以与其它实施例相结合。
本发明实施例提供了一种柔性电路板的丝网印刷方法,请参阅图1至图4,包括如下步骤:
S1、在待印刷的柔性电路板100上设置第一定位标记101,该第一定位标记101将该柔性电路板100划分为多个电路板区域100a。
在本实施例中,请参阅图1所示,第一定位标记101在电路板区域100a的边界设置,图1所示中,电路板区域100a为矩形,第一定位标记101位于矩形的四个顶点上,还位于矩形的四条边上,第一定位标记101可以为通孔、金属垫或蚀刻线,例如,为铜片或蚀刻的垫片或钻孔,尺寸,例如直径可以为0.5mm~3mm。
在一个可选的实施方式中,如图2所示,柔性电路板100的宽度为250mm,长度为250mm~500mm,电路板区域100a呈矩形,每个电路板区域100a的四个顶点处分别设置有第一定位标记101,与图1所示的区别在于,在图2中,第一定位标记101仅位于矩形的四个顶点上,具体地,柔性电路板100包括相对设置的两个第一侧边102、相对设置的两个第二侧边103以及分别形成于相邻的所述第一侧边102和所述第二侧边103连接处的四个转角部104;第一定位标记101的数量为9,分别为设置于所述转角部104的四个顶点定位标101a,设置于所述第一侧边102的中间位置或所述第二侧边103的中间位置的四个中间定位标101b;设置于该柔性电路板100的中心位置的一个中心定位标101c,将柔性电路板100划分为四个电路板区域100a。
S2、提供用于印刷该柔性电路板100的丝网网版200,该丝网网版200上设置有与所述第一定位标记101相对应的第二定位标记201,第二定位标记201将该丝网网版200划分为多个网版分块200a,该网版分块200a与该电路板区域100a一一对应。
在本实施例中,制作丝网网版200时,需要考虑柔性电路板100和丝网网版200的涨缩值,丝网网版200上的第二定位标记201的中心位置与对应的第一定位标记101的中心位置重合,第二定位标记201的尺寸大于所述第一定位标记101的尺寸,例如,二者尺寸可以相差至少0.2mm。
在一个可选的实施方式中,根据所述柔性电路板的涨缩经验值以及用于制作丝网网版的材料的涨缩值制作所述丝网网版,无需对柔性电路板的涨缩值进行测量,直接用以往的经验值作为参考,预防涨缩值制备丝网网版。上述方式尤其适合柔性电路板打样,丝网网版可以直接使用。
在另一个可选的实施方式中,测量所述柔性电路板的涨缩值,根据所述柔性电路板的涨缩值以及用于制作丝网网版的材料的涨缩值制作所述丝网网版。
S3、根据待印刷的所述电路板区域中第一定位标记101的位置以及对应网版分块200a中第二定位标记102的位置,调整所述丝网网版200相对于所述柔性电路板100的位置,以将待印刷的所述电路板区域100a与对应的所述网版分块200a进行对位,覆盖该柔性电路板100上除当前待印刷的电路板区域100a之外的所有区域,对所述电路板区域100a进行丝网印刷。
请参阅图4所示,具体地,对位于图4中左上角的电路板区域100a进行丝网印刷操作,用薄膜覆盖除当前待印刷的电路板区域100a之外的所有区域,调整所述丝网网版200相对于所述柔性电路板100的位置,完成对位及丝网印刷,并对丝网印刷后的电路板区域进行烘干。
S4、重复步骤S3,依次完成每个电路板区域100a的丝网印刷。
具体地,请继续参阅图4所示,对位于图4中右上角的电路板区域100a进行丝网印刷操作,用薄膜覆盖除当前待印刷的电路板区域100a之外的所有区域,调整所述丝网网版200相对于所述柔性电路板100的位置,完成对位及丝网印刷,并对丝网印刷后的电路板区域100a进行烘干。
随后,对位于图4中左下角的电路板区域100a进行丝网印刷操作,用薄膜覆盖除当前待印刷的电路板区域100a之外的所有区域,调整所述丝网网版200相对于所述柔性电路板100的位置,完成对位及丝网印刷,并对丝网印刷后的电路板区域100a进行烘干。
随后,对位于图4中右下角的电路板区域100a进行丝网印刷操作,用薄膜覆盖除当前待印刷的电路板区域100a之外的所有区域,调整所述丝网网版200相对于所述柔性电路板100的位置,完成对位及丝网印刷,并对丝网印刷后的电路板区域100a进行烘干。
本实施例的丝网印刷方法根据柔性电路板尺寸,将柔性电路板划分成多块区域,采用分块放置第一标记点的方式,丝网印刷时分别在每一块区域内进行对位,薄膜盖住其余的区域,依次完成每一次的印刷并烘干,从而实现更精确的丝网印刷。本实施例的丝网印刷方法中丝印对位方案有很大优越性,由于减少了对柔性电路板涨缩的敏感程度,可以提前完成丝网网版的制作,减少打样周期;采用分区域对位,对柔性电路板涨缩的敏感程度降至传统对位方式的一半或更多,从而减少了对位偏差,减少了同一批柔性电路板因涨缩差异而造成的不良;分次印刷也避免因柔性电路板不规则涨缩造成的印刷不良。
本发明实施例还提供了一种柔性电路板的制备方法,包括丝网印刷步骤,所述丝网印刷步骤采用上述的柔性电路板的丝网印刷方法。
本发明实施例还提供了一种柔性电路板,所述柔性电路板采用上述的柔性电路板的制备方法制备而成。
以上所述的仅是本发明的实施方式,在此应当指出,对于本领域的普通技术人员来说,在不脱离本发明创造构思的前提下,还可以做出改进,但这些均属于本发明的保护范围。

Claims (10)

1、一种柔性电路板的丝网印刷方法,其特征在于,包括如下步骤:
S1、在待印刷的柔性电路板上设置第一定位标记,所述第一定位标记将所述柔性电路板划分为多个电路板区域;
S2、提供用于印刷所述柔性电路板的丝网网版,所述丝网网版上设置有与所述第一定位标记相对应的第二定位标记,所述第二定位标记将所述丝网网版划分为多个网版分块,所述网版分块与所述电路板区域一一对应;
S3、覆盖所述柔性电路板上除当前待印刷的所述电路板区域之外的所有区域,根据待印刷的所述电路板区域中第一定位标记的位置以及对应网版分块中第二定位标记的位置,调整所述丝网网版相对于所述柔性电路板的位置,以将待印刷的所述电路板区域与对应的所述网版分块进行对位并对所述电路板区域进行丝网印刷;
S4、重复步骤S3,依次完成每个电路板区域的丝网印刷。
2、根据权利要求1所述的柔性电路板的丝网印刷方法,其特征在于,所述第一定位标记为通孔、金属垫或蚀刻线。
3、根据权利要求1所述的柔性电路板的丝网印刷方法,其特征在于,所述步骤S2中,根据所述柔性电路板的涨缩经验值以及用于制作丝网网版的材料的涨缩值制作所述丝网网版。
4、根据权利要求1所述的柔性电路板的丝网印刷方法,其特征在于,所述步骤S2中,测量所述柔性电路板的涨缩值,根据所述柔性电路板的涨缩值以及用于制作丝网网版的材料的涨缩值制作所述丝网网版。
5、根据权利要求1所述的柔性电路板的丝网印刷方法,其特征在于,在所述步骤S2中,所述第二定位标记的中心位置与所述第一定位标记的中心位置重合,所述第二定位标记的尺寸大于所述第一定位标记的尺寸。
6、根据权利要求1所述的柔性电路板的丝网印刷方法,其特征在于,所述电路板区域呈矩形,所述电路板区域的四个顶点处分别设置有第一定位标记。
7、根据权利要求6所述的柔性电路板的丝网印刷方法,其特征在于,所述柔性电路板包括相对设置的两个第一侧边、相对设置的两个第二侧边以及分别形成于相邻的所述第一侧边和所述第二侧边连接处的四个转角部;
所述第一定位标记包括:
顶点定位标,设置于所述转角部;
中间定位标,设置于所述第一侧边的中间位置或所述第二侧边的中间位置;以及
中心定位标,设置于所述柔性电路板的中心位置。
8、根据权利要求1所述的柔性电路板的丝网印刷方法,其特征在于,在所述步骤S3中,对丝网印刷后的电路板区域进行烘干。
9、一种柔性电路板的制备方法,包括丝网印刷步骤,其特征在于,所述丝网印刷步骤采用权利要求1至8任一项所述的柔性电路板的丝网印刷方法。
10、一种柔性电路板,其特征在于,所述柔性电路板采用权利要求9所述的柔性电路板的制备方法制备而成。
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