WO2021220976A1 - 導電性樹脂組成物及び電子部品の製造方法 - Google Patents

導電性樹脂組成物及び電子部品の製造方法 Download PDF

Info

Publication number
WO2021220976A1
WO2021220976A1 PCT/JP2021/016514 JP2021016514W WO2021220976A1 WO 2021220976 A1 WO2021220976 A1 WO 2021220976A1 JP 2021016514 W JP2021016514 W JP 2021016514W WO 2021220976 A1 WO2021220976 A1 WO 2021220976A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive resin
resin composition
mass
metal powder
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/016514
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
聡一郎 江崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shoei Chemical Inc
Original Assignee
Shoei Chemical Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shoei Chemical Inc filed Critical Shoei Chemical Inc
Priority to EP21797474.0A priority Critical patent/EP4144801A4/en
Priority to CN202180032455.XA priority patent/CN115516589B/zh
Priority to KR1020227040843A priority patent/KR102952186B1/ko
Priority to US17/922,585 priority patent/US12603192B2/en
Priority to PH1/2022/553274A priority patent/PH12022553274A1/en
Priority to JP2022504007A priority patent/JP7078194B2/ja
Publication of WO2021220976A1 publication Critical patent/WO2021220976A1/ja
Anticipated expiration legal-status Critical
Priority to US18/346,538 priority patent/US12205731B2/en
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H01G9/055—Etched foil electrodes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals

Definitions

  • the present invention is an electrode of an electronic component for manufacturing an electronic component by forming an electrode on a electrode-forming body for an electronic component such as a laminate for a laminated electronic component and a cathode-formed body for a solid electrolytic capacitor.
  • the present invention relates to a conductive resin composition for forming.
  • the present invention also relates to a method for manufacturing an electronic component using the conductive resin composition.
  • Patent Document 1 discloses a laminated electronic component including an external electronic electrode in which a conductive resin layer is formed on a base metal layer formed by plating.
  • the conductive resin layer since the conductive resin layer is formed on the underlying metal layer, the conductive resin layer relieves stress even if the substrate on which the laminated electronic component is mounted is bent. By doing so, the occurrence of cracks can be suppressed.
  • Patent Document 2 discloses a conductive resin composition containing a conductive filler, a chelate-forming substance, a phenol resin, a modified epoxy resin, and a boron compound.
  • the conductive resin layer formed of the conductive tree composition containing epoxy resin as the main component of the resin has a certain degree of moisture resistance, it has high moisture resistance required for electronic parts used in mobile devices and automobiles. It was inadequate for sex.
  • a first object of the present invention is to provide a conductive resin composition for forming electrodes of electronic components having high moisture resistance.
  • a second object of the present invention is to provide a conductive resin composition for forming electrodes of electronic components, which has high moisture resistance, few restrictions on design and manufacturing, and high manufacturing efficiency. ..
  • the present inventors have used a conductive resin composition containing a predetermined amount of silicone resin as a resin binder to make the electrode-formed body for electronic parts conductive.
  • a resin binder By forming the resin layer, an electronic component having excellent moisture resistance can be obtained and design restrictions can be reduced as compared with the case of using a conductive resin composition containing an epoxy resin as a main component of a resin binder.
  • the present invention (1) includes a preparatory step for preparing an electrode-formed body for an electronic component and a preparatory step.
  • the metal powder, the resin binder, and the organic solvent are contained, and 20.0% by mass or more of the metal powder is flake-shaped metal powder, and 70.0% by mass of the resin binder.
  • the conductive resin layer is formed on the electrode-formed body for electronic parts.
  • the present invention provides a method for manufacturing an electronic component, which is characterized by the above.
  • the present invention (2) contains a metal powder, a resin binder, and an organic solvent.
  • the metal powder 20.0% by mass or more is flaky metal powder.
  • 70.0% by mass or more of the resin binder is a silicone resin.
  • the present invention provides a conductive resin composition characterized by the above.
  • the present invention (3) provides the conductive resin composition of (2), wherein 80.0% by mass or more of the resin binder is a silicone resin.
  • the present invention (4) is characterized in that the content of the resin binder is 2.5 to 35.0 parts by mass with respect to 100.0 parts by mass of the metal powder (2) or (3). ) Is provided.
  • the present invention (5) provides the conductive resin composition according to any one of (2) to (4), wherein the silicone resin has an epoxy group.
  • the present invention (6) provides the conductive resin composition according to any one of (2) to (4), wherein the silicone resin has a hydroxyl group.
  • the present invention (7) provides the conductive resin composition according to any one of (2) to (4), wherein the silicone resin is a thermosetting silicone resin.
  • the present invention (8) is characterized in that, of the resin binder, more than 0.0% by mass and 20.0% by mass or less is an epoxy resin, which is the conductive resin according to any one of (2) to (7). It provides a composition.
  • the present invention (9) provides the conductive resin composition according to any one of (2) to (8), wherein the flake-shaped metal powder has an aspect ratio of 1.5 to 50.0. It is a thing.
  • the metal powder is a powder containing one or more of silver, copper, nickel, palladium, platinum, gold and aluminum, and a powder containing an alloy containing one or more of these.
  • the present invention provides the conductive resin composition according to any one of (2) to (9), which is at least one powder selected from silver-coated copper powder and silver-coated nickel powder.
  • the present invention (11) further provides a conductive resin composition according to any one of (2) to (10), which further contains a plasticizer.
  • the value of the phase difference ⁇ between the strain and the stress generated by the strain is 32 to 88. It provides the conductive resin composition according to any one of (2) to (11), which is characterized by being in the range of °.
  • the ratio of the viscosity of the conductive resin composition at a shear rate of 0.4 (1 / s) to the viscosity at a shear rate of 40 (1 / s) is 1.4 to 60.0.
  • the present invention provides the conductive resin composition according to any one of (2) to (12), which is in the range of (2) to (12).
  • the present invention (14) provides the conductive resin composition according to any one of (2) to (13), wherein the conductive resin composition is for forming an external electrode of a laminated electronic component. Is what you do.
  • the present invention provides the conductive resin composition according to any one of (2) to (13), wherein the conductive resin composition is for forming a cathode of a solid electrolytic capacitor. Is.
  • the present invention (16) provides the conductive resin composition of (14), wherein the conductive resin composition is for dip printing.
  • the present invention (17) provides the conductive resin composition according to any one of (2) to (16), wherein the moisture permeability determined by the following moisture permeability measurement test is 80.0 mg or less. Is what you do.
  • ⁇ Moisture permeability measurement test> The conductive resin composition was cast on a PET film to a thickness of 250 ⁇ m and cured at 200 ° C. for 60 minutes. The obtained cured film was cut into a circle with a diameter of 7.5 mm, and a 5 ml glass bottle containing 2 g of silica gel was contained.
  • the present invention is a conductive resin composition containing a metal powder, a resin binder, and an organic solvent.
  • the metal powder is 100.0 parts by mass
  • the content of the resin binder is 5.0 to 25.0 parts by mass.
  • 80.0% by mass or more is a silicone resin.
  • the metal powder 20.0% by mass or more is a flake-shaped metal powder.
  • the ratio of the viscosity of the conductive resin composition to the viscosity at a shear rate of 40 (1 / s) at a shear rate of 0.4 (1 / s) is in the range of 1.5 to 20.0.
  • the present invention provides the conductive resin composition according to (3).
  • a conductive resin composition for forming electrodes of electronic components having high moisture resistance it is possible to provide a conductive resin composition for forming electrodes of electronic components having high moisture resistance. Further, according to the present invention, it is possible to provide a conductive resin composition for forming an electrode of an electronic component having high moisture resistance, few restrictions on design and manufacturing, and high manufacturing efficiency.
  • the conductive resin composition of the present invention contains a metal powder, a resin binder, and an organic solvent.
  • a metal powder 20.0% by mass or more is flaky metal powder.
  • 70.0% by mass or more of the resin binder is a silicone resin. It is a conductive resin composition characterized by.
  • FIG. 1 is a schematic perspective view showing a laminated electronic component.
  • FIG. 2 is a schematic cross-sectional view showing a laminated electronic component mounted on a substrate.
  • the laminated electronic component 10 is formed on an outer surface on both ends of a laminated electronic component laminate 1 composed of a plurality of ceramic layers and a plurality of internal electrode layers, and an internal electrode. It consists of external terminal electrodes 2 and 3 that are electrically connected to the layer.
  • the external terminal electrodes 2 and 3 are a metal layer 4 formed on the outer surface of the laminated body 1 for laminated electronic components, a conductive resin layer 5 formed on the surface of the metal layer 4, and a conductive resin. It is composed of a plating layer 6 formed on the surface of the layer 5. That is, in the external terminal electrodes 2 and 3, the conductive resin layer 5 is arranged between the metal layer 4 and the plating layer 6. Then, the laminated electronic component 10 is mounted on the substrate 8 by the solder 7.
  • the conductive resin composition of the present invention contains a metal powder, a resin binder, and an organic solvent.
  • the conductive resin composition of the present invention contains metal powder as a conductive material.
  • the metal powder include powder containing at least one of silver powder, copper powder, nickel powder, palladium powder, platinum powder, gold powder, aluminum powder and the like, silver, copper, nickel, palladium, platinum, gold and the like.
  • Examples include powders containing one or more alloys of aluminum, silver-coated copper powders, and silver-coated nickel powders.
  • the conductive resin composition of the present invention 20.0% by mass or more of the total metal powder is flaky metal powder.
  • the content ratio of the flake-shaped metal powder to the entire metal powder is 20.0 to 100.0% by mass, preferably 40.0 to 100.0% by mass, and particularly preferably 60.0 to 100.0% by mass.
  • the conductivity and adhesiveness of the obtained conductive resin layer are increased.
  • the aspect ratio of the flake-like metal powder is preferably 1.5 to 50.0, more preferably 2.0 to 30.0, and particularly preferably 5.0 to 20.0.
  • the aspect ratio of the flake-shaped metal powder is in the above range, the conductivity and adhesiveness of the obtained conductive resin layer are increased.
  • the aspect ratio of the flake-shaped metal powder is 50 metals arbitrarily selected in the scanning electron microscope (SEM) image observation with the particle diameter (thickness / particle diameter) relative to the particle thickness as the aspect ratio. The aspect ratio of the powder was measured and the average value was calculated.
  • the number average particle size of the flake-shaped metal powder as measured using a scanning electron microscope (SEM) is preferably 0.1 to 20.0 ⁇ m, more preferably 0.3 to 15.0 ⁇ m, and even more preferably 0. It is .5 to 10.0 ⁇ m, particularly preferably 1.0 to 5.0 ⁇ m.
  • the number average particle diameter of the flake-shaped metal powder when measured using a scanning electron microscope (SEM) is an SEM (scanning electron microscope) image observation with the diameter of the longest part of the particles as the particle diameter.
  • the particle size of 50 metal powders arbitrarily selected in the above was measured, and the average value thereof was determined as a number average particle size.
  • the specific surface area of the flake-shaped metal powder is preferably 0.5 to 5.0 m 2 / g, particularly preferably 0.6 to 4.0 m 2 / g.
  • the specific surface area of the flake-shaped metal powder is in the above range, the conductivity and adhesiveness of the obtained conductive resin layer are increased.
  • the metal powder contains flake-shaped metal powder and spherical metal powder, and "the content ratio of the spherical metal powder to the total metal powder is 80.0% by mass or less, and the content of the flake-shaped metal powder to the total metal powder". Is preferably 20.0% by mass or more, and "the content ratio of the spherical metal powder to the entire metal powder is 60.0% by mass or less, and the content of the flake-shaped metal powder to the entire metal powder is 40. It is particularly preferable that it is 0.0% by mass or more. When the content ratio of the flake-shaped metal powder and the spherical metal powder is in the above range, the conductivity and adhesiveness of the obtained conductive resin layer are enhanced.
  • the volume-based cumulative 50% particle size (D 50 ) of the spherical metal powder is preferably 0.01 to 7.0 ⁇ m, particularly preferably 0.03 to 5.0 ⁇ m.
  • D 50 of the spherical metal powder is in the above range, the conductivity and adhesiveness of the obtained conductive resin layer are increased.
  • a 50% value (D 50 ) in the volume-based integrated fraction was determined by using a laser diffraction type particle size distribution measuring device.
  • the specific surface area of the spherical metal powder is preferably 0.2 to 3.0 m 2 / g, particularly preferably 0.3 to 2.5 m 2 / g.
  • the conductivity and adhesiveness of the obtained conductive resin layer are increased.
  • the conductive resin composition of the present invention contains at least a silicone resin as a resin binder.
  • the conductive resin composition of the present invention 70.0% by mass or more of the total resin binder is a silicone resin.
  • the content ratio of the silicone resin to the total resin binder is 70.0 to 100.0% by mass, preferably 80.0 to 100.0% by mass, and more preferably 90.0 to 90.0 to 10% by mass. It is 100.0% by mass, particularly preferably 95.0 to 100.0% by mass.
  • the silicone resin examples include a thermosetting silicone resin and a thermoplastic silicone resin, and among these, a thermosetting silicone resin is preferable.
  • thermosetting silicone resin examples include a self-curing type resin that is cured by heating without using a curing agent and a curing agent curing type resin that is cured by a curing agent.
  • self-curing silicone resin examples include a silicone resin having a hydroxyl group as a reactive functional group and undergoing a dehydration condensation reaction by heating to cure.
  • the curing agent-curable silicone resin examples include silicone resins that are cured by the progress of a cross-linking reaction with a hydrocarbon group such as an alkenyl group when a catalyst is added and heated.
  • the thermosetting silicone resin is not particularly limited.
  • the skeleton of the resin has a structure such as a silicone oligomer, an organosiloxane, a diorganosiloxane, an organopolysiloxane, or a diorganopolysiloxane, and the resin has a structure. Examples thereof include those having a skeleton portion having one or more reactive functional groups.
  • organopolysiloxane and diorganopolysiloxane are preferable in that the moisture resistance of the conductive resin layer is increased.
  • the skeleton portion of the thermosetting silicone resin may be linear or branched.
  • the reactive functional group of the thermosetting silicone resin is not particularly limited, and for example, a hydroxyl group, an alkenyl group, a hydrogensilyl group, a (meth) acryloyl group, an epoxy group, an amino group, a carbinol group, a mercapto group, and the like. Examples include a carboxy group and a phenol group.
  • a hydroxy group and an alkenyl group are preferable in terms of moisture resistance, and an epoxy group is preferable in terms of adhesiveness.
  • thermosetting silicone resin can have a functional group such as an alkyl group, an alkenyl group, or an aromatic group in the side chain in addition to the reactive functional group.
  • a methyl group and a phenyl group are preferable because the moisture resistance of the conductive resin layer is increased.
  • the curing agent of the curing agent-curable thermosetting silicone resin is not particularly limited, and for example, a platinum-based curing agent, a titanium-based curing agent, an aluminum-based curing agent, a zinc-based curing agent, an iron-based curing agent, and phosphorus. Acid-based curing agents and the like can be mentioned.
  • a known curing agent used for the epoxy resin can be used, for example, an amine-based curing agent such as ethylenediamine, oxalic acid or the like. Examples thereof include acid anhydrides such as organic acids and phthalic anhydrides.
  • the molecular weight (weight average molecular weight Mw) of the thermosetting silicone resin is not particularly limited, but is preferably 1000 to 300,000, particularly preferably 2000 to 200,000.
  • the conductive resin composition of the present invention may contain a resin binder other than the silicone resin as long as the effects of the present invention are not impaired.
  • Resin binders other than silicone resin include epoxy resin, butyral resin, acetal resin, acrylic resin, polybutadiene resin, cellulose resin, (meth) acrylic resin, styrene resin, phenol resin, polyurethane resin, polyamide resin, and polyimide resin. Examples thereof include polyamideimide resin and alkyd resin.
  • the content ratio of the epoxy resin to the total resin binder ((epoxy resin / total resin binder (silicone resin + resin other than silicone resin)) ⁇ 100) is It is preferably 25.0% by mass or less, more preferably 20.0% by mass or less, more preferably 10% by mass or less, still more preferably 5.0% by mass or less, and particularly preferably 0.0% by mass.
  • the content ratio of the epoxy resin to the total resin binder in the conductive resin composition is within the above range, the moisture resistance of the conductive resin layer is increased, and the rate of change in the amount of moisture permeation with respect to the change in film thickness is small. Therefore, restrictions on the design of the electronic component can be reduced, and the moldability is improved, so that the manufacturing efficiency can be increased.
  • the content ratio of the epoxy resin to the total resin binder in the conductive resin composition of the present invention ((Epoxy resin / total resin binder (silicone resin)). + Resins other than silicone resin))) ⁇ 100) are preferably more than 0.0% by mass and 20.0% by mass or less, more preferably more than 0.0% by mass and 10.0% by mass or less, still more preferably 0. An epoxy resin exceeding 0.0% by mass and 5.0% by mass or less may be contained.
  • the content ratio of the epoxy resin to the total resin binder in the conductive resin composition is within the above range, it is possible to improve the adhesion of the conductive resin layer while maintaining high moisture resistance of the conductive resin layer. ..
  • the content ratio of the butyral resin to the total resin binder ((butyral resin / total resin binder (silicone resin + resin other than silicone resin)) ⁇ 100) is determined. It is preferably 20.0% by mass or less, more preferably 10.0% by mass or less, still more preferably 5.0% by mass or less, and particularly preferably 0.0% by mass.
  • the content ratio of the butyral resin to the total resin binder in the conductive resin composition is within the above range, the moisture resistance of the conductive resin layer is increased, and the rate of change in the amount of moisture permeation with respect to the change in film thickness is small. Therefore, restrictions on the design and manufacturing of electronic components can be reduced.
  • the content of the resin binder increases the conductivity and adhesiveness of the obtained conductive resin layer.
  • it is preferably 2.5 to 35.0 parts by mass, more preferably 5.0 to 25.0 parts by mass, based on 100.0 parts by mass of the metal powder, in that it becomes a rheology suitable for the dip method. It is preferably 7.0 to 23.0 parts by mass, and particularly preferably 11.0 to 20.0 parts by mass.
  • the content of the resin binder (all resin binders (silicone resin + other than silicone resin)). 2. It can also be used in an amount of 5 to 35.0 parts by mass, preferably 5.0 to 25.0 parts by mass, more preferably 7.0 to 23.0 parts by mass, and particularly preferably 11.0 to 20.0 parts by mass. .. Further, when the conductive resin composition of the present invention is applied to a laminate for a laminated electronic component to form a conductive resin layer, the content of the resin binder (all resin binders (other than silicone resin + silicone resin)).
  • the content of (resin)) is preferably higher than 100.0 parts by mass of the metal powder in that the obtained conductive resin layer has high conductivity and adhesiveness and is a rheology suitable for the dip method. It is 5.0 to 25.0 parts by mass, more preferably 7.0 to 23.0 parts by mass, and particularly preferably 11.0 to 20.0 parts by mass.
  • the content of the curing agent in the conductive resin composition is appropriately selected depending on the content of the thermosetting resin in the conductive resin composition. However, it is usually 0.01 to 10.0% by mass.
  • the organic solvent according to the conductive resin composition of the present invention is not particularly limited, and examples thereof include tertpineol, dihydroterpineol, dihydroterpineol acetate, secondary butyl alcohol, butyl carbitol, butyl carbitol acetate, and benzyl alcohol.
  • the conductive resin composition of the present invention may contain additives such as a defoaming agent, a plasticizer, a dispersant, and a rheology adjuster, if necessary, in addition to the above components.
  • Plasticizers include dimethyl phthalate, diethyl phthalate, dibutyl phthalate, di-2-ethylhexyl phthalate, dinormal octyl phthalate, butyl benzyl phthalate, dioctyl adipate, diisononyl adipate, dibutyl sebacate, sebacic acid.
  • Examples thereof include diethyl, dioctyl sebacate, tricresyl phosphate, chlorinated paraffin, cyclohexane 1,2 dicarboxylic acid diisononyl ester (DINCH) and the like.
  • the conductive resin composition of the present invention is suitably used for forming a cathode of a solid electrolytic capacitor and for dip printing a laminate for a laminated electronic component.
  • the rheology adjuster include silica powder.
  • the content of the silica powder in the conductive resin composition of the present invention is preferably 0.0 to 3 with respect to 100 parts by mass of the metal powder. It is 0.0 parts by mass, particularly preferably 0.0 to 2.0 parts by mass.
  • the content of the organic solvent is appropriately selected according to the type and content of the metal powder, the type and content of the resin binder, the rheology required for each application, and the like.
  • a value of the phase difference ⁇ between the strain and the stress generated by the strain when a strain amount of 1% is applied to the conductive resin composition at an angular frequency of 1 Hz is preferably in a predetermined range.
  • the amount of the conductive resin composition in which the ratio of the viscosity at the shear rate of 0.4 (1 / s) to the viscosity at the shear rate of 40 (1 / s) is within a predetermined range is appropriately selected.
  • the value of the phase difference ⁇ between the strain and the stress generated by the strain when a strain amount of 1% is applied to the conductive composition of the conductive resin composition of the present invention at an angular frequency of 1 Hz is preferable.
  • the above-mentioned value of the phase difference ⁇ is not particularly limited, but the above-mentioned Regarding the lower limit of the value of the phase difference ⁇ of, 45 ° or more is preferable, 47 ° or more is more preferable, 49 ° or more is particularly preferable, 50 ° or more is further preferable, and 51 ° or more is preferable, in terms of high moldability.
  • the upper limit of the above-mentioned value of the phase difference ⁇ is preferably 87 ° or less, more preferably 85 ° or less, particularly preferably 83 ° or less, and further preferably 81 ° or less in terms of high moldability. It is preferable, and 80 ° or less is more preferable.
  • the upper limit and the lower limit of the phase difference ⁇ can be arbitrarily combined.
  • the above-mentioned range of the value of the phase difference ⁇ is preferably in the range of 45 to 87 °, more preferably in the range of 47 to 85 °, and particularly preferably in the range of 49 to 83 ° in that the moldability is improved.
  • the range of 51 to 81 ° is more preferable.
  • the above-mentioned value of the phase difference ⁇ is not particularly limited.
  • the lower limit of the above-mentioned value of the phase difference ⁇ 32 ° or more is preferable, 37 ° or more is more preferable, 45 ° or more is more preferable, 47 ° or more is more preferable, and 49 ° or more is preferable in terms of high moldability.
  • the upper limit of the above-mentioned value of the phase difference ⁇ is preferably 87 ° or less, more preferably 85 ° or less, and 83 ° or less in terms of high moldability. Is particularly preferable, 81 ° or less is further preferable, and 80 ° or less is further preferable.
  • the upper limit and the lower limit of the phase difference ⁇ can be arbitrarily combined.
  • the above-mentioned range of the value of the phase difference ⁇ is preferably in the range of 32 to 87 °, more preferably in the range of 37 to 87 °, and more preferably in the range of 45 to 87 ° in that the moldability is improved.
  • the value of the phase difference ⁇ of the conductive resin composition of the present invention is 40 mm in diameter under the conditions of 25 ° C., an angular frequency of 1 Hz, and a strain amount of 1% using a rheometer (manufactured by TA instrument, model number: AR2000). Measured using a parallel plate.
  • a rheometer manufactured by TA instrument, model number: AR2000.
  • the ratio (mass ratio) of the spherical powder, the flake-like powder, the resin, and the solvent in the conductive resin composition is adjusted. Addition of a rheology modifier may be mentioned.
  • the conductive resin composition of the present invention has an angular frequency of 1 Hz in that the moldability is improved when the electrode-formed body for electronic parts is formed with an electrode using the conductive resin composition.
  • the lower limit of the ratio of the viscosity at a shear rate of 0.4 (1 / s) to the viscosity at a shear rate of 40 (1 / s) when a strain amount of 1% is added is preferably 1.4 or more, preferably 1.5.
  • the above is more preferable, 2.0 or more is more preferable, 2.5 or more is particularly preferable, and the shear rate is 40 (1 / s) when a strain amount of 1% is added to the conductive composition at an angular frequency of 1 Hz.
  • the upper limit of the ratio of the viscosity at the shear rate of 0.4 (1 / s) is preferably 60.0 or less, more preferably 30.0 or less, more preferably 20.0 or less, and 15.0 or less. Is particularly preferable.
  • the shear rate of the conductive resin composition of the present invention is 0.4 (1) with respect to the viscosity at a shear rate of 40 (1 / s) when a strain amount of 1% is applied to the conductive composition at an angular frequency of 1 Hz.
  • the range of the viscosity ratio at / s) is that the moldability is improved when the electrode-formed body for electronic parts is formed with an electrode using the conductive resin composition, and is preferably 1.4 to, for example.
  • the range of 60.0 more preferably the range of 1.5 to 60.0, more preferably the range of 1.5 to 30.0, more preferably the range of 2.0 to 20.0, more preferably 2.
  • Examples thereof include a range of 5 to 20.0, particularly preferably a range of 2.5 to 15.0, and even more preferably a range of 3.0 to 15.0.
  • the above-mentioned viscosity ratio is not particularly limited, but the above-mentioned viscosity Regarding the lower limit of the ratio, 1.5 or more is preferable, 2.0 or more is more preferable, 2.5 or more is particularly preferable, and the upper limit of the above-mentioned viscosity ratio is 20 in terms of increasing moldability. It is preferably 0.0 or less, more preferably 15.0 or less, and particularly preferably 12.0 or less.
  • the above-mentioned viscosity ratio range is preferably in the range of 1.5 to 20.0, more preferably in the range of 2.0 to 20.0, and particularly preferably in the range of 2.0 to 20.0 in that the moldability is high.
  • the range of 2.5 to 15.0, more preferably the range of 2.5 to 12.0 can be mentioned.
  • the above-mentioned viscosity ratio is not particularly limited, but the above-mentioned Regarding the lower limit of the viscosity ratio, 1.5 or more is preferable, 2.0 or more is more preferable, 2.5 or more is particularly preferable, and the above-mentioned upper limit of the viscosity ratio is about the upper limit of the viscosity ratio. , 60.0 or less is preferable, 50.0 or less is more preferable, 35.0 or less is more preferable, 20.0 or less is more preferable, and 15.0 or less is particularly preferable.
  • the above-mentioned viscosity ratio range is preferably in the range of 1.5 to 60.0, more preferably in the range of 2.0 to 50.0, and more preferably in the range of high moldability.
  • examples thereof include a range of 2.0 to 35.0, more preferably a range of 2.0 to 20.0, and particularly preferably a range of 2.5 to 15.0.
  • the viscosity ratio of the conductive resin composition of the present invention is a shear rate of 0.4 (1 / s) and shear at 25 ° C. using a rotational viscometer (manufactured by Brookfield, model number: HADV-II + Pro). By measuring the viscosity under the condition of the velocity 40 (1 / s), the ratio of the viscosity of the shear rate 0.4 (1 / s) to the viscosity of the shear rate 40 (1 / s) is calculated.
  • the ratio (mass ratio) of spherical powder, flake-like powder, resin, and solvent in the conductive resin composition is adjusted, and a rheology adjuster is added. To do.
  • the moisture permeability of the conductive resin composition of the present invention determined by the following moisture permeability measurement test is 80.0 mg or less, preferably 40.0 mg or less, and more preferably 20.0 mg or less.
  • an electronic component having excellent moisture resistance can be obtained when the conductive resin layer is formed using the conductive resin composition of the present invention.
  • ⁇ Moisture permeability measurement test> The conductive resin composition was cast on a PET film to a thickness of 250 ⁇ m and cured at 200 ° C. for 60 minutes. The obtained cured film was cut into a circle with a diameter of 7.5 mm, and a 5 ml glass bottle containing 2 g of silica gel was contained.
  • the conductive resin composition of the first embodiment of the present invention described below is used when an electrode-forming body for an electronic component is formed with an electrode using the conductive resin composition.
  • the moldability is high, especially when the conductive resin layer is formed on the laminated body for laminated electronic parts by the dip method.
  • the conductive resin composition of the first embodiment of the present invention is a conductive resin composition containing a metal powder, a resin binder, and an organic solvent.
  • the metal powder is 100.0 parts by mass
  • the content of the resin binder is 5.0 to 25.0 parts by mass.
  • 80.0% by mass or more is a silicone resin.
  • the metal powder 20.0% by mass or more is a flake-shaped metal powder.
  • the ratio of the viscosity of the conductive resin composition to the viscosity at a shear rate of 40 (1 / s) at a shear rate of 0.4 (1 / s) is in the range of 1.5 to 20.0. It is a conductive resin composition characterized by.
  • resin binder silicone resin, thermosetting silicone resin, curing agent, thermoplastic silicone resin, silicone resin according to the conductive resin composition of the first embodiment of the present invention.
  • Resin binders, epoxy resins, butyral resins, organic solvents, and additives used as necessary, such as antifoaming agents, plasticizing agents, dispersants, and rheology adjusters, relate to the above-mentioned conductive resin composition of the present invention.
  • the conductive resin composition of the first aspect of the present invention 20.0% by mass or more of the total metal powder is flaky metal powder.
  • the content ratio of the flake-shaped metal powder to the entire metal powder is 20.0 to 100.0% by mass, preferably 40.0 to 100.0% by mass, and particularly preferably 60.0 to 100.0% by mass.
  • the conductivity and adhesiveness of the obtained conductive resin layer are increased.
  • the conductive resin composition of the first aspect of the present invention 80.0% by mass or more of the total resin binder is a silicone resin.
  • the content ratio of the silicone resin to the total resin binder is preferably 80.0 to 100.0% by mass, more preferably 90.0 to 100.0% by mass. , Particularly preferably 95.0 to 100.0% by mass.
  • the content ratio of the epoxy resin to the total resin binder (((epoxy resin / total resin binder (silicone resin + resin other than silicone resin))).
  • ⁇ 100) is preferably 25.0% by mass or less, more preferably 20.0% by mass or less, more preferably 10% by mass or less, still more preferably 5.0% by mass or less, and particularly preferably 0.0% by mass. Is.
  • the content ratio of the epoxy resin to the total resin binder in the conductive resin composition is within the above range, the moisture resistance of the conductive resin layer is increased, and the rate of change in the amount of moisture permeation with respect to the change in film thickness is small. Therefore, restrictions on the design of the electronic component can be reduced, and the moldability is improved, so that the manufacturing efficiency can be increased.
  • the content ratio of the epoxy resin to the total resin binder in the conductive resin composition of the first embodiment of the present invention ((epoxy resin / total).
  • the resin binder (silicone resin + resin other than silicone resin)) ⁇ 100) is preferably more than 0.0% by mass and 20.0% by mass or less, more preferably more than 0.0% by mass and 10% by mass or less, and further.
  • the epoxy resin may be contained in an amount of more than 0.0% by mass and not more than 5.0% by mass.
  • the content ratio of butyral resin to the total resin binder ((butyral resin / total resin binder (silicone resin + resin other than silicone resin)) X100) is preferably 20.0% by mass or less, more preferably 10.0% by mass or less, still more preferably 5.0% by mass or less, and particularly preferably 0.0% by mass.
  • the content ratio of the butyral resin to the total resin binder in the conductive resin composition is within the above range, the moisture resistance of the conductive resin layer is increased, and the rate of change in the amount of moisture permeation with respect to the change in film thickness is small. Therefore, restrictions on the design and manufacturing of electronic components can be reduced.
  • the content of the resin binder is based on 100.0 parts by mass of the metal powder. It is 5.0 to 25.0 parts by mass, preferably 7.0 to 23.0 parts by mass, and particularly preferably 11.0 to 20.0 parts by mass.
  • the content of the resin content in the conductive resin composition is within the above range, the conductivity and adhesiveness of the obtained conductive resin layer are increased, and the rheology is suitable for the dip method.
  • the conductive resin composition of the first aspect of the present invention contains a thermosetting resin as a silicone resin
  • a curing agent can be contained.
  • the content of the curing agent in the conductive resin composition depends on the content of the thermosetting resin in the conductive resin composition. , Appropriately selected, but usually 0.01 to 10.0% by mass.
  • the conductive resin composition of the first embodiment of the present invention may contain additives such as an antifoaming agent, a plasticizer, a dispersant, and a rheology adjuster, if necessary, in addition to the above components.
  • Plasticizers include dimethyl phthalate, diethyl phthalate, dibutyl phthalate, di-2-ethylhexyl phthalate, dinormal octyl phthalate, butyl benzyl phthalate, dioctyl adipate, diisononyl adipate, dibutyl sebacate, sebacic acid.
  • the conductive resin composition of the present invention contains silica powder
  • the content of the silica powder in the conductive resin composition of the present invention is preferably 0.0 to 3 with respect to 100 parts by mass of the metal powder. It is 0.0 parts by mass, particularly preferably 0.0 to 2.0 parts by mass.
  • the value of the phase difference ⁇ between the strain and the stress generated by the strain is 45 to 87 °.
  • the range is preferably 47 to 85 °, particularly preferably 49 to 83 °, and even more preferably 51 to 81 °.
  • the ratio of the viscosity of the conductive resin composition of the first embodiment of the present invention to the viscosity at a shear rate of 40 (1 / s) at a shear rate of 0.4 (1 / s) is 1.5 to 20.0.
  • the range is preferably in the range of 2.0 to 20.0, more preferably in the range of 2.5 to 15.0.
  • the conductive resin composition of the present invention (including the conductive resin composition of the first aspect of the present invention) is an electrode-formed body (hereinafter, a cover for electronic parts) on which an electrode is formed in the manufacture of electronic parts. It is also described as an electrode-forming body), and is suitable as a conductive resin composition for forming an electrode.
  • the conductive resin composition of the present invention (including the conductive resin composition of the first embodiment of the present invention) is a conductive resin composition for forming an external electrode of a laminate for a laminated electronic component. Is particularly suitable.
  • the method for manufacturing an electronic component of the present invention is to manufacture an electronic component in which an electrode is formed on the electronic component by using the conductive resin composition of the present invention (including the conductive resin composition of the first aspect of the present invention). It is a method, and includes a preparatory step of preparing an electrode-formed body for an electronic component and an electrode forming step of forming an electrode on the outer surface of the electrode-formed body for an electronic component. , The conductive resin composition of the present invention is used to form a conductive resin layer on the electrode-formed body for electronic components to form an electrode.
  • the method for manufacturing an electronic component of the present invention includes a preparatory step for preparing an electrode-formed body for an electronic component and a preparatory step.
  • the metal powder, the resin binder, and the organic solvent are contained, and 20.0% by mass or more of the metal powder is flake-shaped metal powder, and 70.0% by mass of the resin binder.
  • a conductive resin composition in which% or more is a silicone resin the conductive resin layer is formed on the electrode-formed body for electronic parts. It is a manufacturing method of an electronic component characterized by.
  • the preparation process is a process of preparing an electrode-formed body for electronic components.
  • the electrode-formed body for an electronic component refers to an object on which an electrode is formed in a manufacturing process of an electronic component.
  • the electrode-formed body for electronic components includes a laminated body for laminated electronic components composed of a plurality of ceramic layers and a plurality of internal electrode layers, and a solid electrolytic capacitor covering composed of an anode and a dielectric layer formed on the surface of the anode. Examples thereof include a cathode forming body and an electrode-bearing body for a chip resistor provided with an end face electrode.
  • the laminated body for laminated electronic components is composed of a plurality of ceramic layers and a plurality of internal electrode layers. In the laminated body for laminated electronic components, adjacent ceramic layers are connected to each other by an internal electrode layer interposed between them.
  • Examples of the laminated body for laminated electronic components include a laminated body for a laminated ceramic capacitor, a laminated body for a laminated ceramic inductor, and a laminated body for a piezoelectric actuator.
  • Examples of the material for forming the ceramic layer constituting the laminate for the laminated electronic component include barium titanate, strontium titanate, calcium titanate, barium zirconate, strontium zirconate, calcium zirconate, calcium strontium titanate and the like. ..
  • the material for forming the internal electrode layer constituting the laminated body for laminated electronic parts is any one of nickel, palladium, silver, copper, gold and the like, or an alloy containing one or more of these (for example, with silver). (Alloy with palladium, etc.).
  • the cathode-forming body for a solid electrolytic capacitor is composed of an anode and a dielectric layer formed on the surface of the anode.
  • Examples of the combination of the body forming the anode and the dielectric layer include tantalum and tantalum pentoxide, aluminum and aluminum oxide, niobium and niobium pentoxide, and the like.
  • the electrode forming step is a step of forming an electrode on the outer surface of the electrode-formed body for electronic parts.
  • forming the conductive resin layer on the electrode-forming body for electronic parts means forming the conductive resin layer directly on the surface of the electrode-forming body for electronic parts, and forming the conductive resin layer directly on the surface of the electrode-forming body for electronic parts. This includes both cases where another layer or film (for example, a metal layer, a conductor layer) or the like is first formed on the electrode forming body, and a conductive resin layer is formed on the surface thereof.
  • the conductive resin layer is formed with another layer or film (for example, a metal layer, a conductor layer) or the like interposed therebetween.
  • the position and method of forming the electrode, the thickness of the electrode, the number of electrodes, the type of metal constituting the electrode, the shape of the metal powder used for forming the electrode, etc. are appropriately selected depending on the electronic component to be manufactured. NS.
  • the conductive resin composition of the present invention is used to form a conductive resin layer on the electrode-formed body for electronic parts.
  • the conductive resin composition of the present invention is applied to the electrode-formed body for electronic parts, so that the conductive resin composition of the present invention is placed at a predetermined position on the electrode-formed body for electronic parts. Then, the conductive resin composition of the present invention is cured to form a conductive resin layer.
  • the conductive resin composition of the present invention is directly applied to the surface of the electrode-formed body for electronic parts, so that the conductive resin layer is directly applied to the surface of the electrode-formed body for electronic parts. Can be formed. Further, in the electrode forming step, an appropriate step can be provided depending on the type of the electronic component before forming the conductive resin layer on the electrode-formed body for the electronic component. For example, in the case of a laminated electronic component, in the electrode forming step, after forming a metal layer at a predetermined position of the electrode-formed body for the electronic component, the conductive resin composition of the present invention is applied to the surface of the metal layer.
  • a layer of the conductive resin composition of the present invention is formed at a predetermined position on the electrode-formed body for electronic parts, and then the conductive resin composition of the present invention is cured to obtain a metal.
  • a conductive resin layer is formed on the surface of the layer.
  • a conductive layer made of a carbon layer is formed at a predetermined position on the cathode-formed body for a solid electrolytic capacitor, and then the conductivity of the present invention is formed on the surface of the conductive layer.
  • the conductive resin composition layer of the present invention is formed at a predetermined position on the electrode-formed body for electronic parts, and then the conductive resin composition of the present invention is cured. By doing so, a conductive resin layer is formed on the surface of the conductive layer.
  • an appropriate step can be provided depending on the type of the electronic component. For example, in the case of a laminated electronic component, in the electrode forming step, a conductive resin layer is formed at a predetermined position of the electrode-formed body for the electronic component, and then a plating layer is formed on the surface of the conductive resin layer.
  • an electrode can be formed by forming a conductive resin layer on the electrode-formed body for electronic parts. That is, in this form, the electrode is composed of only the conductive resin layer.
  • the electrode-forming body for electronic parts is subjected to the present by the dip method.
  • the conductive resin composition of the present invention can be applied to form a layer of the conductive resin composition of the present invention at a predetermined position on the electrode-formed body for electronic parts. Since the conductive resin composition of the present invention is excellent in moldability, the conductive resin composition layer of the present invention can be quickly formed at a predetermined position by a dip method. Therefore, according to the conductive resin composition of the present invention, the production efficiency can be increased by applying the conductive resin composition of the present invention to the electrode-formed body for electronic components by the dip method.
  • the electrode-formed body for electronic parts is a laminated body for laminated electronic parts composed of a ceramic layer and an internal electrode layer.
  • the electrode forming step (1) is a conductive resin layer forming step (1) in which the conductive resin composition of the present invention is used to form a conductive resin layer on the outer surface of the laminate for laminated electronic components.
  • the electrode forming step (1) there is a conductive resin layer forming step (1) in which the conductive resin composition of the present invention is used to form a conductive resin layer on the outer surface of the laminate for laminated electronic parts.
  • the present invention is not particularly limited, and examples thereof include an electrode forming step (1A) including a metal layer forming step, a conductive resin layer forming step (1A), and a plating layer forming step.
  • the metal layer forming step is a step of forming a metal layer electrically connected to the internal electrode layer on the outer surface of the laminated body for laminated electronic components.
  • the metal forming the metal layer include at least one of Cu, Ag, Pd, Ni, Sn, Al, Au and Pt, or an alloy containing one or more of these.
  • the method for forming the metal layer is not particularly limited, and examples thereof include a dip method, a plating method, a roll coating method, a screen printing method, and a sputtering method. The thickness, shape, position, number, etc. of the metal layer are appropriately selected.
  • the conductive resin layer forming step (1A) is a step of forming a conductive resin layer on the surface of the metal layer formed by performing the metal layer forming step by using the conductive resin composition of the present invention.
  • the conductive resin composition of the present invention is applied to the surface of the metal layer formed by performing the metal layer forming step, whereby the present invention is applied to the surface of the metal layer.
  • a layer of the conductive resin composition is formed, and then the conductive resin composition of the present invention is cured to form a conductive resin layer.
  • the method for forming the conductive resin composition layer of the present invention is not particularly limited, and examples thereof include a dip method, a screen printing method, and a roll coating method. Of these, the dip method is preferable.
  • the thickness, shape, position, number, and the like of the conductive resin composition layer of the present invention are appropriately selected.
  • the plating layer forming step is a step of forming a plating layer on the surface of the conductive resin layer.
  • the metal forming the plating layer include alloys containing at least one of Ni, Cu, Sn, Ag and Au, or one or more of these.
  • the method for forming the plating layer is not particularly limited, and examples thereof include electrolytic plating and electroless plating. The thickness, shape, position, number, etc. of the plating layer are appropriately selected.
  • the second form of the electrode forming step (hereinafter, also referred to as an electrode forming step (2)) is an electrode forming step when the electrode-formed body for electronic components is a cathode-forming body for a solid electrolytic capacitor. .. Then, the electrode forming step (2) is a conductive resin layer forming step (2) in which the conductive resin composition of the present invention is used to form a conductive resin layer on the outer surface of the cathode forming body for a solid electrolytic capacitor. At least. As the electrode forming step (2), a conductive resin layer forming step (2) is performed in which the conductive resin composition of the present invention is used to form a conductive resin layer on the outer surface of the cathode forming body for a solid electrolytic capacitor. If it has, it is not particularly limited, and for example, an electrode forming step (2) including at least a solid electrolyte layer forming step, a carbon layer forming step, and a conductive resin layer forming step (2A). A) can be mentioned.
  • the solid electrolyte layer forming step is a step of forming a solid electrolyte layer on the outer surface of the cathode forming body for a solid electrolytic capacitor.
  • the method for forming the solid electrolyte layer is not particularly limited and can be formed by a known solid electrolyte produced by a chemical method.
  • the solid electrolyte includes, for example, a conductive polymer such as polypyrrole, polyaniline, polythiophene, or polyacetylene. Can be mentioned.
  • the carbon layer forming step is a step of forming a carbon layer on the solid electrolyte layer.
  • the method for forming the carbon layer is not particularly limited, and for example, a method in which a carbon paste containing a resin, a solvent, and carbon powder is applied onto the solid electrolyte layer by a dip method, and then dried and / or cured. Can be mentioned.
  • the carbon powder is not particularly limited, but graphite powder is preferable.
  • the conductive resin layer forming step (2A) is a step of forming a conductive resin layer on a carbon layer using a conductive resin composition containing a silicone resin.
  • the method for forming the conductive resin layer is not particularly limited, and for example, a conductive resin composition containing a silicone resin is applied by a dip method, a screen printing method, a roll coating method, or the like, and then a silicone resin is applied. Examples thereof include a method of curing the contained conductive resin composition.
  • the electrode forming step (3) includes at least a step of forming a conductive resin layer on the end face electrode.
  • the method for forming the conductive resin layer is not particularly limited, and for example, a conductive resin composition containing a silicone resin is applied by a dip method, a screen printing method, a roll coating method, or the like, and then a silicone resin is applied. Examples thereof include a method of curing the contained conductive resin composition.
  • the electrode-formed body for a chip resistor including the end face electrode is, for example, an insulating substrate, a pair of top electrodes formed on the insulating substrate, a resistor formed between the pair of top electrodes, and a pair of top electrodes.
  • a protective layer formed so as to cover a part of the resistor and an end face electrode formed on the end face of the insulating substrate are provided.
  • the electrode forming step (4) includes at least a step of forming a conductive resin layer on the substrate.
  • the method for forming the conductive resin layer is not particularly limited, and for example, a conductive resin composition containing a silicone resin is applied by screen printing, inkjet printing, or dispenser printing, and then the silicone resin is contained. Examples thereof include a method of curing the conductive composition.
  • the substrate include an alumina substrate, a glass epoxy substrate, a paper phenol substrate, and a paper epoxy substrate.
  • the electrode forming step (5) includes at least a step of forming a conductive resin layer on the film.
  • the method for forming the conductive resin layer is not particularly limited, and for example, a conductive resin composition containing a silicone resin is applied by screen printing, inkjet printing, or dispenser printing, and then the silicone resin is contained. Examples thereof include a method of curing the conductive composition.
  • the film include a polyimide film and a PET film.
  • the specific resistance of the conductive resin layer obtained by using the conductive resin composition of the present invention is preferably 1000 ⁇ ⁇ cm or less, more preferably 500 ⁇ ⁇ cm or less, and particularly preferably 200 ⁇ ⁇ cm or less.
  • the elongation rate of the conductive resin layer obtained by using the conductive resin composition of the present invention is preferably 0.2% or more, particularly preferably 0.3% or more. Since the conductive resin layer having the elongation rate in the above range is formed between the metal layer and the plating layer of the external electrode of the laminated electronic component, cracks and interfacial peeling occur at the connection portion between the substrate and the electronic component. Since it is difficult and cracks are unlikely to occur in the electronic component itself, the impact resistance of the electronic component is improved. Therefore, the impact resistance of the electronic component can be enhanced by forming the conductive resin composition of the present invention between the metal layer and the plating layer of the external electrode of the laminated electronic component.
  • the elongation of the conductive resin layer is such that the cured film obtained by casting the conductive resin composition on a PET film with a thickness of 250 ⁇ m and curing it at 200 ° C. for 60 minutes is cut into a rectangle having a width of 5 mm.
  • a viscoelasticity measuring device manufactured by Hitachi High-Tech Science Co., Ltd., model number: DMA-7100 is used to measure the coating film length when a tensile load of 9.8 N is applied in the long axis direction of the cured film, and a load is applied. It is calculated as the ratio of the length extended when a load is applied to the previous length of 10 mm.
  • the adhesion strength of the conductive resin layer obtained by using the conductive resin composition of the present invention is preferably 0.2 MPa or more, more preferably 0.3 MPa or more, and particularly preferably 0.4 MPa or more.
  • the adhesion strength of the conductive resin layer is within the above range, the impact resistance of the electronic component can be increased.
  • the conductive resin composition is cast on a slide glass substrate with a thickness of 50 ⁇ m, an aluminum cylinder having a diameter of 3 mm is placed on the slide glass substrate, and the conductive resin layer is cured at 200 ° C. for 60 minutes. It is measured by pulling in the vertical direction at a speed of 0.5 mm / s using a Seishin Shoji Co., Ltd. model number: SS-30WD) and measuring the value at the time of breakage.
  • the conductive resin composition of the present invention uses a silicone resin as all or part of the resin binder, the conductivity obtained is higher than that of the conductive resin composition using an epoxy resin as the main component of the resin binder.
  • the moisture resistance of the resin layer is increased, and the heat resistance of the obtained conductive resin layer is increased as compared with the conductive resin composition containing a large amount of butyral resin as a resin binder.
  • the conductive resin composition of the present invention a silicone resin is used as the resin binder and a predetermined amount of the silicone resin is contained, so that the obtained conductive resin layer requires stress relaxation and the like. Easy to meet. Therefore, according to the conductive resin composition of the present invention, it is possible to obtain a conductive resin layer having higher heat resistance as a resin binder than the conductive resin composition containing an epoxy resin as a main component and butyral. ..
  • the conductive resin layer obtained by using the conductive resin composition of the present invention is compared with the conductive resin layer obtained from the conductive resin composition containing an epoxy resin as a main component of the resin binder and containing butyral. , The rate of change in the amount of moisture permeation with respect to the change in film thickness is small.
  • the film thickness of the conductive resin layer to be formed on the object to be formed of the conductive resin layer varies depending on the type of electronic component. Then, as the film thickness becomes thinner, the amount of moisture permeation increases, so it is necessary to cover the increase in the amount of moisture permeation by increasing the ratio of the resin in the conductive resin layer. Then, as the rate of change in the amount of moisture permeation increases with respect to the change in film thickness, the amount of increase in the amount of moisture permeation does not increase significantly, so that many measures are required to cover the increase in the amount of moisture permeation.
  • the silver powders 1 and 2 shown in Table 1 were prepared based on the spray pyrolysis method described in Tokushu Sho 63-31522. That is, for silver powder 1, an aqueous solution in which a silver salt was dissolved was spray-pyrolyzed, and the collected silver powder was classified to adjust the value of D 50. For the obtained silver powder, a 50% value (D 50 ) in a volume-based integrated fraction was determined using a laser diffraction type particle size distribution measuring device. In addition, the specific surface area was measured by the BET method.
  • Spherical silver powder was produced by the method described above, and the obtained spherical silver powder was pulverized with a ball mill using stearic acid as a lubricant to produce flake-shaped silver powder.
  • the particle size and aspect ratio of 50 silver powders arbitrarily selected in the SEM (scanning electron microscope) image observation were measured, and the average value was obtained.
  • the specific surface area was measured by the BET method.
  • a silver-coated copper powder coated with silver so as to have a ratio of 10 parts by mass to 90 parts by mass was produced, and the obtained silver-coated copper powder was used.
  • a flake-shaped silver-coated copper powder was produced by pulverizing with a ball mill using palmitic acid as a lubricant.
  • the specific surface area was measured by the BET method.
  • a conductive resin composition was prepared by blending a metal powder, a silicone resin, and an epoxy resin in the blending ratios shown in Tables 1 and 2.
  • Examples 1 to 8 135 parts by mass of silicone resin 1 as a resin solid content and 165 parts by mass of benzyl alcohol (manufactured by Gordo Co., Ltd.) were mixed, and solvent substitution was carried out under the conditions of 130 ° C., 30 Pa, and 1 hour to obtain a resin solution.
  • the obtained resin liquid, metal powder 1, and metal powder 2 were mixed at the ratios shown in Table 1 and then kneaded using a three-roll mill (manufactured by Inoue Seisakusho) to obtain a paste-like composition. ..
  • the obtained paste-like composition was diluted with benzyl alcohol and adjusted so that the viscosity at 25 ° C. and a shear rate of 4 (1 / s) was 30 Pa ⁇ s, and then the following evaluation was performed. The results are shown in Table 1.
  • Examples 9 to 13, Comparative Examples 1 to 4 135 parts by mass of silicone resin 1 as a resin solid content and 165 parts by mass of benzyl alcohol (manufactured by Gordo Co., Ltd.) were mixed, and solvent substitution was carried out under the conditions of 130 ° C., 30 Pa, and 1 hour to obtain a resin solution.
  • the obtained resin liquid, metal powder 3, and epoxy resin 1 were mixed at the ratios shown in Table 2 and then kneaded using a three-roll mill (manufactured by Inoue Seisakusho) to obtain a paste-like composition. ..
  • the obtained paste-like composition was diluted with benzyl alcohol and adjusted so that the viscosity at 25 ° C. and a shear rate of 4 (1 / s) was 30 Pa ⁇ s, and then the following evaluation was performed. The results are shown in Table 2.
  • Viscosity ratio The viscosity of the conductive resin composition was measured at 25 ° C. using a rotational viscometer (manufactured by Brookfield, model number: HADV-II + Pro) at a shear rate of 0.4 (1 / s) and a shear rate of 40 (1 / s). ) was measured. The ratio of the viscosity of the shear rate of 0.4 (1 / s) to the viscosity of the shear rate of 40 (1 / s) was calculated as the viscosity ratio.
  • Phase difference ⁇ Measured using a rheometer (manufactured by TA instrument, model number: AR2000) at 25 ° C., an angular frequency of 1 Hz, and a strain amount of 1% using a parallel plate having a diameter of 40 mm. The value of the phase difference ⁇ was obtained.
  • the conductive resin composition was cast on a PET film at a thickness of 250 ⁇ m and cured at 200 ° C. for 60 minutes to obtain a cured film.
  • the obtained cured film was cut into a circle having a diameter of 7.5 mm, and fixed with an adhesive so as to cover a 5 ml glass bottle containing 2 g of silica gel. Then, the glass bottle was placed in a 750 ml container containing 100 ml of purified water so that the cured film did not come into contact with the purified water, and the bottle was placed in a dryer set at 65 ° C. and allowed to stand for 15 hours.
  • the weight of the glass bottle before and after putting it in the dryer was measured, and the weight increase was taken as the amount of moisture permeation. If the moisture permeation amount exceeds 160 mg, "Score: 1, Fail, Unusable, Moisture resistance is extremely low", and if it exceeds 80.0 mg and 160 mg or less, "Score: 2, Fail, Unusable, Moisture resistance""Lowproperty", more than 40.0 mg and 80.0 mg or less "Score 3: Pass, usable”, and more than 20.0 mg and 40.0 mg or less "Score 4: Pass, usable, moisture resistance""High” and 20.0 mg or less were rated as "Score 5: Passed, usable, extremely high moisture resistance”.
  • the conductive resin composition was cast on a PET film at a thickness of 250 ⁇ m and cured at 200 ° C. for 60 minutes to obtain a cured film.
  • the obtained cured film is cut into a rectangle with a width of 5 mm, and a coating film when a tensile load of 9.8 N is applied in the long axis direction using a viscoelasticity measuring device (manufactured by Hitachi High-Tech Science Co., Ltd., model number: DMA-7100). The length was measured. The ratio of the length stretched when the load was applied to the length 10 mm before the load was calculated was calculated and used as the elongation rate.
  • the conductive resin composition was cast on a slide glass substrate at a width of 1 cm, a length of 5 cm, and a thickness of 50 ⁇ m, and cured at 200 ° C. for 60 minutes to obtain a cured film.
  • the resistivity of the surface of the cured film was measured by the 4-terminal method using a digital multimeter (Keithley Instruments, KEITHLEY 2002), and the specific resistance was calculated from the obtained value and the sample thickness.
  • the conductive resin composition was cast on a slide glass substrate to a thickness of 50 ⁇ m, an aluminum cylinder having a diameter of 3 mm was placed on the slide glass substrate, and the mixture was cured at 200 ° C. for 60 minutes.
  • a bond tester manufactured by Seishin Shoji Co., Ltd., model number: SS-30WD was used to pull in the vertical direction at a speed of 0.5 mm / s, and the value at the time of breakage was measured.
  • Silicone resin content ratio Content ratio of silicone resin to total resin content in the conductive resin composition containing silicone resin (%) ((Silicone resin / total resin content (silicone resin + resin other than silicone resin)) ⁇ 100)
  • Example 14 A paste-like composition was obtained in the same manner as in Example 4. The obtained paste-like composition was diluted with benzyl alcohol and adjusted so that the viscosity at 25 ° C. and a shear rate of 4 (1 / s) was 30 Pa ⁇ s. Next, the moisture permeability was evaluated in the same manner as above, except that the thickness of the conductive resin composition when cast on the PET film was adjusted and the film thickness of the cured film was as shown in Table 3. .. The results are shown in Table 3 and FIG.
  • Examples 15 to 26 135 parts by mass of silicone resin 1 as a resin solid content and 165 parts by mass of benzyl alcohol (manufactured by Gordo Co., Ltd.) were mixed, and solvent substitution was carried out under the conditions of 130 ° C., 30 Pa, and 1 hour to obtain a resin solution.
  • the obtained resin liquid, metal powder 1, metal powder 2, silica powder 1, and benzyl alcohol are mixed at the ratios shown in Tables 5 and 6, and then used on a three-roll mill (manufactured by Inoue Seisakusho). The mixture was kneaded to obtain a paste-like composition.
  • the obtained composition was diluted with benzyl alcohol and adjusted so that the viscosity at 25 ° C. and a shear rate of 4 (1 / s) was 4 Pa ⁇ s, and then the above evaluation was performed. The results are shown in Tables 5 and 6.
  • Examples 27 to 31 135 parts by mass of silicone resin 1 as a resin solid content and 165 parts by mass of benzyl alcohol (manufactured by Gordo Co., Ltd.) were mixed, and solvent substitution was carried out under the conditions of 130 ° C., 30 Pa, and 1 hour to obtain a resin solution.
  • the obtained resin liquid, metal powder 1, and metal powder 2 were mixed at the ratios shown in Table 7 and then kneaded using a three-roll mill (manufactured by Inoue Seisakusho) to obtain a paste-like composition. ..
  • the obtained composition was diluted with benzyl alcohol and adjusted so that the viscosity at 25 ° C. and a shear rate of 4 (1 / s) was 40 Pa ⁇ s, and then the above evaluation was performed. The results are shown in Table 7.
  • Examples 32 to 34, Comparative Example 6 135 parts by mass of silicone resin 1 as a resin solid content and 165 parts by mass of benzyl alcohol (manufactured by Gordo Co., Ltd.) were mixed, and solvent substitution was carried out under the conditions of 130 ° C., 30 Pa, and 1 hour to obtain a resin solution.
  • the obtained resin liquid, metal powder 1, metal powder 2, and epoxy resin 1 are mixed at the ratios shown in Table 2 and then kneaded using a three-roll mill (manufactured by Inoue Seisakusho) to form a paste.
  • the composition was obtained.
  • the obtained composition was diluted with benzyl alcohol and adjusted so that the viscosity at 25 ° C. and a shear rate of 4 (1 / s) was 30 Pa ⁇ s, and then the above evaluation was performed.
  • Table 8 The results are shown in Table 8.
  • Electrode-formed body there are a plurality of dielectric layers containing barium titanate and internal electrode layers containing nickel, which are substantially rectangular parallelepiped as shown in FIG. 1 having a length of 3.2 mm, a width of 2.5 mm, and a height of 2.5 mm.
  • a laminated body was prepared.
  • a conductive resin composition containing copper powder was applied to both end faces of the laminate in the vertical direction by a dip method, and then held in an air atmosphere at 150 ° C. for 10 minutes.
  • the temperature was raised at a heating rate of 50 ° C./min until the temperature reached 780 ° C., and after reaching 780 ° C., the temperature was maintained for 15 minutes to form copper terminals.
  • the conductive resin composition shown in Table 4 or Table 8 is applied to the copper terminals formed on both end faces of the laminate by the dip method with the vertical direction in the vertical direction, and the conductive resin composition shown in Table 4 or Table 8 is applied under the conditions of an air atmosphere and 200 ° C.
  • the applied conductive resin composition was cured by holding for 60 minutes to form a conductive resin layer on the above-mentioned copper terminals.
  • a laminated ceramic capacitor was produced as a laminated electronic component.
  • the length of the portion where the distance from the boundary between the plating layer and the conductive resin layer to the boundary between the conductive resin layer and the base layer (copper terminal) is the shortest is defined as the end face corner thickness. Further, in the end face portion of the laminate, the portion where the distance from the boundary between the conductive resin layer and the plating layer to the boundary between the conductive resin layer and the base layer (copper terminal) when a perpendicular line is drawn from the boundary between the conductive resin layer and the plating layer toward the laminate is the longest. The length of was taken as the end face thickness.
  • An end face corner thickness of less than 2.5 ⁇ m and / or an end face thickness of more than 300 ⁇ m is “score: 1, rejected, unusable, inferior in manufacturability”, end face corner thickness of 5.0 ⁇ m or more, and end face thickness. 200 ⁇ m or less was evaluated as “Score: 3, Pass, Usable, Excellent Manufacturability”, and others were evaluated as “Score: 2, Pass, Usable, Good Manufacturability”.
  • the shape of the sex resin layer is shown in Table 4 or Table 8.
  • the electrode-formed body is a cover composed of a substantially rectangular parallelepiped anode made of tantalum having a length of 0.5 mm, a width of 3.7 mm, and a height of 5.4 mm, and a dielectric layer made of tantalum pentoxide formed on the surface of the anode.
  • a cathode forming body was prepared. After forming a solid electrolyte layer on the solid electrolyte layer and forming a carbon layer on the solid electrolyte layer, the conductive resin shown in Table 5 or Table 6 is formed by a dip method with the height direction in the vertical direction.
  • the composition was applied onto the carbon layer and held in an air atmosphere at 170 ° C. for 60 minutes to cure the applied conductive resin composition to form a conductive resin layer. After that, it was connected to a terminal and a resin outer layer was formed by a resin molding method to prepare a tantalum capacitor as a solid electrolytic capacitor.
  • a resin molding method to prepare a tantalum capacitor as a solid electrolytic capacitor.
  • the horizontal cross section of the solid electrolytic capacitor is observed by SEM, and the thickness of the conductive resin layer at the corners on the side surface of the cathode-forming body (side corner thickness) and the thickness of the conductive resin layer on the side surface of the cathode-forming body. (Side thickness) was measured.
  • the length of the portion where the distance from the boundary between the resin outer layer and the conductive resin layer to the boundary between the conductive resin layer and the base layer (cathode formed body) is the shortest is defined as the side corner thickness. .. Further, in the side surface portion of the cathode-formed body, the length of the portion where the distance from the boundary between the resin outer layer and the conductive resin layer to the boundary between the conductive resin layer and the base layer (cathode-forming body) is the longest is defined as the side surface thickness. bottom.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coils Or Transformers For Communication (AREA)
PCT/JP2021/016514 2020-05-01 2021-04-23 導電性樹脂組成物及び電子部品の製造方法 Ceased WO2021220976A1 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
EP21797474.0A EP4144801A4 (en) 2020-05-01 2021-04-23 ELECTRICALLY CONDUCTIVE RESIN COMPOSITION AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENTS
CN202180032455.XA CN115516589B (zh) 2020-05-01 2021-04-23 导电性树脂组合物和电子部件的制造方法
KR1020227040843A KR102952186B1 (ko) 2020-05-01 2021-04-23 도전성 수지 조성물
US17/922,585 US12603192B2 (en) 2020-05-01 2021-04-23 Conductive resin composition
PH1/2022/553274A PH12022553274A1 (en) 2020-05-01 2021-04-23 Conductive resin composition and method for manufacturing electronic component
JP2022504007A JP7078194B2 (ja) 2020-05-01 2021-04-23 電子部品の電極形成用導電性樹脂組成物
US18/346,538 US12205731B2 (en) 2020-05-01 2023-07-03 Conductive resin composition

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2020-081190 2020-05-01
JP2020081191 2020-05-01
JP2020-081191 2020-05-01
JP2020081190 2020-05-01
JP2020087086 2020-05-19
JP2020-087085 2020-05-19
JP2020-087086 2020-05-19
JP2020087085 2020-05-19

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US17/922,585 A-371-Of-International US12603192B2 (en) 2020-05-01 2021-04-23 Conductive resin composition
US18/346,538 Division US12205731B2 (en) 2020-05-01 2023-07-03 Conductive resin composition

Publications (1)

Publication Number Publication Date
WO2021220976A1 true WO2021220976A1 (ja) 2021-11-04

Family

ID=78373196

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/016514 Ceased WO2021220976A1 (ja) 2020-05-01 2021-04-23 導電性樹脂組成物及び電子部品の製造方法

Country Status (8)

Country Link
US (2) US12603192B2 (https=)
EP (1) EP4144801A4 (https=)
JP (2) JP7078194B2 (https=)
KR (1) KR102952186B1 (https=)
CN (1) CN115516589B (https=)
PH (1) PH12022553274A1 (https=)
TW (1) TWI896654B (https=)
WO (1) WO2021220976A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220122776A1 (en) * 2020-10-21 2022-04-21 Tdk Corporation Electronic component
US20220199328A1 (en) * 2020-12-18 2022-06-23 Samsung Electro-Mechanics Co., Ltd. Multilayered electronic component and method of manufacturing the same
WO2023119843A1 (ja) * 2021-12-22 2023-06-29 パナソニックＩｐマネジメント株式会社 固体電解コンデンサ素子および固体電解コンデンサ

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021220975A1 (ja) * 2020-05-01 2021-11-04 昭栄化学工業株式会社 電子部品の製造方法
CN115698379B (zh) * 2020-07-03 2024-12-20 三菱材料电子化成株式会社 金属包覆树脂粒子及其制造方法、包含金属包覆树脂粒子的导电性膏以及导电性膜
US20250066579A1 (en) * 2021-11-02 2025-02-27 Shoei Chemical Inc. Thermosetting conductive resin composition and method for producing electronic component
JP7640489B2 (ja) * 2022-03-30 2025-03-05 ノリタケ株式会社 熱硬化性ペースト
US12592345B2 (en) * 2022-05-30 2026-03-31 Tdk Corporation Multilayer ceramic electronic device
TWI834389B (zh) * 2022-11-18 2024-03-01 國巨股份有限公司 陶瓷電容之金屬電極及其製造方法
CN118057558A (zh) 2022-11-18 2024-05-21 国巨股份有限公司 陶瓷电容的金属电极及其制造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6331522A (ja) 1986-07-25 1988-02-10 Kao Corp 吸湿剤
JPH11213756A (ja) * 1998-01-28 1999-08-06 Hitachi Chem Co Ltd 導電性ペースト組成物及びこれを用いた電子部品
JP2000133043A (ja) * 1998-10-22 2000-05-12 Three Bond Co Ltd 接続抵抗値を改善する導電性組成物
WO2003035739A1 (fr) * 2001-10-19 2003-05-01 Hitachi Chemical Co., Ltd. Composition de resine electroconductrice et composantes electroniques faisant appel a cette composition
JP2004168966A (ja) * 2002-11-22 2004-06-17 Hitachi Chem Co Ltd 導電性樹脂組成物及びこれを用いた電子部品
JP2009295602A (ja) 2006-08-22 2009-12-17 Murata Mfg Co Ltd 積層型電子部品、および積層型電子部品の製造方法。
JP2014135463A (ja) * 2013-01-09 2014-07-24 Samsung Electro-Mechanics Co Ltd 導電性樹脂組成物、これを含む積層セラミックキャパシタ及びその製造方法
WO2016104232A1 (ja) 2014-12-26 2016-06-30 ハリマ化成株式会社 導電性ペースト

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3650546B2 (ja) * 1998-08-28 2005-05-18 松下電器産業株式会社 導電性ペースト、およびそれを用いた導電性構造、セラミック電子部品、電子部品、実装体、回路基板、電気的接続方法、回路基板の製造方法、及びセラミック電子部品の製造方法
JP4367631B2 (ja) 2004-04-12 2009-11-18 信越化学工業株式会社 室温硬化型導電性シリコーンゴム組成物
JP2006213909A (ja) 2005-01-06 2006-08-17 Shieldtechs Inc 防錆性および／または導電性に優れた樹脂組成物並びに樹脂組成物被覆部材
JP4951948B2 (ja) * 2005-12-02 2012-06-13 昭栄化学工業株式会社 導体形成方法
JP5201734B2 (ja) * 2009-03-06 2013-06-05 旭化成ケミカルズ株式会社 導電性樹脂組成物、それを用いた半導体装置及び導電性樹脂組成物の製造方法
JP5297344B2 (ja) 2009-11-04 2013-09-25 京都エレックス株式会社 加熱硬化型導電性ペースト組成物
JP5246207B2 (ja) * 2010-06-04 2013-07-24 株式会社村田製作所 チップ型電子部品
JP6416188B2 (ja) * 2013-03-14 2018-10-31 ダウ シリコーンズ コーポレーション 硬化性シリコーン組成物、導電性シリコーン粘着剤、これらの製造及び使用方法、並びにこれらを含有する電気デバイス
US20150262728A1 (en) * 2014-03-11 2015-09-17 E I Du Pont De Nemours And Company Electrically conductive paste composition and method of forming an electrical circuit on a polymer substrate
JP2016004659A (ja) * 2014-06-16 2016-01-12 株式会社村田製作所 導電性樹脂ペーストおよびセラミック電子部品
US20160322163A1 (en) * 2015-04-28 2016-11-03 E I Du Pont De Nemours And Company Terminal electrode of electronic component
WO2017028020A1 (en) * 2015-08-14 2017-02-23 Henkel Ag & Co. Kgaa Sinterable composition for use in solar photovoltaic cells
US20170200556A1 (en) * 2016-01-11 2017-07-13 E I Du Pont De Nemours And Company Electric component
JP7103366B2 (ja) * 2017-10-03 2022-07-20 昭栄化学工業株式会社 太陽電池電極形成用導電性ペースト
JP6877750B2 (ja) * 2017-12-06 2021-05-26 ナミックス株式会社 導電性ペースト
US11739232B2 (en) * 2019-06-12 2023-08-29 Kyoto Elex Co., Ltd. Conductive paste composition
JP7565686B2 (ja) * 2019-12-20 2024-10-11 ノリタケ株式会社 導電性ペースト
JP7411537B2 (ja) * 2020-01-22 2024-01-11 信越化学工業株式会社 生体電極組成物、生体電極、及び生体電極の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6331522A (ja) 1986-07-25 1988-02-10 Kao Corp 吸湿剤
JPH11213756A (ja) * 1998-01-28 1999-08-06 Hitachi Chem Co Ltd 導電性ペースト組成物及びこれを用いた電子部品
JP2000133043A (ja) * 1998-10-22 2000-05-12 Three Bond Co Ltd 接続抵抗値を改善する導電性組成物
WO2003035739A1 (fr) * 2001-10-19 2003-05-01 Hitachi Chemical Co., Ltd. Composition de resine electroconductrice et composantes electroniques faisant appel a cette composition
JP2004168966A (ja) * 2002-11-22 2004-06-17 Hitachi Chem Co Ltd 導電性樹脂組成物及びこれを用いた電子部品
JP2009295602A (ja) 2006-08-22 2009-12-17 Murata Mfg Co Ltd 積層型電子部品、および積層型電子部品の製造方法。
JP2014135463A (ja) * 2013-01-09 2014-07-24 Samsung Electro-Mechanics Co Ltd 導電性樹脂組成物、これを含む積層セラミックキャパシタ及びその製造方法
WO2016104232A1 (ja) 2014-12-26 2016-06-30 ハリマ化成株式会社 導電性ペースト

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220122776A1 (en) * 2020-10-21 2022-04-21 Tdk Corporation Electronic component
US11646160B2 (en) * 2020-10-21 2023-05-09 Tdk Corporation Electronic component
US20220199328A1 (en) * 2020-12-18 2022-06-23 Samsung Electro-Mechanics Co., Ltd. Multilayered electronic component and method of manufacturing the same
US11842853B2 (en) * 2020-12-18 2023-12-12 Samsung Electro-Mechanics Co., Ltd. Multilayered electronic component and method of manufacturing the same
WO2023119843A1 (ja) * 2021-12-22 2023-06-29 パナソニックＩｐマネジメント株式会社 固体電解コンデンサ素子および固体電解コンデンサ

Also Published As

Publication number Publication date
CN115516589A (zh) 2022-12-23
US12603192B2 (en) 2026-04-14
EP4144801A4 (en) 2024-12-25
US20230343481A1 (en) 2023-10-26
TWI896654B (zh) 2025-09-11
EP4144801A1 (en) 2023-03-08
TW202213407A (zh) 2022-04-01
JPWO2021220976A1 (https=) 2021-11-04
KR20230006863A (ko) 2023-01-11
US20230170105A1 (en) 2023-06-01
KR102952186B1 (ko) 2026-04-15
JP7078194B2 (ja) 2022-05-31
PH12022553274A1 (en) 2024-04-22
JP2022106752A (ja) 2022-07-20
US12205731B2 (en) 2025-01-21
JP7103543B1 (ja) 2022-07-20
CN115516589B (zh) 2025-05-30

Similar Documents

Publication Publication Date Title
JP7103543B1 (ja) 電子部品の電極形成用導電性樹脂組成物
JP5569747B2 (ja) 積層セラミックコンデンサ内部電極に用いられるグラビア印刷用導電性ペースト
JP2012174797A5 (https=)
KR20110121572A (ko) 외부 전극용 도전성 페이스트, 및 그것을 이용하여 형성한 외부 전극을 구비한 적층 세라믹 전자 부품
JPWO2018181697A1 (ja) 電極形成用樹脂組成物並びにチップ型電子部品及びその製造方法
CN112106149A (zh) 导电性浆料、电子部件以及叠层陶瓷电容器
JP7078195B2 (ja) 電子部品の製造方法
JP2022133621A (ja) 導電性ペーストおよびその利用
WO2023080027A1 (ja) 熱硬化型導電性樹脂組成物及び電子部品の製造方法
KR20240095230A (ko) 열경화형 도전성 수지 조성물, 전자 부품의 제조 방법
JP2023166098A (ja) ポリマー型導電性ペースト、導電膜、及び、固体電解コンデンサ素子
JP2020055912A (ja) 電極形成用樹脂組成物並びにチップ型電子部品及びその製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21797474

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2022504007

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20227040843

Country of ref document: KR

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 2021797474

Country of ref document: EP

Effective date: 20221201

NENP Non-entry into the national phase

Ref country code: DE

WWG Wipo information: grant in national office

Ref document number: 202180032455.X

Country of ref document: CN

WWG Wipo information: grant in national office

Ref document number: 17922585

Country of ref document: US